JPH05212888A - Thermal head and its manufacture - Google Patents

Thermal head and its manufacture

Info

Publication number
JPH05212888A
JPH05212888A JP31250091A JP31250091A JPH05212888A JP H05212888 A JPH05212888 A JP H05212888A JP 31250091 A JP31250091 A JP 31250091A JP 31250091 A JP31250091 A JP 31250091A JP H05212888 A JPH05212888 A JP H05212888A
Authority
JP
Japan
Prior art keywords
heat
layer
heat storage
storage layer
insulating substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP31250091A
Other languages
Japanese (ja)
Inventor
Masato Kawanishi
Hiromasa Tsukamoto
Mitsuhiko Yoshikawa
光彦 吉川
弘昌 塚本
真人 川西
Original Assignee
Sharp Corp
シャープ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp, シャープ株式会社 filed Critical Sharp Corp
Priority to JP31250091A priority Critical patent/JPH05212888A/en
Publication of JPH05212888A publication Critical patent/JPH05212888A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To enable disconnection of an electrode layer to be prevented by improving printing efficiency without deteriorating durability by a method wherein a heat accumulating layer is composed of heat resisting resin of low heat conductivity and its printing region is formed outside in an almost circular arc form in a section. CONSTITUTION:For a thermal head, a heat accumulating layer 12, a lower protective layer 13, a heating element layer 14, an individual electrode layer 15a, a common electrode layer 15b, and an upper protective layer 16 are laminated on an insulating substrate layer 11. Then, in order to increase a heat transmitting quantity to a side of thermosensitive paper and an ink ribbon by controlling transmission of heat generated from the heat element layer 14 to the insulating layer 11, the heat accumulating layer 12 is composed of heat resisting resin 21, 22 such as polymide resin of low heat conductivity or the like. Further, in order to make printing efficiency better, a printing region L of the heat accumulating layer 12 is formed in an almost circular arc form in a section by extruding outside. Then, balance between heat accumulation and heat radiation in the heat accumulation layer 12 is considered, and a heat radiating layer 17 which radiates the heat from the heat accumulating layer 12 to the insulating substrate 11 side is provided between the insulating substrate 11 and the heat accumulating layer 12 in the printing region L.

Description

【発明の詳細な説明】Detailed Description of the Invention
【0001】[0001]
【産業上の利用分野】本発明は、ワープロ、フアクシミ
リ、カラープリンター等の記録装置に用いられるサーマ
ルヘツドに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermal head used in a recording device such as a word processor, facsimile machine, and color printer.
【0002】[0002]
【従来の技術】一般にサーマルヘツドは直線上に整列配
置された複数の発熱素子を備えており、各発熱素子を印
字信号に応じて選択的に発熱することにより、サーマル
ヘツドに圧接されている感熱紙もしくはインクリボンの
インクを部分的に発色、溶融昇華させて用紙に印字を行
うようになつている。
2. Description of the Related Art Generally, a thermal head is provided with a plurality of heating elements arranged in a straight line, and by selectively heating each heating element according to a print signal, the thermal head is pressed against the thermal head. The ink on the paper or the ink ribbon is partially colored, melted and sublimated to print on the paper.
【0003】(従来例1)従来例1にかかるサーマルヘ
ツドを図2に示す。図中、1はセラミツク製の絶縁基
板、2はガラス製の蓄熱層であるグレーズ層、3は発熱
抵抗体層、4aは個別電極、4bは共通電極、5は上部
保護膜層を示している。
(Conventional Example 1) FIG. 2 shows a thermal head according to Conventional Example 1. In the figure, 1 is an insulating substrate made of ceramic, 2 is a glaze layer which is a heat storage layer made of glass, 3 is a heating resistor layer, 4a is an individual electrode, 4b is a common electrode, and 5 is an upper protective film layer. ..
【0004】従来例1では、図2に示すように、抵抗体
層3が個別電極4から露出する領域の周辺部(以下、印
字領域Lという)は平坦になつており、サーマルヘツド
とプラテンとの単位面積当たりの押し圧が小さいため、
紙、インクリボンとの当たり性が悪く、印字効率を落と
していた。その結果、印加エネルギーを余分に加えなけ
ればならなかつた。
In the conventional example 1, as shown in FIG. 2, the peripheral portion of the region where the resistor layer 3 is exposed from the individual electrode 4 (hereinafter referred to as the printing region L) is flat, and the thermal head and the platen are Since the pressing force per unit area of is small,
The contact efficiency with paper and ink ribbon was poor, and the printing efficiency was reduced. As a result, additional applied energy has to be added.
【0005】(従来例2)従来例2では、上記問題点で
ある印字効率を上げるために、図3の如く、絶縁基板1
上のグレーズ層2を印字領域Lに制限して敷き、これを
断面円弧形の凸形状にすることで、サーマルヘツドとプ
ラテンとの単位面積当たりの押し圧を従来例1に比べて
大きくし、印字効率を上げていた。
(Conventional Example 2) In Conventional Example 2, in order to improve the printing efficiency which is the above-mentioned problem, as shown in FIG.
By limiting the upper glaze layer 2 to the printing area L and laying it, the pressing force per unit area between the thermal head and the platen is made larger than that of the conventional example 1 by making the convex shape having an arc-shaped cross section. , Printing efficiency was raised.
【0006】[0006]
【発明が解決しようとする課題】従来例1,2では、蓄
熱層としてグレーズ層2を用いているため、熱伝導性が
良く、発熱抵抗体層3で発生した熱が絶縁基板1の方へ
熱伝達されやすくなつている。その結果、発熱抵抗体層
3から発生する熱は感熱紙、インクリボン側に伝達され
るが、基板1側への熱伝達が良好なため、基板1側への
余分な熱伝達量分だけ余計にサーマルヘツドに印加エネ
ルギーを加えなくてはならなかつた。
In the conventional examples 1 and 2, since the glaze layer 2 is used as the heat storage layer, the thermal conductivity is good, and the heat generated in the heating resistor layer 3 is transferred to the insulating substrate 1. It is easy to transfer heat. As a result, the heat generated from the heating resistor layer 3 is transferred to the thermal paper and the ink ribbon side, but since the heat transfer to the substrate 1 side is good, an extra heat transfer amount to the substrate 1 side is added. The applied energy had to be applied to the thermal head.
【0007】この印字効率を上げるため、グレーズ層2
を厚くすることで、蓄熱性を良くする手段は考えられて
いるが、逆に蓄熱量が多く印字性能が悪くなり、例えば
印字の尾引き現象が発生するため、印字効率を上げかつ
印字性能も上げることは困難であつた。
To increase the printing efficiency, the glaze layer 2
By increasing the thickness, it is considered to improve the heat storage property, but conversely, the heat storage amount is large and the printing performance deteriorates.For example, the tailing phenomenon of printing occurs, so the printing efficiency and printing performance are improved. It was difficult to raise.
【0008】そこで、印字効率を向上させるため、最近
では、図4の如く、蓄熱層の材料として蓄熱性が良く熱
伝導性が低いポリイミド等の耐熱性樹脂を用いる方式が
試みられている。なお、図4中、6は下部保護膜層であ
る。
Therefore, in order to improve the printing efficiency, recently, as shown in FIG. 4, a method of using a heat-resistant resin such as polyimide having a good heat storage property and a low heat conductivity as a material of the heat storage layer has been attempted. In FIG. 4, 6 is a lower protective film layer.
【0009】しかし、サーマルヘツド印字時の発熱抵抗
体3の温度は400〜500℃に達するため、長時間使
用すると耐熱性樹脂7は熱分解して劣化し、その結果と
して抵抗値の変化が大きくなるために、実際に蓄熱層に
耐熱性樹脂7を用いて製品化することは困難であつた。
However, since the temperature of the heat generating resistor 3 reaches 400 to 500 ° C. during thermal head printing, the heat resistant resin 7 is thermally decomposed and deteriorated when used for a long time, resulting in a large change in resistance value. Therefore, it is difficult to actually use the heat-resistant resin 7 in the heat storage layer for commercialization.
【0010】また、図4の如く、従来、印字領域Lの周
辺部に凸形状を作製する場合、凸形状部の個別電極4a
および共通電極4bの上部に電極保護膜をスパツタ蒸着
等により形成した際に、ポリイミド層7の一部を除去し
て形成するため、その端部が角部を有する段状となり、
角部における膜のステツプカバレツジ(被覆)が悪く、
パターニングのホトリソ工程後にリード電極が断線を生
じることがあつた。
Further, as shown in FIG. 4, conventionally, when a convex shape is formed in the peripheral portion of the printing area L, the individual electrode 4a of the convex shape portion is formed.
And when the electrode protective film is formed on the upper part of the common electrode 4b by sputtering deposition or the like, a part of the polyimide layer 7 is removed so that the end has a stepped shape with corners.
The step coverage (coverage) of the film at the corners is poor,
The lead electrode may be broken after the photolithography step of patterning.
【0011】本発明は、上記課題に鑑み、耐久性を劣化
させずに印字効率を向上でき、かつ、電極層の断線を防
止し得るサーマルヘツドの提供を目的とする。
In view of the above problems, it is an object of the present invention to provide a thermal head capable of improving the printing efficiency without deteriorating the durability and preventing the disconnection of the electrode layer.
【0012】[0012]
【課題を解決するための手段】本発明請求項1による課
題解決手段は、図1の如く、感光紙やインクリボンを印
字領域Lで部分的に加熱して印字するものであつて、絶
縁基板11上に、蓄熱層12と、発熱抵抗体層14と、
電極層15a,15bとが、外側に向かつて積層された
サーマルヘツドにおいて、前記蓄熱層12は、熱伝導性
の低い耐熱性樹脂からなり、該蓄熱層12の印字領域L
は、外側へ断面略円弧状に突出形成されたものである。
As shown in FIG. 1, the means for solving the problems according to the first aspect of the present invention is to print a photosensitive paper or an ink ribbon by partially heating it in a printing area L to print. 11, a heat storage layer 12, a heating resistor layer 14, and
In the thermal head in which the electrode layers 15a and 15b are laminated outwardly, the heat storage layer 12 is made of a heat-resistant resin having low heat conductivity, and the print area L of the heat storage layer 12 is formed.
Is formed to project outward in a substantially arcuate cross section.
【0013】本発明請求項2による課題解決手段は、絶
縁基板11上に、蓄熱層12、下部保護層13、発熱抵
抗体層14、電極層15a、15bおよび上部保護膜層
16を外側に向かつて順次積層するサーマルヘツドの製
造方法において、前記蓄熱層12の形成時に、絶縁基板
11上の全面に蓄熱層12としての耐熱性樹脂21を塗
布し、印字領域Lを残して除去後、これらの表面全体に
再度耐熱性樹脂22を塗布して、蓄熱層12の印字領域
Lを外側へ断面略円弧状に突出形成するものである。
According to the second aspect of the present invention, the heat storage layer 12, the lower protective layer 13, the heating resistor layer 14, the electrode layers 15a and 15b, and the upper protective film layer 16 are directed outward on the insulating substrate 11. In the method of manufacturing the thermal head which is sequentially laminated, the heat resistant resin 21 as the heat storage layer 12 is applied to the entire surface of the insulating substrate 11 when the heat storage layer 12 is formed, and after removing the printing region L, the heat-resistant resin 21 is removed. The heat-resistant resin 22 is applied again to the entire surface to form the printing region L of the heat storage layer 12 so as to project outward in a substantially arcuate cross section.
【0014】本発明請求項3による課題解決手段は、請
求項1記載のサーマルヘツドにおいて、印字領域Lにお
ける絶縁基板11と蓄熱層12との間に、蓄熱層12か
らの熱を絶縁基板11に放熱する放熱層17が設けられ
たものである。
According to a third aspect of the present invention, in the thermal head according to the first aspect, between the insulating substrate 11 and the heat storage layer 12 in the printing area L, heat from the heat storage layer 12 is applied to the insulating substrate 11. A heat dissipation layer 17 that dissipates heat is provided.
【0015】[0015]
【作用】上記請求項1,2による課題解決手段におい
て、印字領域Lが突出した状態で感光紙やインクリボン
を加熱印字しているので、その押圧力が強まる。
In the means for solving the problems according to the first and second aspects, since the photosensitive paper or the ink ribbon is heated and printed with the printing area L protruding, the pressing force is increased.
【0016】また、熱伝導性が低い耐熱性樹脂により蓄
熱しているので、蓄熱効率が高まる。
Further, since heat is stored by the heat resistant resin having low heat conductivity, the heat storage efficiency is improved.
【0017】さらに、印字領域Lの凸形状を断面略円弧
状とし、蓄熱層12の端部にまるみを持たせて、その上
に電極層15a,15bを形成するので、印字領域Lの
凸形状の端部における膜のステツプカバレツジが良くな
り、リード電極の断線を防止できる。
Further, since the convex shape of the printing area L is substantially arcuate in section and the end portions of the heat storage layer 12 are rounded and the electrode layers 15a and 15b are formed thereon, the convex shape of the printing area L is formed. The step coverage of the film at the end portion of is improved, and the disconnection of the lead electrode can be prevented.
【0018】上記請求項3による課題解決手段におい
て、蓄熱層12の蓄熱効率をよくした場合でも、適宜放
熱層17で放熱し、長時間使用しても、耐熱性樹脂は熱
分解を防止できる。
In the problem solving means according to the third aspect, even when the heat storage efficiency of the heat storage layer 12 is improved, heat is appropriately radiated by the heat radiating layer 17 and the heat resistant resin can prevent thermal decomposition even when used for a long time.
【0019】[0019]
【実施例】図1は、本発明の一実施例を示すサーマルヘ
ツドの断面図である。図示の如く、本実施例のサーマル
ヘツドは、感光紙やインクリボンを印字領域Lで部分的
に加熱して印字するものであつて、蓄熱層における蓄熱
放熱のバランスを改善することにより、従来に比べて低
消費電力で、印字性能を良くし、かつ、ヘツド寿命を向
上させるものである。
1 is a sectional view of a thermal head showing an embodiment of the present invention. As shown in the figure, the thermal head of the present embodiment prints a photosensitive paper or an ink ribbon by partially heating it in the printing area L, and improves the balance of the heat storage and heat dissipation in the heat storage layer. In comparison, it consumes less power, improves printing performance, and improves head life.
【0020】すなわち、該サーマルヘツドは、絶縁基板
11上に、蓄熱層12と、下部保護層13と、発熱抵抗
体層14と、個別電極層15aおよび共通電極層15b
と、上部保護膜層16とが、外側に向かつて順次積層さ
れたものである。
That is, the thermal head comprises an insulating substrate 11, a heat storage layer 12, a lower protective layer 13, a heating resistor layer 14, an individual electrode layer 15a and a common electrode layer 15b.
And the upper protective film layer 16 are sequentially laminated toward the outside.
【0021】そして、前記発熱抵抗体層14から発生す
る熱の絶縁基板11への熱伝達を押さえ、感熱紙および
インクリボン側への熱伝達量を多くするため、前記蓄熱
層12は、熱伝導性の低いポリイミド樹脂等の耐熱性樹
脂21,22から構成している。なお、従来使用ができ
なかつた耐熱性樹脂は、後述の放熱層17の使用によ
り、熱分解による劣化を防止できることから、使用可能
となつた。
In order to suppress the heat transfer from the heat generating resistor layer 14 to the insulating substrate 11 and increase the heat transfer amount to the thermal paper and the ink ribbon side, the heat storage layer 12 has a thermal conductivity. It is composed of heat resistant resins 21 and 22 such as a polyimide resin having a low property. It should be noted that the heat-resistant resin that could not be used conventionally can be used because the use of the heat dissipation layer 17 described later can prevent deterioration due to thermal decomposition.
【0022】また、印字効率をよくするため、蓄熱層1
2の印字領域Lは、外側へ断面略円弧状に突出形成され
ている。
Further, in order to improve the printing efficiency, the heat storage layer 1
The second printing area L is formed so as to project outward in a substantially arcuate cross section.
【0023】そして、蓄熱層12における蓄熱放熱のバ
ランスを考慮し、印字領域Lにおける絶縁基板11と蓄
熱層12との間に、蓄熱層12からの熱を絶縁基板11
側に放熱する放熱層17が設けられている。
Then, in consideration of the balance of heat storage and heat dissipation in the heat storage layer 12, the heat from the heat storage layer 12 is applied between the insulating substrate 11 and the heat storage layer 12 in the printing area L.
A heat dissipation layer 17 that dissipates heat is provided on the side.
【0024】上記構成のサーマルヘツドは、次のように
製造される。まず絶縁基板11として耐熱性樹脂を材料
とし、その片面もしくは両面の全面に放熱層17をC
u,Ni等を用いて、メツキ、スパツタもしくは蒸着等
の方法で1〜20μm厚みで付着させる。そして、個別
発熱抵抗体層14の下部に、ホトリソグラフイ法にて上
記放熱層17の幅を0.3〜1.0mmの間で帯状に形
成する。
The thermal head having the above structure is manufactured as follows. First, a heat-resistant resin is used as the insulating substrate 11, and a heat dissipation layer 17 is formed on one or both surfaces of the insulating substrate 11 by C.
Using u, Ni or the like, the adhesion is performed to a thickness of 1 to 20 μm by a method such as plating, sputtering or vapor deposition. Then, below the individual heating resistor layer 14, the width of the heat dissipation layer 17 is formed in a strip shape by a photolithography method with a width of 0.3 to 1.0 mm.
【0025】次に、蓄熱層12を形成する。この際、耐
熱性樹脂としてのポリイミド樹脂21でロールコータ法
もしくはスピンナー法にて、基板11上に5〜20μm
の厚さで塗布し、硬化後、印字領域Lにホトリソグラフ
イ法にて100〜500μmの幅でエツチングし、端部
に角部を有する段状の凸形状を形成する。
Next, the heat storage layer 12 is formed. At this time, the polyimide resin 21 as a heat-resistant resin is coated on the substrate 11 by a roll coater method or a spinner method in a thickness of 5 to 20 μm.
After being applied and cured, the printing area L is etched with a width of 100 to 500 μm by a photolithography method to form a stepped convex shape having a corner at the end.
【0026】この耐熱性樹脂21を硬化した後、さらに
同一材料としてのポリイミド樹脂22を表面全面にスピ
ンナーもしくはロールコータ法にて一様に塗布し硬化す
る。これにより、下層のポリイミド樹脂21の角部は、
上層のポリイミド樹脂22においてまるまり、蓄熱層1
2の凸形状の表面は断面略円弧形の曲線性をもつように
なる。
After the heat-resistant resin 21 is cured, a polyimide resin 22 made of the same material is uniformly applied to the entire surface by a spinner or roll coater method and cured. As a result, the corners of the lower polyimide resin 21 are
The heat storage layer 1 is rounded in the upper polyimide resin 22.
The convex surface of No. 2 has a curved surface having a substantially arcuate cross section.
【0027】次に、下部保護層13を形成する。材料と
してはSiO,またはSiAlON等で膜厚0.1〜
6.0μmをスパツタ法にて成膜する。
Next, the lower protective layer 13 is formed. The material is SiO 2 or SiAlON, and the film thickness is 0.1 to 0.1.
A film having a thickness of 6.0 μm is formed by a sputtering method.
【0028】次に、発熱抵抗体層14をTaSiO
500〜2000Åをスパツタ法にて成膜し、スパツタ
後、個別電極15aおよび共通電極15bを形成する。
この材料として、AlまたはAlSiを用い、蒸着また
はスパツタ法にて成膜し、ホトリソグラフイ法にて形成
する。
Next, the heating resistor layer 14 is formed of TaSiO 2 to a thickness of 500 to 2000 Å by a sputtering method, and after sputtering, the individual electrode 15a and the common electrode 15b are formed.
Al or AlSi is used as this material, and a film is formed by vapor deposition or a sputtering method, and then formed by a photolithography method.
【0029】その後、発熱抵抗体14の保護、酸化防止
および感熱紙、インクリボンの耐摩耗層として、上部保
護膜層16をSiAlONにてスパツタ法で形成し、サ
ーマルヘツドは完成する。
Thereafter, an upper protective film layer 16 is formed of SiAlON by a sputtering method as a wear-resistant layer for protection of the heating resistor 14, oxidation prevention and thermal paper, and ink ribbon, and the thermal head is completed.
【0030】上記サーマルヘツドの使用時には、蓄熱層
の材料として蓄熱性が良く熱伝導性が低いポリイミド等
の耐熱性樹脂を用い、しかも、印字領域Lを突出形成し
ているため、絶縁基板11への熱伝達を押さえ感熱紙や
インクリボン側への熱伝達量を多くすることができ、蓄
熱層12における蓄熱放熱のバランスを改善して従来の
構造に対して印字効率が向上させることができた。具体
的には、消費電力を従来のサーマルヘツドに比べ約50
%減少させることが可能になり、その結果として、フア
クシミリ、プリンター等の電源容量が従来の1/2に削
減でき、サーマルヘツドの低消費電力化、低コスト化に
役立つことができた。
When the thermal head is used, a heat-resistant resin such as polyimide having a good heat storage property and a low heat conductivity is used as a material for the heat storage layer, and the printing region L is formed to project. The amount of heat transfer to the thermal paper or the ink ribbon side can be increased by suppressing the heat transfer of the heat storage layer, and the balance of heat storage and heat dissipation in the heat storage layer 12 can be improved to improve the printing efficiency as compared with the conventional structure. .. Specifically, it consumes about 50% less power than the conventional thermal head.
%, And as a result, the power supply capacity of facsimiles, printers, etc. can be reduced to half of the conventional power consumption, which can be useful for reducing the power consumption and cost of the thermal head.
【0031】なお、発熱抵抗体14から発生する熱が感
熱紙等へ伝達されると同時に、蓄熱層12に伝達され
る。この蓄熱層12に蓄熱される熱については、放熱層
17により適度に放熱させる。これにより、発熱抵抗体
14から発生した熱について、放熱、蓄熱の熱バランス
がとれる。したがつて、耐熱性樹脂21,22の熱分解
による劣化を防止でき、その寿命が増す。加えて、蓄熱
層12の蓄熱のし過ぎを防止でき、その尾引き現象を防
止できる。
The heat generated from the heating resistor 14 is transferred to the thermal paper or the like, and at the same time, transferred to the heat storage layer 12. The heat stored in the heat storage layer 12 is appropriately dissipated by the heat dissipation layer 17. As a result, the heat generated from the heat generating resistor 14 is balanced in terms of heat dissipation and heat storage. Therefore, deterioration due to thermal decomposition of the heat resistant resins 21 and 22 can be prevented and the life thereof is increased. In addition, it is possible to prevent the heat storage layer 12 from storing too much heat, and to prevent its tailing phenomenon.
【0032】また、印字領域Lについて断面略円弧形状
を用いることにより、凸形状の端部に段差すなわち角部
をなくしてまるみを持たせ、その上にスパツタ、蒸着等
により電極層15a,15bを形成しているので、印字
領域Lの凸形状の端部における膜のステツプカバレツジ
が良くなり、電極層15a,15bの断線を防止できる
ようになつた。したがつて、サーマルヘツドの歩留が向
上した。
Further, by using a substantially arcuate cross-section for the printing area L, the convex end has a rounded portion by eliminating steps or corners, and the electrode layers 15a and 15b are formed thereon by sputtering or vapor deposition. Since it is formed, the step coverage of the film at the convex end of the printing region L is improved, and the disconnection of the electrode layers 15a and 15b can be prevented. Therefore, the yield of the thermal head was improved.
【0033】なお、本発明は、上記実施例に限定される
ものではなく、本発明の範囲内で上記実施例に多くの修
正および変更を加え得ることは勿論である。
The present invention is not limited to the above embodiment, and it goes without saying that many modifications and changes can be made to the above embodiment within the scope of the present invention.
【0034】[0034]
【発明の効果】以上の説明から明らかな通り、本発明請
求項1,2によると、印字領域を突出形成しているの
で、発熱抵抗体素子と感熱紙およびインクリボンとの紙
当たり性を向上し得、印字効率を向上できる。
As is apparent from the above description, according to claims 1 and 2 of the present invention, the printing area is formed to project, so that the paper contact property between the heating resistor element and the thermal paper and the ink ribbon is improved. The printing efficiency can be improved.
【0035】しかも、蓄熱層は熱伝導性の低い耐熱性樹
脂を用いているので、絶縁基板側への熱伝導量を小さ
く、逆に感熱紙やインクリボン側への熱伝導量を大きく
できる。そのため、さらに印字効率を大幅に向上させる
ことができる。
Moreover, since the heat storage layer uses a heat resistant resin having a low heat conductivity, the heat conduction amount to the insulating substrate side can be made small, and conversely, the heat conduction amount to the thermal paper or the ink ribbon side can be made large. Therefore, the printing efficiency can be significantly improved.
【0036】しかも、蓄熱層を断面略円弧状としている
ので、従来のような凸形状の端部の角部がなくなり、電
極層の断線を防止でき、サーマルヘツドの歩留を向上し
得る。
In addition, since the heat storage layer has a substantially arcuate cross section, the corners of the projecting end as in the prior art are eliminated, disconnection of the electrode layer can be prevented, and the yield of the thermal head can be improved.
【0037】本発明請求項3によると、印字領域におけ
る絶縁基板と蓄熱層との間に放熱層を設けているので、
蓄熱層の蓄熱量が過度になることによる耐熱性樹脂の劣
化を防止でき、サーマルヘツドの寿命を向上させ得ると
いつた優れた効果がある。
According to claim 3 of the present invention, since the heat dissipation layer is provided between the insulating substrate and the heat storage layer in the printing area,
If the heat-resistant resin can be prevented from deteriorating due to an excessive amount of heat stored in the heat storage layer, and the life of the thermal head can be improved, it will have an excellent effect.
【図面の簡単な説明】[Brief description of drawings]
【図1】図1は本発明の一実施例を示すサーマルヘツド
の断面図である。
FIG. 1 is a sectional view of a thermal head showing an embodiment of the present invention.
【図2】図2は従来のサーマルヘツドの構成断面図であ
る。
FIG. 2 is a cross-sectional view of a conventional thermal head.
【図3】図3は従来のサーマルヘツドの構成断面図であ
る。
FIG. 3 is a cross-sectional view of a conventional thermal head.
【図4】図4は従来のサーマルヘツドの構成断面図であ
る。
FIG. 4 is a cross-sectional view of a conventional thermal head.
【符号の説明】[Explanation of symbols]
11 絶縁基板 12 蓄熱層 13 下部保護膜層 14 発熱抵抗体層 15a,15b 電極層 16 上部保護膜層 17 放熱層 21 耐熱性樹脂 L 印字領域 11 Insulating Substrate 12 Heat Storage Layer 13 Lower Protective Film Layer 14 Heating Resistor Layers 15a, 15b Electrode Layer 16 Upper Protective Film Layer 17 Heat Dissipating Layer 21 Heat Resistant Resin L Printing Area

Claims (3)

    【特許請求の範囲】[Claims]
  1. 【請求項1】 感光紙やインクリボンを印字領域で部分
    的に加熱して印字するものであつて、絶縁基板上に、蓄
    熱層と、発熱抵抗体層と、電極層とが、外側に向かつて
    積層されたサーマルヘツドにおいて、前記蓄熱層は、熱
    伝導性の低い耐熱性樹脂からなり、該蓄熱層の印字領域
    は、外側へ断面略円弧状に突出形成されたことを特徴と
    するサーマルヘツド。
    1. A method for printing by partially heating a photosensitive paper or an ink ribbon in a printing area, wherein a heat storage layer, a heating resistor layer, and an electrode layer face outward on an insulating substrate. In the thermal heads that have been laminated, the thermal storage layer is made of a heat-resistant resin having a low thermal conductivity, and the print area of the thermal storage layer is formed to project outward in a substantially arcuate cross section. ..
  2. 【請求項2】 絶縁基板上に、蓄熱層、下部保護層、発
    熱抵抗体層、電極層および上部保護膜層を外側に向かつ
    て順次積層するサーマルヘツドの製造方法において、前
    記蓄熱層の形成時に、絶縁基板上の全面に蓄熱層として
    の耐熱性樹脂を塗布し、印字領域を残して除去後、これ
    らの表面全体に再度耐熱性樹脂を塗布して、蓄熱層の印
    字領域を外側へ断面略円弧状に突出形成することを特徴
    とするサーマルヘツドの製造方法。
    2. A method of manufacturing a thermal head in which a heat storage layer, a lower protective layer, a heating resistor layer, an electrode layer and an upper protective film layer are sequentially laminated outward on an insulating substrate in the method of forming the heat storage layer. Apply heat-resistant resin as a heat storage layer on the entire surface of the insulating substrate, remove it leaving the print area, and then apply heat-resistant resin again on the entire surface of the heat storage layer to cut the print area of the heat storage layer outward. A method of manufacturing a thermal head, characterized in that it is formed in an arc shape.
  3. 【請求項3】 請求項1記載のサーマルヘツドにおい
    て、印字領域における絶縁基板と蓄熱層との間に、蓄熱
    層からの熱を絶縁基板に放熱する放熱層が設けられたこ
    とを特徴とするサーマルヘツド。
    3. The thermal head according to claim 1, wherein a heat dissipation layer for dissipating heat from the heat storage layer to the insulating substrate is provided between the insulating substrate and the heat storage layer in the print area. Head.
JP31250091A 1991-11-27 1991-11-27 Thermal head and its manufacture Pending JPH05212888A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31250091A JPH05212888A (en) 1991-11-27 1991-11-27 Thermal head and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31250091A JPH05212888A (en) 1991-11-27 1991-11-27 Thermal head and its manufacture

Publications (1)

Publication Number Publication Date
JPH05212888A true JPH05212888A (en) 1993-08-24

Family

ID=18029966

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31250091A Pending JPH05212888A (en) 1991-11-27 1991-11-27 Thermal head and its manufacture

Country Status (1)

Country Link
JP (1) JPH05212888A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7460143B2 (en) * 2003-09-16 2008-12-02 Rohm Co., Ltd. Thermal printhead with a resistor layer and method for manufacturing same
WO2018171093A1 (en) * 2017-03-20 2018-09-27 深圳市博思得科技发展有限公司 Thermal print head

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7460143B2 (en) * 2003-09-16 2008-12-02 Rohm Co., Ltd. Thermal printhead with a resistor layer and method for manufacturing same
WO2018171093A1 (en) * 2017-03-20 2018-09-27 深圳市博思得科技发展有限公司 Thermal print head
CN109968826A (en) * 2017-03-20 2019-07-05 深圳市博思得科技发展有限公司 Thermal printing head

Similar Documents

Publication Publication Date Title
EP0767065B1 (en) Thermal printing head, substrate used therefor and method for producing the substrate
US4309117A (en) Ribbon configuration for resistive ribbon thermal transfer printing
JP5039940B2 (en) Heating resistance element, thermal head, printer, and method of manufacturing heating resistance element
JP4895344B2 (en) Heating resistance element, thermal head and printer using the same
EP1557275A2 (en) Thermal head
JP2611981B2 (en) Substrate for ink jet recording head and ink jet recording head
JP5918383B2 (en) Thermal head and thermal printer equipped with the same
US7352381B2 (en) Thermal print head
US6950117B2 (en) Thermal head
JP5200256B2 (en) Manufacturing method of thermal head
US20020195445A1 (en) Heater with improved heat conductivity
JP2007245672A (en) Thermal head and printer apparatus equipped with this
US5661513A (en) Thermal head
US5940109A (en) Thermal printhead, substrate for the same and method for making the substrate
US6236423B1 (en) Thermal head and method of manufacturing the same
JP4105961B2 (en) Heating head
JP4367771B2 (en) Thermal head
EP1036662A2 (en) Color printer and method of feeding paper to the same, thermal head and method of making the same, and lamp reflex board and thermal recording device using the same
JP3831385B2 (en) Thermal print head
US7969459B2 (en) Thermal print head
US8098268B2 (en) Thermal head and printing device
JP3784366B2 (en) Method for smoothing the surface of photographic paper
JP4619876B2 (en) Heating resistance element parts and printer
US20070040868A1 (en) Thermal printhead
KR20070094515A (en) Thermal head and printing device