CN108624021A - Solar silicon wafers cut the preparation method of backing plate unsaturated polyester (UP) based composites - Google Patents
Solar silicon wafers cut the preparation method of backing plate unsaturated polyester (UP) based composites Download PDFInfo
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- CN108624021A CN108624021A CN201810334236.7A CN201810334236A CN108624021A CN 108624021 A CN108624021 A CN 108624021A CN 201810334236 A CN201810334236 A CN 201810334236A CN 108624021 A CN108624021 A CN 108624021A
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- unsaturated polyester
- polyester resin
- backing plate
- steel bowl
- silicon wafers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/02—Organic and inorganic ingredients
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
- C08K5/098—Metal salts of carboxylic acids
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/14—Peroxides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
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- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses the preparation methods that a kind of solar silicon wafers cut backing plate unsaturated polyester (UP) based composites.Unsaturated polyester resin, accelerating agent, filler and coupling agent are added in steel bowl, strength mechanical agitation, so that each component is uniformly mixed, add curing agent, continue to stir, steel bowl is then put into vacuumize process in baking oven；Finally the mixture in steel bowl is poured into mold and is vacuum-treated, oven for curing processing is put into, after demoulding, obtains solar silicon wafers cutting backing plate unsaturated polyester (UP) based composites.The unsaturated polyester resin plate of the present invention has the characteristics that intensity is high, hardness is moderate, elasticity modulus is big low with shrinking percentage；The unsaturated polyester resin plate of the present invention has the advantage that raw material is easy to get, processing technology is easy, forming and hardening is fast, production cost is low；The unsaturated polyester resin plate of the present invention has good toughness, and the adherency and abrasion to cutting line are small, and cutting accuracy height and product yield are high.
Description
Technical field
The invention belongs to unsaturated polyester composite technical fields, and backing plate is cut more particularly to a kind of solar silicon wafers
With the preparation method of unsaturated polyester (UP) based composites.
Background technology
Silicon chip cutting is the critical process in solar-energy photo-voltaic cell manufacturing process.For using silicon chip as the photovoltaic electric of substrate
For pond, crystal silicon raw material and cutting cost occupy the best part in battery totle drilling cost.Silicon chip cutting yields and
The cost of cutting process is the emphasis of manufacturing enterprise's concern, and traditional solar silicon wafers cut backing plate unorganic glass plate, and matter is crisp, fortune
Cracky in defeated and cutting process influences the yields and cutting efficiency of silicon chip cutting, gradually cuts backing plate by resinae
It is substituted.
Currently, most of solar silicon wafers cutting backing plate is epoxy, phenolic aldehyde and polyester resin, cut with general resinae
Backing plate is cut to compare, unsaturated polyester (UP) class cutting backing plate of the present invention has raw material simple and easy to get, and processing and solidification process are easy,
It is of low cost, it is unlikely to deform, cutting accuracy height and slicing yield are high.By using the solar silicon wafers cutting of technology production
Backing plate significantly improves the yields and cutting efficiency of silicon chip cutting on the basis of cost is not increased.
Invention content
It is unsaturated the purpose of the present invention is on the basis of not increasing cost, providing a kind of solar silicon wafers cutting backing plate
The preparation method of polyester based composites, to improve the yields and cutting efficiency of solar silicon wafers cutting.And after providing at least
Preparation process described in face or the advantages of aspect of performance.
The specific steps are：
（1）Raw material is weighed according to following mass parts：100 parts of unsaturated polyester resins, 0.2 ~ 1.0 part of accelerating agent, 100 ~ 300 parts fill out
Material, 1 ~ 10 part of coupling agent and 2 ~ 10 parts of curing agent.
（2）By step（1）In the unsaturated polyester resin, accelerating agent, filler and the coupling agent that weigh be added in steel bowl, with
Speed strength 2 ~ 10min of mechanical agitation of 800 ~ 1500r/min makes each component be uniformly mixed, adds step（1）What is weighed consolidates
Agent continues 1 ~ 5min of stirring, and steel bowl is then put into 5 ~ 10min of vacuumize process in baking oven；Finally by the mixing in steel bowl
Object, which pours into, is vacuum-treated 2 ~ 10min in 40 ~ 60 DEG C of mold, be put into 40 ~ 100 DEG C of oven for curing 2 ~ 10h of processing, demould
Afterwards, solar silicon wafers cutting backing plate unsaturated polyester (UP) based composites are obtained.
The unsaturated polyester resin is one in m-phthalate unsaturated polyester resin or metaphenylene unsaturated polyester resin
Kind.
The accelerating agent is one or both of cobalt naphthenate and naphthoic acid cobalt.
The filler is one or more in aluminium hydroxide, calcium carbonate and silicon powder.
The coupling agent is one or more in KH550, KH560 and KH570.
The curing agent is one or both of methyl ethyl ketone peroxide and peroxidized t-butyl perbenzoate.
The method of the present invention includes at least following advantageous effect：
（1）The unsaturated polyester resin plate of the present invention has that intensity is high, hardness is moderate, elasticity modulus is big low with shrinking percentage etc. special
Point.
（2）There is the unsaturated polyester resin plate of the present invention raw material to be easy to get, processing technology is easy, forming and hardening is fast, production
Advantage at low cost.
（3）The unsaturated polyester resin plate of the present invention has good toughness, the adherency to cutting line and small, the cutting accuracy of abrasion
High and product yield is high.
Specific implementation mode
Carry out the present invention will be described in detail content below in conjunction with specific embodiment, but does not mean that any limit to the present invention
System.
Embodiment 1：
（1）By 100 parts of metaphenylene unsaturated polyester resin, 0.5 part of cobalt naphthenate, 150 parts of aluminium hydroxide and KH570 coupling agents 3
Part is added in steel bowl, stirs 5min in 1000r/min, each component in system is made to be evenly distributed.
（2）3 parts of methyl ethyl ketone peroxide is added in steel bowl, continues to stir 3min, steel bowl is put into baking oven and vacuumizes place
Manage 6min；It pours the mixture into 50 DEG C of mold and is vacuum-treated 5min, be put into 50 DEG C of oven for curing processing 6h, demould
Afterwards, solar silicon wafers cutting backing plate unsaturated polyester (UP) based composites are obtained.
Embodiment 2：
（1）By 100 parts of metaphenylene unsaturated polyester resin, 0.3 part of cobalt naphthenate, 150 parts of aluminium hydroxide and KH570 coupling agents 3
Part is added in steel bowl, and 1000r/min stirs 5min, and each component in system is made to be evenly distributed.
（2）2 parts of methyl ethyl ketone peroxide is added in steel bowl, continues to stir 3min, steel bowl is put into baking oven and vacuumizes place
Manage 6min；It pours the mixture into 50 DEG C of mold and is vacuum-treated 5min, be put into 50 DEG C of oven for curing processing 5h, demould
Afterwards, solar silicon wafers cutting backing plate unsaturated polyester (UP) based composites are obtained.
Embodiment 3：
（1）By 100 parts of metaphenylene unsaturated polyester resin, 0.8 part of cobalt naphthenate, 150 parts of aluminium hydroxide and KH570 coupling agents 3
Part is added in steel bowl, and 1000r/min stirs 5min, and each component in system is made to be evenly distributed.
（2）6 parts of methyl ethyl ketone peroxide is added in steel bowl, continues to stir 3min, steel bowl is put into baking oven and vacuumizes place
Manage 6min；It pours the mixture into 50 DEG C of mold and is vacuum-treated 5min, be put into 50 DEG C of oven for curing processing 3h, demould
Afterwards, solar silicon wafers cutting backing plate unsaturated polyester (UP) based composites are obtained.
Embodiment 4：
（1）By 3 parts of 100 parts of metaphenylene unsaturated polyester resin, 0.5 part of cobalt naphthenate, 150 parts of silicon powder and KH570 coupling agents
It is added in steel bowl, 1000r/min stirs 5min, and each component in system is made to be evenly distributed.
（2）3 parts of methyl ethyl ketone peroxide is added in steel bowl, continues to stir 3min, steel bowl is put into baking oven and vacuumizes place
Manage 6min；It pours the mixture into 50 DEG C of mold and is vacuum-treated 5min, be put into 50 DEG C of oven for curing processing 7h, demould
Afterwards, solar silicon wafers cutting backing plate unsaturated polyester (UP) based composites are obtained.
Embodiment 5：
（1）By 3 parts of 100 parts of metaphenylene unsaturated polyester resin, 0.5 part of cobalt naphthenate, 150 parts of calcium carbonate and KH570 coupling agents
It is added in steel bowl, 1000r/min stirs 5min, and each component in system is made to be evenly distributed.
（2）3 parts of methyl ethyl ketone peroxide is added in steel bowl, continues to stir 3min, steel bowl is put into baking oven and vacuumizes place
Manage 6min；It pours the mixture into 50 DEG C of mold and is vacuum-treated 5min, be put into 50 DEG C of oven for curing processing 8h, demould
Afterwards, solar silicon wafers cutting backing plate unsaturated polyester (UP) based composites are obtained.
Embodiment 6：
（1）By 100 parts of metaphenylene unsaturated polyester resin, 0.5 part of cobalt naphthenate, 150 parts of aluminium hydroxide and KH570 coupling agents 3
Part is added in steel bowl, and 1200r/min stirs 5min, and each component in system is made to be evenly distributed.
（2）3 parts of methyl ethyl ketone peroxide is added in steel bowl, continues to stir 3min, steel bowl is put into baking oven and vacuumizes place
Manage 8min；It pours the mixture into 50 DEG C of mold and is vacuum-treated 8min, be put into 50 DEG C of oven for curing processing 2h, demould
Afterwards, solar silicon wafers cutting backing plate unsaturated polyester (UP) based composites are obtained.
Solar silicon wafers cutting backing plate made from above-described embodiment carries out table with the performance of unsaturated polyester (UP) based composites
Sign, as a result see the table below.
Solar silicon wafers cut backing plate unsaturated polyester (UP) based composites the performance test results
| Viscosity/cP | Gel time/min | Bending strength/MPa | Bending modulus/GPa | Tensile strength/MPa | |
| Embodiment 1 | 2.4╳105 | 24 | 36.4 | 6.3 | 16.2 |
| Embodiment 2 | 1.7╳105 | 68 | 38.9 | 6.7 | 14.7 |
| Embodiment 3 | 6.9╳105 | 12 | 34.3 | 5.6 | 17.6 |
| Embodiment 4 | 7.3╳104 | 26 | 33.1 | 5.9 | 15.1 |
| Embodiment 5 | 4.2╳105 | 28 | 32.5 | 5.7 | 14.6 |
| Embodiment 6 | 2.6╳105 | 25 | 37.1 | 6.5 | 16.8 |
Compared by embodiment 1 ~ 3, change the curing agent of compound system and the dosage of accelerating agent, it is known that the performance of composite material has
Changed, especially compound system gel time before curing is affected, the viscosity of compound system and the bending of composite material
Intensity, bending modulus and tensile strength all change；Embodiment 1,4 and 5 compares, and changes the type of the filler of compound system, can
Know that compound system viscosity before curing and gel time variation are little, to the bending strength, bending modulus and stretching of composite material
Intensity is varied from；Comparing embodiment 1 and 6 changes the working process parameter of composite material, to compound system viscosity before curing
It is smaller to bending strength, bending modulus and the tensile strength variation of composite material with gel time essentially unchangedization.
Although embodiment of the present invention discloses, it is not limited only to listed with feelings in specification and embodiments
Condition, it can be applied to other related fields completely, for one skilled in the art, be easier to realize design
Modification, therefore without departing from the general concept defined in the claims and the equivalent scope, the present invention is not limited to specific thin
Section and described embodiment.
Claims (1)
1. a kind of preparation method of solar silicon wafers cutting backing plate unsaturated polyester (UP) based composites, it is characterised in that specific step
Suddenly it is：
（1）Raw material is weighed according to following mass parts：100 parts of unsaturated polyester resins, 0.2 ~ 1.0 part of accelerating agent, 100 ~ 300 parts fill out
Material, 1 ~ 10 part of coupling agent and 2 ~ 10 parts of curing agent；
（2）By step（1）In the unsaturated polyester resin, accelerating agent, filler and the coupling agent that weigh be added in steel bowl, with 800 ~
Speed strength 2 ~ 10min of mechanical agitation of 1500r/min makes each component be uniformly mixed, adds step（1）The solidification weighed
Agent continues 1 ~ 5min of stirring, and steel bowl is then put into 5 ~ 10min of vacuumize process in baking oven；Finally by the mixture in steel bowl
2 ~ 10min of vacuum processing in 40 ~ 60 DEG C of mold is poured into, 40 ~ 100 DEG C of oven for curing 2 ~ 10h of processing is put into, after demoulding,
Obtain solar silicon wafers cutting backing plate unsaturated polyester (UP) based composites；
The unsaturated polyester resin is one kind in m-phthalate unsaturated polyester resin or metaphenylene unsaturated polyester resin；
The accelerating agent is one or both of cobalt naphthenate and naphthoic acid cobalt；
The filler is one or more in aluminium hydroxide, calcium carbonate and silicon powder；
The coupling agent is one or more in KH550, KH560 and KH570；
The curing agent is one or both of methyl ethyl ketone peroxide and peroxidized t-butyl perbenzoate.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810334236.7A CN108624021A (en) | 2018-04-14 | 2018-04-14 | Solar silicon wafers cut the preparation method of backing plate unsaturated polyester (UP) based composites |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810334236.7A CN108624021A (en) | 2018-04-14 | 2018-04-14 | Solar silicon wafers cut the preparation method of backing plate unsaturated polyester (UP) based composites |
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| CN108624021A true CN108624021A (en) | 2018-10-09 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114262509A (en) * | 2021-12-23 | 2022-04-01 | 中船重工西安东仪科工集团有限公司 | Low-shrinkage unsaturated resin-based composite material and preparation method and application thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103183940A (en) * | 2011-12-27 | 2013-07-03 | 常熟市亚美模特儿衣架有限公司 | Impact-modified unsaturated polyester glass fibre reinforced plastic moulding compound |
| CN104031358A (en) * | 2014-06-09 | 2014-09-10 | 江门市德山复合材料科技有限公司 | Unsaturated resin fiberglass prepreg for low-temperature low-pressure molding as well as preparation method and application of unsaturated resin fiberglass prepreg |
| CN104987684A (en) * | 2015-06-05 | 2015-10-21 | 苏州珍展科技材料有限公司 | Unsaturated polyester composite material for bathtub and preparing method thereof |
| CN106832841A (en) * | 2016-12-28 | 2017-06-13 | 广东延春高新材料科技股份有限公司 | A kind of unsaturated polyester resin fiberglass preparation method |
-
2018
- 2018-04-14 CN CN201810334236.7A patent/CN108624021A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103183940A (en) * | 2011-12-27 | 2013-07-03 | 常熟市亚美模特儿衣架有限公司 | Impact-modified unsaturated polyester glass fibre reinforced plastic moulding compound |
| CN104031358A (en) * | 2014-06-09 | 2014-09-10 | 江门市德山复合材料科技有限公司 | Unsaturated resin fiberglass prepreg for low-temperature low-pressure molding as well as preparation method and application of unsaturated resin fiberglass prepreg |
| CN104987684A (en) * | 2015-06-05 | 2015-10-21 | 苏州珍展科技材料有限公司 | Unsaturated polyester composite material for bathtub and preparing method thereof |
| CN106832841A (en) * | 2016-12-28 | 2017-06-13 | 广东延春高新材料科技股份有限公司 | A kind of unsaturated polyester resin fiberglass preparation method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114262509A (en) * | 2021-12-23 | 2022-04-01 | 中船重工西安东仪科工集团有限公司 | Low-shrinkage unsaturated resin-based composite material and preparation method and application thereof |
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