CN114189995A - Manufacturing method of circuit board and circuit board - Google Patents
Manufacturing method of circuit board and circuit board Download PDFInfo
- Publication number
- CN114189995A CN114189995A CN202111462075.8A CN202111462075A CN114189995A CN 114189995 A CN114189995 A CN 114189995A CN 202111462075 A CN202111462075 A CN 202111462075A CN 114189995 A CN114189995 A CN 114189995A
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- CN
- China
- Prior art keywords
- plate body
- circuit board
- board
- manufacturing
- windowing
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 35
- 238000005520 cutting process Methods 0.000 claims abstract description 17
- 238000007731 hot pressing Methods 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 18
- 239000000463 material Substances 0.000 abstract description 4
- 206010070834 Sensitisation Diseases 0.000 abstract description 2
- 230000008313 sensitization Effects 0.000 abstract description 2
- 238000004017 vitrification Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a circuit board manufacturing method and a circuit board, wherein the circuit board manufacturing method comprises the following steps: manufacturing a board body of the circuit board; positioning the plate body; fixing a component on the plate body; and cutting the edge of the board body, and windowing the board body to obtain the circuit board. The edge at the cutting plate body to and carry out the stove operation with the plate body before windowing with the plate body, the overall structure of plate body this moment is comparatively complete, the overall structure intensity of plate body is stronger, when reacing macromolecular material's vitrification temperature, the whole plane degree of plate body changes lessly, the plane degree can reach below 30um, carry out the edge cutting again this moment and need cut the window cutting, the whole plane degree that can make the plate body like this is better, thereby will be littleer to sensitization chip's influence. In addition, the cost is not increased, and the cost performance is high.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a circuit board manufacturing method and a circuit board.
Background
In the related technology, the windowing process of the circuit board comprises the steps of completing windowing by laser cutting of corresponding board windowing areas after boards are stacked, then performing SMT furnace passing, and controlling the flatness of the windowed boards after the SMT furnace passing to be about 60 um.
However, the plate body has poor overall strength after windowing. Because the substrate is organic polymer material, self nature (have glass transition temperature (Tg value) can receive high temperature to influence and soften, and the whole plane degree of plate body can change after SMT, and the middle windowing of panel this moment, the panel at edge also is cut off, and whole substrate becomes few, can aggravate the plane degree change of the middle portion of windowing of plate body.
Because camera module requires highly to the plane degree of circuit board windowing part, and the circuit board back of windowing, the high temperature of crossing the stove through SMT can lead to windowing regional plane degree variation, is applied to the attached chip of camera module this moment, can reduce the whole reliability of attached back camera module of chip, and the limitation is stronger.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a manufacturing method of a circuit board, which can enable the whole flatness of the board body to be better, so that the influence on the photosensitive chip is smaller. In addition, the cost is not increased, and the cost performance is high.
The invention further provides a circuit board.
The manufacturing method of the circuit board comprises the following steps: manufacturing a board body of the circuit board; positioning the plate body; fixing a component on the plate body; and cutting the edge of the board body, and windowing the board body to obtain the circuit board.
According to the manufacturing method of the circuit board, the edge of the board body is cut, the board body is subjected to furnace operation before the board body is windowed, the overall structure of the board body is complete, the overall structure strength of the board body is high, the overall flatness of the board body changes little when the glass transition temperature of a high polymer material is reached, the flatness can reach below 30 mu m, and the edge cutting and windowing cutting are performed at the moment, so that the overall flatness of the board body is better, and the influence on a photosensitive chip is smaller. In addition, the cost is not increased, and the cost performance is high.
In some examples of the invention, the step of positioning the plate body comprises: arranging a positioning hole on the plate body; and fixing the position of the positioning hole.
In some examples of the present invention, the step of forming the positioning hole in the plate body includes: and the plate body is provided with a plurality of positioning holes.
In some examples of the present invention, the step of forming a plurality of positioning holes on the plate body includes: the plate body is provided with a plurality of first positioning holes and a plurality of second positioning holes, and the aperture of each first positioning hole is larger than that of each second positioning hole.
In some examples of the present invention, before the step of cutting the edge of the board body and windowing the board body to obtain the circuit board, the method further includes the following steps: and carrying out hot pressing on the windowing area of the plate body.
In some examples of the present invention, the step of hot-pressing the windowed area of the plate body comprises: the temperature of the hot pressing of the windowing region of the plate body is T, the time is T, and the T and the T satisfy the relation: t is more than or equal to 140 ℃ and less than or equal to 300 ℃, and T is more than or equal to 3s and less than or equal to 5 s.
In some examples of the present invention, the step of cutting the edge of the board body and windowing the board body to obtain the circuit board includes: the plate body is windowed and then the edge of the plate body is cut.
In some examples of the present invention, the step of manufacturing a board body of a circuit board includes: the manufactured plate body is a hard plate body, a flexible plate body or a soft and hard combined plate body.
In some examples of the present invention, the step of fixing the component on the board body includes: and mounting components on the board body by adopting an SMT (surface mount technology) mode.
The circuit board is manufactured by the manufacturing method of the circuit board.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a flow chart of a method of fabricating a circuit board according to an embodiment of the invention;
FIG. 2 is a flow chart showing the structure of a method for manufacturing a circuit board without hot pressing;
fig. 3 is a flow chart showing the structure of a method for manufacturing a circuit board when thermocompression is performed.
Reference numerals:
1. a circuit board;
10. a plate body; 20. a component; 30. positioning holes; 31. a first positioning hole; 32. and a second positioning hole.
Detailed Description
Embodiments of the present invention will be described in detail below, the embodiments described with reference to the drawings being illustrative, and the embodiments of the present invention will be described in detail below.
A method of manufacturing a circuit board 1 according to an embodiment of the present invention, by which the circuit board 1 is supported, is described below with reference to fig. 1 to 3.
As shown in fig. 1, the method for manufacturing a circuit board 1 according to the embodiment of the present invention includes the following steps:
and S1, manufacturing the board body 10 of the circuit board 1. That is, the board 10 for manufacturing the circuit board 1 is selected as required, the board 10 can be soldered with the component 20, and the manufacturing of the board 10 of the circuit board 1 can be limited in terms of the size, material, and the like of the circuit board 1 to be finally molded, for example: the overall size of the board body 10 needs to be larger than that of the finally formed circuit board 1 to a certain extent, so that the loss of the board body 10 in the manufacturing process can be avoided, and the required size of the circuit board 1 cannot be formed.
S2, positioning the plate body 10. The board body 10 is positioned, so that the component 20 can be conveniently fixed on the board body 10, and the problem that the board body 10 is unstable when the component 20 is fixed is avoided, so that the fixing position of the component 20 is inaccurate, the board body 10 is damaged, and the circuit board 1 fails to be manufactured.
S3, the component 20 is fixed to the board 10. As shown in fig. 2 and 3, after the board body 10 is positioned, the component 20 may be fixed on the board body 10, and of course, the component 20 needs to be pre-soldered on the board body 10, after all the components 20 are pre-soldered on the board body 10, the whole board body 10 with the pre-soldered component 20 needs to be subjected to furnace processing, that is, reflow soldering, and the component 20 pre-soldered on the board body 10 is more firmly connected to the board body 10 in a high temperature manner, so as to ensure the connection stability between the component 20 and the board body 10.
S4, cutting the edge of the board body 10, and windowing the board body 10, the circuit board 1 is obtained. As shown in fig. 2 and 3, after the board 10 passes through the furnace, the board 10 is subjected to final operation, that is, the board 10 is cut, and the excess portions of the board 10 are cut, so that the cut board 10 meets the required size of the circuit board 1, and the board 10 is windowed, that is, the copper foil is exposed outside the green oil layer at the place where welding or heat dissipation is required, so that the current-carrying capacity is increased, the thickness of the copper foil is increased, and the copper foil can be conveniently used as a welding point or a test point. Finally, the desired circuit board 1 is formed.
From this, at the edge of cutting plate body 10, and go on the stove operation with plate body 10 before windowing with plate body 10, the overall structure of plate body 10 is comparatively complete this moment, plate body 10's overall structure intensity is stronger, when reacing macromolecular material's glass transition temperature, plate body 10's whole plane degree changes lessly, the plane degree can reach below 30um, carry out the edge cutting again this moment and need window the cutting, the whole plane degree that can make plate body 10 like this is better, thereby the influence to sensitization chip will be littleer. In addition, the cost is not increased, and the cost performance is high.
As shown in fig. 2 and 3, step S2 includes: the plate body 10 is provided with a positioning hole 30, and then the position of the positioning hole 30 is fixed. That is, the positioning hole 30 is firstly formed on the board body, and then a component is found to be matched with the positioning hole 30, so as to fix the position of the positioning hole 30, thereby fixing the position of the board body 10, facilitating the subsequent pre-welding of the component 20 on the board body 10 more stably, and improving the success rate of the manufacturing of the circuit board 1. It should be noted that the position of the positioning hole 30 cannot be set at the position of the finally molded circuit board 1.
As shown in fig. 2 and 3, the step of forming the positioning hole 30 in the plate body 10 includes: the plate body 10 is provided with a plurality of positioning holes 30. Set up a plurality of locating holes 30, a plurality of locating holes 30 distribute in the different positions of plate body 10 in addition, can make plate body 10's fixed effect better like this, make plate body 10 fixed more stable to the effect is better when components and parts 20 are welded in advance, improves the success rate of circuit board 1 preparation.
Further, as shown in fig. 2 and 3, a plurality of first positioning holes 31 and a plurality of second positioning holes 32 are formed in the plate body 10, and the diameter of the first positioning holes 31 is larger than that of the second positioning holes 32. That is, the plurality of positioning holes 30 include a plurality of first positioning holes 31 and second positioning holes 32 having different diameters, so that it is more convenient to identify the position on the board 10, to fix the board 10, and to pre-weld the component 20 on the board 10.
According to an alternative embodiment of the present invention, as shown in fig. 1, before step S4, the method further includes the following steps:
s30, hot pressing the windowed area of the plate body 10. As shown in fig. 3, that is, the upper and lower hot pressing heads are pressed on the pre-windowing region, so that windowing is performed, the flatness of the board body 10 in the windowing region can be further improved, and the influence on the photosensitive chip is reduced.
Specifically, step S30 includes: the temperature of hot pressing the windowing area of the plate body 10 is T, the time is T, and T and T satisfy the relation: t is more than or equal to 140 ℃ and less than or equal to 300 ℃, and T is more than or equal to 3s and less than or equal to 5 s. The temperature of the hot pressing of the windowing region of the plate body 10 and the time of the hot pressing of the windowing region of the plate body 10 are reasonably set in the range, the hot pressing effect of the upper hot pressing head and the lower hot pressing head on the plate body 10 can be better, the situation that the hot pressing effect is not obvious due to too low hot pressing temperature and too short hot pressing time can be avoided, the situation that the hot pressing effect is excessive due to too high hot pressing temperature and too long hot pressing time can also be avoided, and the damage to the plate body 10 is caused.
Further, step S4 includes: the plate body 10 is windowed and then the edge of the plate body 10 is cut. Set up comparatively rationally like this, window plate body 10 earlier, can confirm the position and the size of windowing earlier, after windowing to plate body 10, can confirm circuit board 1's basic dimension and structure, then according to final circuit board 1's dimensional requirement, cut the edge of plate body 10 again, set up like this moreover, can avoid at the in-process at the edge of cutting plate body 10, plate body 10 stress concentration to cause plate body 10 to damage.
In addition, step S1 includes: the manufactured plate body 10 is a hard plate body 10, a flexible plate body 10 or a soft and hard combined plate body 10. On the premise that the plate body 10 is not deformed after passing through the furnace, the plate body 10 can be made of a hard plate body 10, a flexible plate body 10 or a rigid-flexible plate body 10, so that the requirements of different circuit boards 1 can be met, and the circuit boards 1 can be selected according to actual requirements in the manufacturing process.
Optionally, step S3 includes: the components 20 are Mounted on the board 10 by SMT (Surface Mounted Technology). SMT technique packing density is high, the finished product is small, light in weight, adopts SMT's mode to paste dress components and parts 20 back on plate body 10, can reduce circuit board 1's volume and weight, adopts SMT's mode moreover, can make components and parts 20 connect on plate body 10 more steadily, in addition, is convenient for like this also realize the automation, improves production efficiency, reduces the cost of manufacture.
As shown in fig. 2 and 3, the circuit board 1 according to the embodiment of the present invention is manufactured by the manufacturing method of the circuit board 1 according to the above embodiment.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.
In the description of the present invention, "the first feature" and "the second feature" may include one or more of the features. In the description of the present invention, "a plurality" means two or more. In the description of the present invention, the first feature being "on" or "under" the second feature may include the first and second features being in direct contact, and may also include the first and second features being in contact with each other not directly but through another feature therebetween. In the description of the invention, "above", "over" and "above" a first feature in a second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is higher in level than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. The manufacturing method of the circuit board is characterized by comprising the following steps:
manufacturing a board body of the circuit board;
positioning the plate body;
fixing a component on the plate body;
and cutting the edge of the board body, and windowing the board body to obtain the circuit board.
2. The method for manufacturing a circuit board according to claim 1, wherein the step of positioning the board body comprises:
arranging a positioning hole on the plate body;
and fixing the position of the positioning hole.
3. The method for manufacturing a circuit board according to claim 2, wherein the step of forming the positioning hole in the board body includes:
and the plate body is provided with a plurality of positioning holes.
4. The method as claimed in claim 3, wherein the step of forming the plurality of positioning holes on the board body comprises:
the plate body is provided with a plurality of first positioning holes and a plurality of second positioning holes, and the aperture of each first positioning hole is larger than that of each second positioning hole.
5. The method for manufacturing a circuit board according to claim 1, wherein before the steps of cutting the edge of the board body and windowing the board body to obtain the circuit board, the method further comprises the following steps:
and carrying out hot pressing on the windowing area of the plate body.
6. The method as claimed in claim 5, wherein the step of hot pressing the windowed area of the board body comprises:
the temperature of the hot pressing of the windowing region of the plate body is T, the time is T, and the T and the T satisfy the relation: t is more than or equal to 140 ℃ and less than or equal to 300 ℃, and T is more than or equal to 3s and less than or equal to 5 s.
7. The method of claim 5, wherein the step of cutting the edge of the board body and windowing the board body to obtain the circuit board comprises:
the plate body is windowed and then the edge of the plate body is cut.
8. The method for manufacturing a circuit board according to claim 1, wherein the step of manufacturing the board body of the circuit board comprises:
the manufactured plate body is a hard plate body, a flexible plate body or a soft and hard combined plate body.
9. The method for manufacturing a circuit board according to claim 1, wherein the step of fixing the component on the board body comprises:
and mounting components on the board body by adopting an SMT (surface mount technology) mode.
10. A circuit board manufactured by the method for manufacturing a circuit board according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111462075.8A CN114189995A (en) | 2021-12-02 | 2021-12-02 | Manufacturing method of circuit board and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111462075.8A CN114189995A (en) | 2021-12-02 | 2021-12-02 | Manufacturing method of circuit board and circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114189995A true CN114189995A (en) | 2022-03-15 |
Family
ID=80542045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111462075.8A Pending CN114189995A (en) | 2021-12-02 | 2021-12-02 | Manufacturing method of circuit board and circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114189995A (en) |
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|---|---|---|---|---|
| JP2000138258A (en) * | 1998-10-30 | 2000-05-16 | Toshiba Corp | Manufacture of semiconductor device |
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| KR20050029904A (en) * | 2003-09-24 | 2005-03-29 | (주)엑큐리스 | Manufacturing method of rigid-flex pcb |
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2021
- 2021-12-02 CN CN202111462075.8A patent/CN114189995A/en active Pending
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