CN104103669A - Flexible display panel - Google Patents
Flexible display panel Download PDFInfo
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- CN104103669A CN104103669A CN201410145315.5A CN201410145315A CN104103669A CN 104103669 A CN104103669 A CN 104103669A CN 201410145315 A CN201410145315 A CN 201410145315A CN 104103669 A CN104103669 A CN 104103669A
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- flexible display
- display panels
- active region
- layer
- substrate
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
- G06F1/1652—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being flexible, e.g. mimicking a sheet of paper, or rollable
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
- H04M1/0268—Details of the structure or mounting of specific components for a display module assembly including a flexible display panel
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Abstract
The present invention relates to a flexible display panel for suppressing a problem in which a crack such as disconnection on an internal circuit layer or the like is generated or a required warpage level is not attainable in a warped area while bending an edge portion thereof. According to an embodiment of the present invention, the layer structure of a signal line portion for electrically connecting elements provided within a display area and a non-active area may be simplified, and a protective member may be formed thereon, thereby obtaining the effect of minimizing the damage of the layer structure due to bending.
Description
Technical field
The present invention relates to flexible display panels, and relate more specifically to the flexible display panels for suppressing following problem: in the time of the marginal portion of bending flexible display panels, on internal circuit layer etc., produce the crimp levels that requirement is for example interrupted or can not obtains in curled regions in crack.
Background technology
In recent years, along with the concern that information shows is risen and uses the increase in demand of portable information medium, the panel display apparatus for replacing for example cathode ray tube of existing display unit (FPD) and commercialization thereof are conducted extensive research.
In this flat panel display field, although the liquid crystal indicator of liquid lightweight and low-power consumption has become the most noticeable up to now panel display apparatus, carry out energetically the exploitation to new flat-panel monitor according to various demands.
Because Organic Light Emitting Diode (OLED) display unit as one of new flat-panel monitor is spontaneous luminescence type, so organic LED display device has fabulous visual angle and contrast-response characteristic and do not need (this is contrary with liquid crystal display) backlight, therefore obtain the device of lightweight and compact and be useful on aspect energy consumption.In addition, organic LED display device has advantage on low DC voltage driving and high response speed, and also especially has useful advantage aspect manufacturing cost.
Especially, even folding or also not easily damaged flexible display apparatus is by the new technology becoming in panel display apparatus field while rolling, the organic light-emitting display device that easily carries out pixel formation in flexible plastic substrates is than being generally more suitable for realizing flexible display apparatus with technical development by the liquid crystal display of glass substrate.
Fig. 1 is the figure of the flexible display panels with plastic material substrate that uses in the flexible display apparatus being shown schematically in correlation technique.
With reference to Fig. 1, flexible display apparatus 1 is formed as having the active region (A/A) of realizing real image on plastic base 10 and the non-active region (N/A) that surrounds this active region (A/A).Although not shown in the drawings, in active region (A/A), be formed with the pixel region limiting by multiple gate lines and data wire, in this pixel region, be formed with multiple thin-film transistors.
In addition, the left distal end in the non-active region (N/A) of flexible display apparatus 1 and right end are sentenced panel inner grid (GIP) structure two gate driver circuits 30 are imbedded wherein.Gate driver circuit 30 is fed to each pixel by the holding wire that is connected to the gate line in active region (A/A) by signal.In addition, be provided with at a side place of non-active region (N/A) data drive circuit 40 that is connected to the data wire on active region (A/A).Data drive circuit 40 is electrically connected to the weld pad 46 forming in a side end of flexible display panels 1.In addition, the polarizing coating of the optical characteristics for compensating flexible display panels 1 60 is adhered to the front surface of active region (A/A).
When the flexible display panels that has a said structure in use realizes display unit, propose wherein to realize by least one side end of bending flexible display panels the structure of narrow frame (bezel).
Fig. 2 is the figure of the warp architecture of the flexible display panels for narrow edge frame structure is described.
With reference to Fig. 2, be configured to there is following form by being formed with the active region (A/A) of multiple pixels and surrounding the flexible display apparatus 1 that the non-active region (N/A) of this active region (A/A) limits: successively the stacking plastic base 10 with polyimides or analog structure, be formed on the driving element layer 20 that comprises various holding wires and multiple thin-film transistors on substrate 10, be formed on driving element layer 20 to realize the light emitting element layer 25 of image; Be configured to protect driving element layer 20 under it and the barrier film 40 of light emitting element layer 25; And be configured to the polarizing coating 60 of compensate for optical characteristic.In addition, the bottom of substrate 10 will further be adhered to for the support membrane 70 with PETG (PET) material that supports flexible display panels 1.At this, non-active region (N/A) is not the region for showing image, therefore be configured to not comprise light emitting element layer 25, barrier film 40 and polarizing coating 60, but be configured to comprise the prearranged signals line and the thin-film transistor that form gate driver circuit in GIP mode.
In order to realize narrow frame in the flexible display apparatus with said structure, flexible display apparatus is constructed so that non-active region (N/A) is curling along the back of the body surface direction of display floater 1.At this, form and be included in holding wire in driving element layer 20 and the metal of thin-film transistor is formed by titanium/aluminium/titanium (Ti/Al/Ti) in the situation that of the electrode/drain electrode of source, and formed by molybdenum niobium/aluminium (MoNb/Al) in the situation that of gate electrode, and owing to often producing crack acting on the power on driving element layer 20 during BENDING PROCESS.
In addition,, compared with plastic base 10, the support membrane 70 that adheres to the bottom of plastic base 10 has and is not easy curling characteristic, causes that thus warp architecture can not keep the problem of its former state during the assembling process of display unit.
Summary of the invention
The present invention is devoted to address the above problem, and one object of the present invention is for providing a kind of for making every side end of the flexible display panels of utilizing plastic base curling to realize narrow border structure and to make the impaired minimized flexible display apparatus of holding wire, the thin-film transistor etc. of curled regions.
To achieve these goals, can comprise according to the flexible display panels of an embodiment of present disclosure: the active region that is provided with multiple pixels with sandwich construction; Be configured to the non-active region that surrounds this active region and be provided with the gate driver circuit with sandwich construction; And be limited with the substrate that is formed on the bending area between gate driver circuit and active region, and at least one side surface of substrate is curling along the back of the body surface direction of substrate, wherein bending area comprises by the boost line forming for the one deck that gate driver circuit is electrically connected to pixel.
In addition, to achieve these goals, can comprise according to the flexible display panels of an embodiment of present disclosure: be limited with active region and comprise the substrate of the non-active region of GIP region and bending area, and the bending area of substrate is curling along the back of the body surface direction of substrate; Be respectively formed on active region and GIP region to comprise the driving element layer of the thin-film transistor that is connected to gate line and data wire; Be formed on bending area to be electrically connected to the boost line of driving element layer; Be formed on the light emitting element layer that is divided into each pixel on driving element layer; Be formed on the first passivation layer on light emitting element layer; Be formed on the organic layer on the first passivation layer; And be formed on the second passivation layer on the first passivation layer of active region, by adhesive, diaphragm is adhered to the top of the second passivation layer.
Foundation is according to the flexible display apparatus of an embodiment of present disclosure; for the layer structure that is arranged on the holding wire part that viewing area (active region) is electrically connected with the element in non-active region can be simplified; and can in holding wire part, form diaphragm, obtain thus and make layer structure due to the bending impaired minimized effect causing.
Brief description of the drawings
The present invention includes accompanying drawing so that the further understanding to invention to be provided, and accompanying drawing is introduced into and forms a part for specification, accompanying drawing illustrates working of an invention scheme and is used from the principle of explanation invention with embodiment one.
In the accompanying drawings:
Fig. 1 is the figure of the flexible display panels with plastic material substrate that uses in the flexible display apparatus being shown schematically in correlation technique;
Fig. 2 is the figure of the warp architecture of the flexible display panels for narrow edge frame structure is described;
Fig. 3 is the figure illustrating according to the structure of the flexible display panels of an embodiment of present disclosure;
Fig. 4 is for illustrating the cross-sectional view of the part that in Fig. 3, IV-IV' along the line gets;
Fig. 5 A illustrates the figure with a fixing example of warp architecture according to the flexible display panels of an embodiment of present disclosure, and Fig. 5 B is for illustrating the cross-sectional view of the part that in Fig. 5 A, V-V' along the line gets; And
Fig. 6 A is for illustrating that processing is according to the figure of the method for the flexible display panels of another embodiment of present disclosure, and Fig. 6 B is for illustrating the figure of the display device structure after the bending of processed flexible display panels.
Embodiment
Hereinafter, flexible display apparatus and manufacture method thereof according to a preferred embodiment of the invention described with reference to the accompanying drawings.
Fig. 3 is the figure illustrating according to the structure of the flexible display panels of an embodiment of present disclosure.
With reference to Fig. 3, be defined as and have according to the flexible display panels 100 of present disclosure: be configured to there is the active region (A/A) of the demonstration image on flexible plastic material substrate 101 and be surrounded by the non-active region (N/A) in the outside of source region (A/A).
The active region (A/A) of flexible display panels 100 is formed with the multiple pixels (PX) that limited to comprise at least one thin-film transistor by multiple gate line (not shown) and data wire (not shown).In addition, be formed with abreast multiple power line (not shown) with data wire (not shown), and so various holding wires and thin-film transistor can form driving element layer (not shown) on substrate.The polarizing coating of the optical characteristics for compensating flexible display panels 100 160 is adhered to the superiors of active region (A/A).
In addition, the non-active region (N/A) at the both-side ends place of flexible display panels 100 is upper is provided with the gate line that is electrically connected to active region (A/A) so that the gate driver circuit 130 of gate drive signal to be provided in GIP mode.
In addition, the non-active region (N/A) in a side end of flexible display panels 100 is upper with COG(glass top chip) mode is provided with that the data drive circuit of data-signal 140 is provided.Data drive circuit 140 is electrically connected to external system by the weld pad 146 being formed on substrate 101.
Especially, be characterised in that according to the flexible display panels 100 of present disclosure: between the gate driver circuit 130 in non-active region (N/A) to be electrically connected to each other and active region (A/A), form additional holding wire; And on additional holding wire, form protective layer 150 so that during the bending of flexible display panels 100 the impaired of organic layer, inorganic layer and other holding wires minimize.
In other words, further form as follows protective layer 150: on substrate 101, form additional holding wire (not shown) to replace the layer structure being formed between conventional active region (A/A) and gate driver circuit 130 to simplify layer structure and to make because substrate 101 minimizes along the curling power that is applied to holding wire (not shown) of upward direction.
Hereinafter, describe in more detail according to the structure of the flexible display panels of an embodiment of present disclosure with reference to a cross section of display floater 100.
Fig. 4 is for illustrating the cross-sectional view of the part that in Fig. 3, IV-IV' along the line gets.
As shown in the drawing, be divided into the non-active region (N/A) that is configured to show the active region (A/A) of image and is configured to be surrounded by source region (A/A) outside according to the display floater 100 of an embodiment of present disclosure.
Each pixel (PX) in active region (A/A) can include OLED and for control Organic Light Emitting Diode at least one switching thin-film transistor and drive thin-film transistor.
In addition, in order to encapsulate pixel (PX) on the whole surface of substrate, in the mode of facing, barrier film 147 is set, and polarizing coating 160 is adhered to the top of barrier film 147.Polarizing coating 160 plays and prevents that picture quality is owing to inciding the reflection of light of organic light-emitting display device from the external world and deteriorated effect.
Between the GIP region (G/A) that comprises gate driver circuit on non-active region (N/A) and active region (A/A), further limit bending area (B/A), and on bending area (B/A), be further formed for that GIP region (G/A) is electrically connected to the boost line 120 of active region (A/A) and for preventing that boost line 120 is due to bending and impaired protective layer 150.
At this, the minimized material of power that will be applied to boost line 120 can make the every side end of boost line 120 bending time is for the protection of layer 150, and at this, thickness and the Young's modulus of boost line 120 and substrate 101 can be taken into account.
With reference to Fig. 4, can on substrate 101, form by insulating material (especially, as the silicon dioxide (SiO of inorganic insulating material
2) or silicon nitride (SiN
x)) the resilient coating (not shown) made.Form resilient coating (not shown) so that semiconductor layer 103 due to the crystallization processes as the semiconductor layer 103 of technique subsequently during because the alkali metal ion deterioration in characteristics problem causing of overflowing from the inside of substrate 101 minimizes, resilient coating can omit.
In addition, each pixel (PX) in the active region on resilient coating (not shown) (A/A) is located be provided for controlling at least one switching thin-film transistor (not shown) of Organic Light Emitting Diode and drive thin-film transistor (TR1).At this, be formed on the driving thin-film transistor (TR1) in pixel with together with GIP thin-film transistor (TR2) on GIP region (G/A).
In addition, form semiconductor layer 103 with corresponding to each thin-film transistor (TR1, TR2), semiconductor layer 103 is configured to have by pure silicon polycrystal and makes with the central part office at semiconductor layer 103 and form the first district 103a of raceway groove and equal Second Region 103b and 103c doped with high concentration impurities in the both sides of the first district 103a.
On the resilient coating including semiconductor layer 103, form gate insulator 105.
In addition, on gate insulator 105, form the first district 103a of gate electrode 107 with the semiconductor layer 103 corresponding in each thin-film transistor (TR1, TR2).
In addition, on the layer identical with the layer of gate electrode 107, form the gate line (not shown) that is connected to the gate electrode 107 of switching thin-film transistor (not shown) and extends along a direction.At this, the single layer structure that gate electrode 107 and gate line can for example, be made up of the first metal material (, any in aluminium (Al), aluminium alloy (AlNd), molybdenum (Mo) and molybdenum titanium (MoTi)) forms or is formed by two or more double-deckers of making or three-decker in described the first metal material.
In addition, during gate electrode 107 and gate line formation, around bending area (B/A), further form boost line 120.Boost line 120 extends to active region (A/A) and non-active region (N/A) will drive thin-film transistor (TR1) to be electrically connected to GIP thin-film transistor (TR2).On figure, show boost line 120 wherein the source electrode that drives thin-film transistor (TR1) is connected to the example of the drain electrode of GIP thin-film transistor (TR2), but concrete syndeton can be according to circuit structure and different from this figure.
In addition, on figure, show boost line 120 wherein by with the Metal Phase of gate line and gate electrode 107 with the example that forms of metal, but boost line 120 can be with forming the source/drain metal of description except gate metal after a while.
And boost line 120 can form with the other flexible metal that has except gate metal or source/drain metal.Boost line 120 part for being curled during bending flexible display panels 100, therefore can be used the metal with flexible material, instead of normally used gate metal or source/drain metal are so that impaired minimizing.Therefore,, in the time that boost line 120 is used flexible copper (Cu) except above-mentioned metal or copper alloy to form, can reduce the extent of damage causing due to bending.
In addition, on the whole surface including gate electrode 107 and gate line of the active region of substrate, form by insulating material (for example,, as the silicon dioxide (SiO of inorganic insulation layer
2) or silicon nitride (SiN
x)) interlayer insulating film 109 made.At this, on the gate insulator 105 below interlayer insulating film 109 and interlayer insulating film 109, be formed for exposing the semiconductor layer contact hole (not shown) of Second Region 103b, the 103c at the both sides place of the first area 103a that is separately positioned on each semiconductor layer 103.
On the interlayer insulating film 109 that comprises semiconductor layer contact hole, form the data wire (not shown) that intersects to limit pixel (PX) with scan line.At this, data wire and power line can be any or its two or more combination in aluminium (Al), aluminium alloy (AlNd), molybdenum (Mo), molybdenum titanium (MoTi), chromium (Cr) and titanium (Ti).
In addition, in each transistor area on interlayer insulating film 109, form and contact with the Second Region 103b, the 103c that expose by semiconductor layer contact hole (not shown) respectively and by the source electrode 113a and the drain electrode 113b that make with the Metal Phase of data wire the second metal material together.At this, semiconductor layer 103, gate insulator 105 and the gate electrode 107 stacking gradually and interlayer insulating film 109 and the source electrode 113a that is formed as being isolated from each other and drain electrode 113b form and drive thin-film transistor (TR1), and are formed as having same structure at GIP region (G/A) upper GIP thin-film transistor (TR2) forming.
Especially, although show in the drawings each thin-film transistor (TR1, TR2) and all have the example of the polysilicon semiconductor layer 103 of top grid type, bottom gate polar form also can be applied to and drive thin-film transistor (TR1).
In the time that thin-film transistor (TR1, TR2) is configured to bottom gate polar form, this layer of structure can comprise: semiconductor layer, and this semiconductor layer is via gate electrode and active layer isolation/isolate and make by having the not ohmic contact layer of pure amorphous silicon via pure amorphous silicon and gate insulator; And the source electrode and the drain electrode that are isolated from each other.
In addition, driving the upper stacked flatness layer 115 with the drain contact hole (not shown) for exposing drain electrode 113b of thin-film transistor (TR1).Can use any insulating material (for example, as the silicon dioxide (SiO of inorganic insulating material
2) or silicon nitride (SiN
x), or the organic insulating material that comprises light acrylic (photo acryl)) for flatness layer 115.
In addition, on flatness layer 115, can form by drain contact hole (not shown) and contact so that each pixel (PX) has independently the first electrode 121 of shape with the drain electrode 113b that drives thin-film transistor (TR1).
In addition, at the first electrode 121 until form the bank layer (bank) 123 made by insulating material (benzocyclobutene (BCB), polyimides or light acrylic especially) on the border of each pixel and non-active region (N/A).Bank layer 123 be formed as surrounding each pixel (PX) with the shape of the imbricate of the first electrode 121, and be formed as having generally the trellis shape of multiple opening portions on active region (A/A).
On the first electrode 121 in each pixel (PX) of being surrounded by bank layer 123, form and be configured to have the organic luminous layer 125 of the organic light emission pattern (not shown) of red-emitting, green glow and blue light respectively.The individual layer that organic luminous layer 125 can be configured to be made up of luminous organic material or be configured to there is hole injection layer, the multi-ply construction of hole transmission layer, luminous material layer, electron transfer layer and electron injecting layer.
On the whole surface of the active region (A/A) in organic luminous layer 125 and bank layer 123, form the second electrode 127.At this, the first electrode 121 and the second electrode 127 and the organic luminous layer 125 between the first electrode 121 and the second electrode 127 form an Organic Light Emitting Diode.
In the time that description has the operation of Organic Light Emitting Diode of said structure, in the time that the reflected voltage of corresponding predetermine level value is applied to the first electrode 121 and the second electrode 127, from the first electrode 121 injected holes and the electric transmission that provides from the second electrode 127 to organic luminous layer 125 to form exciton.In the time that excitation state turns back to ground state, exciton transmitting is as the light of luminous energy, and the light of transmitting is transmitted into the external world through transparent the second electrode 127, and therefore flexible display panels 100 has realized arbitrary image.
On the other hand, form by insulating material (especially, as the silicon dioxide (SiO of inorganic insulating material the active region that comprises the second electrode 127 (A/A) of substrate is upper
2) or silicon nitride (SiN
x)) the first passivation layer 129 of making.Owing to only utilizing the second electrode 127 can not stop moisture penetration to enter in organic luminous layer 125; so form the first passivation layer 129, therefore form the first passivation layer 129 of playing a protective role so that the moisture penetration entering in organic luminous layer 125 minimizes on the second electrode 127.
In addition, GIP thin-film transistor (TR2) on GIP region (G/A) has from the scope of semiconductor layer 103 to first passivation layers 129 and the similarly layer structure of layer structure that drives thin-film transistor (TR1), but has the structure of omitting the first electrode 121 and the second electrode 127 and organic luminous layer 125.
On the contrary, bending area (B/A) is different in the following areas: except boost line 120, do not form above-mentioned thin-film transistor (TR1, TR2) and gate insulator 105, interlayer insulating film 109, flatness layer 115 etc. on bending area.
On the other hand, on the first passivation layer 129 of active region (A/A), form the organic layer 141 of being made by for example polymer of polymerization organic material.At this, olefin-based polymer (polyethylene, polypropylene), PETG (PET), epoxy resin, fluororesin, polysiloxanes etc. can be for forming the polymeric layer of organic layer 131.
In addition, permeate in order to stop moisture to pass organic layer 141, form by insulating material (for example,, as the silicon dioxide (SiO of inorganic insulating material the active region (A/A) that comprises organic layer 141 is upper
2) or silicon nitride (SiN
x)) the second passivation layer 143 of making.
In addition, for Organic Light Emitting Diode being encapsulated on the whole surface of the substrate including the second passivation layer 143, in the mode of facing, barrier film 147 is set, and by adhering to substrate 101 and barrier film 147 completely by thering is any adhesive 145 of making in frit, organic insulating material and the polymeric material of transparent and adhesion characteristics, between the second passivation layer 143 and barrier film 147, there is no air layer.
Polarizing coating 160 is adhered to the top of barrier film 147.Polarizing coating 160 completely closely adheres to barrier film 147 and prevents that to play picture quality is owing to inciding the reflection of light of organic light-emitting display device from the external world and deteriorated effect in the situation that very close to each other.
On the other hand, in the boost line 120 of bending area (B/A), form protective layer 150.Protective layer 150 is set so that boost line 120 impairedly minimizes and play the effect that prevents moisture penetration due to what the bending of flexible display panels 100 caused, and the material with flexible characteristic is for the protection of layer 150.
Especially; when when narrow border structure bending area (B/A) is curling and GIP region (G/A) is arranged on the back of the body surface of flexible display panels 100; consider thickness and Young's modulus, diaphragm 150 plays the suction or the minimized effect of tension force that make to be applied to protective layer 150.For this reason, protective layer 150 can form by having the thickness identical with material with the thickness of substrate 101 and identical material.
Protective layer 150 is formed as during the aforementioned gate insulator 105 of deposition, interlayer insulating film 109, flatness layer 115 etc., exposing boost line 120 after forming boost line 120, and protective layer 150 formed before adhering to barrier film 147 or polarizing coating 160.
On the other hand, during the manufacturing process of display unit, flexible display panels 100 is curling along gravity direction due to the flexibility of substrate 101, thereby has the shortcoming that is difficult to be applied to technique.In the prior art, in order to address the above problem, PETG (PET) is sticked on the whole back of the body surf zone of flexible display panels 100 to be conducive to the manufacturing process of display unit, but it also becomes the factor that hinders BENDING PROCESS.Therefore,, according to present disclosure embodiment, PET film 190 only adheres to the lip-deep part corresponding with active region (A/A) of the back of the body of flexible display panels 100.
Hereinafter, describe with reference to the accompanying drawings according to according to the assembling form of the warp architecture of the flexible display panels of an embodiment of present disclosure.
Fig. 5 A illustrates the figure with the fixing example of warp architecture according to the flexible display panels of an embodiment of present disclosure, and Fig. 5 B is for illustrating the cross-sectional view of the part that in Fig. 5 A, V-V' along the line gets.
As shown in the drawing, according in the flexible display panels 100 of present disclosure, in active region (A/A) on plastic base 101, form and comprise multiple holding wires and transistorized image element circuit layer 110, and upper to form with the similar structure of structure of image element circuit layer 110 the GIP circuit layer 111 that comprises gate driver circuit at non-active region (N/A).To prevent that substrate 101 curling PET film 180 during manufacture process from adhering to the lip-deep active region of the back of the body (A/A) of substrate 101.In addition, by the barrier film for the protection of image element circuit layer 110 140 with adhere to the top of image element circuit layer 110 for the polarizing coating 160 of compensate for optical characteristic.
Contrary with GIP circuit layer 111, image element circuit layer 110 also can comprise organic luminous layer and the thin-film transistor for showing image.
Substrate 101 adheres to the lip-deep mechanical structure 190 of the back of the body at substrate 101 by predetermined adhesive 195, and the side end of mechanical structure 190 can have circular configuration and make the curling predetermined radii that simultaneously forms of side end of substrate 101.
In addition, in the time that adhering in mechanical structure 190, the settled substrate 101 of non-active region (N/A) upper limit along the back of the body surface direction curling bending area (B/A) except GIP region (G/A), and on bending area (B/A), is formed for image element circuit layer 110 to be electrically connected to the boost line 120 of GIP circuit layer 111.In addition, form protective layer 150 in boost line 120, due to the curling power being applied in boost line 120, to minimize and prevent that boost line 120 is exposed to extraneous and impaired for making for this protective layer 150.At this, the thickness of protective layer 150 and material quality are determined by substrate 101 and boost line 120.
Therefore, in the flexible display panels 100 being arranged in mechanical structure 190, gate driver circuit is arranged on the back of the body surface of mechanical structure 190 and the left frame part of flexible display panels 100 and the width of left frame part are watched all and being reduced from front surface, has realized thus narrow frame (N/B).
On the other hand, above-mentioned embodiment has wherein makes the only left frame part of flexible display panels 100 and the structure of left frame part bending, and describes with reference to the accompanying drawings according to the flexible display panels of another embodiment of present disclosure.
Fig. 6 A is for illustrating that processing is according to the figure of the method for the flexible display panels of another embodiment of present disclosure, and Fig. 6 B is for illustrating the figure of the display device structure after processed flexible display panels bending.
With reference to Fig. 6 A, be defined as and there is the active region (A/A) of realizing real image on substrate 201 and the non-active region (N/A) that is surrounded by source region (A/A) according to the flexible display apparatus 200 of present disclosure, and in active region (A/A), form the pixel region limiting by multiple gate lines and data wire, and each pixel region is formed with thin-film transistor.
In addition, sentence GIP structure in the left distal end of the non-active region (N/A) of flexible display panels 200 and right end and imbed therein two gate driver circuits 230 that are connected to gate line.Data drive circuit 240 is electrically connected to the substrate weld pad 246 of a side end that is formed on display floater 200.In addition, the polarizing coating of the optical characteristics for compensating display floater 200 260 is adhered to the front surface of active region (A/A).Especially, between active region (A/A) and gate driver circuit 230, be formed with boost line (not shown) and the protective layer in boost line 250.
In the time that at least a portion of the every side end of bending is used for having the narrow frame of flexible display panels 200 of said structure to realize, there is in the following areas restriction: in the time of the top end of bending display floater and bottom side end, because the interference of folded part is difficult to left distal end and the right end of bending display floater, and in the time of the left distal end of bending display floater and right end, be also difficult to top end and the bottom side end of bending display floater.
In order to overcome this restriction, according to another embodiment of present disclosure, be cut into each angular region (a-d) shown in Fig. 6 A so that the mutual minimum interference during the bending of four side ends.In other words, before bending flexible display panels 200, by predetermined corner cut technique, each angular region (a-d) removed, and then top end, bottom side end, left distal end and the right end of bending flexible display panels 200 to realize the narrow frame (N/B) for all side ends of display floater 200.
At this; although do not illustrate in the drawings; but between active region (A/A) and data drive circuit 240, omit the structure of conventional layer structure with application formation boost line and the protective layer in boost line, make thus the holding wire and layer the impaired of structure that cause due to the bending between active region (A/A) and data drive circuit 240 minimize.
Although disclose particularly in the foregoing description many themes, it should be interpreted as illustrating preferred embodiment, but not restriction to invention scope.Therefore, the present invention should not determined and should be determined by claim and equivalent thereof by embodiment disclosed herein.
Claims (17)
1. a flexible display panels, comprising:
Active region, described active region is provided with multiple pixels with sandwich construction;
Non-active region, described non-active region is configured to surround described active region, and is provided with the gate driver circuit with sandwich construction; And
Substrate, described substrate is limited with the bending area being formed between described gate driver circuit and described active region, and at least one side surface of described substrate is curling along the back of the body surface direction of described substrate,
Wherein said bending area comprises boost line, and described boost line is by forming for the one deck that described gate driver circuit is electrically connected to described pixel.
2. flexible display panels according to claim 1, wherein said bending area also comprises the protective layer being formed in described boost line.
3. flexible display panels according to claim 1, wherein said pixel comprises:
Gate line;
The data wire intersecting with described gate line; And
Be electrically connected to the thin-film transistor one of at least in described gate line and described data wire.
4. flexible display panels according to claim 3, wherein said boost line by with described gate line and described data wire in arbitrary Metal Phase with metal form.
5. flexible display panels according to claim 3, wherein said boost line is made up of copper (Cu) or copper alloy.
6. flexible display panels according to claim 2, wherein said protective layer has the material identical with the material of described substrate.
7. flexible display panels according to claim 2, wherein said protective layer is formed as having the thickness identical with the thickness of described substrate.
8. flexible display panels according to claim 1, is wherein adhered to the bottom of described substrate corresponding to the PET film of described active region.
9. flexible display panels according to claim 1, each turning end of wherein said substrate is cut into and makes four side ends of described substrate is all curling.
10. a flexible display panels, comprising:
Substrate, described substrate is limited with active region and comprises the non-active region of GIP region and bending area, and the described bending area of described substrate is curling along the back of the body surface direction of described substrate;
Driving element layer, described driving element layer is respectively formed on described active region and described GIP region to comprise the thin-film transistor that is connected to gate line and data wire;
Boost line, described boost line is formed on described bending area to be electrically connected to described driving element layer;
Light emitting element layer, described light emitting element layer is formed on described driving element layer, and described light emitting element layer is divided into each pixel;
The first passivation layer, described the first passivation layer is formed on described light emitting element layer;
Organic layer, described organic layer is formed on described the first passivation layer; And
The second passivation layer, described the second passivation layer is formed on described first passivation layer of described active region, by adhesive, diaphragm is adhered to the top of described the second passivation layer.
11. flexible display panels according to claim 10, are wherein formed with protective layer at the top place of described boost line.
12. flexible display panels according to claim 10, wherein said boost line by with described grid and described data wire in arbitrary Metal Phase with metal form.
13. flexible display panels according to claim 10, wherein said boost line is made up of copper (Cu) or copper alloy.
14. flexible display panels according to claim 11, wherein said protective layer has the material identical with the material of described substrate.
15. flexible display panels according to claim 11, wherein said protective layer is formed with the thickness identical with the thickness of described substrate.
16. flexible display panels according to claim 10, are wherein adhered to the bottom of described substrate corresponding to the PET film of described active region.
17. flexible display panels according to claim 10, each turning end of wherein said substrate is cut into and makes four side ends of described substrate is all curling.
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KR1020130040072A KR102076666B1 (en) | 2013-04-11 | 2013-04-11 | Flexible display panel |
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CN104103669B CN104103669B (en) | 2018-04-20 |
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US10181576B2 (en) * | 2016-09-12 | 2019-01-15 | Samsung Display Co., Ltd. | Display device |
JP6962673B2 (en) | 2016-09-12 | 2021-11-05 | 株式会社ジャパンディスプレイ | Resin substrate |
JP6770859B2 (en) * | 2016-09-16 | 2020-10-21 | 株式会社ジャパンディスプレイ | Display device manufacturing method |
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KR101974086B1 (en) * | 2016-09-30 | 2019-05-02 | 삼성디스플레이 주식회사 | Display module |
KR102385458B1 (en) | 2016-10-06 | 2022-04-13 | 삼성디스플레이 주식회사 | Flexible display device and manufacturing method thereof |
US11864396B2 (en) | 2016-10-06 | 2024-01-02 | Samsung Display Co., Ltd. | Flexible display device and method of manufacturing the same |
KR102553139B1 (en) | 2016-10-24 | 2023-07-10 | 엘지디스플레이 주식회사 | Display Device |
KR20180063418A (en) | 2016-12-01 | 2018-06-12 | 삼성디스플레이 주식회사 | Display device and method of manufacturing the same |
KR20180073349A (en) * | 2016-12-22 | 2018-07-02 | 엘지디스플레이 주식회사 | Organic light emitting display device |
KR20180075733A (en) | 2016-12-26 | 2018-07-05 | 엘지디스플레이 주식회사 | Flexible display device |
US10664009B2 (en) * | 2017-01-20 | 2020-05-26 | Dell Products L.P. | Narrow border plastic cover with optimal opto-mechanical properties |
JP7002855B2 (en) * | 2017-04-05 | 2022-01-20 | 株式会社ジャパンディスプレイ | Display device |
KR102341412B1 (en) | 2017-08-29 | 2021-12-22 | 삼성디스플레이 주식회사 | Display device |
KR102413315B1 (en) * | 2017-08-31 | 2022-06-24 | 엘지디스플레이 주식회사 | Organic light emitting diode display |
CN107491221B (en) * | 2017-08-31 | 2023-08-22 | 京东方科技集团股份有限公司 | Display substrate, preparation method and display device |
CN109427249A (en) * | 2017-08-31 | 2019-03-05 | 昆山工研院新型平板显示技术中心有限公司 | Flexible display panels and preparation method thereof |
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JP2019096577A (en) * | 2017-11-28 | 2019-06-20 | 株式会社ジャパンディスプレイ | Display device |
JP6556812B2 (en) * | 2017-11-28 | 2019-08-07 | Nissha株式会社 | Film type touch sensor with hard coat and flexible device using the same |
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KR102471758B1 (en) * | 2017-12-11 | 2022-11-29 | 삼성디스플레이 주식회사 | Display device |
KR102104981B1 (en) | 2017-12-19 | 2020-05-29 | 엘지디스플레이 주식회사 | Display device |
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KR102562900B1 (en) | 2018-02-02 | 2023-08-04 | 삼성디스플레이 주식회사 | Flexible display apparatus and touch sensitive display apparatus |
US20190252637A1 (en) * | 2018-02-13 | 2019-08-15 | Innolux Corporation | Foldable display device |
KR102549923B1 (en) * | 2018-02-27 | 2023-06-30 | 삼성디스플레이 주식회사 | Display device, polarizing film and method for fabricating the polarizing film |
KR102543688B1 (en) * | 2018-04-02 | 2023-06-14 | 삼성디스플레이 주식회사 | Display device and manufacturing method of display device |
KR102555446B1 (en) * | 2018-04-26 | 2023-07-13 | 삼성디스플레이 주식회사 | Display device |
CN108735789B (en) * | 2018-05-30 | 2021-06-01 | 上海天马微电子有限公司 | Flexible organic light-emitting display panel and display device |
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KR20190137976A (en) * | 2018-06-01 | 2019-12-12 | 삼성디스플레이 주식회사 | Display apparatus and electronic divice including the same |
TWI680537B (en) * | 2018-08-31 | 2019-12-21 | 友達光電股份有限公司 | Device substrate |
KR102568726B1 (en) * | 2018-09-18 | 2023-08-22 | 삼성디스플레이 주식회사 | Display device |
CN109461742B (en) * | 2018-10-11 | 2020-11-24 | 武汉华星光电半导体显示技术有限公司 | Flexible display panel |
KR20200041408A (en) * | 2018-10-11 | 2020-04-22 | 삼성디스플레이 주식회사 | Display device and manufacturing method thereof |
KR20210035382A (en) * | 2019-09-23 | 2021-04-01 | 삼성디스플레이 주식회사 | Display device and carrier panel |
KR20210079898A (en) * | 2019-12-20 | 2021-06-30 | 엘지디스플레이 주식회사 | Display device |
KR20210086284A (en) | 2019-12-31 | 2021-07-08 | 엘지디스플레이 주식회사 | Display apparatus |
KR20210142808A (en) * | 2020-05-18 | 2021-11-26 | 삼성디스플레이 주식회사 | Display device and Method of manufacturing of the display device |
KR20220049895A (en) * | 2020-10-15 | 2022-04-22 | 엘지디스플레이 주식회사 | Stretchable display device |
US11675448B2 (en) * | 2020-12-11 | 2023-06-13 | Tpk Advanced Solutions Inc. | Touch panel and method for forming the same |
KR20220105238A (en) * | 2021-01-19 | 2022-07-27 | 삼성디스플레이 주식회사 | Display device and tiled display device |
CN112951870B (en) * | 2021-01-29 | 2024-02-27 | 厦门天马微电子有限公司 | Display panel, preparation method thereof and display device |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1622715A (en) * | 2003-11-24 | 2005-06-01 | 三星Sdi株式会社 | Organic light-emitting display and manufacturing method thereof |
CN1728900A (en) * | 2004-07-30 | 2006-02-01 | 株式会社半导体能源研究所 | Display device and method for manufacturing the same |
CN1734542A (en) * | 2004-07-22 | 2006-02-15 | 三星电子株式会社 | Organic light-emitting display device |
CN1992264A (en) * | 2005-12-29 | 2007-07-04 | Lg.菲利浦Lcd株式会社 | Organic electro-luminescence display device and method of manfacturing the same |
US20080012474A1 (en) * | 2006-07-11 | 2008-01-17 | Samsung Electronics Co., Ltd. | Display device |
US7348492B1 (en) * | 1999-11-17 | 2008-03-25 | Sharp Kabushiki Kaisha | Flexible wiring board and electrical device using the same |
US20110007042A1 (en) * | 2009-07-07 | 2011-01-13 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
US20120146886A1 (en) * | 2010-12-13 | 2012-06-14 | Sony Corporation | Display apparatus and electronic apparatus |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5644075B2 (en) * | 2009-08-25 | 2014-12-24 | セイコーエプソン株式会社 | Electro-optical device and electronic apparatus |
KR101482629B1 (en) * | 2011-06-30 | 2015-01-14 | 삼성디스플레이 주식회사 | flexible display panel and the display apparatus comprising the flexible display panel |
US9219245B2 (en) * | 2011-11-18 | 2015-12-22 | Samsung Display Co., Ltd. | Organic light emitting diode display and manufacturing method thereof |
KR20130055252A (en) * | 2011-11-18 | 2013-05-28 | 삼성디스플레이 주식회사 | Organic light emitting diode display and manufacturing method thereof |
TWI506751B (en) * | 2012-05-29 | 2015-11-01 | Shih Hua Technology Ltd | Touch panel |
KR101965257B1 (en) * | 2012-10-08 | 2019-04-04 | 삼성디스플레이 주식회사 | Flexible display apparatus |
-
2013
- 2013-04-11 KR KR1020130040072A patent/KR102076666B1/en active IP Right Grant
-
2014
- 2014-04-07 TW TW103112726A patent/TWI549571B/en active
- 2014-04-11 US US14/251,244 patent/US9760125B2/en active Active
- 2014-04-11 CN CN201410145315.5A patent/CN104103669B/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7348492B1 (en) * | 1999-11-17 | 2008-03-25 | Sharp Kabushiki Kaisha | Flexible wiring board and electrical device using the same |
CN1622715A (en) * | 2003-11-24 | 2005-06-01 | 三星Sdi株式会社 | Organic light-emitting display and manufacturing method thereof |
CN1734542A (en) * | 2004-07-22 | 2006-02-15 | 三星电子株式会社 | Organic light-emitting display device |
CN1728900A (en) * | 2004-07-30 | 2006-02-01 | 株式会社半导体能源研究所 | Display device and method for manufacturing the same |
CN1992264A (en) * | 2005-12-29 | 2007-07-04 | Lg.菲利浦Lcd株式会社 | Organic electro-luminescence display device and method of manfacturing the same |
US20080012474A1 (en) * | 2006-07-11 | 2008-01-17 | Samsung Electronics Co., Ltd. | Display device |
US20110007042A1 (en) * | 2009-07-07 | 2011-01-13 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
US20120146886A1 (en) * | 2010-12-13 | 2012-06-14 | Sony Corporation | Display apparatus and electronic apparatus |
Cited By (101)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104503122B (en) * | 2014-12-25 | 2018-05-18 | 上海天马微电子有限公司 | A kind of display panel, display and preparation method thereof |
CN104503122A (en) * | 2014-12-25 | 2015-04-08 | 上海天马微电子有限公司 | Display panel, displayer, manufacturing method of display panel and manufacturing method of displayer |
CN105789252B (en) * | 2015-01-09 | 2019-04-12 | 苹果公司 | Organic light emitting diode display with curved substrate |
CN105789252A (en) * | 2015-01-09 | 2016-07-20 | 苹果公司 | Organic Light-emitting Diode Display With Bent Substrate |
CN109904203B (en) * | 2015-01-12 | 2022-06-10 | 苹果公司 | Flexible display panel with curved substrate |
CN105789255B (en) * | 2015-01-12 | 2019-03-12 | 苹果公司 | Flexible display panels with bent substrate |
CN105789255A (en) * | 2015-01-12 | 2016-07-20 | 苹果公司 | Flexible Display Panel With Bent Substrate |
CN109904203A (en) * | 2015-01-12 | 2019-06-18 | 苹果公司 | Flexible display panels with bent substrate |
US11223020B2 (en) | 2015-01-12 | 2022-01-11 | Apple Inc. | Flexible display panel with bent substrate |
CN105845707A (en) * | 2015-02-02 | 2016-08-10 | 三星显示有限公司 | Display device |
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WO2016180014A1 (en) * | 2015-05-11 | 2016-11-17 | Boe Technology Group Co., Ltd. | Flexible array substrate, display panel having the same, keyboard assembly, and electronic device thereof |
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US9811169B2 (en) | 2015-05-11 | 2017-11-07 | Boe Technology Group Co., Ltd. | Flexible array substrate, display panel having the same, keyboard assembly, and electronic device thereof |
US10734462B2 (en) | 2015-11-20 | 2020-08-04 | Japan Display Inc. | Flexible display device including bent flexible substrate and bent circuit layer |
US10319799B2 (en) | 2015-11-20 | 2019-06-11 | Japan Display Inc. | Flexible display device including bent flexible substrate and bent circuit layer |
CN106992259A (en) * | 2015-11-20 | 2017-07-28 | 株式会社日本显示器 | Display device |
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US10847545B2 (en) | 2015-12-15 | 2020-11-24 | Lg Display Co., Ltd. | Flexible display device having a bending connection line in a bending area |
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US11362292B2 (en) | 2015-12-15 | 2022-06-14 | Lg Display Co., Ltd. | Flexible display device |
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CN107039008B (en) * | 2016-02-03 | 2021-07-16 | 三星显示有限公司 | Display device |
CN107039008A (en) * | 2016-02-03 | 2017-08-11 | 三星显示有限公司 | Display device |
CN107134496A (en) * | 2016-02-29 | 2017-09-05 | 昆山工研院新型平板显示技术中心有限公司 | Thin film transistor (TFT) and its manufacture method, display panel and display device |
US10424667B2 (en) | 2016-02-29 | 2019-09-24 | Kunshan New Flat Panel Display Technology Center Co., Ltd. | Thin film transistor with a protective layer, and manufacturing method therefor, display panel and display apparatus |
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US10209546B2 (en) | 2016-07-21 | 2019-02-19 | Boe Technology Group Co., Ltd. | Display panel and display device, and fabrication methods thereof |
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WO2018014689A1 (en) * | 2016-07-21 | 2018-01-25 | Boe Technology Group Co., Ltd. | Display panel and display device, and fabrication methods thereof |
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US11011551B2 (en) | 2017-02-17 | 2021-05-18 | Boe Technology Group Co., Ltd. | Array substrate with a plurality of different signal lines |
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US10680016B2 (en) | 2017-05-02 | 2020-06-09 | Boe Technology Group Co., Ltd. | Flexible display panel, method for fabricating the same, and flexible display device |
WO2018232792A1 (en) * | 2017-06-23 | 2018-12-27 | 深圳市华星光电半导体显示技术有限公司 | Display panel |
US10693087B2 (en) | 2017-06-23 | 2020-06-23 | Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Display panel with a metal wire array disposed on the bending region of a flexible substrate |
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US11805688B2 (en) | 2017-08-07 | 2023-10-31 | Samsung Display Co., Ltd. | Bendable display device |
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US10692957B2 (en) | 2017-08-31 | 2020-06-23 | Lg Display Co., Ltd. | Organic light emitting display device for protecting an electrostatic discharging circuit |
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US11189670B2 (en) | 2017-10-31 | 2021-11-30 | Lg Display Co., Ltd. | Display apparatus having zero bezel by bending bezel area |
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US11910644B2 (en) | 2017-10-31 | 2024-02-20 | Lg Display Co., Ltd. | Display apparatus having zero bezel by bending bezel area |
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WO2019090819A1 (en) * | 2017-11-09 | 2019-05-16 | 深圳市华星光电半导体显示技术有限公司 | Flexible goa display panel and manufacturing method therefor |
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WO2019144452A1 (en) * | 2018-01-23 | 2019-08-01 | 武汉华星光电半导体显示技术有限公司 | Flexible display device manufacturing method, and flexible display device |
US10637007B1 (en) | 2018-01-23 | 2020-04-28 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Method for manufacturing flexible display device and flexible display device |
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US11367399B2 (en) | 2018-12-19 | 2022-06-21 | Lg Display Co., Ltd. | Display panel and display device |
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WO2021031534A1 (en) * | 2019-08-22 | 2021-02-25 | 武汉华星光电技术有限公司 | Array substrate, display panel, and display device |
US11610520B2 (en) | 2019-10-22 | 2023-03-21 | Lg Display Co., Ltd. | Foldable display apparatus |
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US11889647B2 (en) | 2020-08-19 | 2024-01-30 | Apple Inc. | Display panel bend reinforcement |
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CN113534516A (en) * | 2021-06-16 | 2021-10-22 | 北海惠科光电技术有限公司 | Array substrate, display device and manufacturing method of display device |
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US20140306941A1 (en) | 2014-10-16 |
TWI549571B (en) | 2016-09-11 |
KR102076666B1 (en) | 2020-02-12 |
US9760125B2 (en) | 2017-09-12 |
CN104103669B (en) | 2018-04-20 |
TW201440582A (en) | 2014-10-16 |
KR20140122960A (en) | 2014-10-21 |
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