CN108598135A - OLED display panel and preparation method thereof - Google Patents
OLED display panel and preparation method thereof Download PDFInfo
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- CN108598135A CN108598135A CN201810575822.0A CN201810575822A CN108598135A CN 108598135 A CN108598135 A CN 108598135A CN 201810575822 A CN201810575822 A CN 201810575822A CN 108598135 A CN108598135 A CN 108598135A
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- display panel
- oled display
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- buffer layer
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
A kind of OLED display panel of present invention offer and preparation method thereof, the OLED display panel definition have bending region, the bending region to be provided with signal lead；Wherein, the bending region surface is provided with bending stress buffer layer, and the bending stress buffer layer covers the signal lead；The bending stress buffer layer prepares to be formed using organic material.Advantageous effect：The present invention in bending region surface by being arranged bending stress buffer layer so that the stress at metal routing in bending region reduces the risk that metal routing is broken because bending for a long time, and then improve the service life of display panel close to zero.
Description
Technical field
The present invention relates to display technology field more particularly to the systems of a kind of OLED display panel and the OLED display panel
Preparation Method.
Background technology
Organic Light Emitting Diode (Organic Light-Emitting Diode, OLED) is because it is in solid-state lighting and tablet
The direction of display possesses huge development potentiality and has obtained the very big concern of academia and industrial circle.What OLED tablets can be done
It is lighter and thinner, thus flexible display technologies will be following development trend.Common substrate substrate is mostly PI (polyimides) etc.
Flexible substrate, thin film transistor (TFT) by the control of signal, realize the luminous regulation and control to OLED device on flexible substrates.
However, largely transmitting the metal routing of signal can be integrated at the lower edge of display panel, in rear end module group procedure
It is middle to carry out bending action folding and the back side fixed to display panel, a more serious risk can be brought in this way, i.e., when long
Between the stress that generates in bending process so that the case where metal routing in the region is often broken, to cause letter
Number lost contact.
In conclusion the OLED display panel of the prior art, the metal routing positioned at bending region because keeping curved for a long time
Folding state, meeting affected by force leads to risk increase of breaking, and then reduces the service life of OLED display panel.
Invention content
The present invention provides a kind of OLED display panel, and in the bending region of OLED display panel, setting bending stress buffers
Layer, to reduce the stress generated to metal routing when OLED display panel bending, to solve the OLED display panel of the prior art,
Metal routing positioned at bending region because keeping bending state, meeting affected by force to lead to risk increase of breaking for a long time, in turn
The technical issues of reducing the service life of OLED display panel.
To solve the above problems, technical solution provided by the invention is as follows：
The present invention provides a kind of OLED display panel, and the OLED display panel definition has bending region, the bent area
Field surface is provided with signal lead；
Wherein, the bending region surface is provided with bending stress buffer layer, described in the bending stress buffer layer covering
Signal lead；The bending stress buffer layer prepares to be formed using organic material.
According to one preferred embodiment of the present invention, the bending edges of regions is provided with fence structure, and the bending stress is slow
Layer is rushed to be formed in the fence structure.
According to one preferred embodiment of the present invention, the elastic membrane amount of the fence structure is more than the bending stress buffer layer
Elastic membrane amount.
According to one preferred embodiment of the present invention, the fence structure includes outer barricade and interior barricade, the height of the outer barricade
Degree is higher than the height of the interior barricade, also, the outer barricade partly overlaps with the interior barricade.
According to one preferred embodiment of the present invention, the inside of the fence structure is in continuous climbing face.
According to one preferred embodiment of the present invention, the edge of the bending stress buffer layer is bonded on the inside of the fence structure,
Also, the edge thickness of the bending stress buffer layer is less than the height of the outer barricade.
According to one preferred embodiment of the present invention, in the bending region, it is located at the described curved of the signal lead side
The thickness of transverse stress buffer layer and the product of elastic membrane amount, are approximately equal to the thickness and bullet of the film layer positioned at the signal lead other side
The product of property film amount.
According to one preferred embodiment of the present invention, the bending stress buffer layer includes the first organic film, and is formed in
The elastic membrane amount of second organic film on first organic film surface, second organic film is organic more than described first
The elastic membrane amount of film layer.
According to one preferred embodiment of the present invention, the edge of first organic film is bonded the interior barricade side, described
The edge thickness of first organic film is less than the height of the interior barricade；The edge of second organic film is bonded the outer gear
Wall side and the interior barricade top surface, the edge thickness of second organic film are less than the height of the outer barricade.
The present invention also proposes a kind of OLED display panel preparation method, the method includes：
S10, provides OLED display panel, and the OLED display panel define display area, bending region and
Binding region；
Fence structure is arranged in S20, the edge along the bending region；
S30 forms organic material layer in the fence structure interior zone, curved to be formed in the bending region surface
Transverse stress buffer layer.
According to one preferred embodiment of the present invention, the S20 is specifically included：
S201 forms the first organic material layer in the bending region surface；
S202, in the first organic material layer coating photoresist；
S203 is exposed processing using exposure sources and light shield to the setting regions of photoresist layer；
S204 carries out development treatment to the photoresist layer, forms photoetching agent pattern；
S205 performs etching processing to the organic material layer, forms patterned first organic material layer, removal
The photoresist forms the fence structure.
According to one preferred embodiment of the present invention, the S30 is specifically included：Using InkJet printing processes, by second organic material
The bed of material prepares the interior zone in the fence structure, forms the bending stress buffer layer.
Beneficial effects of the present invention are：A kind of OLED display panel of present invention offer and preparation method thereof, by being bent
Bending stress buffer layer is arranged in region surface so that the stress at metal routing in bending region reduces gold close to zero
Belong to the risk that cabling is broken because bending for a long time, and then improves the service life of display panel.
Description of the drawings
It, below will be to embodiment or the prior art in order to illustrate more clearly of embodiment or technical solution in the prior art
Attached drawing needed in description is briefly described, it should be apparent that, the accompanying drawings in the following description is only some invented
Embodiment for those of ordinary skill in the art without creative efforts, can also be attached according to these
Figure obtains other attached drawings.
Fig. 1 is the sectional view of the display panel of this preferred embodiment one.
Fig. 2 is the sectional view of the display panel of this preferred embodiment two.
Fig. 3 is the production method flow chart of display panel of the present invention.
Specific implementation mode
The explanation of following embodiment is referred to the additional illustration, to illustrate the present invention can be used to implement particular implementation
Example.The direction term that the present invention is previously mentioned, such as [on], [under], [preceding], [rear], [left side], [right side], [interior], [outer], [side]
Deng being only the direction with reference to annexed drawings.Therefore, the direction term used be illustrate and understand the present invention, rather than to
The limitation present invention.The similar unit of structure is with being given the same reference numerals in the figure.
The present invention is directed to the OLED display panel of the prior art, and the metal routing positioned at bending region because keeping curved for a long time
Folding state, meeting affected by force lead to risk increase of breaking, and then the technical issues of the service life of reduction OLED display panel,
The present embodiment can solve the defect.
As shown in FIG. 1, FIG. 1 is the sectional view of the OLED display panel of this preferred embodiment one, the present invention provides a kind of
OLED display panel, including：Non-display area including display area and positioned at display area one end；The non-display area
Signal lead 130, bending region and binding region are provided in domain, one end of the signal lead 130 extends to described show
Show in region, the opposite other end is extended to by the bending region in the binding region.
The OLED display panel includes：Array substrate 110, the array substrate 110 include thin film transistor (TFT) array, source
Pole, drain electrode, pixel electrode；Insulating layer 120, is set to 110 surface of the array substrate, and signal lead 130 is set to described exhausted
The surface of edge layer 120；Planarization layer 140 is set on the insulating layer 120；Pixel defining layer 150 is set to described flat
Change 140 surface of layer；OLED display layers 160 are set to 150 surface of the pixel defining layer；And thin-film encapsulation layer 170, setting
In the surface of the OLED display layers 160；Filled layer 180,110 table of the array substrate being set in the bending region
Face；Bending stress buffer layer 190 is set to 130 surface of the signal lead in the bending region；Fence structure 200, if
It is placed in 130 surface of the signal lead in the non-display area.
Wherein, comparable in elastic membrane amount, make the thickness of the bending stress buffer layer 190, with the bending
The thickness for being located at total film layer of 130 lower section of the signal lead in region is identical, may make that the bending region is being bent
When, the signal lead 130 is on the stress neutral axis in the bending region, the stress of the bending stress buffer layer 190
It cancels out each other with the stress of the film layer of 130 lower section of the signal lead so that the stress at the signal lead 130 is zero, drop
The risk that the low signal lead 130 fractures.
Specifically, in the case of elastic membrane amount is discrepant, in the bending region, it is located at the signal lead side
The product of the thickness and elastic membrane amount of the bending stress buffer layer is approximately equal to the thickness of the film layer positioned at the signal lead other side
The product of degree and elastic membrane amount, can equally make the bending region when being bent, and the signal lead 130 is in described
On the stress neutral axis for bending region, the film layer of the stress and 130 lower section of the signal lead of the bending stress buffer layer 190
Stress cancel out each other so that the stress at the signal lead 130 is zero, reduces the risk that the signal lead 130 fractures.
Since the elastic membrane amount of object is bigger, stress when which deforms upon is bigger, and generation elastic deformation is smaller, and
The bending region when being bent, the filled layer 180, the bending stress buffer layer 190 occur elastic deformation according to
Secondary reduction, therefore, accordingly, it is desirable that the filled layer 180, the bending stress buffer layer 190 elastic membrane amount be sequentially increased,
The elastic membrane amount of i.e. described 190 material of bending stress buffer layer is more than the elastic membrane amount of 180 material of the filled layer.
The bending stress buffer layer 190 and the filled layer 180 are all made of organic material making, and the bending stress is slow
Layer 190 is rushed to prepare on 130 surface of the signal lead using InkJet printing processes, since organic material has mobility, in order to
Ink spilling in the production process is avoided, the barrier wall structure 200 is set in 190 surrounding of bending stress buffer layer, it is described
Fence structure 200 is stopping the bending stress buffer layer 190 so that the bending stress buffer layer 190, which is in, limits area
In domain.
Wherein, the fence structure 200 includes outer barricade 201 and interior barricade 202, and the height of the outer barricade 201 is higher than
The interior barricade 202, also, the outer barricade 201 partly overlaps with the interior barricade 202, the outer barricade 201 with it is described interior
Barricade 202 forms hierarchic structure, and for the interior barricade 202 close to the bending stress buffer layer 190, the outer barricade 201 is separate
The bending stress buffer layer 190 can effectively limited the bending stress buffer layer 190 control by the way that two layers of barricade is arranged
In region.
The thicknesses of layers of the bending stress buffer layer 190 is less than the height of the outer barricade 201, i.e., the described bending stress
Buffer layer 190 is away from a side surface of the array substrate 110 less than the outer barricade 201 away from the array substrate 110
One side surface, to prevent during making bending stress buffer layer 190, organic material overflows the outer barricade 201.
The interior barricade 202 and the outer barricade 201 are a closing structure, and surround the bending stress buffer layer
190 settings.
The inside of the outer barricade 201 and the interior barricade 202 is in continuous climbing face so that film layer and the fence structure
Between connect it is more secured.The OLED display layers 160 include the anode being successively set in the array substrate, hole injection
Layer, hole transmission layer, OLED luminescent layers, electron transfer layer, electron injecting layer and cathode.
The first via is provided on the planarization layer 130, it is described to accommodate the anode of the OLED display layers 160
Anode is electrically connected by source electrode in first via and the array substrate 110 or drain electrode.
The second via is provided in the pixel defining layer 150, to accommodate the part-structure in OLED display layers 160,
Such as OLED luminescent layers, the OLED luminescent layers are connect by second via with the anode.
The cathode of the OLED display layers 160 is arranged on the surface of the pixel defining layer 150.
The thin-film encapsulation layer 170 covers the OLED display layers 160；The thin-film encapsulation layer 170 includes setting gradually
The first inorganic encapsulated layer 171, organic layer 172, the second inorganic layer 173 on 160 surface of OLED display layers；First nothing
Machine encapsulated layer 171 covers the OLED display layers 160；Second inorganic layer 173 covers the first inorganic encapsulated layer 171 and described
Organic layer 172；Because the organic layer 172 has mobility, it is also equipped with barrier wall structure at the edge of the organic layer 172, is used
To prevent the organic layer 172 from overflowing.
The binding region includes IC driving circuits and flexible PCB.
The interior barricade 202 and the outer barricade 201 are all made of organic material making, the interior barricade 202 with it is described outer
Optical cover process making, including depositing organic material, coating photoresist, exposure, development, etching, glass light can be used in barricade 201
A series of processing procedures such as photoresist.
As shown in Fig. 2, Fig. 2 is the sectional view of the OLED display panel of this preferred embodiment two, this preferred embodiment and reality
Example one is applied the difference is that the structure of bending stress buffer layer 190 is different, other structures are identical as embodiment one.
Bending stress buffer layer 190 in this preferred embodiment includes the first organic film 191 and the second organic film
192, first organic film 191 is set to the surface of the signal lead 130 in the bending region, and described second has
Machine film layer 192 is set to the surface of first organic film 191.
Wherein, first organic film 191 covers the signal lead 130；The thickness of first organic film 191
Less than the thickness of second organic film 192.
First organic film 191 and second organic film 192 are all made of InkJet printing processes preparation.
First organic film 191 is away from a side surface of the array substrate 110 and second organic film 192
It is curved surfaces away from a side surface of the array substrate 110.
Second organic film 192 deviates from away from a side surface of the array substrate 110 less than the outer barricade 201
One side surface of the array substrate 110 is overflowed to avoid first organic film 191 and second organic film 192
Limited area.
Since the elastic membrane amount of object is bigger, stress when which deforms upon is bigger, and generation elastic deformation is smaller, and
The bending region is when being bent, the filled layer 180, first organic film 191 and second organic film
Layer 192 occur elastic deformations be sequentially reduced, therefore, accordingly, the filled layer 180, first organic film 191 and
The elastic membrane amount of second organic film 192 is sequentially increased.
By changing the thickness of second organic layer 192 and first organic layer 191, to make the signal lead
On the 130 stress neutral axis in bending region.
Since second organic layer 192 is arranged on 191 surface of the first organic layer, so, it is desirable that described second has
The barrier water oxygen performance of 192 material of machine layer is better than the barrier water oxygen performance of 191 material of the first organic layer.
The edge of first organic film is bonded the interior barricade side, and the edge thickness of first organic film is small
In the height of the interior barricade；The edge of second film layer is bonded the outer barricade side and the interior barricade top surface, described
The edge thickness of second film layer is less than the height of the outer barricade.
As shown in figure 3, Fig. 3 is the production method flow chart of steps of this preferred embodiment, OLED provided by the invention is shown
The preparation method of panel, including：
S10, provides OLED display panel, and the OLED display panel define display area, bending region and
Binding region；
Fence structure is arranged in S20, the edge along the bending region；
S30 forms organic material layer in the fence structure interior zone, curved to be formed in the bending region surface
Transverse stress buffer layer.
Wherein, the S20 includes：
S201 forms the first organic material layer in the bending region surface；
S202, in the first organic material layer coating photoresist；
S203 is exposed processing using exposure sources and light shield to the setting regions of photoresist layer；
S204 carries out development treatment to the photoresist layer, forms photoetching agent pattern；
S205 performs etching processing to the organic material layer, forms patterned first organic material layer, removal
The photoresist forms the fence structure.
Wherein, S30 includes：Using InkJet printing processes, the second organic material layer is prepared in the fence structure
Portion region forms the bending stress buffer layer.
Beneficial effects of the present invention are：A kind of OLED display panel of present invention offer and preparation method thereof, by being bent
Bending stress buffer layer is arranged in region surface so that the stress at metal routing in bending region reduces gold close to zero
Belong to the risk that cabling is broken because bending for a long time, and then improves the service life of display panel.
In conclusion although the present invention is disclosed above with preferred embodiment, above preferred embodiment is not to limit
The system present invention, those skilled in the art can make various changes and profit without departing from the spirit and scope of the present invention
Decorations, therefore protection scope of the present invention is subject to the range that claim defines.
Claims (12)
1. a kind of OLED display panel, which is characterized in that the OLED display panel definition has bending region, the bending region
Surface is provided with signal lead；
Wherein, the bending region surface is provided with bending stress buffer layer, and the bending stress buffer layer covers the signal
Cabling；The bending stress buffer layer prepares to be formed using organic material.
2. OLED display panel according to claim 1, which is characterized in that the bending edges of regions is provided with enclosure wall knot
Structure, the bending stress buffer layer are formed in the fence structure.
3. OLED display panel according to claim 2, which is characterized in that the elastic membrane amount of the fence structure is more than
The elastic membrane amount of the bending stress buffer layer.
4. OLED display panel according to claim 2, which is characterized in that the fence structure includes outer barricade and interior gear
Wall, the height of the outer barricade is higher than the height of the interior barricade, also, the outer barricade partly overlaps with the interior barricade.
5. OLED display panel according to claim 4, which is characterized in that the inside of the fence structure is in continuous climbing
Face.
6. OLED display panel according to claim 4, which is characterized in that the edge of the bending stress buffer layer is bonded
On the inside of the fence structure, also, the edge thickness of the bending stress buffer layer, it is less than the height of the outer barricade.
7. OLED display panel according to claim 1, which is characterized in that in the bending region, be located at the letter
The product of the thickness and elastic membrane amount of the bending stress buffer layer of number cabling side, is approximately equal to another positioned at the signal lead
The thickness of the film layer of side and the product of elastic membrane amount.
8. OLED display panel according to claim 7, which is characterized in that the bending stress buffer layer has including first
Machine film layer, and it is formed in second organic film on first organic film surface, the elastic membrane of second organic film
Elastic membrane amount of the amount more than first organic film.
9. OLED display panel according to claim 8, which is characterized in that the edge of first organic film is bonded institute
Interior barricade side is stated, the edge thickness of first organic film is less than the height of the interior barricade；The side of second film layer
Edge is bonded the outer barricade side and the interior barricade top surface, and the edge thickness of second film layer is less than the height of the outer barricade
Degree.
10.OLED display panel preparation methods, which is characterized in that the method includes：
S10 provides OLED display panel, and defines display area, bending region and binding in the OLED display panel
Region；
Fence structure is arranged in S20, the edge along the bending region；
S30 forms organic material layer in the fence structure interior zone, is answered to form bending in the bending region surface
Power buffer layer.
11. preparation method according to claim 10, which is characterized in that the S20 includes：
S201 forms the first organic material layer in the bending region surface；
S202, in the first organic material layer coating photoresist；
S203 is exposed processing using exposure sources and light shield to the setting regions of photoresist layer；
S204 carries out development treatment to the photoresist layer, forms photoetching agent pattern；
S205 performs etching processing to the organic material layer, forms patterned first organic material layer, described in removal
Photoresist forms the fence structure.
12. preparation method according to claim 10, which is characterized in that the S30 includes：It, will using InkJet printing processes
Second organic material layer prepares the interior zone in the fence structure, forms the bending stress buffer layer.
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| CN201810575822.0A CN108598135A (en) | 2018-06-06 | 2018-06-06 | OLED display panel and preparation method thereof |
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Cited By (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109378339A (en) * | 2018-12-24 | 2019-02-22 | 武汉华星光电半导体显示技术有限公司 | Display panel and preparation method thereof with stress relief structure |
| CN109616493A (en) * | 2018-10-31 | 2019-04-12 | 武汉华星光电半导体显示技术有限公司 | Flexible display panels and display device |
| CN110620166A (en) * | 2019-08-26 | 2019-12-27 | 合肥工业大学 | Method for preparing ultra-flexible optical detector on neutral plane with zero stress |
| CN110718558A (en) * | 2019-09-16 | 2020-01-21 | 武汉华星光电半导体显示技术有限公司 | OLED display panel and preparation method thereof |
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| US11121333B2 (en) | 2019-09-16 | 2021-09-14 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | OLED display panel and method for fabricating same |
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| CN114141141A (en) * | 2021-11-08 | 2022-03-04 | 荣耀终端有限公司 | Display panel and electronic equipment |
| CN115346438A (en) * | 2022-08-04 | 2022-11-15 | 武汉华星光电半导体显示技术有限公司 | Flexible display panel |
| WO2023015579A1 (en) * | 2021-08-09 | 2023-02-16 | Tcl华星光电技术有限公司 | Array substrate and fabrication method therefor |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150034935A1 (en) * | 2013-07-31 | 2015-02-05 | Samsung Display Co., Ltd. | Flexible display device and manufacturing method thereof |
| CN107123667A (en) * | 2017-06-28 | 2017-09-01 | 京东方科技集团股份有限公司 | Flexible array substrate and preparation method thereof, flexible display |
| CN107706220A (en) * | 2017-09-28 | 2018-02-16 | 上海天马微电子有限公司 | Flexible display panels and preparation method thereof and display device |
-
2018
- 2018-06-06 CN CN201810575822.0A patent/CN108598135A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150034935A1 (en) * | 2013-07-31 | 2015-02-05 | Samsung Display Co., Ltd. | Flexible display device and manufacturing method thereof |
| CN107123667A (en) * | 2017-06-28 | 2017-09-01 | 京东方科技集团股份有限公司 | Flexible array substrate and preparation method thereof, flexible display |
| CN107706220A (en) * | 2017-09-28 | 2018-02-16 | 上海天马微电子有限公司 | Flexible display panels and preparation method thereof and display device |
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| WO2020118823A1 (en) * | 2018-12-12 | 2020-06-18 | 武汉华星光电半导体显示技术有限公司 | Display panel and display apparatus having display panel |
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| CN109378339A (en) * | 2018-12-24 | 2019-02-22 | 武汉华星光电半导体显示技术有限公司 | Display panel and preparation method thereof with stress relief structure |
| CN110620166A (en) * | 2019-08-26 | 2019-12-27 | 合肥工业大学 | Method for preparing ultra-flexible optical detector on neutral plane with zero stress |
| WO2021051728A1 (en) * | 2019-09-16 | 2021-03-25 | 武汉华星光电半导体显示技术有限公司 | Oled display panel and manufacturing method therefor |
| CN110718558A (en) * | 2019-09-16 | 2020-01-21 | 武汉华星光电半导体显示技术有限公司 | OLED display panel and preparation method thereof |
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Application publication date: 20180928 |