CN108573961A - A kind of ultra high density mounted type COB area light source and its manufacturing method - Google Patents
A kind of ultra high density mounted type COB area light source and its manufacturing method Download PDFInfo
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- CN108573961A CN108573961A CN201810699797.7A CN201810699797A CN108573961A CN 108573961 A CN108573961 A CN 108573961A CN 201810699797 A CN201810699797 A CN 201810699797A CN 108573961 A CN108573961 A CN 108573961A
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- substrate
- electrode
- light source
- high density
- ultra high
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Abstract
A kind of ultra high density mounted type COB area light source and its manufacturing method, the ultra high density mounted type COB area light source includes substrate, the substrate is equipped with box dam, is fixed with multiple LED chips on the inside of box dam, the upper surface of the substrate is additionally provided with two front electrodes being connected with LED chip；The lower surface of the substrate is equipped with the backplate being connected respectively with two front electrodes.The packaging method of electrode is arranged using bottom by the present invention, and fast and easy powers on use.
Description
Technical field
The present invention relates to area source technical field, especially a kind of ultra high density mounted type COB area light source and its manufacturer
Method.
Background technology
COB area light source is the mirror metal substrate or ceramics that LED chip is placed directly against to high reflecting rate by COB technologies
Specular removal on substrate integrates area source, compared to traditional LED, COB techniques without holder, electroless plating, without Reflow Soldering process, at
Originally greatly reduce, be increasingly becoming the development priority of LED industry.
Existing COB area light source, positive and negative electrode are all integrally fixed at the upper surface of COB area light source, are using COB light source
When, it needs conducting wire to be welded on positive and negative electrode to introduce electric current, welding process itself is relatively complicated, and COB area light source powers on
The area very little of pole, just further adds operational inconvenience, and the inconvenience of this mode of connection also limits COB area light source
It is applied in combination.
Invention content
Electrode is arranged using bottom in a kind of ultra high density mounted type COB area light source of present invention offer and its manufacturing method
Packaging method, fast and easy power on use.
According to the first aspect of the invention, the present invention provides a kind of ultra high density mounted type COB area light source, including substrate,
The substrate is equipped with box dam, is fixed with multiple LED chips on the inside of box dam, the upper surface of the substrate is additionally provided with two and LED
The connected front electrode of chip；The lower surface of the substrate is equipped with the backplate being connected respectively with two front electrodes.
Preferably, the substrate is equipped with perforative through-hole, and conductor adapting piece, the conductor connection are equipped in the through-hole
The both ends of part are connected with front electrode and backplate respectively.
Preferably, the through-hole is plated through-hole.
Preferably, the lower surface of the substrate is coated with welding resistance oil reservoir, and the welding resistance oil reservoir is equipped with multiple grooves, the back of the body
Face electrode is arranged in the groove.
Preferably, welding electrode is additionally provided in the groove, the welding electrode is connected with backplate, the welding electricity
The surface of pole is equipped with tin coating.
Preferably, the area of the tin coating is less than the area of welding electrode, and the surface of the welding electrode is in tin coating
Outside be equipped with nickel-gold layer.
Preferably, the surface of the backplate is equipped with nickel-gold layer.
According to the second aspect of the invention, the present invention provides a kind of manufacturing method of ultra high density mounted type COB area light source,
Include the following steps：Multiple through-holes through substrate are opened up on substrate；Surface and through-hole to substrate carry out metalized；
Layers of copper is thickeied in substrate surface, dry film is fixed in the thickening layers of copper of substrate back；It paints, is formed on dry film pre- by film light
If groove；Backplate is plated in groove；Remove remaining dry film, welding resistance oil reservoir is coated in substrate back；After film light is painted, dew
Go out backplate；Overleaf heavy nickel-gold layer on electrode；LED chip is fixed on substrate front side, the outside setting of LED chip is enclosed
Dam, the front electrode that the setting of box dam outside is connected with LED chip, the through-hole and backplate phase that front electrode passes through metallization
Even.
Preferably, removing remaining dry film, before substrate back coats welding resistance oil reservoir, further including：In partial rear electricity
It is extremely upper that tin coating is set.
In the present invention, the lower surface of substrate is equipped with backplate, and backplate is connected with LED chip, overleaf on electrode
Loading current can also drive LED chip to light.Overleaf due to electrode setting, directly electrode welding can be fixed, compared to
The mode of existing conducting wire welding, greatly improves convenience.Preset conducting wire, the entire faces COB light can be set on stationary plane
Source is directly anchored in conducting wire, is formed various combination, is facilitated and COB area light source is applied in combination.
Description of the drawings
Fig. 1 is the sectional view of the ultra high density mounted type COB area light source of an embodiment of the present invention；
Fig. 2 is the schematic rear view of the ultra high density mounted type COB area light source of an embodiment of the present invention；
Fig. 3 is the structural schematic diagram that the ultra high density mounted type COB area light source of an embodiment of the present invention is applied in combination；
Fig. 4 is structural schematic diagram of the substrate of an embodiment of the present invention after trepanning；
Fig. 5 is the substrate of an embodiment of the present invention through thickening layers of copper treated structural schematic diagram；
Fig. 6 is the structural schematic diagram of the coating welding resistance oil reservoir metacoxal plate of an embodiment of the present invention；
Fig. 7 is the structural schematic diagram of the heavy nickel-gold layer metacoxal plate of an embodiment of the present invention.
Specific implementation mode
Below by specific implementation mode combination attached drawing, invention is further described in detail.
The present invention provides a kind of ultra high density mounted type COB area light source, as shown in Figure 1 comprising substrate 1, substrate 1 can be adopted
Use ceramic material.Box dam 11 is equipped on the substrate 1, box dam 11 encloses a circular trough, is fixed in circular trough more
A LED chip 10, LED chip 10 is fixed on substrate 1, and can be linked together by gold thread.In the upper surface of the substrate 1
Two front electrodes being connected with LED chip 10 21 are additionally provided with, front electrode 21 can be located at the outside of box dam 11.Two front electricity
Pole is positive positive electrode and front negative sense electrode respectively, front forward direction electrode and front negative sense electrode respectively with LED chip
Both ends are connected, and the loading power between positive positive electrode and front negative sense electrode can be such that LED chip 10 lights.Meanwhile institute
The lower surface for stating substrate 1 is equipped with the backplate 31 being connected respectively with two front electrodes 21.Backplate 31 include the back side just
To electrode and back side negative sense electrode, back side forward direction electrode and back side negative sense electrode respectively with the positive electrode in corresponding front and front
Negative sense electrode is connected.Backplate 31 can be arranged it is multiple, with corresponding front electrode 21 be connected.
When using the COB light source of the present embodiment, directly the backplate 31 at the COB light source back side is weldingly fixed on accordingly
Wiring point, to introduce electric current.It no longer needs to introduce power supply by way of the welding lead on front electrode 21.Such as Fig. 3 institutes
Show, stationary plane 100 is equipped with two conducting wires 101, and conducting wire 101 can be loaded with the conductive bar of electric current, along pre-
Determine direction extension.The spacing of spacing and two backplates 31 between two conducting wires 101 matches, and can pass through spot welding etc.
Two backplates 31 are respectively welded fixed in two conducting wires 101 means.Two conducting wires 101 are respectively as electricity
The anode and cathode in source, to which power supply is introduced COB light source, COB light source can shine.It, can according to the trend of conducting wire 101
Sequentially to fix multiple COB area light sources, facilitates and multiple COB area light sources are applied in combination.
In one embodiment, the substrate 1 is equipped with perforative through-hole 20, and being equipped with conductor in the through-hole 20 connects
The both ends of part, the conductor adapting piece are connected with front electrode 21 and backplate 31 respectively so that backplate 31 and LED core
Piece 10 is electrically connected.
Further, the through-hole 20 is plated through-hole, and through-hole 20 after forming, by metalized, makes through-hole 20
Inside it is attached with conductive metallic object.
In one embodiment, the lower surface of the substrate 1 is coated with welding resistance oil reservoir 4, and the welding resistance oil reservoir 4 is equipped with multiple
Groove, the backplate 31 are arranged in the groove.Welding resistance oil reservoir 4 can prevent 31 unlapped region of backplate into
Row welding, only can be welded to precalculated position by backplate 31.
In one embodiment, the partial rear electrode in the groove forms welding electrode 32, the welding electrode 32
It integrated can be connected with backplate 31, be equipped with tin coating 6 on the surface of the welding electrode 32, can conveniently be welded on tin plating
Adhesion on layer 6 facilitates welding to operate.
In one embodiment, the area of the tin coating 6 is less than the area of welding electrode 32, and tin coating 6 is located at weldering
The surface at the middle part of receiving electrode 32, the welding electrode 32 is equipped with nickel-gold layer 5 in the outside of tin coating 6, and nickel gold material has good
Good ductility, can extend the service life of entire product.
Further, the surface of the backplate 31, which is set also, nickel-gold layer 6, is protected to backplate 31.
The embodiment of the present invention provides a kind of manufacturing method of ultra high density mounted type COB area light source, for manufacturing above-mentioned reality
Apply the ultra high density mounted type COB area light source of example comprising following steps：
As shown in figure 4, opening up multiple through-holes 10 through substrate 1 on substrate 1, alumina ceramic plate can be used in substrate 1,
According to electrode institute position on substrate 1, above-mentioned through-hole 10 is opened up in advance, and the mode that laser cutting can be used is cut into above-mentioned lead to
Hole 10.Surface and through-hole 10 to substrate 1 carry out metalized, one layer of metal are covered in plate face, being attached in through-hole 10 can
Conductive metallic object, the metallic object can fill up entire through-hole 10.As shown in figure 5, thickening layers of copper 22 on the surface of substrate 1, thicken
There is opening corresponding with through-hole 10, metallic object to be stretched out from opening in layers of copper 22.In the thickening layers of copper 22 at 1 back side of substrate
Fixed dry film is irradiated using the film plate with prodefined opening by UV light, pre-groove is formed on dry film, groove is along pre-
Fixed path extends.Plate backplate 31 in groove, backplate 31 has multiple, and is connected with each other in a groove.Such as Fig. 6
It is shown, remove remaining dry film, in 1 backside coating welding resistance oil reservoir 4 of substrate, backplate 31 is also coated on interior by welding resistance oil reservoir 4.
Identical film plate in step before use is irradiated by UV light, and welding resistance oil reservoir 4 forms multiple grooves, make backplate 31 from
Expose in the groove of welding resistance oil reservoir 4.Later, as shown in fig. 7, overleaf sinking nickel-gold layer 5 on electrode 31.
After completing above-mentioned steps, LED chip 10 will be packaged.Specifically, multiple LED chips 10 are fixed on substrate
Box dam 11 is arranged in the outside in 1 front, LED chip 10, and the front electrode being connected with LED chip 10 is arranged in the outside of box dam 11
21, two front electrodes 21 are positive positive electrode and front negative sense electrode respectively, front forward direction electrode and front negative sense electrode
It is connected respectively with the both ends of LED chip 10.Two front electrodes 21 pass through the through-hole of metallization and two backplates 31 respectively
It is connected.
Further, removing remaining dry film, further including following steps before substrate back coats welding resistance oil reservoir：
Tin coating 6 is set on partial rear electrode 31, is used as welding electrode 32, the setting of tin coating 6 welding a part of backplate 31
On receiving electrode 32, to facilitate solder to be fixed on welding electrode 32.
The above content is combining, specific embodiment is made for the present invention to be further described, and it cannot be said that this hair
Bright specific implementation is confined to these explanations.For those of ordinary skill in the art to which the present invention belongs, it is not taking off
Under the premise of from present inventive concept, a number of simple deductions or replacements can also be made.
Claims (9)
1. a kind of ultra high density mounted type COB area light source, it is characterised in that：
Including substrate, the substrate is equipped with box dam, is fixed with multiple LED chips on the inside of box dam, the upper surface of the substrate is also
If there are two the front electrodes being connected with LED chip；The lower surface of the substrate, which is equipped with, to be respectively connected with two front electrodes
Backplate.
2. ultra high density mounted type COB area light source according to claim 1, it is characterised in that：
The substrate is equipped with perforative through-hole, and conductor adapting piece, the both ends point of the conductor adapting piece are equipped in the through-hole
It is not connected with front electrode and backplate.
3. ultra high density mounted type COB area light source according to claim 2, it is characterised in that：
The through-hole is plated through-hole.
4. ultra high density mounted type COB area light source according to claim 1, it is characterised in that：
The lower surface of the substrate is coated with welding resistance oil reservoir, and the welding resistance oil reservoir is equipped with multiple grooves, the backplate setting
In the groove.
5. ultra high density mounted type COB area light source according to claim 4, it is characterised in that：
Welding electrode is additionally provided in the groove, the welding electrode is connected with backplate, and the surface of the welding electrode is set
There is tin coating.
6. ultra high density mounted type COB area light source according to claim 5, it is characterised in that：
The area of the tin coating is less than the area of welding electrode, and the surface of the welding electrode is equipped with nickel in the outside of tin coating
Layer gold.
7. ultra high density mounted type COB area light source according to claim 4, it is characterised in that：
The surface of the backplate is equipped with nickel-gold layer.
8. a kind of manufacturing method of ultra high density mounted type COB area light source, which is characterized in that include the following steps：
Multiple through-holes through substrate are opened up on substrate；Surface and through-hole to substrate carry out metalized；In substrate table
Face thickeies layers of copper, and dry film is fixed in the thickening layers of copper of substrate back；It is painted by film light, forms pre-groove on dry film；
Backplate is plated in groove；Remove remaining dry film, welding resistance oil reservoir is coated in substrate back；After film light is painted, expose the back side
Electrode；Overleaf heavy nickel-gold layer on electrode；LED chip is fixed on substrate front side, box dam, box dam is arranged in the outside of LED chip
The front electrode being connected with LED chip is arranged in outside, and front electrode is connected by the through-hole of metallization with backplate.
9. according to the method described in claim 8, it is characterized in that：
Removing remaining dry film, before substrate back coats welding resistance oil reservoir, is further including：It is arranged on partial rear electrode tin plating
Layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810699797.7A CN108573961A (en) | 2018-06-29 | 2018-06-29 | A kind of ultra high density mounted type COB area light source and its manufacturing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810699797.7A CN108573961A (en) | 2018-06-29 | 2018-06-29 | A kind of ultra high density mounted type COB area light source and its manufacturing method |
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|---|---|
| CN108573961A true CN108573961A (en) | 2018-09-25 |
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|---|---|---|---|
| CN201810699797.7A Pending CN108573961A (en) | 2018-06-29 | 2018-06-29 | A kind of ultra high density mounted type COB area light source and its manufacturing method |
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| CN101951735A (en) * | 2010-09-17 | 2011-01-19 | 深圳市集锦线路板科技有限公司 | Coppering and porefilling process for circuit board |
| CN102365001A (en) * | 2011-06-30 | 2012-02-29 | 广东达进电子科技有限公司 | Manufacture method for multiple surface treatments on one board |
| CN103400833A (en) * | 2013-07-29 | 2013-11-20 | 深圳市天电光电科技有限公司 | Led module and manufacturing method thereof |
| CN103579477A (en) * | 2013-11-04 | 2014-02-12 | 上海大学 | Light emitting diode flip chip packaging method based on through hole technology |
| CN205960027U (en) * | 2016-07-27 | 2017-02-15 | 佛山市国星光电股份有限公司 | COB light source and collection moulding piece and lamps and lanterns |
| CN107041077A (en) * | 2017-04-27 | 2017-08-11 | 广东依顿电子科技股份有限公司 | A kind of circuit board producing method of turmeric and the golden compound base amount method of electricity |
| CN208637418U (en) * | 2018-06-29 | 2019-03-22 | 珠海市宏科光电子有限公司 | A kind of ultra high density mounted type COB area light source |
-
2018
- 2018-06-29 CN CN201810699797.7A patent/CN108573961A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101951735A (en) * | 2010-09-17 | 2011-01-19 | 深圳市集锦线路板科技有限公司 | Coppering and porefilling process for circuit board |
| CN102365001A (en) * | 2011-06-30 | 2012-02-29 | 广东达进电子科技有限公司 | Manufacture method for multiple surface treatments on one board |
| CN103400833A (en) * | 2013-07-29 | 2013-11-20 | 深圳市天电光电科技有限公司 | Led module and manufacturing method thereof |
| CN103579477A (en) * | 2013-11-04 | 2014-02-12 | 上海大学 | Light emitting diode flip chip packaging method based on through hole technology |
| CN205960027U (en) * | 2016-07-27 | 2017-02-15 | 佛山市国星光电股份有限公司 | COB light source and collection moulding piece and lamps and lanterns |
| CN107041077A (en) * | 2017-04-27 | 2017-08-11 | 广东依顿电子科技股份有限公司 | A kind of circuit board producing method of turmeric and the golden compound base amount method of electricity |
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