CN108630637A - Heat dissipation member and chip package with same - Google Patents
Heat dissipation member and chip package with same Download PDFInfo
- Publication number
- CN108630637A CN108630637A CN201710320362.2A CN201710320362A CN108630637A CN 108630637 A CN108630637 A CN 108630637A CN 201710320362 A CN201710320362 A CN 201710320362A CN 108630637 A CN108630637 A CN 108630637A
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- Prior art keywords
- groove
- radiating piece
- radiating
- chip
- carrier plate
- Prior art date
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- 230000017525 heat dissipation Effects 0.000 title abstract description 19
- 238000004806 packaging method and process Methods 0.000 claims description 30
- 238000005538 encapsulation Methods 0.000 claims description 23
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 239000000084 colloidal system Substances 0.000 description 26
- 238000012856 packing Methods 0.000 description 25
- 239000010410 layer Substances 0.000 description 16
- 238000002844 melting Methods 0.000 description 14
- 230000008018 melting Effects 0.000 description 14
- 238000000034 method Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 8
- 239000002184 metal Substances 0.000 description 6
- 238000009826 distribution Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 238000001746 injection moulding Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000003698 laser cutting Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920006336 epoxy molding compound Polymers 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a heat dissipation member and a chip package with the same. The heat dissipation member of the present invention includes a heat dissipation body and a plurality of extension portions. The heat dissipation main body is provided with a heat dissipation surface, at least one first groove positioned on the heat dissipation surface, an annular bulge positioned on the heat dissipation surface and at least one second groove positioned on the heat dissipation surface. The annular protrusion is located between the first groove and the second groove. The annular protrusion surrounds the at least one groove. The plurality of extending parts respectively extend outwards from the edge of the heat dissipation main body. Each extension part is provided with an opening. In addition, a chip package containing the heat dissipation member is also provided. Therefore, the manufacturing yield is good, and the heat dissipation efficiency of the chip package can be improved.
Description
Technical field
The present invention relates to a kind of radiating piece more particularly to a kind of radiating pieces for being suitable for being used in chip packaging piece.
Background technology
In general, when chip operates, a large amount of thermal energy will produce.If thermal energy can not loss and be constantly deposited in
In chip, the temperature of chip can constantly rise.Thus, which chip may lead to efficiency attenuation or use because of overheat
The lost of life, severe patient even cause permanent damage.Lead to temporary or permanent failure to prevent chip overheating,
Must usually radiating piece be configured to reduce the operating temperature of chip, and then allow chip can normal operation.
In the chip packaging piece manufacturing process with radiating piece, typically radiating piece is configured on line carrier plate, and
Make chip between radiating piece and line carrier plate, is then placed in mold together, then by the packing colloid of melting such as ring
Oxygen mold pressing resin (Epoxy Molding Compound, EMC) injects mold, so that packing colloid covering line carrier plate, chip
And partial radiating piece.Then, make packing colloid cooling and cure, to form encapsulated layer.
However, because the flow velocity or flow of mould stream are not easy to control, or because of disturbance caused in injection process,
Packing colloid is possible to locally coat the radiating surface of radiating piece, so cause the appearance of chip packaging piece occur flaw and
The radiating efficiency of chip packaging piece is caused not to be elevated effectively.Therefore, the heat dissipation effect of chip packaging piece how is further promoted
Rate has become the project for wanting to solve at present in fact.
Invention content
The present invention provides a kind of radiating piece and has the chip packaging piece of radiating piece, with good manufacturing yield and can be with
Promote the radiating efficiency of chip packaging piece.
One embodiment of the invention provides a kind of radiating piece comprising a heat sink body and multiple extensions.Heat dissipation master
There is body a radiating surface, at least one first groove on radiating surface, one to be located at the annular protrusion on radiating surface and be located at
At least one second groove on radiating surface, wherein annular protrusion is between the first groove and the second groove, and annular protrusion ring
Around at least one first groove.Multiple extensions extend outwardly from the edge of heat sink body respectively, and each extension is respectively provided with
One opening.
Another embodiment of the present invention provides a kind of chip packaging piece comprising a line carrier plate, a chip, a radiating piece
An and encapsulated layer.Chip is configured on line carrier plate and is electrically connected with line carrier plate.Radiating piece is configured at line carrier plate
Above so that chip is between heat sink body and line carrier plate.Encapsulated layer covers line carrier plate, chip and radiating piece.
To make the foregoing features and advantages of the present invention clearer and more comprehensible, special embodiment below, and it is detailed to coordinate attached drawing to make
Carefully it is described as follows.
Description of the drawings
Figure 1A is the upper schematic diagram according to the radiating piece of the first embodiment of the present invention；
Figure 1B is the enlarged drawing in the regions R1 in Figure 1A；
Fig. 1 C are the diagrammatic cross-sections along Figure 1B Vertical Centre Lines A-A '；
Fig. 2A is the diagrammatic cross-section according to the chip packaging piece of one embodiment of the invention；
Fig. 2 B are the enlarged drawings in the regions R2 in Fig. 2A；
Fig. 2 C are the partial cutaway schematics according to the chip packaging piece of another embodiment of the present invention；
Fig. 2 D are the enlarged drawings in the regions R3 in Fig. 2 C；
Fig. 3 is the local upper schematic diagram according to the radiating piece of the second embodiment of the present invention；
Fig. 4 is the local upper schematic diagram according to the radiating piece of the third embodiment of the present invention；
Fig. 5 is the local upper schematic diagram according to the radiating piece of the fourth embodiment of the present invention.
Reference sign：
100、300、400、500：Radiating piece
110、310、410、510：Heat sink body
110a、110a1、110a2、310a、410a、510a：Radiating surface
112、312、412、512：Annular protrusion
112a1：The first side wall
112a2：Second sidewall
114、314、414、514：First groove
116、316、416、516：Second groove
114a、116a：Recess sidewall
130：Extension
130a：Opening
132：First rake
134：First connecting portion
136：Second rake
138：Second connecting portion
W1：Length
W2：Width
20、20’：Chip packaging piece
22：Line carrier plate
24、24'：Encapsulated layer
24a、24a'：First encapsulation part
24b、24b'：Second encapsulation part
24c'：Extra encapsulation part
26：Chip
26a：Conducting wire
26b：Active surface
28：Conducting terminal
R1、R2、R3：Region
Specific implementation mode
Figure 1A is the upper schematic diagram according to the radiating piece of the first embodiment of the present invention.Figure 1B is the regions R1 in Figure 1A
Enlarged drawing.Fig. 1 C are the diagrammatic cross-sections along Figure 1B Vertical Centre Lines A-A '.Please also refer to Figure 1A to Fig. 1 C, the radiating piece of the present embodiment
100 include a heat sink body 110 and multiple extensions 130.Heat sink body 110 has a radiating surface 110a, is located at radiating surface
One first groove 114, one on 110a is located at the annular protrusion 112 on radiating surface 110a and one on radiating surface 110a
Second groove 116.Annular protrusion 112 is between the first groove 114 and the second groove 116, and annular protrusion 112 is around first
Groove 114.Multiple extensions 130 extend outwardly from the edge of heat sink body 110 respectively, and each extension 130 is respectively provided with one
Be open 130a.
Radiating piece 100 is, for example, made to sheet metal progress punching press by stamping process (stamping process)
At.In some embodiments, sheet metal can be previously cut to suitably form radiating piece before stamping process progress
100 profile and size, then, then by stamping process the sheet metal with contoured and size accordingly squeezed or
Bending, to form radiating piece 100.In some embodiments, can by high pressure waterjet (water jet cutter) technology or
Sheet metal is cut into the profile and size for suitably forming radiating piece 100 by laser cutting (laser cutting) technology.At it
In his embodiment, the cutting of sheet metal can together carry out in stamping process.In the present embodiment, the heat dissipation of radiating piece 100
Main body 110 is one of the forming with extension 130, and is for example all metal material, however, the present invention is not limited thereto.
In the present embodiment, the heat sink body 110 of radiating piece 100 is a circular plate body, and the first groove 114 is an annular
Groove, the second groove 116 are an annular groove.Annular protrusion 112 is located at the periphery of heat sink body 110, and around the of annular
One groove 114.First groove 114 is close to annular protrusion 112, so that the first side wall 112a1 and the first groove of annular protrusion 112
114 recess sidewall 114a alignment.Second groove 116 is close to annular protrusion 112, so that the second sidewall of annular protrusion 112
112a2 is aligned with the recess sidewall 116a of the second groove 116.The radiating surface 110a surrounded by the first groove 114 is, for example, one
Plane.Specifically, since the radiating piece of the present embodiment 100 is with made by stamping process, so needing additional press section
The sheet metal divided, to form the first groove 114 and the second groove 116.Therefore, by additional compression on radiating surface 110a
Metal material can accordingly form the annular protrusion 112 between the first groove 114 and the second groove 116, to reduce radiating surface
Defects (such as burr, ripple glaze or torn grain) of the 110a formed in stamping process.Thus, which radiating piece 100 is with good
Good manufacturing yield, and the radiating surface 110a that is surrounded of the first groove 114 and/or can positioned at the bottom surface of the opposite sides radiating surface 110a
Think plane, and makes radiating piece 100 that there is good radiating efficiency.
In the present embodiment, radiating piece 100 includes four extensions 130, and four extensions 130 are located at heat dissipation master
The edge of body 110, and extended outwardly and be bent by the edge of heat sink body 110, to form an accommodating sky in 100 lower section of radiating piece
Between.The chip 26 in chip packaging piece 20 (being shown in Fig. 2A) can be made (to be shown in figure thus, be formed by accommodating space
It 2A) is placed in wherein.Each extension 130 is respectively provided with an opening 130a, and at least one opening 130a in radiating piece 100 permits
Xu Mo streams pass through.Thus, in carrying out subsequent injection molding processing (molding process), the encapsulation of melting can be made
Colloid (such as：Epoxy moldable resin) 130a is open by least one of which by is inserted in accommodating space, and then cover circuit
Support plate 22 (being shown in Fig. 2A), chip 26 (being shown in Fig. 2A) and partial radiating piece 100.Then, packing colloid is made to cool down
And cure, to form encapsulated layer 24 (being shown in Fig. 2A).
Extension 130 has the first rake 132, first connecting portion 134, the second rake 136 and second connecting portion
138.It is worth noting that, in the diagrammatic cross-section of Fig. 1 C, the first rake 132 of extension 130, first connecting portion 134,
Second rake 136 and the second connecting portion 138 of part do not appear on the hatching line A-A ' in Figure 1B.But in fig. 1 c,
Still by the first rake 132 of extension 130, the second connecting portion of first connecting portion 134, the second rake 136 and part
138 projected position is shown in phantom, to indicate the correspondence of its position.
In the present embodiment, radiating piece 100 (is shown in by the second connecting portion 138 of extension 130 with line carrier plate 22
Fig. 2A) connect.Specifically, in one embodiment, can for example be wrapped between radiating piece 100 and line carrier plate 22 (being shown in Fig. 2A)
Containing an adhesion layer (not shown), so that second connecting portion 138 is mutually interconnected with line carrier plate 22 (being shown in Fig. 2A) by adhesion layer
It connects.In another feasible embodiment, second connecting portion 138 can for example have a trip, and line carrier plate 22 (is shown in figure
2A) the card slot that the trip can be corresponded to one, so that second connecting portion 138 and line carrier plate 22 (being shown in Fig. 2A) can be with
Mutually fasten.In another feasible embodiment, the surface of line carrier plate 22 (being shown in Fig. 2A) can have one to correspond to second
The recess of interconnecting piece 138, so that second connecting portion 138 can be placed directly on line carrier plate 22 (being shown in Fig. 2A).
In the present embodiment, the second rake 136 is connect with second connecting portion 138, and first connecting portion 134 and second tilts
Portion 136 connects, and the second rake 136 is between first connecting portion 134 and second connecting portion 138.Thus, by dissipating
Second rake 136 of hot main body 110, the first connecting portion 134 of extension 130 and extension 130 can be under heat sink body 110
It is rectangular at accommodating the accommodating space of chip 26 (being shown in Fig. 2A).In one embodiment, the second rake 136 makes heat sink body
There is an appropriate spacing, to be connected to chip 26 (being shown in Fig. 2A) and circuit between 110 and chip 26 (being shown in Fig. 2A)
Multiple conducting wire 26a (being shown in Fig. 2A) between support plate 22 (being shown in Fig. 2A) will not contact with heat sink body 110.First connection
Portion 134 extends outwardly from the edge of heat sink body 110, and (figure is shown in can accommodate chip 26 with the formation of the second rake 136
Accommodating space 2A).In another feasible embodiment, extension 130 can have multiple second rakes 136 and/or more
A first connecting portion 134, to form the accommodating space that can accommodate chip 26 (being shown in Fig. 2A).
In other feasible embodiments, can electrically it be connected each other by conductive bump between chip 26 and line carrier plate 22
It connects.In other words, chip 26 can be set to by flip-chip technology (Flip-Chip) on line carrier plate 22, and be carried with circuit
Plate 22 is electrically connected.
In the present embodiment, the first rake 132 of extension 130 is connect with heat sink body 110, the first rake 132
It connect with first connecting portion 134, wherein the first rake 132 is between heat sink body 110 and first connecting portion 134, and dissipates
Four extensions 130 of warmware 100 are connected to each other by respective first connecting portion 134, however, the present invention is not limited thereto.It can one
In capable embodiment, four extensions 130 of radiating piece 100 can be separated from each other, and the first rake of each extension 130
132 connect with heat sink body 110.
Fig. 2A is according to the diagrammatic cross-section of the chip packaging piece of one embodiment of the invention, and Fig. 2 B are the regions R2 in Fig. 2A
Enlarged drawing.Please also refer to Fig. 2A to Fig. 2 B, the chip packaging piece 20 of the present embodiment includes a line carrier plate 22, a chip 26, one
Radiating piece 100 and an encapsulated layer 24.Chip 26 is configured on line carrier plate 22 and is electrically connected with line carrier plate 22.Radiating piece
100 are configured on line carrier plate 22 so that the chip 26 is between heat sink body 110 and line carrier plate 22.Encapsulated layer 24 covers
Lid line carrier plate 22, chip 26 and radiating piece 100.
In the present embodiment, line carrier plate 22 is, for example, printed circuit board (the printed circuit with single layer circuit
Board, PCB), the printed circuit board with multilayer line or with reroute road floor (redistribution layer) base
Plate.Chip 26 is, for example, to attach film (not shown) with chip to be attached on line carrier plate 22, and pass through lead welding technique (wire
Bonding) chip 26 is electrically connected by a plurality of conducting wire 26a with line carrier plate 22.In some embodiments, chip packaging piece
20 can further comprise that multiple conducting terminals 28 (conductive terminals), wherein conducting terminal 28 are configured at circuit load
On plate 22, and conducting terminal 28 is located at chip 26 on two apparent surfaces of line carrier plate 22.In addition, conducting terminal 28
Such as it is the soldered ball (solder balls), convex block (bumps), conductive column (conductive pillars) or above-mentioned of array arrangement
Combination etc. so that chip 26 passes through line carrier plate 22 and conducting terminal 28 and is electrically connected with other elements.
In the present embodiment, radiating piece 100 is configured on line carrier plate 22, and chip 26 is located at heat sink body 110 and prolongs
Extending portion 130 is formed by accommodating space, so that chip 26 is between heat sink body 110 and line carrier plate 22.Radiating piece 100
Heat sink body 110 be covered on chip 26, and the area of radiating surface 110a1 that the first groove 114 is surrounded is more than chip 26
Active surface 26b area.Thus, radiating piece 100 has larger heat dissipation (heat dispersion) area, because
What this produced thermal energy when chip 26 operates can dissipate to that the first groove 114 surrounded from the active surface 26b of chip 26 dissipates
Hot face 110a1, and exported thermal energy by radiating piece 100, so that chip packaging piece 20 has good radiating efficiency, but this hair
It is bright without being limited thereto.
Encapsulated layer 24 includes the first encapsulation part 24a and the second encapsulation part 24b, wherein the first encapsulation part 24a is located at circuit
Support plate 22 is with coating chip 26, and the first encapsulation part 24a is covered by radiating piece 100, and the second encapsulation part 24b covers radiating piece
100 extension 130, and the second encapsulation part 24b is connect by the opening 130a of extension 130 with the first encapsulation part 24a.Yu Xin
Can radiating piece 100 is configured on line carrier plate 22, and chip 26 is made to be located at heat dissipation in the injection molding processing of chip package 20
Between part 100 and line carrier plate 22, and it is placed in mold together.Then, the packing colloid of melting is injected into mold.In mold
In, the packing colloid of melting is formed by that mould flows through at least one opening 130a in radiating piece 100 and lateral space enters by dissipating
Hot main body 110, the second rake 136 are formed by with first connecting portion 134 in accommodating space, so that packing colloid covers circuit
Support plate 22, chip 26 and partial radiating piece 100.Also, the packing colloid of melting can be via the 130a outflows of remaining opening
Accommodating space, so that partial packing colloid covers extension 130.Then, make the packing colloid of melting cooling and cure with
Form encapsulated layer 24.Thus, which the first of encapsulated layer 24 can be formed after hardening in the packing colloid in above-mentioned accommodating space
Encapsulation part 24a, and the second encapsulation part 24b of encapsulated layer 24 can be formed after hardening in the packing colloid outside above-mentioned accommodating space.
Second encapsulation part 24b can be connect by the opening 130a of extension 130 with the first encapsulation part 24a, and cover radiating piece 100
Extension 130.
Since the annular protrusion 112 on radiating surface 110a can be bonded with mold, annular protrusion 112 can be
The packing colloid of resistance shelves melting in injection molding processing.Thus, which the packing colloid of melting will not cover annular protrusion 112 and surround
Part radiating surface 110a1 so that solidification after packing colloid be formed by the heat dissipation that encapsulated layer 24 does not interfere with radiating piece 100
Function.
According to the partial cutaway schematic of the chip packaging piece of another embodiment of the present invention, wherein Fig. 2 C are Fig. 2 C and 2D
According to the partial cutaway schematic of the chip packaging piece 20 ' of another embodiment of the present invention, and to 20 ' institute of chip packaging piece in Fig. 2 C
The regional area of display is corresponding to, to the regions R2 shown by chip packaging piece 20, Fig. 2 D are the regions R3 in Fig. 2 C in Fig. 2 B
Enlarged drawing, the chip packaging piece 20 ' of another embodiment is similar with the chip packaging piece 20 of Fig. 2A, 2B in Fig. 2 C, 2D, similar
Component indicates with identical label, and has the function of similar, and omits description.And chip packaging piece 20 and chip packaging piece
20 ' main difference is that, the second groove 116 can with the packing colloid of the melting of limited portions, even and if melting packaging plastic
The body covering part regions radiating surface 110a2 and annular protrusion 112 is crossed, but still can be by positioned at the first recessed of heat sink body 110
The packing colloid of melting is confined to the first groove 114 by slot 114.Thus, which the packing colloid of melting will not cover convex annular
The 112 circular part regions radiating surface 110a1 are played, and the packing colloid after curing is formed by encapsulated layer 24 ' (including first
Encapsulation part 24a', the second encapsulation part 24b' and extra encapsulation part 24c') do not interfere with the heat sinking function of radiating piece 100.
Radiating piece 100 used in chip packaging piece 20 can have other designs, below by collocation Fig. 3 to Fig. 5 needles
The variation of radiating piece 100 is described.
Fig. 3 is the local upper schematic diagram according to the radiating piece of the second embodiment of the present invention.Referring to FIG. 3, in this reality
It applies in example, radiating piece 300 is similar to radiating piece 100, and similar component is indicated with identical label, and has similar work(
Can, and omit description.And radiating piece 300 and radiating piece 100 main difference is that, the heat sink body 310 of radiating piece 300 has
Radiating surface 310a, the annular protrusion 312 on radiating surface 310a, multiple first grooves 314 and multiple second grooves
316.Annular protrusion 312 is located at the periphery of heat sink body 310, and around multiple first grooves 314.Multiple second grooves 316 are
Multiple arc grooves being separated from each other, wherein the second groove 316 corresponds to the opening 130a distributions of extension 130.Multiple first
Groove 314 is multiple arc grooves being separated from each other, wherein the first groove 314 corresponds to the opening 130a distributions of extension 130.
Thus, which even if crossing the packing colloid after annular protrusion 312 has the flow direction of different directions, it can still be limited to first
Groove 314.
In one embodiment, multiple first grooves 314 are multiple arc grooves being separated from each other, wherein the first groove 314
Corresponding to the opening 130a distributions of extension 130, and the camber length W1 of the first groove 314 is more than corresponding opening 130a most
Big width W2., still can be by thus, even if crossing the packing colloid after annular protrusion 312 has the flow direction of different directions
It is confined to the first groove 314.
Fig. 4 is the local upper schematic diagram according to the radiating piece of the third embodiment of the present invention.Referring to FIG. 4, in this reality
It applies in example, radiating piece 400 is similar to radiating piece 100, and similar component is indicated with identical label, and has similar work(
Can, and omit description.And radiating piece 400 and radiating piece 100 main difference is that, the heat sink body 410 of radiating piece 400 has
Radiating surface 410a, the first groove 414 of the annular of an annular protrusion 412, one on radiating surface 410a and multiple second recessed
Slot 416, and annular protrusion 412 is between the first groove 414 and the second groove 416.Multiple second grooves 416 be it is multiple each other
The arc groove of separation, wherein the second groove 416 corresponds to the opening 130a distributions of extension 130.Annular protrusion 412, which is located at, to be dissipated
The periphery of hot main body 410, and around the first groove 414.Even if thus, melting packing colloid cross annular protrusion 412,
But still the packing colloid of melting can be confined to the first groove 414 by the first groove positioned at heat sink body 410.
Fig. 5 is the local upper schematic diagram according to the radiating piece of the fourth embodiment of the present invention.Referring to FIG. 5, in this reality
It applies in example, radiating piece 500 is similar to radiating piece 300, and similar component is indicated with identical label, and has similar work(
Can, and omit description.And radiating piece 500 and radiating piece 300 main difference is that, the heat sink body 510 of radiating piece 500 has
Radiating surface 510a, the annular protrusion 512 on radiating surface 510a, the annular of multiple first grooves 514 and one it is second recessed
Slot 516, and annular protrusion 512 is between the first groove 514 and the second groove 516.Multiple first grooves 514 be it is multiple each other
The arc groove of separation, wherein the first groove 514 corresponds to the opening 130a distributions of extension 130, and the arc of the first groove 514
Type length is more than the maximum width of corresponding opening 130a.Annular protrusion 512 is located at the periphery of heat sink body 510, and around first
Groove 514.Even if thus, cross the packing colloid after annular protrusion 512 have different directions flow direction, still can be by office
It is limited to the first groove 514.
In conclusion the radiating piece of the present invention has good manufacturing yield and good radiating efficiency.And with this
The chip packaging piece of the radiating piece of invention has good radiating efficiency.
Finally it should be noted that：The above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Present invention has been described in detail with reference to the aforementioned embodiments for pipe, it will be understood by those of ordinary skill in the art that：Its according to
So can with technical scheme described in the above embodiments is modified, either to which part or all technical features into
Row equivalent replacement；And these modifications or replacements, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (10)
1. a kind of radiating piece, which is characterized in that including：
Heat sink body has radiating surface, at least one first groove, the ring on the radiating surface on the radiating surface
Shape protrusion and at least one second groove on the radiating surface, wherein the annular protrusion is located at described at least one first
Between groove and at least one second groove, and the annular protrusion is around at least one first groove；And
Multiple extensions extend outwardly from the edge of the heat sink body respectively, and each extension is respectively provided with opening.
2. radiating piece according to claim 1, which is characterized in that the heat sink body includes a circular plate body.
3. radiating piece according to claim 1, which is characterized in that at least one first groove includes multiple is separated from each other
The first arc groove, and the multiple first arc groove corresponding to the multiple opening be distributed.
4. radiating piece according to claim 3, which is characterized in that the length of each first arc groove is more than corresponding institute
State the width of opening.
5. radiating piece according to claim 1, which is characterized in that at least one first groove includes at least one first ring
Connected in star.
6. radiating piece according to claim 1, which is characterized in that at least one second groove includes multiple is separated from each other
The second arc groove, and the multiple second arc groove corresponding to the multiple opening be distributed.
7. radiating piece according to claim 6, which is characterized in that the length of each first arc groove is more than correspondence and opens
The width of mouth.
8. radiating piece according to claim 1, which is characterized in that at least one second groove includes at least one second ring
Connected in star.
9. a kind of chip packaging piece, which is characterized in that including：
Line carrier plate；
Chip is configured on the line carrier plate and is electrically connected with the line carrier plate；
Radiating piece as described in claim 1, the radiating piece is configured on the line carrier plate so that the chip is located at institute
It states between heat sink body and the line carrier plate；And
Encapsulated layer covers the line carrier plate, the chip and the radiating piece.
10. chip packaging piece according to claim 9, which is characterized in that the encapsulated layer includes：
First encapsulation part, positioned at the line carrier plate to coat the chip, and first encapsulation part is by the radiating piece institute
Covering；And
Second encapsulation part covers the multiple extension, and second encapsulation part passes through the multiple opening and described first
Encapsulation part connects.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106108924A TWI615930B (en) | 2017-03-17 | 2017-03-17 | Heat sink and chip package having the same |
| TW106108924 | 2017-03-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108630637A true CN108630637A (en) | 2018-10-09 |
Family
ID=61614641
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710320362.2A Pending CN108630637A (en) | 2017-03-17 | 2017-05-09 | Heat dissipation member and chip package with same |
| CN201720505829.6U Active CN207124188U (en) | 2017-03-17 | 2017-05-09 | Heat dissipation member and chip package with same |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720505829.6U Active CN207124188U (en) | 2017-03-17 | 2017-05-09 | Heat dissipation member and chip package with same |
Country Status (2)
| Country | Link |
|---|---|
| CN (2) | CN108630637A (en) |
| TW (1) | TWI615930B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112447630A (en) * | 2020-11-09 | 2021-03-05 | 南昌航空大学 | Heat dissipation body and chip package having the same |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109863596B (en) | 2019-01-22 | 2020-05-26 | 长江存储科技有限责任公司 | Integrated circuit package structure and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6249433B1 (en) * | 1999-05-14 | 2001-06-19 | Siliconware Precision Industries | Heat-dissipating device for integrated circuit package |
| CN2596547Y (en) * | 2002-12-25 | 2003-12-31 | 立卫科技股份有限公司 | Semiconductor packaging structure with radiating fin |
| CN1549337A (en) * | 2003-05-09 | 2004-11-24 | 华泰电子股份有限公司 | Radiating fin device for preventing radiating fin glue spilling in semi conductor packaging parts |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040076028A (en) * | 2003-02-24 | 2004-08-31 | 한국시그네틱스 주식회사 | Tape Ball Grid Array Package improving heat spreader characteristics and manufacturing method thereof |
| TWM545360U (en) * | 2017-03-17 | 2017-07-11 | 力成科技股份有限公司 | Heat sink and chip package having the same |
-
2017
- 2017-03-17 TW TW106108924A patent/TWI615930B/en active
- 2017-05-09 CN CN201710320362.2A patent/CN108630637A/en active Pending
- 2017-05-09 CN CN201720505829.6U patent/CN207124188U/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6249433B1 (en) * | 1999-05-14 | 2001-06-19 | Siliconware Precision Industries | Heat-dissipating device for integrated circuit package |
| CN2596547Y (en) * | 2002-12-25 | 2003-12-31 | 立卫科技股份有限公司 | Semiconductor packaging structure with radiating fin |
| CN1549337A (en) * | 2003-05-09 | 2004-11-24 | 华泰电子股份有限公司 | Radiating fin device for preventing radiating fin glue spilling in semi conductor packaging parts |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112447630A (en) * | 2020-11-09 | 2021-03-05 | 南昌航空大学 | Heat dissipation body and chip package having the same |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI615930B (en) | 2018-02-21 |
| TW201836095A (en) | 2018-10-01 |
| CN207124188U (en) | 2018-03-20 |
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Application publication date: 20181009 |