CN108630592A - Sheet material expanding unit - Google Patents
Sheet material expanding unit Download PDFInfo
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- CN108630592A CN108630592A CN201810233574.1A CN201810233574A CN108630592A CN 108630592 A CN108630592 A CN 108630592A CN 201810233574 A CN201810233574 A CN 201810233574A CN 108630592 A CN108630592 A CN 108630592A
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- machined object
- elastic wave
- sheet material
- shaped frame
- extension piece
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
- H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
Abstract
Sheet material expanding unit is provided, machined object or film-like adhesive can be split without remaining undivided region, and inhibits to extend the generation of the fracture of piece.The sheet material expanding unit has：Ring-shaped frame (11) is fixed in ring-shaped frame fixed cell (20)；Expanding element (30,31) pushes extension piece (12) and makes its extension；Elastic wave test sensor (50,51,52,53), detection generated elastic wave when making machined object (13) or film-like adhesive are broken along segmentation starting point (16) by extending the extension of piece；With control unit (40).The value of the output signal from elastic wave test sensor is stored as threshold value in advance as benchmark when machined object or film-like adhesive are broken by control unit completely, in the extension by extending piece come when being split, in the case where the output signal from elastic wave test sensor is not up to threshold value, it is considered as there are unbroken region and output error signal.
Description
Technical field
The present invention relates to sheet material expanding unit, which is used for the machined objects such as chip or film-like adhesive
It is split.
Background technology
Disclose following technology：There is along segmentation preset lines irradiation for semiconductor wafer the laser beam of permeability, profit
The modification layer as segmentation starting point is formed with Multiphoton Absorbtion, chip is split as starting point using modifying layer.Also, also public affairs
Knowing has to form the technology of laser processing groove or cutting slot etc. as the segmentation starting point other than modification layer.Along segmentation preset lines
When the substantially disk-shaped machined object such as chip to being formed with segmentation starting point is split, first, machined object is pasted onto
On piece is extended, which is secured on ring-shaped frame.Then, machined object is applied by being extended to extension piece
External force generates from segmentation starting point and is split the crackle that machined object penetrates through in a thickness direction (referring to patent document 1).
Also, it discloses that there is the back side and is referred to as DAF (Die Attach Film：Bonding die film) film-like adhesive
The technology that machined object is split, wherein the thickness of the film-like adhesive is several μm~100 μm or so, by epoxy resin etc.
It constitutes.When machined object is divided together with DAF by extending the extension of piece, the chip with DAF is formed.The final quilt of chip
It heats and is bonded on defined object (with reference to patent document 2) by DAF.
It is extended in the extension by extension piece as described above to carry out the sheet material of the segmentation (extension disconnects) of machined object
In device, make to extend piece the ring-shaped frame that is kept of peripheral part and the region for being pasted with machined object in extension piece it
Between along machined object thickness direction generate it is opposite move, to make extension piece extend.Ring-shaped frame is consolidated for example, it is known that having
Surely the sheet material expanding unit for keeping and extending the structure of piece jack-up using component is jacked up.
When the opposite jack-up for jacking up component is insufficient, the extension for extending piece is just insufficient.Then, due to can not be to quilt
Machining object suitably external force action, so machined object can not be generated by abundant Ground Split in the segmentation preset lines of a part
Undivided region.Here, undivided region refers in the region along segmentation preset lines, is not present machined object in thickness
The crackle that is penetrated through on direction and can not be by the region of appropriate Ground Split.On the other hand, when the opposite jack-up for jacking up component is excessive
When, extension piece cannot withstand extension and be broken.
The value appropriate that component is jacked up relative to the opposite jack-up amount of ring-shaped frame is split according to machined object
And the size of each chip formed and extend the type etc. of piece and different.Therefore, it carries out testing etc. and obtaining and be suitable in advance
The opposite jack-up amount for jacking up component is set as the value appropriate by the value of the jack-up amount of the size of chip or the type of extension piece
And implement the extension of extension piece.
Patent document 1：No. 3408805 bulletins of Japanese Patent Publication No.
Patent document 2：Japanese Unexamined Patent Publication 2009-272503 bulletins
But even if in the case where setting the opposite jack-up amount for jacking up component according to the value obtained in advance, because of quilt
There are the reasons such as deviation for machining object and the property of extension piece, actually are carrying out being possible to remain undivided area when extension disconnects
Domain.Therefore, jack-up amount is set as more more than above-mentioned jack-up appropriate amount in many cases.Due to the increasing of jack-up amount
Adding is that the operating personnel of operating device measure progress by visual observation, so not generating undivided region in order to obtain and not making
The optimum value for extending piece fracture, needs experience and technical ability.
Invention content
The present invention is completed in view of the problem, can will be along segmentation its purpose is to provide sheet material expanding unit
It the machined object of preset lines segmentation and is divided into along the film-like adhesive of each chip separation and does not remain undivided region, and
It can inhibit the generation of the fracture of extension piece.
The present invention is a kind of sheet material expanding unit, by being pasted onto on the back side of machined object or the back side of film-like adhesive
On extension piece by machined object be supported on center have opening ring-shaped frame, the machined object is along a plurality of of intersection
Segmentation preset lines are formed with segmentation starting point, and the film-like adhesive is pasted on the back side of each chip after singulation, above-mentioned
Under situation, sheet material expanding unit is extended extension piece and is split to machined object or along each along segmentation starting point
Chip is split the film-like adhesive, which is characterized in that sheet material expanding unit has：Ring-shaped frame fixed cell, tool
There is the bearing surface that the ring-shaped frame to machined object unit is supported, and the ring-shaped frame of mounting on the bearing surface is consolidated
It is fixed；Expanding element, using pressing portion to by the inner circumferential of the fixed ring-shaped frame of ring-shaped frame fixed cell and machined object
Extension piece between periphery is pushed and is extended to extension piece；Elastic wave test sensor, detection to extension piece into
Row extension and make machined object along generated bullet when segmentation starting point fracture or when film-like adhesive is along each chip fracture
Property wave；And control unit, control unit have storage part, storage part by machined object along segmentation starting point be broken completely when or
The value of output signal from elastic wave test sensor when film-like adhesive is broken completely along each chip as benchmark and
It is stored as threshold value, when making machined object along segmentation starting point fracture being extended to extension piece or is made membranaceous in advance
In the case that bonding agent is not up to threshold value along the output signal from elastic wave test sensor when each chip fracture, it is considered as
The output error signal there are unbroken region.
Sheet material expanding unit according to the present invention, elasticity when being in advance broken machined object or film-like adhesive well
Wave is stored as threshold value, is compared to the value and threshold value of the output signal from elastic wave test sensor in extension disconnects,
It can be judged as being broken completely in the case of equal with threshold value, therefore extension piece can be made to be in best extended mode.And
And by being compared to the value and threshold value of the output signal from elastic wave test sensor in being disconnected in extension, Neng Goujin
Whether row remains the judgement in unbroken region, therefore can prevent unbroken.
In accordance with the invention it is possible to sheet material expanding unit is obtained, it can be to the machined object along segmentation preset lines segmentation
Or be split along the film-like adhesive of each chip separation without remaining undivided region, and inhibit to extend the fracture of piece
Generation.
Description of the drawings
Fig. 1 is the stereogram of the sheet material expanding unit of present embodiment.
Fig. 2 is the sectional view for the sheet material expanding unit for showing the 1st mode.
Fig. 3 is the sectional view for the state for showing that the sheet material expanding unit in the way of the 1st divides machined object.
Fig. 4 is the sectional view for the sheet material expanding unit for showing the 2nd mode.
Fig. 5 is the sectional view for the sheet material expanding unit for showing the 3rd mode.
Fig. 6 is the sectional view for the sheet material expanding unit for showing the 4th mode.
Fig. 7 is the chart for the testing result for showing elastic wave test sensor.
Label declaration
1：Sheet material expanding unit；10：Machined object unit；11：Ring-shaped frame；12：Extend piece；13：Machined object；13a：
Periphery；14：Opening；15：Divide preset lines；16：Modify layer；20：Frame fixed cell；21：Supporting station；22：Bearing surface；23：
Cover board；24：Supporting leg；25：Circular open；26：Circular open；30：Lifting platform (expanding element, pressing portion)；31：Ball-screw
Mechanism (expanding element)；33：Roller (expanding element, pressing portion)；34：Stage portion；35：Ball screw framework；36：Cylinder rod；40：Control
Unit processed；40a：Storage part；40b：Comparing section；40c：Drive control part；41：Notification unit；50：Elastic wave test sensor；
51：Elastic wave test sensor；52：Elastic wave test sensor；53：Elastic wave test sensor；C：Chip.
Specific implementation mode
Hereinafter, the sheet material expanding unit to present embodiment illustrates.Fig. 1 is the sheet material expanding unit of present embodiment
Stereogram.Fig. 2 and Fig. 3 is the sectional view for the 1st mode for showing sheet material expanding unit, and Fig. 4 shows sheet material expanding unit
The sectional view of 2nd mode, Fig. 5 are the sectional views for the 3rd mode for showing sheet material expanding unit, and Fig. 6 is to show sheet material expanding unit
The 4th mode sectional view.First, referring to figs. 1 to the structure of Fig. 3 pairs of the 1st mode to the common sheet material expanding unit of the 4th mode
It illustrates.In addition, sheet material expanding unit is not limited to the structure, can be suitably changed.
Sheet material expanding unit 1 shown in FIG. 1 keeps the ring-shaped frame 11 for constituting machined object unit 10, makes stickup
Extension piece 12 on ring-shaped frame 11 is extended and is split to machined object 13.The center of ring-shaped frame 11 be formed with by
Extend the circular opening 14 that piece 12 covers.Extension piece 12 is fixed on the back of the body of ring-shaped frame 11 in the peripheral edge margin of opening 14
Surface side, extension piece 12 being capable of flexible deformations in the inside region of opening 14.The extension piece 12 can elastic part it is viscous
It is attached on the back side of substantially disk-shaped machined object 13.Internal diameter of the outer diameter of machined object 13 than the opening 14 of ring-shaped frame 11
It is small, there is radial gap between the periphery 13a of machined object 13 and the inner circumferential (inner edge portion of opening 14) of ring-shaped frame 11.
The a plurality of segmentation preset lines 15 (referring to Fig.1) of clathrate intersection are provided on the front of machined object 13,
It is divided in each region that preset lines 15 mark off and is formed with various devices (illustration omitted).Also, in machined object 13
Portion is formed with the modification layer 16 as segmentation starting point along segmentation preset lines 15 (with reference to Fig. 2).In addition, modification layer 16 refers to because swashing
The irradiation of light and the density of inside as machined object 13, refractive index, mechanical strength or other physical characteristics and surrounding are not
With state, the region that is reduced compared with surrounding of intensity.In the present embodiment, it instantiates modification layer 16 and is used as segmentation starting point,
But as long as segmentation starting point is starting point when making the strength reduction of machined object 13 and being split, for example, it can be swash
Light processing groove, cutting slot, scribe line.
Sheet material expanding unit 1 has the frame fixed cell kept to the ring-shaped frame 11 of machined object unit 10
20.Frame fixed cell 20 has：Supporting station 21 is quadrangle when looking down；And cover board 23, cover from above bearing
The bearing surface 22 of platform 21.Supporting station 21 is by multiple supporting legs 24 from lower side bearing.Supporting station 21 and cover board 23 it is respective in
Centre is formed with identical with the opening 14 of ring-shaped frame 11 circular open of diameter 25,26.
As shown in Fig. 2, about machined object unit 10, machined object 13 is made upward to be positioned in ring-shaped frame 11
On bearing surface 22.When cover board 23 is mounted on supporting station 21 in this state, ring-shaped frame 11 is by the bearing of supporting station 21
Face 22 and cover board 23 are clamped and are kept, also, extend piece 12 can elastic part and machined object 13 opened positioned at circle
The inside of mouth 25,26.Cover board 23 is fixed on by fixture (not shown) etc. on supporting station 21, and thus ring-shaped frame 11 is in stationary state
Under be firmly held.
There is lifting platform 30 in the center of sheet material expanding unit 1.Lifting platform 30 has generally circular periphery shape when overlooking
Shape, diameter are smaller than the internal diameter of the circular open 25,26 in frame fixed cell 20.Lifting platform 30 is by multiple ball-screw machines
Structure 31 is by from lower side bearing.Each ball screw framework 31 has：Motor 31a；Ball-screw 31b, it is upward from motor 31a
Fang Yanshen is rotated by motor 31a；Nut 31c is screwed togather with ball-screw 31b；And supporting leg 31d, with
Nut 31c connections.Nut 31c and supporting leg 31d limits the rotation centered on axis of ball-screw 31b, in supporting leg
The upper end of 31d is fixed with lifting platform 30.Therefore, when the motor 31a to each ball screw framework 31 is driven and makes ball
When leading screw 31b rotations, nut 31c and supporting leg 31d are moved up and down and lifting platform 30 are made to lift.Lifting platform 30 can be moved to ratio
The position of readiness on the lower of supporting station 21 and the jack-up position more against the top than supporting station 21 (with reference to Fig. 3), in lifting platform 30 from waiting for
Seat in the plane set be moved to jack up position when, pass through from the inside of circular open 25,26, from below upward push extension piece 12.
Extension piece 12 is set to extend by the pushing.That is, making extension piece 12 expand to constitute by lifting platform 30 and ball screw framework 31
The expanding element of exhibition, wherein the lifting platform 30 is the pressing portion pushed to extension piece 12, which makes liter
Platform 30 is dropped to lift.
It is entirely circumferentially provided with multiple rollers 33 on the outer rim edge of lifting platform 30.As shown in Fig. 2, multiple rollers 33 are respectively in step
It is supported to pivot about with axle portion 33a in portion 34, which is formed in the outer rim of lifting platform 30.Work as liter
When dropping the rising of platform 30, each roller 33 is contacted with the lower surface of extension piece 12 and is pushed.Each roller 33 pushes extension piece 12
Position be region of the inner circumferential (opening 14 inner edge portion) of ring-shaped frame 11 between the periphery 13a of machined object 13.
In above sheet material expanding unit 1, when the motor 31a to ball screw framework 31 is driven and make lifting
When platform 30 gradually moves upward from position of readiness, as shown in Fig. 2, multiple rollers 33 with positioned at the inside of circular open 25,26
Extend the lower surface contact of piece 12.When making the side's movement further up of lifting platform 30, the machined object 13 in piece 12 is extended
Sticking area is boosted, the power drawing in extension piece 12 direction shown in arrow F1 in Fig. 3.Being added in piece 12 is extended as a result,
The sticking area of work object 13 is extended radially.Then, machined object 13 is acted on towards the external force of expanding direction, to be formed
Modification layer 16 (Fig. 2) in machined object 13 is that starting point cracks on the thickness direction of machined object 13.To being processed
Object 13 applies external force until the positive back side of penetration of cracks machined object 13, makes a reservation for along segmentation to which machined object 13 is divided into
Each chip C (Fig. 3) of line 15 (Fig. 1).It, can be with subtle degree by using ball screw framework 31 in the expansion unit
The lifting of lifting platform 30 is adjusted, or the lifting speed of lifting platform 30 can be changed and suitably manage the fracture of machined object 13
Speed.
As shown in figure 3, by lifting platform 30 will extend make its extension by piece 12 jacks up when, the angle for extending piece 12 can be
The peripheral edge portion of lifting platform 30 changes.By configuring multiple rollers 33, can inhibit to extend piece 12 with lifting platform 30 in outer rim
Friction at part, can swimmingly be extended.
After the segmentation of machined object 13 is completed, the motor 31a of ball screw framework 31 is driven and makes liter
Drop platform 30 drops to position of readiness.Then, fixation of the frame fixed cell 20 to ring-shaped frame 11 is released, by machined object unit
10 remove from sheet material expanding unit 1.
In the extension of above such sheet material expanding unit 1 disconnects, need that lifting platform 30 is made to be moved to top until quilt
Machining object 13 is fully segmented into all chip C as shown in Figure 3.When lifting platform 30 is insufficient relative to the jack-up amount of extension piece 12
When, it can remain the undivided region not being suitably divided in the region along segmentation preset lines 15 of machined object 13.Separately
On the one hand, when the jack-up of lifting platform 30 amount is excessive, extension piece 12 is possible to cannot withstand extension and produce fracture.Therefore, it
Seek the jack-up amount for setting lifting platform 30 neither too much nor too littlely.But the deviation of the property according to extension piece 12 or machined object 13, it is
The external force for being split with not remaining undivided region and needing can be fine different, therefore are difficult entirely to set lifting platform
30 jack-up amount.Present embodiment can easily manage the jack-up of lifting platform 30 according to the state of the segmentation of machined object 13
Amount, below illustrates its feature.
Fig. 2 and the sheet material expanding unit 1 of the 1st mode shown in Fig. 3 have control unit 40, notification unit 41 and elasticity
Wave detection sensor 50.Control unit 40 is uniformly controlled sheet material expanding unit 1, by execute various processing processor or
The compositions such as memory.Notification unit 41 can be shown by picture, be shone, sound etc. notifies aftermentioned error condition, by being arranged
In compositions such as the display pictures, illumination region, loud speaker of sheet material expanding unit 1.
Elastic wave test sensor 50 is for example by having the function of detecting the AE sensors (acoustic emission sensor) of elastic wave
It constitutes.Specifically, there is elastic wave test sensor 50 ultrasonic wave for the inside for being fixed on fixed flange (illustration omitted) to shake
Sub (illustration omitted).Ultrasonic oscillator is for example by barium titanate (BaTiO3), lead zirconate titanate (Pb (Zr, Ti) O3), lithium niobate
(LiNbO3), lithium tantalate (LiTaO3) etc. materials formed, have will vibrate the property for being converted into voltage (vibration signal).
As shown in Figures 2 and 3, elastic wave test sensor 50 is mounted on lifting platform 30, especially in lifting platform 30
Roller 33 following location directly be configured with elastic wave test sensor 50.When making extension piece 12 extend as shown in Figure 3, deformation
Energy is discharged along with the fracture of machined object 13 as elastic wave.The elastic wave generated by the segmentation of the machined object 13
Elastic wave test sensor 50 is traveled to via roller 33 and lifting platform 30, wherein the roller 33 is contacted with extension piece 12, the lifting platform
30 are supported by axle portion 33a two pairs of rollers 33.Elastic wave test sensor 50 detect propagated elastic wave and by output signal
It is output to control unit 40.
Output signal detected by elastic wave test sensor 50 is converted into exporting by signal processing part (illustration omitted)
Voltage and be input to control unit 40.Control unit 40 has storage part 40a, comparing section 40b and drive control part 40c.It deposits
Storage portion 40a is made of above-mentioned memory, prestores the elastic wave for the completed state of segmentation for indicating machined object 13
The output signal of detection sensor 50 is as threshold data.What the extension that comparing section 40b is carried out in sheet material expanding unit 1 disconnected
It is compared, judges to being stored in the threshold value of storage part 40a and the output signal from elastic wave test sensor 50 in the process
Whether output signal has reached threshold value.Drive control part 40c is controlled to the action of the motor 31a of ball screw framework 31
The position of system.According to the judging result of comparing section 40b, by drive control part 40c come the continuation of the action to motor 31a or
Stopping is controlled.
In more detail, (segmentation) is broken into each chip according to machined object 13 well without remaining undivided region
The output signal of elastic wave test sensor 50 when C, sets above-mentioned threshold value.Fig. 7 is to show elastic wave test sensor 50
Testing result example chart.In the graph in figure 7, the longitudinal axis is the AE values that elastic wave test sensor 50 is exported, horizontal
Axis is the time, the chart be detect make the rising of lifting platform 30 start after to stopping until obtained by result.When processed
AE values become larger when object 13 is broken and generates elastic wave.The output waveform W1 of AE values shown in Fig. 7 indicates that machined object 13 is not residual
The case where staying undivided region and fragmenting into each chip C completely.According to output waveform W1 come given threshold.For example, will indicate
The accumulation output of the AE values for the area in region that output waveform W1 is divided is set as threshold value.In given threshold, by making
The jack-up amount of lifting platform 30 is more, is easy judgement segmentation and completes time point.The threshold value being achieved in that is stored in storage part 40a
In.
Then, the machined object unit 10 that carry undivided machined object 13 is arranged in sheet material expanding unit 1,
The motor 31a of ball screw framework 31 is driven on one side and lifting platform 30 is made to increase with defined speed, is utilized on one side
Control unit 40 monitors the output signal of elastic wave test sensor 50.Control unit 40 is deposited using comparing section 40b to compare
It is stored in the threshold value of storage part 40a and the output signal from elastic wave test sensor 50, to carry out defined processing or move
It manages.Specifically, to the accumulation of the output waveform W1 of the Fig. 7 stored as threshold value output, (output waveform W1 is divided
Area in region) and the accumulation output (output wave of the output waveforms of the AE values of elastic wave test sensor 50 that actually obtains
The area in region that shape is divided) it is compared, in the case where they are equal, can be judged as not remaining undivided area
Domain and make machined object 13 completely be broken.On the other hand, output waveform W2 as shown in Figure 7 like that, the accumulations of AE values output
In the case that (area in region that output waveform W2 is divided) is not up to the accumulation output of the output waveform W1 as threshold value,
It is judged as that the fracture of machined object 13 is insufficient, remains undivided region.
As the processing or action management carried out according to above comparison result, for example, being sensed from elastic wave test
When the output signal of device 50 has reached threshold value, the action of the motor 31a of ball screw framework 31 is made by drive control part 40c
(jack-up of lifting platform 30 acts) stops.In the case where the output signal from elastic wave test sensor 50 is equal with threshold value
It may determine that and be broken completely for machined object 13, therefore, it is determined that it is abundant for the upper jack-up amount for extension piece 12 at the time point,
Lifting platform 30 can also be made to stop.Also, since the jack-up of the lifting platform 30 on time point amount is required minimum limit, so
Excessive load will not be applied to extension piece 12, can prevent from being broken.It is completed that is, can be measured with neither too much nor too little best jack-up
For the pushing of extension piece 12.Furthermore, it is contemplated that some detection errors, can also control to be passed from elastic wave test
The output signal of sensor 50 has reached the moment of threshold value, but makes ball after the defined time (defined drive volume)
The motor 31a of screw mechanism 31 stops.
Also, it can also carry out testing etc. and obtaining type, the processing conditions phase with machined object 13, extension piece 12 in advance
The value of suitable jack-up amount is used as benchmark jack-up amount, when making lifting platform 30 move upward in the segmentation process in certain machined object 13
When moving benchmark jack-up amount, the threshold value by being stored in storage part 40a and the output signal from elastic wave test sensor 50
Comparison judge whether the segmentation of machined object 13 is completed.Regardless of whether lifting platform 30 has been made to be moved upward benchmark jack-up
Amount, in the case where the output signal from elastic wave test sensor 50 is not up to threshold value as the output waveform W2 of Fig. 7,
It is judged as remaining unbroken region on machined object 13.In this case, indicate that there are unbroken from comparing section 40b outputs
The error signal in region.When output error signal, control unit 40 carries out defined error handle.
In error handle, notification unit 41 can be used to carry out the notice of error condition.Operating personnel's acceptance error shape
The notice of state and sheet material expanding unit 1 is operated, be adjusted lifting platform 30 jack-up amount etc. countermeasures.At this point,
The comparison that can continue the output signal and threshold value of elastic wave test sensor 50 by control unit 40, to continue to judge
With notify the presence or absence of unbroken region.In such manner, it is possible to according to actually whether remaining has the testing result in undivided region come high
The jack-up amount of lifting platform 30 is adjusted to precision, rather than according to the visual measurement of operating personnel.Also, as error handle, control
Unit 40 processed can also automatically adjust the jack-up amount of lifting platform 30.
In addition, it is assumed that in the case where producing the destruction of extension piece 12 for some reason, it can also pass through control unit
40 and elastic wave test sensor 50 detect.Elastic wave test sensor 50 is disposed in proximity to the roller 33 contacted with extension piece 12
Position, the elastic wave that generates is easy to travel to elastic wave test sensor 50 due to extending the destruction of piece 12.Due to extending
Waveform for the elastic wave that piece 12 generates when being destroyed etc. and the elasticity usually generated when machined object 13 is broken during extension disconnects
Wave is different, so can identify.It is different when being detected from the fracture of machined object 13 using elastic wave test sensor 50
When the elastic wave of exception, control unit 40 can be judged as producing the destruction of extension piece 12.Alternatively, bullet can also be advanced with
Property wave detection sensor 50 store in storage part 40a detecting elastic wave when extension piece 12 is destroyed, utilize comparing section
40b is compared with the abnormal elastic wave of the storage data is detected, judges whether the destruction for producing extension piece 12.When
It is judged as in the case of arbitrary in the case of producing the destruction for extending piece 12, is preferably executed by notification sheet by control unit 40
Member 41 stops to the action of the motor 31a of the notice and ball screw framework 31 of operating personnel, to prevent the expansion of damage.
Be arranged elastic wave test sensor position or elastic wave test sensor type can also with it is described above
1st mode is different, as its variation, shows that the sheet material of the 2nd mode, the 3rd mode and the 4th mode expands in fig. 4 to fig. 6
Extending apparatus.The element in addition to elastic wave test sensor of each mode of 2nd mode, the 3rd mode and the 4th mode with it is above-mentioned
The 1st mode it is identical, the explanation to identical element is omitted.
The sheet material expanding unit 1 of 2nd mode shown in Fig. 4 makes elastic wave test sensor 51 be contacted with extension piece 12.Bullet
Property wave detection sensor 51 be located at quilt in radial (horizontal direction in the case that upper and lower directions of Fig. 4 is set as vertical direction)
Near the center of machining object 13, contacted from lower face side with extension piece 12.
Elastic wave test sensor 51 is by ball screw framework 35 from lower side bearing.Ball screw framework 35 has：It is electronic
Machine 35a；Ball-screw 35b extends upward from motor 35a, is rotated by motor 35a；Nut 35c,
It is screwed togather with ball-screw 35b, and limits rotation；And supporting leg 35d, link with nut 35c, the ball screw framework 35
Elastic wave test sensor 51 is supported on to the upper end of supporting leg 35d.Make ball-screw when being driven to motor 35a
When 35b rotates, nut 35c and supporting leg 35d are moved up and down and elastic wave test sensor 51 are made to lift.When passing through ball-screw
When the driving of mechanism 31 makes lifting platform 30 carry out lifting action, ball screw framework 35 makes elastic wave test pass by drive control
Sensor 51 is also linkedly lifted, to the state for maintaining elastic wave test sensor 51 to be contacted with extension piece 12.Also, because
The fracture of machined object 13 and the elastic wave that generates travels to elastic wave test via the extension piece 12 for being pasted with machined object 13
Sensor 51.
About the sheet material expanding unit 1 of the 3rd mode shown in fig. 5, examined configured with elastic wave in the top of machined object 13
Survey sensor 52.Elastic wave test sensor 52 is separated with machined object 13, the elasticity generated by the fracture of machined object 13
Wave reaches elastic wave test sensor 52 as the sound wave propagated in air.Elastic wave test sensor 52 and above-mentioned AE
Sensor is different, and the microphone by that can detect the relatively low sound wave of the frequency comprising audio-band is constituted, and will be processed
The vibration of the air generated when the fracture of object 13 is converted into electric signal and is output to control unit 40.
In order to make the testing conditions of elastic wave test sensor 52 stablize, jack-up action is preferably being carried out by lifting platform 30
When the distance between machined object 13 and elastic wave test sensor 52 are remained it is constant.I.e., it is possible to which elastic wave test is made to pass
Sensor 52 linkedly carries out lifting action with lifting platform 30.
About the sheet material expanding unit 1 of the 4th mode shown in fig. 6, not in lifting platform 30 in 20 side of frame fixed cell
It is provided with elastic wave test sensor 53.Elastic wave test sensor 53 be inserted into the hole portion for being formed in cover board 23 and with added
The ring-shaped frame 11 of work object unit 10 abuts.The elastic wave generated when machined object 13 is broken is from extension piece 12 via cyclic annular frame
Frame 11 travels to elastic wave test sensor 53.
The elastic wave test sensor 50,51 and 53 of each mode of Fig. 4 and Fig. 6 can be with the 1st above-mentioned mode (Fig. 2, figure
3) elastic wave test sensor 50 is equally made of AE sensors.By using AE sensors, can be not readily susceptible to
The high-precision detection of the influences such as the noise of surrounding.The object and arrival that each elastic wave test sensor 50,51 and 53 is contacted
The propagation path of elastic wave before sensor is mutually different, and the different AE for being suitable for respective condition can suitably be selected to pass
Sensor uses.
As described above, in the present embodiment, the elastic wave generated by the fracture of machined object 13 is detected, on one side will
It is compared with the threshold value of elastic wave when indicating that machined object 13 is broken well, is extended the expansion of piece 12 on one side
Exhibition, according to the result of the comparison, carries out the output of error signal and the action control etc. of lifting platform 30.As a result, without relying on logical
The higher management of difficulty as the adjustment of operating personnel visually measured is crossed, can easily be set neither too much nor too little best
Extend the extended mode of piece 12.
The machined object 13 for the division processing object that sheet material expanding unit 1 as present embodiment is carried out, for example,
Semiconductor device wafer, optical device wafer, package substrate, semiconductor substrate, inorganic material substrate, oxide wafer can be used
Etc. various workpiece.As semiconductor device wafer, silicon wafer or compound semiconductor wafer after device can also being used to be formed.
As optical device wafer, sapphire wafer or silicon carbide wafer after device can also being used to be formed.Also, as encapsulation base
Plate can also use CSP (Chip Size Package：Chip size packages) substrate can also make as semiconductor substrate
It, can also sapphire, ceramics, glass etc. as inorganic material substrate with silicon or GaAs etc..In addition, as oxide wafer,
Device can also be used to form the lithium tantalate before rear or device is formed, lithium niobate.
Also, the object for the division processing that the sheet material expanding unit of the present invention is carried out is not limited to as described above added
Work object.For example, it is also possible to by be pasted onto machined object is split obtained from each chip the back side on DAF (Die
Attach Film) as film-like adhesive as segmentation object.About film-like adhesive, can divide by machined object
It is split together with machined object when being cut into each chip, it can also be after being divided into each chip only to film-like adhesive
It is split.
Also, in the present embodiment, instantiating makes (the paste section of the machined object 13 in extension piece 12 of lifting platform 30
Point) carried out relative to frame fixed cell 20 (ring-shaped frame 11) lifting moving type sheet material expanding unit 1, but can also
Apply do not make in contrast to this machined object 13 move and make ring-shaped frame 11 carry out lifting moving type sheet material extension
In device.Specifically, the part that will be equivalent to lifting platform 30 is changed to without that will extend piece 12 and machined object up and down
13 are supported on the supporting table of certain position, and will be equivalent to the part of frame fixed cell 20, be changed to being capable of lifting moving
Lifting unit.When being extended disconnection, the lifting unit of holding ring-shaped frame 11 is made to be moved to lower section.At this point, supporting table
Itself is not moved, but by the drawing force moved downwards along with ring-shaped frame 11, and extension piece 12 is pushed in bearing on one side
It is extended on one side on workbench.Therefore, same as the lifting platform of the above embodiment 30, supporting table is used as in extension piece 12
Machined object 13 the pressing portion that is pushed of sticking area and function.
The sheet material of such type for moving machined object 13 and making 11 lifting moving of ring-shaped frame is being extended into dress
It sets in the case of apply in Fig. 4 or Fig. 5 modes, since the upper and lower directions position of machined object 13 does not change, so bullet
Property wave detection sensor 51,52 is configured to without lifting action.
The sheet material expanding unit for applying the present invention can be used alone, and can also be used as multiple free group of processing units
The part of integration module system closed and constituted uses.
Also, the embodiments of the present invention are illustrated, but as the other embodiment of the present invention, it can also
The above embodiment and variation are globally or locally combined.
Also, embodiments of the present invention are not limited to above-mentioned embodiment and variation, can also not depart from
It is made various changes in the range of the purport of the technological thought of the present invention, replaces, deforms.In addition, if because technology progress or
The other technologies that derive and other modes can be utilized to realize the technological thought of the present invention, then can also be come using this method real
It applies.Therefore, it can include all embodiments within the scope of the technical idea of the present invention that claims, which cover,.
Industrial availability
As described above, machined object and film-like adhesive are divided in the present invention extension piece being made to extend
In the sheet material expanding unit cut, have the following effects that：It can reliably be split without remaining undivided region, and can
The generation for inhibiting the fracture of extension piece, the sheet material expanding unit to improving productivity and the higher division processing of precision prescribed have
With.
Claims (1)
1. a kind of sheet material expanding unit, by the extension piece being pasted onto on the back side of machined object or on the back side of film-like adhesive
The machined object is supported on to the ring-shaped frame for having opening in center, the machined object is predetermined along a plurality of segmentation of intersection
Line is formed with segmentation starting point, and the film-like adhesive is pasted on the back side of each chip after singulation, in the scenario above, should
Sheet material expanding unit is extended the extension piece and is split to the machined object or along each along the segmentation starting point
Chip is split the film-like adhesive, which is characterized in that
The sheet material expanding unit has：
Ring-shaped frame fixed cell has the bearing surface supported to the ring-shaped frame of machined object unit, and to carrying
The ring-shaped frame set on the bearing surface is fixed；
Expanding element, using pressing portion to being added with this by the inner circumferential of the fixed ring-shaped frame of ring-shaped frame fixed cell
The extension piece between the periphery of work object is pushed and is extended to the extension piece；
Elastic wave test sensor, detection are extended the extension piece and the machined object are made to be broken along the segmentation starting point
When or the film-like adhesive along each chip fracture when generated elastic wave；And
Control unit,
The control unit has storage part, and when which is broken the machined object along the segmentation starting point completely or this is membranaceous
The value of output signal from the elastic wave test sensor when bonding agent is broken completely along each chip is pre- as benchmark
First stored as threshold value,
When so that the machined object is broken along the segmentation starting point being extended to the extension piece or make the film-like adhesive edge
In the case that the output signal from the elastic wave test sensor is not up to threshold value when each chip fracture, it is considered as presence
Unbroken region and output error signal.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
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| JP2017058814A JP6814674B2 (en) | 2017-03-24 | 2017-03-24 | Seat expansion device |
| JP2017-058814 | 2017-03-24 |
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| CN108630592A true CN108630592A (en) | 2018-10-09 |
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| JP (1) | JP6814674B2 (en) |
| KR (1) | KR102326394B1 (en) |
| CN (1) | CN108630592B (en) |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111952235A (en) * | 2019-05-17 | 2020-11-17 | 三菱电机株式会社 | Semiconductor manufacturing apparatus and method for manufacturing semiconductor device |
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| JP7285636B2 (en) * | 2018-12-06 | 2023-06-02 | 株式会社ディスコ | Plate-like material processing method |
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| CN105226018A (en) * | 2014-06-27 | 2016-01-06 | 株式会社迪思科 | Band extension fixture |
| CN105304561A (en) * | 2014-06-12 | 2016-02-03 | 株式会社迪思科 | Wafer processing method |
| CN105321865A (en) * | 2014-06-13 | 2016-02-10 | 株式会社迪思科 | Tape expanding apparatus |
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| WO2004105109A1 (en) * | 2003-05-22 | 2004-12-02 | Tokyo Seimitsu Co., Ltd. | Dicing device |
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| JP2007268563A (en) * | 2006-03-31 | 2007-10-18 | Toray Eng Co Ltd | Laser scribing apparatus and method |
| JP2009064905A (en) * | 2007-09-05 | 2009-03-26 | Disco Abrasive Syst Ltd | Extension method and extension apparatus |
| JP5931772B2 (en) * | 2013-02-13 | 2016-06-08 | 株式会社東芝 | Semiconductor manufacturing equipment |
| JP2015177060A (en) * | 2014-03-14 | 2015-10-05 | 株式会社東芝 | Semiconductor manufacturing apparatus and semiconductor device manufacturing method |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101577217A (en) * | 2008-05-09 | 2009-11-11 | 株式会社迪思科 | Breaking apparatus for membraniform adhesive and breaking method thereof |
| CN105304561A (en) * | 2014-06-12 | 2016-02-03 | 株式会社迪思科 | Wafer processing method |
| CN105321865A (en) * | 2014-06-13 | 2016-02-10 | 株式会社迪思科 | Tape expanding apparatus |
| CN105226018A (en) * | 2014-06-27 | 2016-01-06 | 株式会社迪思科 | Band extension fixture |
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| CN111952235A (en) * | 2019-05-17 | 2020-11-17 | 三菱电机株式会社 | Semiconductor manufacturing apparatus and method for manufacturing semiconductor device |
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| TW201835992A (en) | 2018-10-01 |
| CN108630592B (en) | 2023-07-07 |
| JP6814674B2 (en) | 2021-01-20 |
| KR102326394B1 (en) | 2021-11-12 |
| TWI755505B (en) | 2022-02-21 |
| KR20180108457A (en) | 2018-10-04 |
| JP2018163917A (en) | 2018-10-18 |
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