CN108566738B - A kind of optic module PCB production method - Google Patents
A kind of optic module PCB production method Download PDFInfo
- Publication number
- CN108566738B CN108566738B CN201810609433.5A CN201810609433A CN108566738B CN 108566738 B CN108566738 B CN 108566738B CN 201810609433 A CN201810609433 A CN 201810609433A CN 108566738 B CN108566738 B CN 108566738B
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- radium
- shine
- outer layer
- production method
- pad
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Abstract
The present invention provides a kind of optic module PCB production method, comprising steps of a. carries out sawing sheet, internal layer, pressing, drilling, plating, outer layer production, anti-welding processing to wiring board；When outer layer makes, the welding region of element is partly buried without copper sheet, landless；When outer layer makes, the pin setting binding pad of optical module chip is also corresponded to；B. radium-shine windowing being carried out in the welding region for partly burying element, the copper foil of internal layer is exposed into medium ablation between outer layer and internal layer；C. sandblasting removes the carbon slag formed when radium-shine windowing；D. change gold, the pad one formed when copper foil and outer layer that internal layer exposes are made assimilates gold；E. it forms for the first time；The insertion region for corresponding to optical module chip in the circuit board is slotted using mechanical-moulded mode, binds pad pitch groove edge 7mil；F. it forms for second；The groove edge close to binding pad is cut using radium-shine mode, so that the groove edge 3mil after binding pad pitch cutting.
Description
Technical field
The present invention relates to wiring board production field more particularly to a kind of optic module PCB production methods.
Background technique
Optical module is a kind of electronic component of photoelectric conversion, is briefly exactly that optical signal is converted into electric signal, telecommunications
Number it is converted into optical signal, including ballistic device, receiving device and electronic functional circuit, as long as therefore having the place of optical signal
Just have the application of optical module.Optic module is by function point: optical receiver module, optical transmission module, the integrated module of optical transceiver and light
Forwarding module etc..
With the development of communication technology, optical module is gradually to miniaturization, low-power consumption, hot plug, high-speed, remote, intelligence
The directions such as energyization are developed, and the optical device on optic module PCB plate is caused also to become increasingly complex.It needs to encapsulate transmitting in optical module, connect
Receipts and storage chip reduce small product size, chip need to usually use embedded encapsulation, therefore need on corresponding PCB to save space
Fluting, and chip pin is to bind to weld with gold thread, for save the cost and short circuit between gold thread is prevented, between pad edge and trough rim
Away from generally only 3mil or so, and conventional groove milling method requirement pad need to have the safe distance of 7mil to slot, routinely machinery side
Formula is unable to reach the technical requirements;And individual components belong to and partly bury device, need locally to reveal internal layer copper, and change gold
To facilitate component to install, but internal layer copper foil is relatively thin and windowing position is located among plate, is difficult to make using traditional control depth gong,
Precision and qualification rate are lower, it is difficult to Man Yaoqiu.
Summary of the invention
In view of the above-mentioned problems, the present invention provides a kind of optic module PCB production method, including step,
A. sawing sheet, internal layer circuit production, pressing, drilling, plating, outer layer production, anti-welding processing are carried out to wiring board；Outer layer
When production, the welding region of element is partly buried without copper sheet, landless；When outer layer makes, the pin setting of optical module chip is also corresponded to
Bind pad；
B. radium-shine windowing is carried out in the welding region for partly burying element, by medium ablation between outer layer and internal layer, exposes internal layer
Copper foil；
C. sandblasting removes the carbon slag formed when radium-shine windowing；
D. change gold, the pad one formed when copper foil and outer layer that internal layer exposes are made assimilates gold；
E. it forms for the first time；The insertion region for corresponding to optical module chip in the circuit board is slotted using mechanical-moulded mode,
Bind pad pitch groove edge 7mil；
F. it forms for second；The groove edge close to binding pad is cut using radium-shine mode, so that binding pad
Groove edge 3mil after distance cutting.
Preferably, when radium-shine windowing, correspondence partly buries the hole that the welding region of element uses diameter as 4mil in radium-shine formula
Arranged, set on the corresponding welding region edge for partly burying element hole hole center away from for 1mil, partly bury element set on corresponding to
Welding region inside hole hole center away from for 2mil.
Further, when radium-shine windowing, radium-shine parameter is set as 12 μm of pulsewidth, and hair number is 2 hairs, and the time is 25 μ s.
Preferably, the wiring board of 8mil is greater than for dielectric thickness, first carries out controlled depth milling in the welding region for partly burying element,
Radium-shine windowing is carried out again.
Preferably, it when carrying out second of molding, is cut by laser using UV.
Preferably, the copper-clad plate after one piece of brownification is padded when carrying out second of molding, below wiring board, and uses wrinkle glue
Wiring board is fixed in copper-clad plate by band.
Preferably, after first time forms, plate harmomegathus is measured, harmomegathus is more than the needs point in 2mil or more between plate
Heap operation, with radium-shine precision when guaranteeing to form for second.
Optic module PCB production method provided by the invention is adopted when the welding region for half-and-half burying element carries out radium-shine windowing
With direct radium-shine mode, surface dielectric is ablated off, internal layer copper foil is revealed, and is removed the carbon slag of ablation by sandblasting
It removes, to improve machining accuracy, then by normal flowization gold, makes internal layer copper foil heavy upper nickel-gold layer together with surface pads, realize
Partly bury the installation requirements of device；And in processing and forming, in the peace for guaranteeing binding pad and groove milling for connecting chip pin
It is first rough milled when full distance, reuses the mode that radium-shine partial cut carries out refine, substitute the molding mode of tradition machinery, then
While gong slot precision is to adapt to product demand, processing cost is also below the mode for using radium-shine cutting completely.
Detailed description of the invention
Fig. 1 is radium-shine windowing schematic diagram in optic module PCB production method embodiment provided by the invention.
Fig. 2 is molding for the first time and second of forming area in optic module PCB production method embodiment provided by the invention
Schematic diagram.
Fig. 3 is optic module PCB example structure schematic diagram.
Specific embodiment
The present invention will be described in detail with reference to the accompanying drawings and examples.
In the specific implementation, it carries out according to the following steps, includes:
A. sawing sheet, internal layer circuit production, internal layer AOI, pressing, drilling, including laser drilling and machinery are carried out to wiring board
Drilling, plating, outer layer production, outer layer AOI, anti-welding processing, text；When outer layer makes, partly bury the welding region of element without copper sheet,
Landless；When outer layer makes, the pin setting binding pad of optical module chip is also corresponded to；
B. radium-shine windowing is carried out in the welding region for partly burying element, by medium ablation between outer layer and internal layer, exposes internal layer
Copper foil；Outer layer make when, partly bury the welding region of element without copper sheet, landless, it is therefore intended that prevent it is radium-shine can not ablation；Such as
Shown in Fig. 1, for a wiring board with layers of copper L1 to L8, layers of copper L8 is outer layer, after radium-shine windowing, between layers of copper L8 and layers of copper L7
The medium of the corresponding welding region for partly burying element is ablated, exposes layers of copper L7, and the copper foil surface of exposing needs smooth, no residue glue；Often
Rule windowing method is controlled depth milling, but controls deep depth tolerances and can only accomplish +/- 3mil, thus plate be situated between it is thick there was only 3mil, and copper foil compared with
Thin (1OZ), therefore conventional method is difficult to make, and is easy to appear L7 layers of copper foil milling of layers of copper and wears or have residue glue problem, is opened using radium-shine
Window has apparent advantage.
When radium-shine windowing, the corresponding welding region for partly burying element uses diameter to be arranged for the hole of 4mil in radium-shine formula
Column, set on the corresponding welding region edge for partly burying element hole hole center away from for 1mil, the welding of element is partly buried set on correspondence
The hole center in the hole inside region is away from for 2mil, i.e., the light beam in windowing using diameter 4mil carries out radium-shine, and open a window edge department
The comparatively dense of the radium-shine light beam distribution divided, so that edge portions are more smooth.Radium-shine parameter is set as 12 μm of pulsewidth, and hair number is 2
Hair, time are 25 μ s.
Particularly, the wiring board of 8mil is greater than for dielectric thickness, first carries out controlled depth milling in the welding region for partly burying element,
Radium-shine windowing is carried out again, when because being situated between thick too thick, radium-shine higher cost and parameter is not easily controlled.
C. sandblasting removes the carbon slag formed when radium-shine windowing；
D. change gold, the pad one formed when copper foil and outer layer that internal layer exposes are made assimilates gold；
E. it forms for the first time；The insertion region for corresponding to optical module chip in the circuit board is slotted using mechanical-moulded mode,
Bind pad pitch groove edge 7mil；Slot is reduced to the position of slot 3mil spacing for binding pad when production molding formula
Unilateral 4mil guarantees to bind the safe distance that pad has 7mil to groove edge when forming for the first time, avoids hurting when molding tying up
Determine pad.After first time forms, plate harmomegathus is measured, harmomegathus is more than to need stacking operation in 2mil or more between plate,
With radium-shine precision when guaranteeing to form for second.
F. it forms for second；The groove edge close to binding pad is cut using radium-shine mode, slot is cut away and ties up
Determine 4mil extra between pad so that the groove edge 3mil after binding pad pitch cutting.One piece of palm fibre of pad is needed below wiring board
Copper-clad plate after change, and wiring board being fixed in copper-clad plate using wrinkle adhesive tape prevents from radium-shine scattering to board.
It when carrying out second of molding, is preferentially cut using UV light, such as using the radium-shine cutting of CO2, is needed after the completion of cutting
Manual removal falls black carbon compound.
First time forming area 1, second of forming area 2, binding pad 3 as shown in Fig. 2, molding after manufactured optical module
PCB is as shown in Figure 3.In the design of optic module PCB, chip pin is to bind to weld with gold thread, for save the cost and prevents gold
Short-circuit between line, pad edge and trough rim spacing generally only have 3mil or so, and conventional groove milling method requires pad that need to have to slot
The safe distance of 7mil, even if using high-precision optical mold machine, it is also desirable to which minimum 5mil, the plate for such as making this type are qualified
Rate is lower, therefore in processing and forming, first when guaranteeing the safe distance of the binding pad for connecting chip pin and groove milling
Rough milled, reuse the mode that radium-shine partial cut carries out refine, substitute the molding mode of tradition machinery, then gong slot precision with
While adapting to product demand, processing cost is also below the mode for using radium-shine cutting completely.
Embodiments of the present invention above described embodiment only expresses, the description thereof is more specific and detailed, but can not
Therefore limitations on the scope of the patent of the present invention are interpreted as, as long as skill obtained in the form of equivalent substitutions or equivalent transformations
Art scheme should all fall in protection of the invention.
Claims (7)
1. a kind of optic module PCB production method, which is characterized in that comprising steps of
A. sawing sheet, internal layer circuit production, pressing, drilling, plating, outer layer production, anti-welding processing are carried out to wiring board；Outer layer production
When, the welding region of element is partly buried without copper sheet, landless；When outer layer makes, the pin setting binding of optical module chip is also corresponded to
Pad；
B. radium-shine windowing being carried out in the welding region for partly burying element, the copper of internal layer is exposed into medium ablation between outer layer and internal layer
Foil；
C. sandblasting removes the carbon slag formed when radium-shine windowing；
D. change gold, the pad one formed when copper foil and outer layer that internal layer exposes are made assimilates gold；
E. it forms for the first time；The insertion region for corresponding to optical module chip in the circuit board is slotted using mechanical-moulded mode, is bound
Pad pitch groove edge 7mil；
F. it forms for second；The groove edge close to binding pad is cut using radium-shine mode, so that binding pad pitch
Groove edge 3mil after cutting.
2. according to optic module PCB production method described in claim 1, it is characterised in that: corresponding in radium-shine formula when radium-shine windowing
The welding region for partly burying element uses diameter to be arranged for the hole of 4mil, set on the corresponding welding region edge for partly burying element
The hole center in hole is away from for 1mil, and the hole center in the hole inside the corresponding welding region for partly burying element is away from for 2mil.
3. according to optic module PCB production method described in claim 2, it is characterised in that: when radium-shine windowing, radium-shine parameter is set as
12 μm of pulsewidth, hair number is 2 hairs, and the time is 25 μ s.
4. according to optic module PCB production method described in claim 1, it is characterised in that: be greater than the line of 8mil for dielectric thickness
Road plate first carries out controlled depth milling in the welding region for partly burying element, then carries out radium-shine windowing.
5. according to optic module PCB production method described in claim 1, it is characterised in that: when carrying out second of molding, using UV
Laser cutting.
6. according to optic module PCB production method described in claim 1, it is characterised in that: when carrying out second of molding, wiring board
The copper-clad plate after one piece of brownification is padded in lower section, and wiring board is fixed in copper-clad plate using wrinkle adhesive tape.
7. according to optic module PCB production method described in claim 1, it is characterised in that: after first time forms, measurement plate rises
It contracts, harmomegathus is more than to need stacking operation in 2mil or more between plate, with radium-shine precision when guaranteeing to form for second.
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| CN201810609433.5A CN108566738B (en) | 2018-06-13 | 2018-06-13 | A kind of optic module PCB production method |
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| CN201810609433.5A CN108566738B (en) | 2018-06-13 | 2018-06-13 | A kind of optic module PCB production method |
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| CN108566738A CN108566738A (en) | 2018-09-21 |
| CN108566738B true CN108566738B (en) | 2019-07-16 |
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| CN111326640B (en) * | 2018-12-13 | 2022-08-09 | 同泰电子科技股份有限公司 | Method for forming window on light-emitting diode carrier plate |
| CN114189995A (en) * | 2021-12-02 | 2022-03-15 | 广州得尔塔影像技术有限公司 | Manufacturing method of circuit board and circuit board |
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| KR101089923B1 (en) * | 2009-12-01 | 2011-12-05 | 삼성전기주식회사 | Manufacturing method of printed circuit board |
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|---|---|---|---|---|
| CN103167735A (en) * | 2011-12-12 | 2013-06-19 | 深南电路有限公司 | Method for processing printed circuit board (PCB) with step-shaped groove and multilayer PCB |
| CN103298245A (en) * | 2013-06-14 | 2013-09-11 | 东莞生益电子有限公司 | Manufacture method for high-frequency circuit board and circuit board manufactured through method |
| CN103491706A (en) * | 2013-10-09 | 2014-01-01 | 东莞生益电子有限公司 | Method for manufacturing high-thermal-conductivity printed circuit board and printed circuit board |
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| CN105407646A (en) * | 2015-12-11 | 2016-03-16 | 深圳崇达多层线路板有限公司 | Process for improving residual copper of stepped groove |
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| CN108566738A (en) | 2018-09-21 |
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