CN108628103B - Automatic light intensity uniformity adjusting device and adjusting method - Google Patents

Automatic light intensity uniformity adjusting device and adjusting method Download PDF

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Publication number
CN108628103B
CN108628103B CN201710154369.1A CN201710154369A CN108628103B CN 108628103 B CN108628103 B CN 108628103B CN 201710154369 A CN201710154369 A CN 201710154369A CN 108628103 B CN108628103 B CN 108628103B
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light intensity
adjusting
lens
automatic
standard data
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CN108628103A (en
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杨鹏
陈昌利
何�雄
张轲
姚宏忠
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Semiconductor Manufacturing International Shanghai Corp
Semiconductor Manufacturing International Beijing Corp
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Semiconductor Manufacturing International Shanghai Corp
Semiconductor Manufacturing International Beijing Corp
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • G03F7/70558Dose control, i.e. achievement of a desired dose

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

The invention discloses a light intensity uniformity automatic regulating device and a regulating method, comprising a light intensity real-time detection system, a light intensity analysis system and a light intensity automatic regulating system; the light intensity real-time monitoring system detects the light intensity on the wafer worktable and transmits the detection result to the light intensity analysis system; the light intensity analysis system combines a standard data to generate an adjusting signal and transmits the adjusting signal to the light intensity automatic adjusting system; the automatic light intensity adjusting system adjusts the light intensity of the light emitted by the light source according to the adjusting signal. Therefore, the loss of the lens can be compensated and reduced in advance, and the aim of light intensity uniformity is finally achieved, so that the uniformity of the CD can be improved, and the photoetching quality is improved; moreover, the frequency of replacing elements of the equipment is reduced, and the cost is effectively saved.

Description

Automatic light intensity uniformity adjusting device and adjusting method
Technical Field
The invention relates to the technical field of semiconductors, in particular to an automatic light intensity uniformity adjusting device and an adjusting method.
Background
The photolithography process is an important part of semiconductor production and directly restricts the quality of products. The factors influencing the lithographic process mainly include two aspects, a technical aspect and an equipment aspect. Since the photolithography apparatus is essential for performing the photolithography process, it is important to ensure the accuracy of the photolithography apparatus.
However, equipment loss is inevitable, and in general, when the equipment loss occurs, the equipment condition is improved by replacing spare elements. However, the cost of the lithographic equipment is extremely high, and the equipment is replaced as soon as loss occurs, which is not beneficial to reducing the production cost.
Disclosure of Invention
The invention aims to provide an automatic light intensity uniformity adjusting device and an automatic light intensity uniformity adjusting method, which are used for improving the situation of uneven light intensity caused by lens loss.
In order to solve the above technical problem, the present invention provides an automatic light intensity uniformity adjusting device, comprising:
the system comprises a light intensity real-time detection system, a light intensity analysis system and a light intensity automatic adjustment system; the light intensity real-time monitoring system detects the light intensity on the wafer worktable and transmits the detection result to the light intensity analysis system; the light intensity analysis system combines a standard data to generate an adjusting signal and transmits the adjusting signal to the light intensity automatic adjusting system; the automatic light intensity adjusting system adjusts the light intensity of the light emitted by the light source according to the adjusting signal.
Optionally, for the light intensity uniformity automatic adjusting device, the light intensity real-time detection system is arranged in the wafer workbench, and the upper surface of the light intensity real-time detection system is flush with the upper surface of the wafer workbench.
Optionally, for the light intensity uniformity automatic regulating apparatus, the light intensity real-time detection system includes a sensor, the sensor is movably disposed in the wafer worktable, and scanning of the wafer worktable is completed line by line from one corner of the wafer worktable.
Optionally, for the automatic light intensity uniformity adjusting device, in the scanning process of the sensor, every time when the sensor passes through the position of one exposure unit, the light intensity information of the position of the exposure unit is recorded as a detection result and transmitted to the light intensity analyzing system.
Optionally, for the automatic light intensity uniformity adjusting device, the light intensity analyzing system includes a single chip microcomputer and a standard data input module, the single chip microcomputer determines whether the detection result covers the positions of all the exposure units, determines whether the standard data input by the standard data input module matches the number of all the exposure units, and compares the detection result with the standard data to generate an adjusting signal.
Optionally, for the automatic light intensity uniformity adjusting device, the light intensity analyzing system further includes: and the detection result transmitted by the sensor is an electric signal, and the electric signal is converted into a digital signal by the analog-to-digital converter and transmitted to the singlechip.
Optionally, for the automatic light intensity uniformity adjusting device, the light intensity analyzing system further includes a driver, and the driver transmits the adjusting signal to the automatic light intensity adjusting system.
Optionally, for the automatic light intensity uniformity adjusting device, the automatic light intensity adjusting system includes: the motor drives the transmission module to transmit the action to the position adjusting module under the driving of the adjusting signal, so that the position adjusting module performs position adjustment, and the optical adjusting module changes the light intensity of the light emitted by the light source.
Optionally, for the automatic light intensity uniformity adjusting device, the transmission module includes a motor output shaft, a coupler and a screw rod driving shaft, the motor output shaft transmits the motion of the motor to the coupler, and the coupler drives the screw rod driving shaft to enable the position adjusting module to adjust the position.
Optionally, for the automatic light intensity uniformity adjusting device, the position adjusting module includes: the nut is sleeved on the screw rod, and the coupler drives the screw rod driving shaft to enable the screw rod to rotate, so that the position of the nut is changed.
Optionally, for the automatic light intensity uniformity adjusting device, the optical adjusting module includes: the first lens is fixed in position, the second lens is arranged on the nut, and the relative position of the first lens and the second lens is changed along with the change of the position of the nut.
Optionally, for the automatic light intensity uniformity adjusting device, the optical adjustment module further includes a housing, two opposite surfaces of the housing are provided with an input plane mirror and an output plane mirror, and the first lens and the second lens are disposed between the input plane mirror and the output plane mirror.
Optionally, for the automatic light intensity uniformity adjusting device, the housing has an opening, and the second lens is connected to the nut at the opening.
The invention also provides an adjusting method of the automatic light intensity uniformity adjusting device, which comprises the following steps:
turning on a light source;
the light intensity real-time monitoring system detects the light intensity on the wafer worktable and transmits the detection result to the light intensity analysis system;
the light intensity analysis system combines a standard data to generate an adjusting signal and transmits the adjusting signal to the light intensity automatic adjusting system;
the automatic light intensity adjusting system adjusts the light intensity of the light emitted by the light source according to the adjusting signal.
Optionally, for the adjusting method of the light intensity uniformity automatic adjusting device, the light intensity real-time detection system includes a sensor, the wafer worktable is scanned line by line from one corner of the wafer worktable, and light intensity information of the position of the exposure unit is recorded as a detection result and transmitted to the light intensity analysis system every time the wafer worktable passes through the position of the exposure unit.
Optionally, for the adjusting method of the automatic light intensity uniformity adjusting device, the light intensity analyzing system comprises a single chip microcomputer and a standard data input module, and the single chip microcomputer counts the detection results until all the positions of the exposure units are included; meanwhile, counting the standard data input by the standard data input module until the standard data are matched with the number of all the exposure units; and then comparing the detection result with standard data to generate an adjusting signal.
Optionally, for the adjusting method of the light intensity uniformity automatic adjusting device, the light intensity automatic adjusting system includes: the motor drives the transmission module to transmit the action to the position adjusting module under the driving of the adjusting signal, so that the position adjusting module performs position adjustment, and the optical adjusting module changes the light intensity of the light emitted by the light source.
The invention provides a light intensity uniformity automatic regulating device and a regulating method, comprising a light intensity real-time detection system, a light intensity analysis system and a light intensity automatic regulating system; the light intensity real-time monitoring system detects the light intensity on the wafer worktable and transmits the detection result to the light intensity analysis system; the light intensity analysis system combines a standard data to generate an adjusting signal and transmits the adjusting signal to the light intensity automatic adjusting system; the automatic light intensity adjusting system adjusts the light intensity of the light emitted by the light source according to the adjusting signal. Therefore, the loss of the lens can be compensated and reduced in advance, and the aim of light intensity uniformity is finally achieved, so that the uniformity of the CD can be improved, and the photoetching quality is improved; moreover, the frequency of replacing elements of the equipment is reduced, and the cost is effectively saved.
Drawings
FIG. 1 is a schematic diagram of a main portion of a projection lithography machine;
FIG. 2 is a schematic diagram of a projection lithography machine including an automatic light intensity uniformity adjusting apparatus according to an embodiment of the present invention;
FIGS. 3-4 are schematic distribution diagrams of a real-time light intensity detection system according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a movement path of a real-time light intensity detection system according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of a light intensity analyzing system according to an embodiment of the present invention;
FIG. 7 is a diagram illustrating an automatic light intensity adjusting system according to an embodiment of the present invention;
FIG. 8 is a flowchart illustrating a method for automatically adjusting light intensity uniformity according to an embodiment of the present invention;
FIG. 9 is a schematic diagram illustrating the operation of the light intensity analyzing system according to an embodiment of the present invention;
FIG. 10 is a view showing a light intensity distribution of an exposure unit before improvement using the automatic light intensity uniformity adjusting apparatus of the present invention;
FIG. 11 shows a light intensity distribution of the exposure unit after being improved by the automatic light intensity uniformity adjusting apparatus of the present invention.
Detailed Description
The automatic light intensity uniformity adjusting apparatus and adjusting method according to the present invention will be described in more detail with reference to the accompanying schematic drawings, in which preferred embodiments of the present invention are shown, and it is understood that those skilled in the art can modify the present invention described herein while still achieving the advantageous effects of the present invention. Accordingly, the following description should be construed as broadly as possible to those skilled in the art and not as limiting the invention.
The invention is described in more detail in the following paragraphs by way of example with reference to the accompanying drawings. Advantages and features of the present invention will become apparent from the following description and from the claims. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
Referring to FIG. 1, the main parts of a projection lithography machine are shown. Including a light source 100, a relay lens 101, a mirror 102, a reticle stage 103, a lens 104, and a wafer stage 105. Light emitted by the light source 100 passes through an illumination system (including a Beam Matching Unit (BMU), a fly lens, an aperture, a zoom lens, a shading unit and the like, not shown in the figure) to perform a series of optical processing, such as smooth diffraction effect, uniform illumination, filtering and cold light processing, strong light illumination, light intensity adjustment and the like, and a beam of light with the highest light intensity and the best uniformity is reflected by the reflector 102 through the relay lens 101 and irradiates on a mask of the mask worktable 103, and a pattern on the mask is projected onto a wafer through the lens 104 to be imaged. Due to the special design of the lens 104, after the light passes through the exposure area of the lens with reduced magnification, a pattern with the size of only 1/4 or 1/5 and rotated by 180 degrees is formed on the surface of the wafer. The method has the advantages that the mask layout has more relaxed line width design, and the line width of one fourth or one fifth of the mask layout can be obtained after exposure. In addition, the defects on the mask pattern caused by design or other reasons can also become one fourth or one fifth of the original size after the exposure of the lens with the reduced magnification, so that the defect rate of the product is favorably reduced. The exposure operation is repeated with simultaneous movement of the mask stage and the wafer stage until the entire wafer surface is exposed.
However, as the machine is used for a longer time, the light intensity tends to be uneven. The inventor finds that the reason of the uneven light intensity in long-term production is that the light source intensity is high, the central use frequency of the lens 104 is high, the damage is serious, the peripheral use frequency is low, the damage is slight, and finally the central light intensity is low and the peripheral light intensity is high. The CD (line width) uniformity of the produced product is also poor, the exposure is not uniform, the yield is low, and the equipment cannot produce high-precision products. In this case, the lens 104 is usually replaced.
On this basis, the inventors thought that defects due to damage to the lens 104 could be ameliorated by adjusting the light intensity distribution. Accordingly, an automatic light intensity uniformity adjusting device is provided, comprising:
the system comprises a light intensity real-time detection system, a light intensity analysis system and a light intensity automatic adjustment system; the light intensity real-time monitoring system detects the light intensity on the wafer worktable and transmits the detection result to the light intensity analysis system; the light intensity analysis system combines a standard data to generate an adjusting signal and transmits the adjusting signal to the light intensity automatic adjusting system; the automatic light intensity adjusting system adjusts the light intensity of the light emitted by the light source according to the adjusting signal.
The following describes the automatic light intensity uniformity adjusting device and the adjusting method of the present invention in detail with reference to fig. 2 to 9.
As shown in fig. 2, the automatic light intensity uniformity adjusting apparatus according to the present invention is shown together with the main part of a projection lithography machine in order to make it easier for the reader to understand. The method comprises the following steps:
the system comprises a light intensity real-time detection system 1, a light intensity analysis system 2 and a light intensity automatic adjustment system 3; the light intensity real-time monitoring system 1 detects the light intensity on the wafer worktable 9 and transmits the detection result to the light intensity analysis system 2; the light intensity analysis system 2 combines a standard data to generate an adjusting signal and transmits the adjusting signal to the light intensity automatic adjusting system 3; the automatic light intensity adjusting system 3 adjusts the light intensity of the light emitted by the light source according to the adjusting signal.
That is, after the light emitted from the light source 4 is adjusted at the front end, the light passes through the relay lens 5 and the automatic light intensity adjusting system 3, is reflected by the reflector 6, and then is irradiated onto the mask of the mask worktable 6, and then enters the lens 8, and is irradiated onto the wafer worktable 9, so that the mask pattern is displayed on the wafer of the wafer worktable 9. However, as described above, the light intensity reaching the wafer stage 9 is not uniform, which is disadvantageous for controlling the CD. Therefore, the light intensity real-time detection system 1 of the invention realizes the detection of the light intensity on the wafer worktable 9, and after the light intensity is analyzed by the light intensity analysis system 2, the automatic light intensity adjustment system 3 adjusts the light intensity emitted by the light source 4 until the light intensity irradiated on the wafer worktable 9 is uniform.
As shown in fig. 3 and 4, the real-time light intensity detection system 1 is disposed in the wafer stage 9, and the upper surface of the real-time light intensity detection system 1 is flush with the upper surface of the wafer stage 9. The real-time light intensity detection system 1 comprises a sensor 11, wherein a through hole 12 is formed in the center of the sensor 11, and a data transmission line is convenient to install to realize connection with the light intensity analysis system 2. Sensor 11 can be 1 or a plurality of, and a shared is small, the installation of being convenient for, and a plurality ofly then can be more accurate detection light intensity, and still can work when one of them appears damaging. In the present invention, the sensor 11 may have a circular shape (cylindrical shape) and a diameter of 5 to 30mm, and the through hole 12 may have a circular shape and a diameter of 1 to 15 mm.
The sensor 1 is movably arranged in the wafer workbench 9, and the wafer workbench 9 comprises a wafer bearing platform 91 for bearing a wafer for exposure. The sensor 11 can move synchronously with the wafer carrier 91 to scan the wafer table 9 line by line from one corner of the wafer table 9. As shown in fig. 5, a movement path of the sensor 11 is shown. Of course, the movement path is not limited thereto.
It will be appreciated that the exposure process performed in the region directly beneath the lens 8 involves a plurality of exposure units which are positioned in the plane occupied by the wafer table 9, and in order to achieve uniform exposure, it is necessary to ensure that each exposure unit is exposed to a uniform (or substantially uniform) intensity. Therefore, in the scanning process of the sensor 11, every time when the sensor passes through the position of one exposure unit, the light intensity information of the position of the exposure unit is recorded as a detection result and transmitted to the light intensity analysis system 2. For example, for an exposure program (recipe) comprising 9 rows of 63 exposure units with 7 exposure units, the sensor 11 needs to record the light intensity information of these 63 exposure units during scanning. In one embodiment, the light intensity information detected by the sensor is present as an analog data voltage signal.
Referring to fig. 6, the light intensity analyzing system includes a single chip 23 and a standard data input module 22, where the single chip 23 determines whether the detection result includes the light intensity information of the positions of all the exposure units, determines whether the standard data input by the standard data input module 22 matches the number of all the exposure units, and compares the detection result with the standard data to generate an adjustment signal.
For the condition that the detection result transmitted by the sensor is an electric signal, the light intensity analysis system further comprises an analog-to-digital converter 21, and the analog-to-digital converter 21 converts the electric signal transmitted by the sensor 11 into a digital signal and transmits the digital signal to the single chip microcomputer 23. For example, the analog-to-digital converter 21 may be a TLC2543CN chip or other device with similar functions, and the invention is not limited and exemplified. The single chip 23 can be counted by a built-in data adding module, for example, when the number of the accumulated value groups reaches 63, the actual light intensity distribution diagram value signal is output to the operation module of the single chip. The standard data input module 22 inputs standard data (for example, a standard light intensity distribution diagram value signal) to the single chip 23, or an accumulation counting method is adopted, that is, a data addition module performs statistics, when the number of the counts is the same as the number of the groups transmitted by the sensor 11, all the standard data signals are output to an operation module, and the calculated data are output as an adjustment signal.
In one embodiment, the light intensity analyzing system further comprises a driver 24, and the driver 24 converts the adjusting signal into an amplified pulse signal and transmits the amplified pulse signal to the automatic light intensity adjusting system (specifically, the motor 31, which will be described below).
As shown in fig. 7, the automatic light intensity adjusting system includes: the light source comprises a motor 31, a transmission module, a position adjusting module and an optical adjusting module, wherein the motor 31 drives the transmission module to transmit the action to the position adjusting module under the driving of the adjusting signal, so that the position adjusting module adjusts the position, and the optical adjusting module changes the light intensity of the light emitted by the light source.
Specifically, in one embodiment, the transmission module includes a motor output shaft 32, a coupling 33, and a screw driving shaft 34, the motor output shaft 32 transmits the motion of the motor 31 to the coupling 33, and the coupling 33 drives the screw 34 to drive the shaft, so that the position adjustment module performs position adjustment. It is understood that the illustrated transmission module is not limited to the structure described in the embodiment, and for example, it may be only one motor output shaft directly connected to the position modulation module and performing motion transmission. For another example, the transmission of the operation may be performed in a crawler mode. The position adjustment module includes: the screw 35 and the nut 36, the nut 36 is sleeved on the screw 35, and the coupling 33 drives the screw driving shaft 34 to rotate the screw 35, so as to change the position of the nut 36. The optical adjustment module includes: a first lens 38 and a second lens 37, wherein the first lens 38 is fixed in position, the second lens 37 is arranged on the nut 36, and the relative position of the first lens 38 and the second lens 37 is changed along with the change of the position of the nut 36. For example, the first lens 38 is a convex lens, the second lens 37 is a concave lens, and the distance between the convex lens and the concave lens can be adjusted by quantitatively fine-tuning the relative position of the concave lens. Fine adjustment of the distance between the convex lens and the concave lens changes the light intensity distribution. The light output by the light intensity automatic adjusting system can be realized, so that the central light intensity is enhanced, the peripheral light intensity is relatively weakened, and the loss of the zoom lens is compensated in advance. Finally, the aim of uniform light intensity is achieved.
Further, the optical adjustment module further includes a housing 310, two opposite surfaces of the housing 310 are plane mirrors 39, and can be divided into an input plane mirror and an output plane mirror according to the light passing sequence, which can be made of transparent glass, resin, and the like, and the first lens 38 and the second lens 37 are disposed between the two plane mirrors 39, so that the space environment in the housing 310 is kept from external interference by the two plane mirrors 39.
The housing 310 has a sub-chamber in which the screw driving shaft 34, the screw 35 and the nut 36 are accommodated. To achieve protection of the screw drive shaft 34, screw 35 and nut 36. An opening is also provided on the side of the auxiliary chamber facing the second lens 37, where the second lens 37 is connected to the nut 36, thereby enabling movement of the second lens 37.
Referring to fig. 8 and 9, a detailed description will be given of an adjusting method of the present invention using the above automatic light intensity uniformity adjusting device, including:
step S11, turning on the light source;
step S12, the light intensity real-time monitoring system detects the light intensity on the wafer worktable and transmits the detection result to the light intensity analysis system;
step S13, the light intensity analysis system combines a standard data, generates an adjusting signal and transmits the adjusting signal to the light intensity automatic adjusting system;
and step S14, the automatic light intensity adjusting system adjusts the light intensity of the light emitted by the light source according to the adjusting signal.
For step S12, with reference to fig. 9, the sensor 11 scans the wafer table 9 line by line from one corner of the wafer table 9, and each time the wafer table passes through the position of an exposure unit, records the light intensity information of the position of the exposure unit as a detection result and transmits the detection result to the light intensity analysis system, for example, the light intensity analysis system may obtain an electrical signal after scanning, transmit the electrical signal to the analog-to-digital converter 21, convert the electrical signal into a digital signal, and transmit the digital signal to the single chip 23 for statistics, and determine whether the number of sets of values reaches a target. Taking an example that an exposure program comprises 9 lines, 7 exposure units in each line and 63 exposure units in total, the sensor 11 transmits a detection result to the single chip microcomputer 23 once when scanning light intensity information of one exposure unit, if statistics fails to reach a target (for example, the number of all the exposure units), scanning is continued and light intensity information scanned to the next exposure unit is transmitted until the target is reached (that is, light intensity information of positions where all the exposure units are located is included), information transmission is stopped, and 63 groups of data are output as a detection result, for example, a numerical signal of an actual light intensity distribution map. Meanwhile, at the standard data input module 22, standard data is sequentially input, wherein each input standard data corresponds to an exposure unit corresponding to the light intensity information detected by one sensor. The single chip microcomputer 23 performs statistics until the number of sets of the input standard data reaches a target (i.e., matches the number of all exposure units), for example, 63 sets, stops inputting, and outputs the standard data, for example, a standard light intensity distribution diagram value signal. Then, the single chip microcomputer 23 compares the detection result with the standard data, generates an adjustment signal, and outputs the adjustment signal.
The driver 24 converts the adjustment signal into an amplified pulse signal and transmits the amplified pulse signal to the motor 31 of the automatic light intensity adjustment system, so that the motor 31 operates, the motor output shaft 32 transmits the action of the motor 31 to the coupler 33, and the coupler 33 drives the screw rod 34 to drive the shaft so as to rotate the screw rod 35, thereby changing the position of the nut 36. Since the first lens 38 is fixed in position, the second lens 37 is disposed on the nut 36, and thus the relative positions of the first lens 38 and the second lens 37 are changed as the position of the nut 36 is changed. In the case where the first lens 38 is a convex lens and the second lens 37 is a concave lens, the distance between the convex lens and the concave lens can be adjusted by quantitatively fine-tuning the relative position of the concave lens. Fine adjustment of the distance between the convex lens and the concave lens changes the light intensity distribution. The light output by the light intensity automatic adjusting system can be realized, so that the central light intensity is enhanced, the peripheral light intensity is relatively weakened, and the loss of the zoom lens is compensated in advance.
Finally, the aim of uniform light intensity is achieved.
The automatic light intensity uniformity adjusting device and the adjusting method can be applied to the existing projection lithography machines, for example, the lithography machines with the wafer bearing platform 91 with the diameter of 200mm and 300mm can be suitable.
As shown in fig. 10 to 11, the light intensity distribution of the 63 exposure units before improvement and the light intensity distribution of the 63 exposure units after improvement using the automatic light intensity uniformity adjusting apparatus of the present invention are respectively shown, wherein each box represents an exposure unit, and the value therein is used to represent the light intensity. It can be seen that the value of the middle portion exposing unit in fig. 10 is low (representing low light intensity), while the value of the middle portion exposing unit in fig. 11 is raised (representing increased light intensity). Therefore, the effect is remarkable in improving CD deterioration due to device aging.
Further through experimental data analysis, the light intensity uniformity problem is obviously improved:
the average light intensity uniformity of the original equipment is 5 percent, the average line width uniformity is 10 percent, and the minimum line width of the equipment can reach 0.5 micron.
After the automatic light intensity uniformity adjusting device and the adjusting method are adopted, the illumination uniformity of the same equipment is 1.0 percent, the average line width uniformity is 3 percent, and the equipment can reach the minimum line width of 0.4 micron.
In summary, the automatic light intensity uniformity adjusting device and the adjusting method provided by the invention comprise a real-time light intensity detecting system, a light intensity analyzing system and an automatic light intensity adjusting system; the light intensity real-time monitoring system detects the light intensity on the wafer worktable and transmits the detection result to the light intensity analysis system; the light intensity analysis system combines a standard data to generate an adjusting signal and transmits the adjusting signal to the light intensity automatic adjusting system; the automatic light intensity adjusting system adjusts the light intensity of the light emitted by the light source according to the adjusting signal. Therefore, the loss of the lens can be compensated and reduced in advance, and the aim of light intensity uniformity is finally achieved, so that the uniformity of the CD can be improved, and the photoetching quality is improved; moreover, the frequency of replacing elements of the equipment is reduced, the service life of the equipment is prolonged, and the cost is effectively saved.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

Claims (12)

1. An automatic light intensity uniformity adjusting device, comprising:
the system comprises a light intensity real-time detection system, a light intensity analysis system and a light intensity automatic adjustment system; the light intensity real-time monitoring system detects the light intensity on the wafer worktable and transmits the detection result to the light intensity analysis system; the light intensity analysis system combines a standard data to generate an adjusting signal and transmits the adjusting signal to the light intensity automatic adjusting system; the automatic light intensity adjusting system comprises an optical adjusting module, the optical adjusting module comprises a first lens and a second lens, the first lens is a convex lens, the second lens is a concave lens, and the automatic light intensity adjusting system adjusts the relative position between the second lens and the first lens according to the adjusting signal so as to reduce the light intensity difference between the central area and the peripheral area after the light emitted by the light source irradiates the wafer worktable;
the light intensity automatic adjusting system also comprises a motor, a transmission module and a position adjusting module, wherein the motor drives the transmission module to transmit the action to the position adjusting module under the driving of the adjusting signal, so that the position adjusting module carries out position adjustment, and the optical adjusting module changes the light intensity of light emitted by the light source;
the transmission module comprises a motor output shaft, a coupler and a lead screw driving shaft, the position adjusting module comprises a lead screw and a nut, the nut is sleeved on the lead screw, the motor output shaft transmits the action of the motor to the coupler, and the coupler drives the lead screw driving shaft to rotate the lead screw so as to change the position of the nut; the first lens is fixed in position, the second lens is arranged on the nut, and the relative position of the first lens and the second lens is changed along with the change of the position of the nut.
2. The automatic light intensity uniformity adjusting device according to claim 1, wherein the real-time light intensity detecting system is disposed in the wafer stage, and an upper surface of the real-time light intensity detecting system is flush with an upper surface of the wafer stage.
3. The automatic regulating device for the uniformity of light intensity as claimed in claim 2, wherein said real-time detecting system of light intensity comprises a sensor movably disposed in said wafer stage for scanning said wafer stage line by line from one corner of said wafer stage.
4. The apparatus according to claim 3, wherein during the scanning process of the sensor, each time the sensor passes through the position of an exposure unit, the light intensity information of the position of the exposure unit is recorded as a detection result and transmitted to the light intensity analysis system.
5. The apparatus according to claim 4, wherein the light intensity analyzing system comprises a single-chip microcomputer and a standard data input module, the single-chip microcomputer determines whether the detection result includes the light intensity information of the positions of all the exposure units, determines whether the standard data input by the standard data input module matches the number of all the exposure units, and compares the detection result with the standard data to generate the adjustment signal.
6. The automatic light intensity uniformity adjusting device according to claim 5, wherein the light intensity analyzing system further comprises: and the detection result transmitted by the sensor is an electric signal, and the electric signal is converted into a digital signal by the analog-to-digital converter and transmitted to the singlechip.
7. The automatic light intensity uniformity adjusting device according to claim 5, wherein said light intensity analyzing system further comprises a driver, said driver transmitting said adjusting signal to said automatic light intensity adjusting system.
8. The apparatus of claim 7, wherein the optical adjustment module further comprises a housing, wherein the housing has an input plane mirror and an output plane mirror disposed on opposite sides of the housing, and the first lens and the second lens are disposed between the input plane mirror and the output plane mirror.
9. The apparatus of claim 8 wherein the housing has an opening, and the second lens is coupled to the nut at the opening.
10. A method for adjusting an automatic light intensity uniformity adjusting device according to any one of claims 1 to 9, comprising:
turning on a light source;
the light intensity real-time monitoring system detects the light intensity on the wafer worktable and transmits the detection result to the light intensity analysis system;
the light intensity analysis system combines standard data to generate an adjusting signal and transmits the adjusting signal to the light intensity automatic adjusting system, the light intensity automatic adjusting system comprises an optical adjusting module, the optical adjusting module comprises a first lens and a second lens, the first lens is a convex lens, and the second lens is a concave lens;
the automatic light intensity adjusting system adjusts the relative position between the second lens and the first lens according to the adjusting signal so as to reduce the light intensity difference between the central area and the peripheral area behind the wafer workbench irradiated by the light emitted by the light source.
11. The adjusting method of the automatic light intensity uniformity adjusting device according to claim 10, wherein the real-time light intensity detecting system comprises a sensor, the wafer stage is scanned line by line from one corner of the wafer stage, and each time the wafer stage passes through the position of an exposure unit, the light intensity information of the position of the exposure unit is recorded as the detection result and transmitted to the light intensity analyzing system.
12. The adjusting method of the automatic light intensity uniformity adjusting device according to claim 11, wherein the light intensity analyzing system comprises a single chip microcomputer and a standard data input module, and the single chip microcomputer counts the detection results until all the positions of the exposure units are included; meanwhile, counting the standard data input by the standard data input module until the standard data are matched with the number of all the exposure units; and then comparing the detection result with standard data to generate an adjusting signal.
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