CN108621594B - Thermal printing head - Google Patents
Thermal printing head Download PDFInfo
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- CN108621594B CN108621594B CN201710165253.8A CN201710165253A CN108621594B CN 108621594 B CN108621594 B CN 108621594B CN 201710165253 A CN201710165253 A CN 201710165253A CN 108621594 B CN108621594 B CN 108621594B
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- layer
- infrared radiation
- printing head
- thermal printing
- heat
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33505—Constructional details
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33505—Constructional details
- B41J2/3351—Electrode layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33505—Constructional details
- B41J2/33515—Heater layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33505—Constructional details
- B41J2/3353—Protective layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33505—Constructional details
- B41J2/33535—Substrates
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Abstract
The invention discloses a kind of thermal printing heads comprising infrared radiation layer, the infrared radiation layer are made of infrared radiation material, in a manner of heat radiation to print media radiations heat energy.Thus, the thermal printing head can heat printing consumables in a manner of infrared radiation, to it is strong using penetration power possessed by heating by infrared radiation, inside and outside can heat simultaneously, heating speed is fast, be not required to heat transfer medium transmitting, the thermal efficiency is good and the infrared absorption rate of heating object is sufficiently high when heating object can reach characteristic with temperature similar in infrared emitter in a short time, effectively raise print speed and significantly reduce printing energy consumption, the mechanical loss of thermal printing head and the manufacture difficulty of thermal printing head and cost.
Description
Technical field
The present invention relates to printing clothing arts, and in particular to for temperature-sensitive, the thermal printing head of heat transfer printing type, more
In particular to a kind of thermal printing head for transmitting the required thermal energy of printing in a manner of infrared radiation.
Background technique
Thermal printing and heat transfer Method of printing are all to be beaten to realize using thermal printing head the heating of printing consumable part table face
Print work.Thermal printing mode does not use carbon ribbon, and thermal printing head directly heats its surface on thermal print media surface
Thermally sensitive composition develops the color and then prints corresponding pattern, and therefore, it is exactly table that the printing consumables of thermal printing mode, which only has one kind,
Has the thermal print media of heat-sensitive material in face.And when the work of heat transfer printing type, carbon ribbon is placed in above print media, heat
The fever body region of quick print head is close to carbon ribbon and presses carbon ribbon on the print medium, when the heater of thermal printing head generates heat
When carbon ribbon is heated, make that ink on carbon ribbon melts or distillation is detached from carbon ribbon basement membrane and is transferred in print media material, thus
Durable, lasting printing content is printed, therefore, the printing consumables of heat transfer printing type includes carbon ribbon and print media.
Thermal printing head in the prior art generallys use " heat transfer " mode to printing consumables transferring heat energy.With application number
For the Chinese patent of CN201620212061.9, it discloses a kind of thermal printing heads, including metal substrate, glass accumulation of heat
Layer, resistive layer, conductive layer and protective layer attach glass recuperation layer with heat-conducting glue on metal substrate, and vacuum is splashed on glass recuperation layer
Conductive layer is carved and exposes resistive layer portion and form heater, do not carve part by radio resistance layer, vacuum sputtering conductive layer on resistive layer
Both ends conductive layer, the vacuum sputtering protective layer on heater are formed, heater one end connects common bus, and one end is separately connected drive
Dynamic IC, the on off operating mode of each hot spot is controlled by IC.Heat is generated when heater is powered, temperature increases.Print head fever
Body region need to be pressed on printing consumables, by the heat transfer of heater to printing consumables by way of heat transfer, make to print
Colour developing or printing ink transfer occur for consumptive material to realize print job.
It is well known that heat transfer essence is exactly by microcosmic particles such as molecule, atom and free electrons a large amount of in substance
Warm-up movement is hit mutually, and so that energy is reached low temperature part from the high-temperature part of object, or be transmitted to cryogenic object by high temp objects
Process.The microprocess of heat transfer is: in the high part of temperature, the particle vibration kinetic energy of object is larger.It is micro- in low temperature part
Grain vibration kinetic energy is smaller.Because the vibration of particle interacts, so small to kinetic energy from the big part of kinetic energy in interior of articles thermal energy
Partial conductance.
To sum up, it is limited by heat transfer transmitting heat mode, thermal printing head in the prior art at least has following lack
Point:
1) temperature of heater will be much higher than the temperature or carbon belt printing ink hair of the heat-sensitive ingredients colour developing in thermal print media
Raw thawing or the disengaging carbon ribbon basement membrane in turn that distils are transferred to required temperature when print media.The colour temp of general heat-sensitive paper
It is 70 DEG C or so；The thawing of carbon ribbon or sublimation temperature are usually 65 DEG C~85 DEG C.And its heater when thermal printing head work
The high temperature that temperature will usually reach several Baidu could transmit layer by layer thermal energy, and printing consumables is heated to it and develops the color, melt accordingly
The temperature changed or distilled.So its heating efficiency is low, print speed is influenced, while causing energy waste.
2) when with the thermal printing head work of heat transfer heating method transmitting heat, it is necessary to which print head fever body region is tight
It is pressed on printing consumables；Meanwhile in order to guarantee heat transfer efficiency, the protective layer on heater surface again cannot be too thick.And it is beating
It prints in work progress, printing consumables is in persistent movement.In this way, the printing consumables pressed on the print head during exercise will
The protective layer on print head is worn, print head longevity is caused not grown.Especially when print media is to be attached on one layer of base stock
In the case where a sheet by a sheet die cut label, when print media is mobile, the edge of every label is phase to the impact damage of print head
When serious.For the user of some high-volume printing, a thermal printing head is just needed replacing in several weeks.User is come
It says, other than increasing the cost of purchase print head, it is also necessary to be equipped with the technical staff with certain professional skill or payment clothes
Business expense could replace print head to the printer technology personnel of profession.In addition, damage caused by print head abrasion is without pre- in advance
Alert, replacement print head is bound to cause the case where print job pauses, and brings indirect loss.
3) because the fever body running of print head has the manufacturing process and material of print head at a high temperature of a few Baidu
Quite high requirement causes the especially high performance thermal printing head price of thermal printing head to remain high.
For this reason, it is necessary to a kind of new thermal printing head be designed, to overcome the above problem.
Summary of the invention
The technical problem to be solved in the present invention is that for thermal printing head in the prior art due to using " heat transfer "
Mode to printing consumables transferring heat energy and cause print speed is slow, print needed for energy consumption is high, print head abrasion is big and print head
The highly difficult big problem of manufacturing cost, a kind of new thermal printing head is provided, can be in a manner of infrared radiation to printing
Consumptive material transferring heat energy is to effectively raise print speed and significantly reduce the mechanical loss of printing energy consumption, thermal printing head
And the manufacture difficulty and cost of thermal printing head.
Technical solution used by the present invention solves the problems, such as it is:
The present invention provides a kind of thermal printing head comprising infrared radiation layer, the infrared radiation layer, by infrared ray
Radiative material constitute, in a manner of heat radiation to printing consumables radiations heat energy.
In thermal printing head provided by the invention, the thermal printing head further includes substrate, electrode layer and protective layer,
In,
The infrared radiation layer is formed on the substrate, has multiple infrared radiating bodies being intervally arranged, each
A infrared radiating body includes the junction positioned at the irradiation unit at middle part and positioned at the irradiation unit both ends；
The electrode layer is partially attached to the junction of multiple infrared radiating bodies；
The protective layer is covered in the irradiation unit of the electrode layer and the infrared radiation layer.
In thermal printing head provided by the invention, the thermal printing head further includes substrate, resistive layer and electrode layer,
In,
The resistive layer is formed in the upper of the substrate, has multiple resistance heaters being intervally arranged, described in each
Resistance heater includes the conducting portion positioned at the heating part at middle part and positioned at the heating part both ends；
The electrode layer is partially attached to the conducting portion of multiple resistance heaters；
The infrared radiation layer is covered in the heating part of multiple resistance heaters.
In thermal printing head provided by the invention, the thermal printing head further includes substrate, electrode layer and protective layer,
In,
The electrode layer forms on the substrate, has multiple electrodes being spaced apart from each other；
The infrared radiation layer is attached respectively to connect section and multiple connection phases on multiple electrodes with multiple
The radiant section of two adjacent junctions；
The protective layer covers the electrode layer and the infrared radiation layer.
In thermal printing head provided by the invention, the thermal printing head further includes substrate, resistive layer and electrode layer,
In,
The electrode layer forms on the substrate, has multiple electrodes being spaced apart from each other；
The resistive layer, with multiple conduction periods being attached respectively on multiple electrodes and multiple connections adjacent two
The fever section of a conduction period；
The infrared radiation layer is covered in the fever section of the resistive layer.
In thermal printing head provided by the invention, the thermal printing head further includes being made of the transparent material of infrared ray
Protective layer, the protective layer is covered in the infrared radiation layer and the electrode layer.
In thermal printing head provided by the invention, the infrared radiation material is conductive.
In thermal printing head provided by the invention, the infrared radiation material has insulating properties.
In thermal printing head provided by the invention, the substrate includes base and the insulated heat that is formed in the base
Layer, the insulated thermal insulating layer are made of insulated heat material.
Compared with prior art, implement thermal printing head provided by the invention, have the following beneficial effects: that the temperature-sensitive is beaten
Printing head includes infrared radiation layer, and the infrared radiation layer is made of infrared radiation material, in a manner of heat radiation
To print media radiations heat energy.The thermal printing head can heat printing consumables in a manner of infrared radiation as a result,
It is heated simultaneously to which, energy strong using penetration power possessed by heating by infrared radiation are inside and outside, heating speed is fast, is not required to heat transfer medium
Heating object can be in a short time when transmitting, the thermal efficiency are well and the infrared absorption rate of heating object is sufficiently high
Reach the characteristic with temperature similar in infrared emitter, effectively raise print speed and significantly reduce printing energy consumption,
The mechanical loss of print head and the manufacture difficulty of print head and cost.
Detailed description of the invention
Fig. 1 is the local overlooking schematic diagram for the thermal printing head that the embodiment of the present invention one provides；
Fig. 2 is the diagrammatic cross-section of the line A-A along Fig. 1；
Fig. 3 is the local overlooking schematic diagram of thermal printing head provided by Embodiment 2 of the present invention；
Fig. 4 is the diagrammatic cross-section of the line A-A along Fig. 3；
Fig. 5 is the local overlooking schematic diagram for the thermal printing head that the embodiment of the present invention three provides；
Fig. 6 is the diagrammatic cross-section of the line A-A along Fig. 5；
Fig. 7 is the local overlooking schematic diagram for the thermal printing head that the embodiment of the present invention four provides；
Fig. 8 is the diagrammatic cross-section of the line A-A along Fig. 7；
Drawing reference numeral explanation in specific embodiment:
| Substrate | 1 | Infrared radiation layer | 2 |
| Resistive layer | 3 | Electrode layer | 4 |
| Protective layer | 5 | Base | 11 |
| Insulated thermal insulating layer | 12 | ||
| Public electrode | 4a、4c | Absolute electrode | 4b、4d |
| Infrared radiating body | 21 | Resistance heater | 31 |
| Irradiation unit | 211 | First junction | 212 |
| Second junction | 213 | Heating part | 311 |
| First conducting portion | 312 | Second conducting portion | 313 |
| Radiant section | 22 | Connect section | 23 |
| Fever section | 32 | Conduction period | 33 |
Specific embodiment
For a clearer understanding of the technical characteristics, objects and effects of the present invention, now control attached drawing is described in detail
A specific embodiment of the invention.Obviously, described embodiments are only a part of the embodiments of the present invention, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are obtained without creative efforts
The every other embodiment obtained, shall fall within the protection scope of the present invention.
Embodiment one
The present embodiment provides a kind of thermal printing heads, and referring to Fig. 1 and Fig. 2, coordinate system in figure, X represents main scanning direction, Y
Sub-scanning direction is represented, Z is represented and X/Y plane vertical direction.The print head includes substrate 1, infrared radiation layer 2, electrode layer
4 and protective layer 5.In the X/Y plane for only illustrating the infrared radiation layer 2 and the electrode layer 4 in order to facilitate understanding, in Fig. 1
Structure.
The substrate 1 is the rectangular flat plate extended on main scanning direction X.In the present embodiment, the substrate 1 includes base
Layer 11, metal layer and insulated thermal insulating layer 12.The base 11 is formed by aluminium oxide ceramics；The metallization in the base 11
(for example, Au or Cu etc.) to form the metal layer, the metal layer can reduce the infrared radiation layer 2 to the base
Energy loss caused by 11 directions radiate；Then adhere to one layer in such a way that thick film screen printing re-sinters on the metal layer again absolutely
To form the insulated thermal insulating layer 12, the insulated thermal insulating layer 12 can be very good to avoid the infrared radiation edge heat-barrier material
Heat distributes when layer 2 works.
The infrared radiation layer 2 is formed on the substrate 1 with infrared radiation material, is intervally arranged by multiple
The infrared radiating body 21 of strip is constituted.In the present embodiment, adhere to one layer in the insulated thermal insulating layer 12 using vapour deposition method together
When have the infrared radiation material of good electric heating property and higher infrared radiation rate (for example, carbon or SnO2It is compound
Object etc.) to form infrared radiation initiation layer, then the item with photoetching technique by infrared radiation initiation layer separation at interval
Shape, to form multiple infrared radiating bodies 21 in a strip shape.Each described infrared radiating body 21 includes being located at
The irradiation unit 211 at middle part and the first junction 212 and the second junction 213 positioned at 211 both ends of irradiation unit, when described
When the first junction 212 of infrared radiating body and the second 213 loading current of junction, the surface temperature of the irradiation unit 211 with
The raising of loading current the trend of approximately linear be presented increase, while the infrared radiation rate of the irradiation unit 211 also rises to
Higher level.
The electrode layer 4 is attached to the first junction 212 and the second junction of multiple infrared radiating bodies 21
213.Specifically, first using magnetron sputtering method by metal material (for example, Al etc.) be deposited on the infrared radiation layer 2 (
I.e. multiple infrared radiating bodies 21) on form electrode initiation layer, then using photoetching technique by the electrode initiation layer system
It is standby at required circuit patterns to form the electrode layer 4 so that the irradiation unit 211 of the infrared radiating body 21 be exposed to it is described
Electrode layer 4.In the present embodiment, the electrode layer 4 includes a public electrode 4a and multiple absolute electrode 4b；The public electrode
4a includes multiple first connecting pins for being respectively attached to multiple first junctions 212, and connects multiple described simultaneously
The common end of one connecting pin；Multiple absolute electrode 4b are attached respectively to multiple second junctions 213.The infrared ray
The irradiation unit 211 of radiator 21 is emerging between the public electrode 4a and absolute electrode 4b.The absolute electrode 4b can be by
Control system selectivelyes switch on, and when the electrode 4b is connected, electric current will pass through the radiation of the infrared radiating body 21
Portion 211 promotes the fever of irradiation unit 211 and infrared radiation, is heated printing consumables to complete printing operation.
The protective layer 5 is covered in the irradiation unit 211 of the electrode layer 4 and the infrared radiation layer 2, the protective layer
5 by having, high temperature resistant, wear-resisting, corrosion-resistant, coefficient of friction be low and the material for the performances such as infrared ray can penetrate is (for example, silicon nitride
Or glass etc.) constitute.Specifically, using Film forming method by silicon nitride (Si3N4) it is attached to multiple infrared radiating bodies 21
Irradiation unit 211 and the electrode layer 4 on to form the protective layer 5.The protective layer 5 is for protecting the infrared radiation
Body 21 and electrode layer 4.
Embodiment two
The present embodiment provides a kind of thermal printing head, referring to Fig. 3 and Fig. 4, coordinate system in figure, X represents main scanning direction, Y
Sub-scanning direction is represented, Z is represented and X/Y plane vertical direction.The thermal printing head include substrate 1, resistive layer 3, electrode layer 4,
Infrared radiation layer 2 and protective layer 5.Only illustrate the XY of the resistive layer 3 and the electrode layer 4 in order to facilitate understanding, in Fig. 3
Structure in plane.
The substrate 1 is the rectangular flat plate extended on main scanning direction X.In the present embodiment, the substrate 1 includes base
Layer 11 and insulated thermal insulating layer 12.The base 11 is formed by aluminium oxide ceramics；It is re-sintered in the base 11 with thick film screen printing
Mode adhere to one layer of insulated heat material to form the insulated thermal insulating layer 12, the insulated thermal insulating layer 12 can be very good to keep away
Heat distributes when exempting from the resistive layer 3 work, to be conducive to accumulation of heat.
The resistive layer 3 is formed in the upper of the substrate 1, by multiple resistance heaters 31 in a strip shape being intervally arranged
It constitutes.In the present embodiment, use magnetron sputtering mode adhere in the insulated thermal insulating layer 12 one layer of tantalum Ta base resistance material with
Resistance initiation layer is formed, the resistance initiation layer is then separated by strip at interval by photoetching technique, to be formed multiple
The resistance heater 31 in a strip shape.Each described resistance heater 31 includes the heating part 311 and position positioned at middle part
The first conducting portion 312 and the second conducting portion 313 in 311 both ends of heating part.
The electrode layer 4 is attached to the first conducting portion 312 and the second conducting portion 313 of multiple resistance heaters 31.
Specifically, it is (namely multiple described that metal material (for example, Al etc.) is deposited on the resistive layer 3 using magnetron sputtering method first
Resistance heater 31) on form electrode initiation layer, the electrode initiation layer is then prepared by required circuit using photoetching technique
Pattern is to form the electrode layer 4, so that the heating part 311 of the resistance heater 31 is exposed to the electrode layer 4.This implementation
In example, the electrode layer 4 includes a public electrode 4a and multiple absolute electrode 4b；The public electrode 4a includes adhering to respectively
In multiple first connecting pins of multiple first conducting portions 312, and the public of multiple first connecting pins is connected simultaneously
End；Multiple absolute electrode 4b are attached respectively to multiple second conducting portions 313.The heating part of the resistance heater 31
311 are emerging between the public electrode 4a and absolute electrode 4b.The absolute electrode 4b can be by control system selectively
It connects, when the electrode 4b is connected, electric current will pass through the heating part 311 of the resistance heater 31, promote the fever
Portion 311 generates heat.
The infrared radiation layer 2 is covered in the heating part 311 of multiple resistance heaters 31.Specifically, described
Infrared radiation rate with higher is deposited on the heating part 311 of resistive layer 3 and the electrode layer 4 and nonconducting metal aoxidizes
Object (such as compound of ZrO2, SiO2) is to form the infrared radiation layer 2.When the heating part of the resistance heater 31
The temperature of 311 adstante febres, the part of the infrared radiation layer 2 being attached on the heating part 311 increases, and starts efficient
Infrared radiation, to heat printing consumables to complete printing operation.In addition, the infrared radiation layer 2 is because of the material that uses
Characteristic also has certain protective effect to the resistance heater 31 and the electrode layer 4.
The protective layer 5 is covered in the infrared radiation layer 2 and the electrode layer 4, and the protective layer 5 is by having resistance to height
Warm, wear-resisting, corrosion-resistant, coefficient of friction is low and material (for example, the silicon nitride or glass etc.) structure for the performances such as infrared ray can penetrate
At.Specifically, using Film forming method by silicon nitride (Si3N4) be attached on the infrared radiation layer 2 and the electrode layer 4
To form the protective layer 5.The protective layer 5 is for protecting the infrared radiation layer 2 and the electrode layer 4.
Embodiment three
The present embodiment provides a kind of thermal printing heads, and referring to figs. 5 and 6, coordinate system in figure, X represents main scanning direction, Y
Sub-scanning direction is represented, Z is represented and X/Y plane vertical direction.The thermal printing head includes substrate 1, electrode layer 4, infrared ray spoke
Penetrate layer 2 and protective layer 5.Only illustrate the XY of the electrode layer 4 and the infrared radiation layer 2 flat in order to facilitate understanding, in Fig. 5
Structure in face.
The substrate 1 is the rectangular flat plate extended on main scanning direction X.In the present embodiment, the substrate 1 includes base
Layer 11, metal layer and insulated thermal insulating layer 12.The base 11 is formed by aluminium oxide ceramics；The metallization in the base 11
(for example, Au or Cu etc.) to form the metal layer, the metal layer can reduce the infrared radiation layer 2 to the base
Energy loss caused by 11 directions radiate；Then adhere to one layer in such a way that thick film screen printing re-sinters on the metal layer again absolutely
To form the insulated thermal insulating layer 12, the insulated thermal insulating layer 12 can be very good to avoid the infrared radiation edge heat-barrier material
Heat distributes when layer 2 works.
The electrode layer 4 is formed on the substrate 1, has multiple electrodes being spaced apart from each other.Specifically, the electrode
Layer 4 is after carrying out thick film screen printing in the insulated thermal insulating layer 12 by Au slurry, then is sintered and is formed.The electrode layer
4 have public electrode 4c and multiple along the spaced absolute electrode 4d of main scanning direction X.As shown in figure 5, the public electrode
4c has multiple connects multiple subbands along the spaced subband for being rectangle strip of main scanning direction X and simultaneously
Master tape, each absolute electrode 4d some along sub-scanning direction Y protrude into the two adjacent of the public electrode 4c
In the gap of the subband, and public electrode 4c is not in contact with each other with absolute electrode 4d phase, does not constitute circuit loop.The independence
Electrode 4d can be selectivelyed switch on by control system.
The infrared radiation layer 2 is attached respectively to connect section 23 and multiple companies on multiple electrodes with multiple
Connect the radiant section 22 of two adjacent junctions.Specifically, the infrared radiation layer 2 is by having good electric heating property
Material with high infrared ray radiance is (for example, carbon or SnO2Compound) formed, in the present embodiment, again using thick film screen printing
The mode of sintering adheres to one layer of elongated, belt-shaped conductive carbon film extended along main scanning direction X on the electrode layer 4, to be formed
The infrared radiation layer 2.As shown in figure 5, the infrared radiation layer 2 and public electrode 4c and all independent electrical
Pole 4d has lap.The portion Chong Die with the public electrode 4c and the absolute electrode 4d of the infrared radiation layer 2
Point be it is described connect section 23, it is the radiant section 22 that position folded by section 23 is connected described in adjacent two.When described only
When vertical electrode 4d is connected, electric current will pass through the radiant section 22, promote the fever of radiant section 22 and infrared radiation, air exercise
Print consumptive material is heated to complete printing operation.
The protective layer 5 covers the electrode layer 4 and the infrared radiation layer 2, for protecting the infrared radiation
Layer 2 and the electrode layer 4.High temperature resistant, wear-resisting, corrosion-resistant, coefficient of friction is low and infrared ray can be worn by having for the protective layer 5
The material (for example, silicon nitride or glass etc.) of the performances such as saturating is constituted.In the present embodiment, the protective layer 5 is by amorphous glass (glass
Cream material) carry out thick film screen printing on the electrode layer 4 and the infrared radiation layer 2 after, then be sintered and formed.
Example IV
The present embodiment provides a kind of thermal printing heads, and referring to figs. 7 and 8, coordinate system in figure, X represents main scanning direction, Y
Sub-scanning direction is represented, Z is represented and X/Y plane vertical direction.The thermal printing head include substrate 1, electrode layer 4, resistive layer 3,
Infrared radiation layer 2 and protective layer 5.Only illustrate the XY of the electrode layer 4 and the resistive layer 3 in order to facilitate understanding, in Fig. 7
Structure in plane.
The substrate 1 is the rectangular flat plate extended on main scanning direction X.In the present embodiment, the substrate 1 includes base
Layer 11 and insulated thermal insulating layer 12.The base 11 is formed by aluminium oxide ceramics；It is re-sintered in the base 11 with thick film screen printing
Mode adhere to one layer of insulated heat material to form the insulated thermal insulating layer 12, the insulated thermal insulating layer 12 can be very good to keep away
Heat distributes when exempting from the resistive layer 3 work, to be conducive to accumulation of heat.
The electrode layer 4 is formed on the substrate 1, has multiple electrodes being spaced apart from each other.Specifically, the electrode
Layer 4 is after carrying out thick film screen printing in the insulated thermal insulating layer 12 by Au slurry, then is sintered and is formed.The electrode layer
4 have public electrode 4c and multiple along the spaced absolute electrode 4d of main scanning direction X.As shown in fig. 7, the public electrode
4c has multiple connects multiple subbands along the spaced subband for being rectangle strip of main scanning direction X and simultaneously
Master tape, each absolute electrode 4d some along sub-scanning direction Y protrude into the two adjacent of the public electrode 4c
In the gap of the subband, and public electrode 4c is not in contact with each other with absolute electrode 4d phase, does not constitute circuit loop.The independence
Electrode 4d can be selectivelyed switch on by control system.
The resistive layer 3 has multiple conduction periods 33 being attached respectively on multiple electrodes and multiple connections adjacent
Two conduction periods 33 fever section 32.Specifically, the resistive layer 3 is by the big material of resistivity (for example, ruthenium-oxide
Deng) formed, in the present embodiment, adhere to one layer on the electrode layer 4 in such a way that thick film screen printing re-sinters along main scanning side
The elongated, belt-shaped film being made of ruthinium oxide material extended to X, to form the resistive layer 3.As shown in fig. 7, the resistance
The layer 3 and public electrode 4c and whole absolute electrode 4d have lap.The resistive layer 3 with the common electrical
The part of pole 4c and absolute electrode 4d overlapping is the conduction period 33, portion folded by the conduction period 33 of adjacent two
Position is the fever section 32.When the absolute electrode 4d is connected, electric current will pass through the fever section 32, promote the hair
Hot arc 32 generates heat.
The infrared radiation layer 2 is covered in the fever section 32 of the resistive layer 3.Specifically, in the electrode layer 4 and institute
It states resistive layer 3 and adheres to one layer of ceramic material with high IR beta radiation rate with the method that thick film screen printing re-sinters above to be formed
The infrared radiation layer 2.When 32 adstante febre of fever section, the infrared radiation layer 2 is attached to the fever section 32
On the temperature of part increase, and start high efficient radiation infrared ray, to heat printing consumables to complete printing operation.In addition,
The infrared radiation layer 2 also has centainly the resistance heater 31 and the electrode layer 4 because of the material property used
Protective effect.
The protective layer 5 is covered in the infrared radiation layer 2 and the electrode layer 4, for protecting the infrared ray spoke
Penetrate layer 2 and the electrode layer 4.High temperature resistant, wear-resisting, corrosion-resistant, coefficient of friction is low and infrared ray can by having for the protective layer 5
The material (for example, silicon nitride or glass etc.) for the performances such as penetrating is constituted.In the present embodiment, the protective layer 5 is by amorphous glass (glass
Glass cream material) carry out thick film screen printing on the electrode layer 4 and the infrared radiation layer 2 after, then be sintered and formed.
In conclusion thermal printing head provided by example one, two, three, four all includes being made of infrared radiation material
Infrared radiation layer 2, complete thermal printing using the thermal printing head or when heat transfer print job as a result, it is described
Thermal printing head can heat printing consumables in a manner of infrared radiation.And under the mode of heating by infrared radiation has
It states advantage: 1) there is penetration power, inside and outside can heat simultaneously, heating speed is fast；2) it is not required to heat transfer medium transmitting, the thermal efficiency is good；
3) when the infrared absorption rate of heating object is sufficiently high, heating object can reach in a short time and infrared emitter
Similar temperature.So, compared with prior art, thermal printing head provided by embodiment one, two, three, four will bring with
Lower benefit:
1, the thermal printing head uses infrared radiation mode transferring heat energy, when heating to printing consumables, spoke
The infrared ray penetrated can directly heat printing consumables, and the thermal printing head passs heat without being pressed on to transmit on printing consumables.
The thermal printing head is effectively avoided as a result, to be worn by printing consumables.
2, the thermal printing head uses infrared radiation mode transferring heat energy, when heating to printing consumables, institute
State colour temp or heat transfer printing that thermal printing head only needs to reach the thermal print media in slightly higher than thermal printing
In carbon belt printing ink transfer needed for the i.e. certifiable print job of temperature (tens degrees Celsius) smoothly complete, thus, the temperature-sensitive
The manufacturing process of print head can be simpler, and manufacturing cost also will be cheaper, while also reduce the energy in print procedure and disappearing
Consumption.
3, the thermal printing head uses infrared radiation mode transferring heat energy, since the efficiency of heating by infrared radiation is wanted
Much higher than the heating efficiency of heat exchange pattern, when heating to printing consumables, the thermal printing head can be quickly right
Printing consumables is heated, to improve print speed.
To sum up, thermal printing head provided by the invention can overcome it is in the prior art with heat exchange pattern transmit heat
The defect of the thermal printing head of amount.
The embodiment of the present invention is described with above attached drawing, but the invention is not limited to above-mentioned specific
Embodiment, the above mentioned embodiment is only schematical, rather than restrictive, those skilled in the art
Under the inspiration of the present invention, without breaking away from the scope protected by the purposes and claims of the present invention, it can also make very much
Form, within these are all belonged to the scope of protection of the present invention.
Claims (4)
1. a kind of thermal printing head, including infrared radiation layer (2), the infrared radiation layer (2), by infrared radiation material
Constitute, in a manner of heat radiation to printing consumables radiations heat energy, which is characterized in that the thermal printing head further includes substrate
(1), electrode layer (4) and protective layer (5), wherein
The infrared radiation layer (2), is formed on the substrate (1), has multiple infrared radiating bodies being intervally arranged
(21), each described infrared radiating body (21) includes positioned at the irradiation unit (211) at middle part and positioned at the irradiation unit
(211) junction at both ends；
The electrode layer (4) is partially attached to the junction of multiple infrared radiating bodies (21)；
The protective layer (5) is covered in the irradiation unit (211) of the electrode layer (4) and the infrared radiation layer (2).
2. thermal printing head according to claim 1, which is characterized in that the protective layer (5) is transparent by infrared ray
Material is constituted.
3. thermal printing head according to claim 1, which is characterized in that the infrared radiation material is conductive.
4. thermal printing head according to claim 1, which is characterized in that the substrate (1) includes base (11) and formed
Insulated thermal insulating layer (12) on the base (11), the insulated thermal insulating layer (12) are made of insulated heat material.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710165253.8A CN108621594B (en) | 2017-03-20 | 2017-03-20 | Thermal printing head |
| CN201910243935.5A CN109968826B (en) | 2017-03-20 | 2017-03-20 | Thermal print head |
| PCT/CN2017/093268 WO2018171093A1 (en) | 2017-03-20 | 2017-07-18 | Thermal print head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710165253.8A CN108621594B (en) | 2017-03-20 | 2017-03-20 | Thermal printing head |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910243935.5A Division CN109968826B (en) | 2017-03-20 | 2017-03-20 | Thermal print head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108621594A CN108621594A (en) | 2018-10-09 |
| CN108621594B true CN108621594B (en) | 2019-07-23 |
Family
ID=63583872
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910243935.5A Active CN109968826B (en) | 2017-03-20 | 2017-03-20 | Thermal print head |
| CN201710165253.8A Active CN108621594B (en) | 2017-03-20 | 2017-03-20 | Thermal printing head |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910243935.5A Active CN109968826B (en) | 2017-03-20 | 2017-03-20 | Thermal print head |
Country Status (2)
| Country | Link |
|---|---|
| CN (2) | CN109968826B (en) |
| WO (1) | WO2018171093A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI678289B (en) * | 2018-12-07 | 2019-12-01 | 謙華科技股份有限公司 | Manufacturing method of thermal head |
| CN110027327B (en) * | 2019-05-10 | 2020-07-03 | 深圳市博思得科技发展有限公司 | Novel wide-width thermal printing head and manufacturing method thereof |
| CN114434975B (en) * | 2020-10-30 | 2024-01-05 | 深圳市博思得科技发展有限公司 | Thermal print head and method for manufacturing the same |
| CN114083905B (en) * | 2021-12-06 | 2023-01-20 | 湖南凯通电子有限公司 | Heating circuit of thermal printer |
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- 2017-03-20 CN CN201910243935.5A patent/CN109968826B/en active Active
- 2017-03-20 CN CN201710165253.8A patent/CN108621594B/en active Active
- 2017-07-18 WO PCT/CN2017/093268 patent/WO2018171093A1/en active Application Filing
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| JPS62199464A (en) * | 1986-02-28 | 1987-09-03 | Oki Electric Ind Co Ltd | Heat ray radiation head |
| JPH02117849A (en) * | 1988-10-27 | 1990-05-02 | Seiko Epson Corp | Printing device |
| JPH0389482A (en) * | 1989-08-31 | 1991-04-15 | Toshiba Lighting & Technol Corp | Contact type heater |
| JP2003276226A (en) * | 2002-03-22 | 2003-09-30 | Alps Electric Co Ltd | Thermal head |
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| CN205768086U (en) * | 2016-03-21 | 2016-12-07 | 大连佳盈半导体技术有限公司 | Thermal printing head |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018171093A1 (en) | 2018-09-27 |
| CN109968826B (en) | 2020-04-10 |
| CN108621594A (en) | 2018-10-09 |
| CN109968826A (en) | 2019-07-05 |
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