CN108573908B - Mechanical supporting device of semiconductor substrate processing micro-chamber - Google Patents
Mechanical supporting device of semiconductor substrate processing micro-chamber Download PDFInfo
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- CN108573908B CN108573908B CN201710142347.3A CN201710142347A CN108573908B CN 108573908 B CN108573908 B CN 108573908B CN 201710142347 A CN201710142347 A CN 201710142347A CN 108573908 B CN108573908 B CN 108573908B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a mechanical supporting device of a micro-chamber for processing a semiconductor substrate, which comprises: the support ring is fixedly arranged above the first support plate; the movable seat is mutually sleeved with the support ring in a sliding way to form a sleeved space, and a driving device fixedly connected with the support ring and the movable seat respectively is arranged in the sleeved space; a lower cavity is arranged in the upper concave ring of the movable seat; the upper chamber is used for forming a semiconductor wafer micro-processing cavity when contacting with the lower chamber, and is fixed and adjusted horizontally through a second supporting plate and a third supporting plate; by adopting the technical scheme of the invention, the driving device controls the movable seat to move up and down relative to the support ring to guide the opening and closing of the lower cavity and the upper cavity arranged in the movable seat, and the level of the movable seat during movement is directly controlled through the sleeving structure between the support ring and the movable seat.
Description
Technical Field
The present invention relates to the field of surface treatment of semiconductor wafers or similar workpieces, and more particularly to an apparatus for chemically treating the surface of semiconductor wafers, as well as cleaning, etching and other similar processes.
Background
In the process of producing an integrated circuit by using a wafer, the processes of cleaning, etching and the like are required to be carried out for many times, and the processing methods can be mainly divided into a dry method and a wet method, wherein the wet method is the method which is most widely applied in the prior art, and the prior wet method process mainly comprises a chemical solution immersion method and a spraying method.
In the patent document of the present applicant's application published on 10/17/2012, publication No. CN102737955A, a method for wet processing a wafer by using a micro-processing chamber is disclosed. In the micro-processing chamber, the semiconductor wafer is closely received and processed. A micro-processing chamber, consisting of an upper chamber and a lower chamber, may be in an open position to load or remove semiconductor wafers or in a closed position to introduce chemical reagents or other fluids into the chamber for processing of semiconductor wafers. The open or closed position may be achieved by relative movement of the upper and lower movable parts. The upper and lower moveable parts of the apparatus are held together by four posts extending upwardly from respective corner portions of the bottom plate of the lower moveable part to the top plate of the upper moveable part, which can be raised or lowered along the four posts to set the micro-processing chamber in either an open or closed position. However, there are several problems associated with this design, first, the support posts limit the three-dimensional movement of the micro-processing chamber required for a particular application. Second, the plates holding the upper and lower chambers may be easily deformed as the chamber size becomes larger. The deformation affects the shape and size of the internal space of the chamber formed after the upper and lower chambers are closed, resulting in unexpected processing results. Third, the prior art designs require precise machining of the posts and corresponding holes in the plate and box in order to achieve good alignment of all parts. Finally, during operation, the movable parts moving along the pillar may generate particles caused by friction. The particles may be a source of contamination for the process. In advanced semiconductor manufacturing, it is widely recognized that most particulate contamination comes from the processing system.
Therefore, the applicant of the present application has optimized the above-mentioned apparatus, and in the patent application publication No. CN105934817A of 2016, 9, 7, the applicant has disclosed an improved semiconductor wafer cleaning apparatus. In this improvement, four guide posts are omitted through the plate and box of the main structure of the apparatus, all the edges of the support plate are reinforced by means of support beams, the size of which can be adjusted according to the application, which more effectively prevent the support plate from being deformed by the pressure or vacuum forces required during the cleaning procedure and required to keep the upper and lower chambers precisely attached to each other, moreover, the introduction of support beams will reduce the possibility of particles being generated by friction of the parts during the opening or closing of the micro-processing chamber; the internal shape of the micro-processing chamber can be easily tuned by adjusting screws or other existing moving parts in the top support unit; the improved design allows for the recycling of more parts at the end of the life of the wafer cleaning apparatus.
Although the above improvements improve the structure of the existing micro-processing chamber in wet processing the wafer to some extent, the following problems still exist in the above improvements: firstly, the moving unit is moved by utilizing parts such as an air bag and the like, and is guided by wheels arranged at the corners or edges of a lower supporting plate or a lower box when the moving unit moves, so that horizontal deviation is difficult to be avoided in the moving process, and the problem of closing between an upper chamber and a lower chamber is caused; when the device is installed, although the pillars, the plates and the corresponding holes in the boxes do not need to be precisely machined, the positions of the wheels arranged at the corners or edges of the lower supporting plate or the lower box still need to be precisely positioned; and the guide rail for guiding the moving unit to move is arranged on the spacing pillar, so that at least one of the lower support plate or the lower box needs to be processed to the edge of the spacing pillar, and the larger size increases extra weight and power required by parts such as an air bag and the like for moving the moving unit. Therefore, further optimization of the design is necessary.
Disclosure of Invention
The invention provides a mechanical supporting device of a micro-chamber for processing a semiconductor substrate, which has a more simplified structure, accurate movement and positioning of a cavity and miniaturization of a moving unit.
For the micro-cavity mechanical supporting device for processing the semiconductor substrate, the technical scheme is as follows: the method comprises the following steps: the supporting device comprises a first supporting unit, a movable unit, a second supporting unit, a third supporting unit and a plurality of supporting columns. The first supporting unit includes: the support ring comprises a first support plate and a support ring, wherein the first support plate is horizontally arranged, and the support ring is fixedly arranged above the first support plate. The movable unit is supported by the first supporting unit, and includes: a drive device; a movable seat: the movable seat is cylindrical, the upper part and the lower part of the movable seat are respectively provided with an annular upper concave ring and an annular lower concave ring, the lower concave ring of the movable seat and the support ring are mutually sleeved in a sliding way to form a sleeving space, and the driving device is arranged in the sleeving space and is respectively fixedly connected with the lower part of the movable seat and the upper part of the first support plate; the circle centers of the movable seat, the support ring and the upper concave ring and the lower concave ring of the movable seat are coaxial; and a lower chamber: the lower chamber is disposed within an upper recessed ring of the movable seat. The second supporting unit includes: the second supporting plate is horizontally arranged, and the second supporting plate is fixedly connected with the first supporting plate through the plurality of supporting columns; the upper chamber is positioned through a through hole formed in the second support plate and supported by the second support plate, the upper chamber corresponds to the lower chamber in position, and the upper chamber and the lower chamber are structurally designed reasonably to form a micro-processing cavity for processing the semiconductor wafer when in contact; the micro-processing chamber has at least one inlet and outlet port for directing fluids for processing semiconductor wafers into and out of the micro-processing chamber. The third support unit is configured to apply pressure to the upper chamber to horizontally and well position the upper chamber, including: a third support plate fixedly connected by the plurality of struts and having a plurality of screws, reinforcing structures or movable parts that apply pressure to the upper chamber.
By adopting the structure, the movable seat is driven by the driving device to slide up and down along the support ring so as to lift the lower chamber arranged in the upper concave ring of the movable seat, so that the lower chamber is contacted with the upper chamber to form a micro-processing chamber or is separated and opened to limit the horizontal position and direction of the lower chamber when moving up and down through the mutual sleeving of the lower concave ring and the support ring.
Further, the first supporting unit further includes a plurality of first supporting beams, the second supporting unit further includes a plurality of second supporting beams, and the third supporting unit further includes a plurality of third supporting beams.
Further, the support ring is fixedly arranged on the first support plate through the plurality of first support beams. The support ring is better positioned by the first support beam, and the strength of the support ring can be improved.
Furthermore, first backup pad, second backup pad, third backup pad respectively through first supporting beam, second supporting beam, third supporting beam with many spinal branch posts fixed connection for fix a position and increase of strength first backup pad, second backup pad, third backup pad.
Furthermore, the mechanical supporting device of the semiconductor substrate processing micro-chamber is also provided with a shell plate, and the first supporting beam and the third supporting beam are symmetrically provided with grooves, so that the shell plate can be inserted into and fixed in the grooves.
Furthermore, a liquid leakage groove is formed in the bottom of the upper concave ring of the movable seat. So as to prevent leakage of the chemical liquid in the micro-processing chamber.
Furthermore, a leakage detection mechanism is arranged in the leakage groove. Possible leaks are monitored and when a leak is detected, the apparatus can be shut down or otherwise safely handled.
Furthermore, the support ring upper surface is equipped with annular protective groove, annular protective groove is coaxial with the removal seat, and the external diameter of annular protective groove is greater than the external diameter that removes the seat. The arrangement is to prevent possible micro-processing cavity leakage, and to prevent leakage from causing corrosion and other pollution to the device due to the fact that the annular protection groove is additionally arranged on the support ring when liquid is not arranged on the movable seat or overflows from the leakage groove due to various reasons.
Furthermore, the inner wall of the lower concave ring of the movable seat is sleeved outside the inner diameter wall of the annular protection groove on the support ring.
Furthermore, the inner wall of the support ring is sleeved outside the outer wall of the concave ring of the moving seat, the outer wall of the moving seat is also provided with an annular flow guide edge, and the flow guide edge is higher than the upper surface of the support ring; the inner diameter of the annular protection groove is smaller than the outer diameter of the diversion edge, and the outer diameter of the annular protection groove is larger than the outer diameter of the diversion edge.
Drawings
FIG. 1 is a side view of one embodiment of the present invention;
FIG. 2 is a cross-sectional view of section A-A of FIG. 1 in one embodiment of the invention;
FIG. 3 is an exploded view of FIG. 2;
FIG. 4 is a partial enlarged view of the area B of FIG. 2;
fig. 5 is a cross-sectional view of the invention in cross-section a-a of fig. 1 in another embodiment.
Detailed Description
Reference in the specification to "one embodiment" or "an embodiment" or "another embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least an implementation of the invention. The appearances of the phrase "in one embodiment" or "in another embodiment" in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. "plurality" in this disclosure means two or more, "a number" means one or more. "and/or" in the present invention means "and" or ".
A semiconductor substrate processing micro-chamber mechanical support apparatus 100 of the present invention is schematically illustrated in fig. 1-5.
Referring to fig. 1-5, the mechanical support device 100 for a semiconductor substrate processing micro-chamber of the present invention may include a first support unit 110, a movable unit 120, a second support unit 130, and a third support unit 140. The first support unit 110 is configured to support the movable unit 120, and a complete closed/open space for processing a semiconductor wafer is formed between the lower chamber 125 of the movable unit 120 and the upper chamber 132 of the second support unit 130, the first support unit 110, the second support unit 130, and the third support unit 140 are connected by a plurality of pillars 150, and all components are accommodated between the first support unit 110 and the third support unit 140.
The first support unit 110 includes at least a first support plate 111, and a support ring 112 disposed on the first support plate 111. The first support plate 111 should be made of a material with high strength, such as stainless steel or a high strength aluminum alloy, since it will be subjected to the pressure required to keep the chamber closed. In one embodiment, the first support unit 110 may further include four first support beams 113, and the support ring 112 may be fixedly disposed on the first support plate 111 by the first support beams 113. In another embodiment, the edge of the first supporting plate 111 is designed to be slidably recessed in a groove on the inner side of the first supporting beam 113 in the longitudinal direction, so as to be received and fixed in a groove on the inner side of the second supporting beam 133, thereby enhancing the strength of the first supporting plate 111. In another embodiment, the first support beam 113 further includes a first groove 114 recessed on an end of the first support beam 113. An outer shell plate (not shown) may be slid into the first channel 114 and received and secured within the first recess 114.
The movable unit 120 includes a bladder 121 (or other type of commercially available drive means, such as a mechanical or pneumatic drive, that can be used to move other parts of the movable unit 120 up and down), a movable seat 122, and a lower chamber 125. The air bag 121 is disposed on top of the first support plate 111. The lower chamber 125 defines a lower working surface and a lower inner perimeter of the micro-processing chamber. The movable base 122 is cylindrical, the upper portion and the lower portion of the movable base 122 are respectively provided with an annular upper concave ring 123 (for placing a lower chamber 125) and a lower concave ring 124, the lower concave ring 124 and the support ring 112 are slidably engaged with each other to form an engaging space 125, the driving device 121 is disposed in the engaging space 125, one end of the driving device is connected to the lower concave ring 124, and the other end of the driving device is connected to the first support plate 111.
In one embodiment, the bottom of the upper recessed ring 123 (below the lower chamber 125) is provided with a leakage trough 126 for collecting possible chemical liquid leaking from the micro-processing chamber. A leak detection device 127 may be provided in the leak tank 126 for monitoring and/or alerting.
In another embodiment, the upper surface of the support ring 112 is further provided with an annular protection groove 115, and the annular protection groove 115 can contain overflowing liquid after the liquid overflows from the movable seat 122, so that the liquid is prevented from corroding equipment, harming human bodies or polluting the environment. Since the liquid in the annular shield groove 115 can be easily observed, this can also serve as a warning in the event of accidental failure of the leak detection device 127. Furthermore, the liquid in the leakage groove 126 can be directly led out to the annular protective groove 115 or the waste liquid can be directly discharged to a waste liquid collecting device or a waste liquid pipeline by arranging a plurality of diversion holes 128 which lead to the leakage groove 126 on the movable seat 122.
The undercut ring 124 may be engaged with the support ring 112 in a variety of ways, as shown in FIG. 2, the inner wall of the support ring 112 may be directly engaged outside the outer wall of the undercut ring 124; when the supporting ring 112 is provided with the annular protection groove 115, as shown in fig. 3, the inner wall of the lower concave ring 124 may be sleeved outside the inner diameter wall of the annular protection groove 115.
When the inner wall of the support ring 112 is sleeved outside the outer wall of the concave ring 124 and the support ring 112 is provided with the annular protection groove 115, the outer wall of the movable seat 122 is further provided with an annular flow guiding edge 129, and the flow guiding edge 129 is higher than the upper surface of the support ring 112 and lower than the flow guiding hole 128; the inner diameter of the annular protection groove 115 is smaller than the outer diameter of the guide edge 129, and the outer diameter of the annular protection groove 115 is larger than the outer diameter of the guide edge 129, so that liquid guided out of the guide hole 128 can enter the annular protection groove 115 along the guide edge 129.
The second supporting unit 130 includes a second supporting plate 131, an upper chamber 132, and a plurality of second supporting beams 133 (not necessarily). The upper chamber 132 defines an upper working surface and an upper inner perimeter of the micro-processing chamber. The second support plate 131 is provided with a through-hole and is configured to support the upper chamber 132, and the upper chamber 132 passes through the through-hole of the second support plate 131 and is horizontally positioned therethrough. Preferably, the second support plate 131 is made of a material having a low possibility of deformation. The thickness of the edge of the second support plate 131 is structurally designed such that the edge of the second support plate 131 can slide into the groove recessed on the inner side of the second support beam 133 in the longitudinal direction, thereby being received and fixed in the groove on the inner side of the second support beam 133.
The third supporting unit 140 includes a third supporting plate 141, four third supporting beams 143 (not necessarily). . The third support plate 141 may be fixedly connected directly to the support column 150, and in another embodiment, the third support plate 141 is connected to the support column 150 by a third support beam 143. The third support beam 143 includes a groove recessed on an inner side of the third support beam 143 in the longitudinal direction. The thickness of the edge of the third support plate 141 is structurally designed such that the edge of the third support plate 141 can slide into the groove and be received and fixed therein. The third support plate 141 also includes a plurality of screws 144 or other conventional movable parts, such as pneumatic components. Forces may be applied to the upper chamber 132 by these screws 144 or existing movable parts to adjust the horizontal position and internal shape of the micro-processing chamber. In one embodiment, pressure equalization plates may be used to equalize the spot pressure generated from screws and other existing movable parts to a larger area. In one embodiment, the third support beam 143 is provided with a second recess 144 corresponding to the first recess 114 of the first support beam 113 for accommodating an outer shell plate by which the inside of the device is isolated from the outside. Generally, the second support plate 131 and/or the third support plate 141 have holes for passing electric wires and pipes therethrough.
It should be noted that the above mentioned nesting means: the concave ring 124 and the support ring 112 are designed in a certain structure, so that when the driving device drives the movable unit 120 to move up and down along the support ring 112, the support ring 112 can position the concave ring 124 to ensure that the horizontal position and the moving angle of the movable unit 120 do not change during the moving process (i.e., the support ring 112 guides the movable unit 120 to move up and down).
The materials used to form the lower chamber 125 and the upper chamber 132 will depend on the fluids used in the processing. In general, the selected material should have good chemical resistance to the fluid used. The structure of the lower chamber 125 and the upper chamber 132 may be designed differently according to the process. Generally, the lower chamber 125 and the upper chamber 132 are required to satisfy the requirements of high safety, high efficiency and low cost. No limitation on the structure of the lower chamber 125 and the upper chamber 132 is intended to be covered by the present invention.
Hereinafter, a semiconductor wafer cleaning method using the semiconductor wafer cleaning apparatus according to the present invention is described.
First, a semiconductor wafer is loaded on the top of the lower chamber 125.
Next, the lower chamber 125 and the upper chamber 132 are set in the closed position by pressing air into the bladder 121. When the bladder 121 is inflated, the bladder 121 pushes the movable base 122 and the lower chamber 125 to move upward until the lower chamber 125 contacts the upper chamber 132 positioned by the second support plate 131 and is closed to form a micro processing chamber.
After the micro-processing chamber is closed, the process begins by introducing the fluid to be processed into the micro-processing chamber through a fluid distribution system (not shown) that includes at least one aperture positioned in either the lower chamber 125 or the upper chamber 132. The fluid used will be drained from the micro processing chamber through at least one hole positioned in the lower chamber 125 or the upper chamber 132.
Next, after the cleaning process is completed, the air in the air cells 121 is released. When the air bag 121 is deflated, the movable seat 122 and the lower chamber 125 will move downward until the bottom of the movable seat 122 reaches the first support plate 111.
Finally, the semiconductor wafer is removed from the lower chamber 125.
The design of the apparatus of the present invention has several advantages. First, the positioning problem of the moving unit in the up-and-down moving process can be realized by the matching of the moving seat 122 and the support ring 112, so that the specification of the moving unit is greatly reduced, the weight of the moving unit is reduced, and the energy consumption of the power devices such as the air bag 121 is reduced. At the same time, the possibility of metal particles being generated by friction of the parts during opening or closing of the micro-processing chamber is further reduced, since no movement on the spacer struts (often of metal material) is required. On the premise of not sacrificing the error in the guiding process, the positioning error in the mounting process of the support ring does not generate any transverse redundant stress on the movable unit any more, the mounting and processing difficulty is reduced, the shape of the movable unit is ensured not to be changed easily, and the shape stability of the lower cavity is further ensured. In addition, compared with the prior art, the equipment design disclosed by the invention can greatly simplify the manufacturing of most parts, allows the simple maintenance and replacement of the most parts, improves the utilization rate of processing materials (for example, the supporting ring, the movable seat and the lower cavity can be processed by using the same material, saves the processing materials), and can obviously reduce the manufacturing cost.
The above embodiments are merely illustrative of the technical ideas and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, and not to limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered within the protection scope of the present invention.
Claims (10)
1. A semiconductor substrate processing micro-chamber mechanical support apparatus, comprising: a first supporting unit, a movable unit, a second supporting unit, a third supporting unit and a plurality of pillars; the method is characterized in that:
the first supporting unit includes: the support ring is fixedly arranged above the first support plate;
the movable unit is supported by the first supporting unit, and includes:
a drive device;
a movable seat: the movable seat is cylindrical, the upper part and the lower part of the movable seat are respectively provided with an annular upper concave ring and an annular lower concave ring, the lower concave ring of the movable seat and the support ring are mutually sleeved in a sliding way to form a sleeving space, and the driving device is arranged in the sleeving space and is respectively fixedly connected with the lower part of the movable seat and the upper part of the first support plate; the circle centers of the movable seat, the support ring and the upper concave ring and the lower concave ring of the movable seat are coaxial;
and a lower chamber: the lower cavity is arranged in an upper concave ring of the movable seat;
the second supporting unit includes: the second supporting plate is horizontally arranged, and the second supporting plate is fixedly connected with the first supporting plate through the plurality of supporting columns;
the upper chamber is positioned through a through hole formed in the second support plate and supported by the second support plate, the upper chamber corresponds to the lower chamber in position, and the upper chamber and the lower chamber are structurally designed reasonably to form a micro-processing cavity for processing the semiconductor wafer when in contact;
the third support unit is configured to apply pressure to the upper chamber to horizontally and well position the upper chamber, including: a third support plate fixedly connected by the plurality of struts and having a plurality of screws, reinforcing structures or movable parts that apply pressure to the upper chamber.
2. The semiconductor substrate processing micro chamber mechanical support apparatus of claim 1, wherein: the first supporting unit further comprises a plurality of first supporting beams, the second supporting unit further comprises a plurality of second supporting beams, and the third supporting unit further comprises a plurality of third supporting beams.
3. The semiconductor substrate processing micro chamber mechanical support apparatus of claim 2, wherein: the support ring passes through a plurality of first supporting beams are fixed to be set up on first backup pad.
4. The semiconductor substrate processing micro chamber mechanical support apparatus of claim 2, wherein: the first supporting plate, the second supporting plate and the third supporting plate are fixedly connected with the plurality of supporting columns through a first supporting beam, a second supporting beam and a third supporting beam respectively.
5. The semiconductor substrate processing micro chamber mechanical support apparatus of claim 2, wherein: the mechanical supporting device of the semiconductor substrate processing micro-chamber is further provided with a shell plate, and the first supporting beam and the third supporting beam are symmetrically provided with grooves, so that the shell plate can be inserted into and fixed in the grooves.
6. The semiconductor substrate processing micro chamber mechanical support apparatus of claim 1, wherein: and a liquid leakage groove is formed in the bottom of the upper concave ring of the movable seat.
7. The semiconductor substrate processing micro chamber mechanical support apparatus of claim 6, wherein: and a leakage detection mechanism is arranged in the leakage groove.
8. The semiconductor substrate processing micro chamber mechanical support apparatus of one of claims 1 to 7, wherein: the support ring upper surface is equipped with annular protective groove, annular protective groove is coaxial with the removal seat, and the external diameter of annular protective groove is greater than the external diameter that removes the seat.
9. The semiconductor substrate processing micro chamber mechanical support apparatus of claim 8, wherein: the inner wall of a concave ring of the movable seat is sleeved outside the inner diameter wall of an annular protection groove on the support ring.
10. The semiconductor substrate processing micro chamber mechanical support apparatus of claim 8, wherein: the inner wall of the support ring is sleeved outside the outer wall of the concave ring of the moving seat, the outer wall of the moving seat is also provided with an annular flow guide edge, and the flow guide edge is higher than the upper surface of the support ring; the inner diameter of the annular protection groove is smaller than the outer diameter of the diversion edge, and the outer diameter of the annular protection groove is larger than the outer diameter of the diversion edge.
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| CN201710142347.3A CN108573908B (en) | 2017-03-10 | 2017-03-10 | Mechanical supporting device of semiconductor substrate processing micro-chamber |
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| CN201710142347.3A CN108573908B (en) | 2017-03-10 | 2017-03-10 | Mechanical supporting device of semiconductor substrate processing micro-chamber |
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| CN108573908B true CN108573908B (en) | 2020-09-08 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101395700A (en) * | 2006-03-08 | 2009-03-25 | Sez股份公司 | Device for fluid treating plate-like articles |
| CN102737955A (en) * | 2011-04-15 | 2012-10-17 | 无锡华瑛微电子技术有限公司 | Semiconductor processing device |
| CN102738034A (en) * | 2011-04-15 | 2012-10-17 | 无锡华瑛微电子技术有限公司 | Semiconductor processing apparatus provided with structure for processing fluid leakage recovery |
| CN102893372A (en) * | 2010-05-25 | 2013-01-23 | 朗姆研究公司 | Closed chamber with fluid separation feature |
| CN105934817A (en) * | 2013-12-31 | 2016-09-07 | 温索菲亚 | Semiconductor wafer cleaning system |
-
2017
- 2017-03-10 CN CN201710142347.3A patent/CN108573908B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101395700A (en) * | 2006-03-08 | 2009-03-25 | Sez股份公司 | Device for fluid treating plate-like articles |
| CN102893372A (en) * | 2010-05-25 | 2013-01-23 | 朗姆研究公司 | Closed chamber with fluid separation feature |
| CN102737955A (en) * | 2011-04-15 | 2012-10-17 | 无锡华瑛微电子技术有限公司 | Semiconductor processing device |
| CN102738034A (en) * | 2011-04-15 | 2012-10-17 | 无锡华瑛微电子技术有限公司 | Semiconductor processing apparatus provided with structure for processing fluid leakage recovery |
| CN105934817A (en) * | 2013-12-31 | 2016-09-07 | 温索菲亚 | Semiconductor wafer cleaning system |
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| CN108573908A (en) | 2018-09-25 |
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