CN108572709A - The computer housing of water flowing cooling - Google Patents
The computer housing of water flowing cooling Download PDFInfo
- Publication number
- CN108572709A CN108572709A CN201810544484.4A CN201810544484A CN108572709A CN 108572709 A CN108572709 A CN 108572709A CN 201810544484 A CN201810544484 A CN 201810544484A CN 108572709 A CN108572709 A CN 108572709A
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- CN
- China
- Prior art keywords
- water
- flowing
- circuit board
- intermediate layer
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/181—Enclosures
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses the computer housings of water flowing cooling, including chassis shell body, the chassis shell body is at least to be detachably connected on one side, the parallel circuit board slot of several groups is provided in the chassis shell body, a circuit board can be fixed in every group of circuit board slot, it further include refrigeration compressor, the one side of the circuit board is for installing circuit module, another side is equipped with intermediate layer of water-flowing, the lower end of the intermediate layer of water-flowing is water inlet end, upper end is water outlet, and the refrigeration compressor forms complete water route access with intermediate layer of water-flowing.The present invention can reduce water temperature by refrigeration compressor, by being passed through the cold water after refrigeration, effective temperature-reducing, especially in heat weather, good cooling effect, it is ensured that the normal work of circuit to the circuit board surface in cabinet.
Description
Technical field
The present invention relates to the computer housings of water flowing cooling, belong to machine box for server technical field.
Background technology
Inventor, which retrieves, finds Patent No. 201620085637.X, and patent name is water cooling computer housing, and the patent is public
The cold computer housing of boiling water, including frame and mounting plate, frame are formed by connecting by the more water pipes with hollow cavity and easy heat radiation,
The inner cavity of each water pipe, which is interconnected, forms closure pipeline, is equipped in frame for the radiator liquid of radiating subassembly to be transported to closure
The liquid feeding device of pipeline.When electronic component operational heat makes the radiator liquid of radiating subassembly heat up, liquid feeding device will radiate
Liquid is transported to closure pipeline, and radiator liquid in frame water pipe inner cavity is driven to circulate in being closed in pipeline, dissipates at this time
The heat of hot liquid will be constantly dispersed into from the side wall of water pipe in the external world, in this way, realizing water cooling computer housing by internal heat
The purpose distributed, for comparing more existing cabinet by the way of fan cooling, above-mentioned water cooling computer housing utilizes heat dissipation
The mode that constantly flows and take away heat of the liquid in frame water pipe, avoids causing because dust blocks due to chassis intake
The problem of poor heat radiation.Although the patent is open to use water cooling, the arrangement in water route and not close to circuit board, and not
It is open to be furnished with dedicated refrigerating plant so as to apply, it is difficult to the effect of cooling cabinet really be realized, especially in sweltering heat
In environment, water is difficult direct reduction temperature.
Inventor, which retrieves, finds Patent No. 201610520356.7, and patent name is intelligent water-cooled cabinet, and the patent is public
Intelligent water-cooled cabinet, including shell, display screen, water cooled pipeline and cooling chamber have been opened, the display is installed before the shell
Button is provided below in screen, the display screen, and refrigerant addition tank is provided below in the button, and the refrigerant adds under tank
Face is equipped with automatic valve, and the automatic valve is provided below return water storehouse, intelligent thermometer is equipped with inside the return water storehouse,
The bottom in the return water storehouse is provided with automatically-controlled door, and the side of the automatically-controlled door is provided with water storage, is installed inside the water storage
There is level switch, water pump is installed on the inside of the water storage, the water cooled pipeline, the water cooling are connected on the water pump
There are two the cooling chambers for installation on pipeline, and the cooling chamber is installed above temperature sensor.Advantageous effect is：Without even
Water pipe and outlet pipe are tapped into, by the temperature upper limit that CPU and radiator is arranged, you can realize automatic cooling, intelligence degree height.
The patent needs intelligent control, of high cost, is not easy to promote, and when actually executing, there are inconveniences in the difficult point of realization, and portion
Part is easily damaged, and is replaced trouble, after damage, is found not in time, it is easy to cabinet inside parts damages is caused, to high accurancy and precision
Circuit board causes to damage.
Invention content
Above-mentioned in order to solve the problems, such as, the invention discloses the computer housing of water flowing cooling, specific technical solutions
It is as follows：
The computer housing of water flowing cooling, including chassis shell body, the chassis shell body are at least to be detachably connected on one side, the machine
It is provided with the parallel circuit board slot of several groups in tank shell, a circuit board can be fixed in every group of circuit board slot, further includes system
Cold compressor, the one side of the circuit board is for installing circuit module, and another side is equipped with intermediate layer of water-flowing, the intermediate layer of water-flowing
Lower end is water inlet end, and upper end is water outlet, and the refrigeration compressor forms complete water route access with intermediate layer of water-flowing,
The water outlet of the intermediate layer of water-flowing is connected to refrigeration compressor by water pipe conveying, cold after refrigerant compression mechanism cold
Water is connected to the water inlet end of intermediate layer of water-flowing by water pipe conveying；
The intermediate layer of water-flowing is internally provided with several connecting poles, and the internal voids spacing of intermediate layer of water-flowing is consistent, and intermediate layer of water-flowing
There are several affixed points, intermediate layer of water-flowing to be adjacent to and contact with circuit board with circuit board.
The side surface that the circuit board is used to install circuit module is provided with several thin conduits, and every thin conduit is all provided with
It is equipped with several fixed card buckles.
The centre of the fixed card buckle is enclosed in thin conduit surrounding, fixed card buckle with thin conduit hot melt one, fixed card buckle
Two free ends towards circuit board；
After circuit module installation on circuit boards, thin conduit is placed in the gap between circuit module, and by fixed card buckle
Two free ends are inserted into the through-hole on circuit board, and thin conduit is fixed.
The thin conduit is intake from its lower end, is discharged from the upper end, and thin conduit is connected to the water route of refrigeration compressor.
The circuit board and circuit module surface are both provided with waterproof layer.
The beneficial effects of the invention are as follows：
The present invention can reduce water temperature by refrigeration compressor, by being passed through after refrigeration to the circuit board surface in cabinet
Cold water, effective temperature-reducing, especially in heat weather, good cooling effect, it is ensured that the normal work of circuit.
The present invention eliminates traditional electric fan heat dissipation, the blowing noises of electric fan is avoided, especially suitable for noise
More demanding place.
Description of the drawings
Fig. 1 is the structural schematic diagram of the present invention,
Fig. 2 is the Section A-A figure of Fig. 1,
Fig. 3 is the B direction views of Fig. 2,
Reference numerals list：1-chassis shell body, 2-circuit boards, 3-water pipes, 4-refrigeration compressors, 5-intermediate layer of water-flowing, 6-
Circuit module, 7-thin conduits, 8-fixed card buckles.
Specific implementation mode
With reference to the accompanying drawings and detailed description, the present invention is furture elucidated.It should be understood that following specific implementation modes are only
For illustrating the present invention rather than limiting the scope of the invention.
Fig. 1 is the structural schematic diagram of the present invention, and Fig. 2 is the Section A-A figure of Fig. 1, and Fig. 3 is the B direction views of Fig. 2, figure acceptance of the bid
Note component names are followed successively by：Chassis shell body 1, circuit board 2, water pipe 3, refrigeration compressor 4, intermediate layer of water-flowing 5, circuit module 6, thin water
Pipe 7, fixed card buckle 8.
In conjunction with attached drawing as it can be seen that this water-cooled machine box for server, including chassis shell body, the chassis shell body are at least on one side
It is detachably connected, the parallel circuit board slot of several groups is provided in the chassis shell body, one can be fixed in every group of circuit board slot
A circuit board further includes refrigeration compressor, and the one side of the circuit board is equipped with water flowing folder for installing circuit module, another side
The lower end of layer, the intermediate layer of water-flowing is water inlet end, and upper end is water outlet, and the refrigeration compressor is formed completely with intermediate layer of water-flowing
Water route access.Chassis shell body is dismantled into one side or multi-panel when circuit board is either replaced in installation, after circuit board is installed, in electricity
The back side of road plate is laid with intermediate layer of water-flowing, and intermediate layer of water-flowing and refrigeration compressor are formed complete water route access, noted in intermediate layer of water-flowing
Enter proper amount of water, when circuit board is in running order, starts refrigeration compressor, refrigeration compressor is fluidly by water system
Cold, cold water is flowed by intermediate layer of water-flowing in back of circuit board, and cooling-down effect is played.
The water outlet of the intermediate layer of water-flowing is connected to refrigeration compressor by water pipe conveying, after refrigerant compression mechanism cold
Cold water the water inlet end of intermediate layer of water-flowing is connected to by water pipe conveying.Intermediate layer of water-flowing forms closed loop water loop with refrigeration compressor.
The side surface that the circuit board is used to install circuit module is provided with several thin conduits, and every thin conduit is all provided with
It is equipped with several fixed card buckles.After circuit module installation on circuit boards, thin conduit is placed in the gap between circuit module,
And two free ends of fixed card buckle are inserted into the through-hole on circuit board, thin conduit is fixed.Thin conduit is used for circuit
Plate front cools down, and thin conduit is arranged in the gap between circuit module, and thin conduit is fixed on circuit by fixed card buckle
On plate, in use, thin conduit will not shake, and according to the position of circuit module, the specific quantity that thin conduit is set and
Position, setting are more flexible.
The centre of the fixed card buckle is enclosed in thin conduit surrounding, fixed card buckle with thin conduit hot melt one, fixed card buckle
Two free ends towards circuit board.Fixed card buckle is fixed with thin conduit, the round and smooth shape of fixed card buckle, prevents from influencing circuit mould
The normal operation of block.
The thin conduit is intake from its lower end, is discharged from the upper end, and thin conduit is connected to the water route of refrigeration compressor.Carefully
Flow in water pipe is from bottom to top, it is ensured that has water in thin conduit always.
The intermediate layer of water-flowing is internally provided with several connecting poles, and the internal voids spacing of intermediate layer of water-flowing is consistent, and water flowing
Interlayer has several affixed points, intermediate layer of water-flowing to be adjacent to and contact with circuit board with circuit board.Sky inside intermediate layer of water-flowing for being filled with water
Gap spacing is consistent, that is, the water layer thickness formed is consistent, and can be adjacent to circuit board, cools down to circuit board efficient.
The circuit board and circuit module surface are both provided with waterproof layer.Waterproof layer can prevent the Hquids such as water to electricity
Road plate and circuit module avoid circuit board or circuit module open circuit.
The technical means disclosed in the embodiments of the present invention is not limited to the technical means disclosed in the above technical means, and further includes
By the above technical characteristic arbitrarily the formed technical solution of combination.
It is enlightenment with above-mentioned desirable embodiment according to the present invention, through the above description, relevant staff is complete
Various changes and amendments can be carried out without departing from the scope of the technological thought of the present invention' entirely.The technology of this invention
Property range is not limited to the contents of the specification, it is necessary to determine its technical scope according to right.
Claims (5)
1. the computer housing of water flowing cooling, including chassis shell body, the chassis shell body is at least to be detachably connected on one side, described
It is provided with the parallel circuit board slot of several groups in chassis shell body, a circuit board, feature can be fixed in every group of circuit board slot
It is to further include refrigeration compressor, the one side of the circuit board is for installing circuit module, and another side is equipped with intermediate layer of water-flowing, institute
The lower end for stating intermediate layer of water-flowing is water inlet end, and upper end is water outlet, and the refrigeration compressor forms complete water route with intermediate layer of water-flowing
Access,
The water outlet of the intermediate layer of water-flowing is connected to refrigeration compressor by water pipe conveying, cold after refrigerant compression mechanism cold
Water is connected to the water inlet end of intermediate layer of water-flowing by water pipe conveying；
The intermediate layer of water-flowing is internally provided with several connecting poles, and the internal voids spacing of intermediate layer of water-flowing is consistent, and intermediate layer of water-flowing
There are several affixed points, intermediate layer of water-flowing to be adjacent to and contact with circuit board with circuit board.
2. the computer housing of water flowing cooling according to claim 1, it is characterised in that the circuit board is for installing circuit
One side surface of module is provided with several thin conduits, and every thin conduit is both provided with several fixed card buckles.
3. the computer housing of water flowing according to claim 2 cooling, it is characterised in that the centre of the fixed card buckle with it is thin
Water pipe hot melt one, fixed card buckle are enclosed in thin conduit surrounding, and two free ends of fixed card buckle are towards circuit board；
After circuit module installation on circuit boards, thin conduit is placed in the gap between circuit module, and by fixed card buckle
Two free ends are inserted into the through-hole on circuit board, and thin conduit is fixed.
4. the computer housing of water flowing cooling according to claim 3, it is characterised in that the thin conduit is intake from its lower end,
It is discharged from the upper end, and thin conduit is connected to the water route of refrigeration compressor.
5. the computer housing of water flowing cooling according to claim 4, it is characterised in that the circuit board and circuit module table
Face is both provided with waterproof layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810544484.4A CN108572709A (en) | 2018-05-31 | 2018-05-31 | The computer housing of water flowing cooling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810544484.4A CN108572709A (en) | 2018-05-31 | 2018-05-31 | The computer housing of water flowing cooling |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108572709A true CN108572709A (en) | 2018-09-25 |
Family
ID=63572234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810544484.4A Pending CN108572709A (en) | 2018-05-31 | 2018-05-31 | The computer housing of water flowing cooling |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108572709A (en) |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080017355A1 (en) * | 2006-05-16 | 2008-01-24 | Hardcore Computer, Inc. | Case for a liquid submersion cooled electronic device |
| CN102194529A (en) * | 2010-03-19 | 2011-09-21 | 上海微电子装备有限公司 | Patch type heat-radiating device with active cooling |
| CN202671891U (en) * | 2012-05-31 | 2013-01-16 | 南京乐金熊猫电器有限公司 | Washing machine with water cooling type circuit board |
| CN103138602A (en) * | 2011-11-30 | 2013-06-05 | 永济新时速电机电器有限责任公司 | Water-cooling inversion power module |
| CN203537659U (en) * | 2013-09-30 | 2014-04-09 | 虞小生 | Circuit board having water-cooling function |
| CN205491635U (en) * | 2016-04-06 | 2016-08-17 | 西安因变光电科技有限公司 | Power circuit board geomantic omen mixed cooling machine case |
| CN205540473U (en) * | 2016-01-28 | 2016-08-31 | 深圳市万景华科技有限公司 | Water -cooling computer machine case |
| CN206077917U (en) * | 2016-08-26 | 2017-04-05 | 汕头市欧兰斯模型科技有限公司 | A kind of circuit board water-cooled box |
| CN206272950U (en) * | 2016-12-29 | 2017-06-20 | 福建闽威科技股份有限公司 | It is a kind of to concentrate the high-performance circuit board for radiating |
| CN206272951U (en) * | 2016-12-29 | 2017-06-20 | 福建闽威科技股份有限公司 | A kind of circuit board of water-cooling |
| CN107124849A (en) * | 2016-02-24 | 2017-09-01 | 讯凯国际股份有限公司 | Water-cooling system |
| CN206713155U (en) * | 2017-05-22 | 2017-12-05 | 衢州共创电子科技有限公司 | A kind of arc-shaped circuit board |
-
2018
- 2018-05-31 CN CN201810544484.4A patent/CN108572709A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080017355A1 (en) * | 2006-05-16 | 2008-01-24 | Hardcore Computer, Inc. | Case for a liquid submersion cooled electronic device |
| CN102194529A (en) * | 2010-03-19 | 2011-09-21 | 上海微电子装备有限公司 | Patch type heat-radiating device with active cooling |
| CN103138602A (en) * | 2011-11-30 | 2013-06-05 | 永济新时速电机电器有限责任公司 | Water-cooling inversion power module |
| CN202671891U (en) * | 2012-05-31 | 2013-01-16 | 南京乐金熊猫电器有限公司 | Washing machine with water cooling type circuit board |
| CN203537659U (en) * | 2013-09-30 | 2014-04-09 | 虞小生 | Circuit board having water-cooling function |
| CN205540473U (en) * | 2016-01-28 | 2016-08-31 | 深圳市万景华科技有限公司 | Water -cooling computer machine case |
| CN107124849A (en) * | 2016-02-24 | 2017-09-01 | 讯凯国际股份有限公司 | Water-cooling system |
| CN205491635U (en) * | 2016-04-06 | 2016-08-17 | 西安因变光电科技有限公司 | Power circuit board geomantic omen mixed cooling machine case |
| CN206077917U (en) * | 2016-08-26 | 2017-04-05 | 汕头市欧兰斯模型科技有限公司 | A kind of circuit board water-cooled box |
| CN206272950U (en) * | 2016-12-29 | 2017-06-20 | 福建闽威科技股份有限公司 | It is a kind of to concentrate the high-performance circuit board for radiating |
| CN206272951U (en) * | 2016-12-29 | 2017-06-20 | 福建闽威科技股份有限公司 | A kind of circuit board of water-cooling |
| CN206713155U (en) * | 2017-05-22 | 2017-12-05 | 衢州共创电子科技有限公司 | A kind of arc-shaped circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180925 |