CN108565546A - The method of antenna and the glass back cover with antenna are made in glass back cover - Google Patents
The method of antenna and the glass back cover with antenna are made in glass back cover Download PDFInfo
- Publication number
- CN108565546A CN108565546A CN201611135656.XA CN201611135656A CN108565546A CN 108565546 A CN108565546 A CN 108565546A CN 201611135656 A CN201611135656 A CN 201611135656A CN 108565546 A CN108565546 A CN 108565546A
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- Prior art keywords
- antenna
- back cover
- layer
- glass back
- glass
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/10—Glass or silica
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/18—Metallic material, boron or silicon on other inorganic substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
Abstract
A method of it making antenna in glass back cover, belongs to electronic device field, including:Conductive membrane layer is portrayed as antenna loop using photoetching lithographic, antenna loop is covered with insulating coating by the sputter insulation material layer on the protection ink layer of glass back cover, the sputter at least layer of conductive film layer on insulation material layer.This method uses sputter conductive membrane layer, then is portrayed as the mode of antenna loop, successfully realizes and is integrated with antenna function in glass back cover, accurate Drawing can be carried out to antenna loop using this method, compared to traditional printing technology, the dimensional accuracy higher of antenna.Meanwhile the technique is not limited by glass back cover shape, can realize that the antenna setting on plane, cambered surface, four side curved surfaces, bilateral curved surface, application surface are extremely wide.The present invention also provides a kind of glass back covers with antenna, and the above method is used to be integrated with antenna function in glass back cover, have the characteristics that more frivolous, communication effect is more preferable and shape is rich and changeful.
Description
Technical field
The present invention relates to electronic device field, in particular to a kind of method making antenna in glass back cover with
And the glass back cover with antenna.
Background technology
Antenna Design occupies critically important status in the design of end product, is the extremely important of influence consumer experience
Part, conventional antenna structure has stent-type and sticking type.Stent-type antenna is by plastic stent and sheet metal (radiator) group
At sheet metal is fixed with plastic stent using hot melting way, and plastics often use ABS and PC materials, metal often to use copper facing, phosphor-copper, no
Become rusty the materials such as steel disc, and to add two PIN on mainboard, of high cost;Sticking type antenna attaches sheet metal (radiator)
On product dorsal shield, fixed form generally uses hot melt structure, can also use gum connection type.
In the prior art, it is covered after antenna being integrated into, is the trend developed in the industry to make equipment more lightening.
Currently used metal shell will produce electromagnetic shielding, can for the communication quality of the new mechanics of communication such as 4G, 5G, NFC, WIFI
It has an impact, so current metal center, rear cover are typically necessary isolation multistage and could ensure signal of communication.Therefore, existing
The rear cover for being integrated with antenna it is often complicated, cost is relatively high.In comparison, if using a kind of technology antenna gold
Belong to the problem of piece (radiator) is directly made in glass back cover, just can solve electromagnetic shielding, simultaneously so that product becomes
It is more frivolous, also can simple flow, reduce cost.In the prior art, have and integrated in glass back cover by way of printing
Antenna, but this method is only suitable for flat glass rear cover, and now increasingly universal curved surface rear cover is difficult to complete antenna
Installation, and the antenna size precision that this method is made is still to be improved.
Invention content
The purpose of the present invention is to provide a kind of methods that antenna is made in glass back cover, can be widely applied for now
All kinds of planes on the market and bend glass rear cover, realization is antenna integrated in glass back cover, and this method is simple to operate,
Obtained antenna size precision height, signal is more stable.
Another object of the present invention is to provide a kind of glass back covers with antenna, the above method are used, in glass
After cover and realize antenna function, it is more frivolous, signal is more stable.
What the embodiment of the present invention was realized in:
A method of making antenna in glass back cover, including:Sputter insulate on the protection ink layer of glass back cover
Material layer.The sputter at least layer of conductive film layer on insulation material layer.Conductive membrane layer is portrayed all day long using photoetching lithographic
Line loop.Antenna loop is covered with insulating coating.
A kind of glass back cover with antenna is made using the above-mentioned method for making antenna in glass back cover.
The advantageous effect of the embodiment of the present invention is:A kind of side making antenna in glass back cover provided by the present invention
Method using sputter conductive membrane layer, then is portrayed as the mode of antenna loop, successfully realizes and be integrated with antenna work(in glass back cover
Can, accurate Drawing can be carried out to antenna loop using this method, compared to traditional printing technology, the dimensional accuracy of antenna is more
It is high.Meanwhile the technique is not limited by glass back cover shape, can be realized on plane, cambered surface, four side curved surfaces, bilateral curved surface
Antenna is arranged, and application surface is extremely wide.The present invention also provides a kind of glass back covers with antenna, and the above method is used to exist
It is integrated with antenna function in glass back cover, it is more frivolous, communication effect is more preferable, and shape is rich and changeful.
Description of the drawings
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached
Figure is briefly described, it should be understood that the following drawings illustrates only certain embodiments of the present invention, therefore is not construed as pair
The restriction of range for those of ordinary skill in the art without creative efforts, can also be according to this
A little attached drawings obtain other relevant attached drawings.
A kind of stacking order schematic diagram for glass back cover with antenna that Fig. 1 is provided by the embodiment of the present invention.
Icon:100- has the glass back cover of antenna;110- element glass substrates;120- protects ink layer;130- insulation materials
The bed of material;140- conductive membrane layers;150- insulating coatings.
Specific implementation mode
It in order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below will be in the embodiment of the present invention
Technical solution be clearly and completely described.The person that is not specified actual conditions in embodiment, builds according to normal condition or manufacturer
The condition of view carries out.Reagents or instruments used without specified manufacturer is the conventional production that can be obtained by commercially available purchase
Product.
Below to a kind of method making antenna in glass back cover of the embodiment of the present invention and a kind of with antenna
Glass back cover is specifically described.
A method of it making antenna in glass back cover, includes the following steps:
S1. the sputter insulation material layer on the protection ink layer of glass back cover.
Further, in the other preferred embodiments of the present invention, the thickness of insulation material layer is 10~100nm, is preferably adopted
Use SiO2Material.Insulation material layer can fill and lead up the tiny pit-hole in protection ink layer, so as to improve conductive membrane layer and protection
Adhesive force between ink makes the two that can combine closely.Meanwhile insulation material layer can play the role of insulation.
The plated film of insulation material layer is preferably by the way of magnetic control sputtering plating.Magnetic control sputtering plating technology has " low temperature " and " high speed "
The characteristics of, plated film is efficient.In the other preferred embodiments of the present invention, the sputter temperature of insulation material layer is preferably 100~150
DEG C, best sputter effect can be obtained on protection ink layer within this temperature range, obtained insulation material layer has essence
Degree height, hard and fine and close feature.
Wherein, glass back cover obtains after being strengthened by element glass substrate, and the shape of element glass substrate can be as needed
The element glass substrate of plane 2D, cambered surface 2.5D, curved surface 3D are selected, specific schedule of reinforcement can be can also be of physical strengthening
It learns and strengthens, it is preferred to use chemical strengthening, detailed process are:Glass is placed in the KNO of melting3In fused salt, make element glass substrate
Smaller ion (the Na of surface layer radius+) with the larger ion (K of radius in fused salt+) swap, finally the two of element glass substrate
Surface forms compressive stress layer, forms tensile stress layer in the inside of element glass substrate, reaches and improve glass machinery intensity and resisting temperature
The purpose of impact property.Further, the temperature for controlling reinforcement process is 350~450 DEG C, and maintains 3~5h times, in the work
Under the conditions of skill so that the surface stress value of element glass substrate is more than 600MPa, and stress layer depth is more than 20 μm, there is enough intensity
To adapt to demand of each electronic product to rear cover intensity.
Further, coating protection ink layer is also needed to for the element glass substrate after above-mentioned reinforcing, protects ink layer
It is coated on element glass substrate by the way of printing or spraying, can be one layer or multilayer.Preferably, temperature be 20~
40 DEG C, pressure is to coat protection ink layer by the way of spraying under 0.1~1MPa.Further, the color of ink can be
The thickness of black, white, gold etc., every layer of protection ink layer is 3~10 μm.Meanwhile it being obtained after being coated with protection ink layer
The optical density (OD) OD values of glass back cover are more than 3.0.The glass back cover obtained after coating protection ink on element glass substrate, surface
Gloss is uniform, is suitble to that it is further processed.
It is provided by the present invention it is a kind of in glass back cover make antenna method further include:S2. on insulation material layer
Sputter at least layer of conductive film layer.
Further, the plated film of conductive membrane layer is preferably made by the way of magnetic control sputtering plating, to be efficiently obtained quality
Uniformly, the conductive membrane layer of high-precision, high intensity.In the other preferred embodiments of the present invention, the sputter temperature of conductive membrane layer
Preferably 70~120 DEG C, best sputter effect can be obtained within this temperature range.
The material of conductive membrane layer can select single metal or different color and lusters are presented according to quality proportioning as needed
Alloy, the copper that electric conductivity can be selected excellent, gold, aluminium, corronil etc..In the preferred embodiment, it provides
A kind of more metal layer conductive membrane layer structures, are successively splashed on the protection ink layer of glass back cover using the sequence of molybdenum/aluminium/molybdenum
Plating film forming, wherein the molybdenum film of first layer is in direct contact with protection ink layer, for improving between glass cover-plate and aluminium film
The aluminium film of adhesive force, the second layer brings excellent electric conductivity to entire conductive membrane layer, and the molybdenum film of third layer then can
Protect aluminium film not oxidized, entire conductive membrane layer shows the mirror effect of bright silver.
Further, the sheet resistance of entire conductive membrane layer is 0.1~1 Ω/, to ensure the conduction of entire conductive membrane layer
Performance, to ensure that the signal strength for the antenna being made is stablized.
It is provided by the present invention it is a kind of in glass back cover make antenna method further include:S3. conductive membrane layer is adopted
It is portrayed as antenna loop with photoetching lithographic.
Further, antenna loop does not have fixed shape need, can be according to sShape features or other factors come voluntarily
It is designed to the shape needed.Preferably, antenna loop is portrayed using photoetching lithographic techniques, and photoetching lithographic techniques are generally used for
IC, touch screen, the making of display comprising coating photoresist, pre-baked, exposure, development, solid roasting, etching and stripping and etc..Into
One step, it is coated with the photoresist that photoresist selects range of viscosities in 10~150cps, and pre-baked 2~10min at 80~130 DEG C.With
Afterwards, it is exposed development under the exposure intensity of 150~350mJ, is developed at 20~30 DEG C and carries out, developing powder is controlled 1
~2m/min.2~10min of baking at 100~150 DEG C is moved to after development, and is etched at 35~45 DEG C, etching speed
Degree control is in 4~6m/min.After the completion of etching, stripping is carried out at 45~65 DEG C, stripping speed control is in 2~4m/min.
Photoetching is carried out under this condition, and precision can reach ± 0.005mm, to obtain dimensionally stable, high-precision antenna loop.
It is provided by the present invention it is a kind of in glass back cover make antenna method further include:S4. by antenna loop with absolutely
Edge coating covers.
Further, the mode of sputter or spraying may be used in the setting of insulating coating.Further, insulating coating can be with
Glass back cover there is into being completely covered or selectively only covering the part of antenna loop on one side for antenna loop.Absolutely
Edge coating can prevent conductive membrane layer exposure from being aoxidized in air, to influence the resistance of antenna.Preferably, insulating coating
Thickness be 1~10 μm, while realizing isolation effect, do not influence the frivolous property of entire glass back cover as possible.
A kind of glass back cover 100 with antenna uses the above-mentioned method for making antenna in glass back cover to be made.
The stacking order schematic diagram of the glass back cover 100 with antenna is as shown in Figure 1, include:Element glass substrate 110,
Protection ink layer 120 is coated on element glass substrate 110;Sputter has insulation material layer 130 on protection ink layer 120;
Sputter has conductive membrane layer 140 on insulation material layer 130;Conductive membrane layer 140 to form the antenna loop of setting by portraying;
Insulating coating 150 is coated on antenna loop.
The feature and performance of the present invention are described in further detail with reference to embodiments.
Embodiment 1
The plane 2D glass back covers with antenna that the present embodiment provides a kind of, are made by following steps.
S1. the sputter insulation material layer on the protection ink layer of glass back cover.
One layer of SiO of magnetic control sputtering plating on the protection ink layer of plane 2D glass back covers2Insulation material layer, the control of sputter temperature
At 120~130 DEG C, the thickness control of insulation material layer is in 10~100nm.
S2. the sputter at least layer of conductive film layer on insulation material layer.
The first molybdenum film of magnetic control sputtering plating, aluminium film and the second molybdenum film successively on insulation material layer, wherein the first molybdenum is thin
The thickness of film and the second molybdenum film is 50nm, and aluminium film thickness is 200nm, and the temperature of magnetic control sputtering plating is controlled at 120 DEG C.
S3. conductive membrane layer is portrayed as antenna loop.
Using photoetching lithographic techniques, above-mentioned conductive membrane layer is portrayed as antenna loop.It is coated with photoresist and selects range of viscosities
In the photoresist of 120cps, and the pre-baked 8min at 120 DEG C.Then, it is exposed development under the exposure intensity of 200mJ, develops
It is carried out at 25 DEG C, developing powder is controlled in 2m/min.Moved to after development at 150 DEG C and toast 2min, and at 40 DEG C into
Row etching, etching speed are controlled in 5m/min.After the completion of etching, stripping is carried out at 50 DEG C, stripping speed control is in 3m/min.
S4. antenna loop is covered with insulating coating.
Glass back cover has to the one side whole face spray insulation coating of antenna loop, the thickness control of insulating coating 1~
10μm。
Embodiment 2
The cambered surface 2.5D glass back covers with antenna that the present embodiment provides a kind of, are made by following steps.
S1. the sputter insulation material layer on the protection ink layer of glass back cover.
One layer of SiO of magnetic control sputtering plating on the protection ink layer of cambered surface 2.5D glass back covers2Insulation material layer, sputter temperature control
System is at 100~110 DEG C, and the thickness control of insulation material layer is in 10~100nm.
S2. the sputter at least layer of conductive film layer on insulation material layer.
The first molybdenum film of magnetic control sputtering plating, aluminium film and the second molybdenum film successively on insulation material layer, wherein the first molybdenum is thin
The thickness of film and the second molybdenum film is 50nm, and aluminium film thickness is 200nm, and the temperature of magnetic control sputtering plating is controlled at 100 DEG C.
S3. conductive membrane layer is portrayed as antenna loop.
Using photoetching lithographic techniques, above-mentioned conductive membrane layer is portrayed as antenna loop.It is coated with photoresist and selects range of viscosities
In the photoresist of 150cps, and the pre-baked 10min at 130 DEG C.Then, it is exposed development under the exposure intensity of 350mJ, develops
It is carried out at 20 DEG C, developing powder is controlled in 1m/min.Moved to after development at 120 DEG C and toast 5min, and at 35 DEG C into
Row etching, etching speed are controlled in 6m/min.After the completion of etching, stripping is carried out at 50 DEG C, stripping speed control is in 4m/min.
S4. antenna loop is covered with insulating coating.
Glass back cover has to the one side whole face spray insulation coating of antenna loop, the thickness control of insulating coating 1~
10μm。
Embodiment 3
The four side curved surface 3D glass back covers with antenna that the present embodiment provides a kind of, are made by following steps.
S1. the sputter insulation material layer on the protection ink layer of glass back cover.
One layer of SiO of magnetic control sputtering plating on the protection ink layer of four side curved surface 3D glass back covers2Insulation material layer, sputter temperature
Control is at 110~120 DEG C, and the thickness control of insulation material layer is in 10~100nm.
S2. the sputter at least layer of conductive film layer on insulation material layer.
Magnetic control sputtering plating a layer thickness is the Copper thin film of 200nm, the temperature control of magnetic control sputtering plating successively on insulation material layer
At 120 DEG C.
S3. conductive membrane layer is portrayed as antenna loop.
Using photoetching lithographic techniques, above-mentioned conductive membrane layer is portrayed as antenna loop.It is coated with photoresist and selects range of viscosities
In the photoresist of 30cps, and the pre-baked 2min at 80 DEG C.Then, it is exposed development under the exposure intensity of 150mJ, is developed in
It is carried out at 30 DEG C, developing powder is controlled in 2m/min.It is moved to after development at 100 DEG C and toasts 5min, and carried out at 45 DEG C
Etching, etching speed are controlled in 4m/min.After the completion of etching, stripping is carried out at 45 DEG C, stripping speed control is in 2m/min.
S4. antenna loop is covered with insulating coating.
Glass back cover has to the one side whole face spray insulation coating of antenna loop, the thickness control of insulating coating 1~
10μm。
Embodiment 4
The present embodiment provides a kind of bilateral curved surface 3D glass back covers with antenna, are made by following steps.
S1. the sputter insulation material layer on the protection ink layer of glass back cover.
One layer of SiO of magnetic control sputtering plating on the protection ink layer of bilateral curved surface 3D glass back covers2Insulation material layer, sputter temperature
Control is at 120~130 DEG C, and the thickness control of insulation material layer is in 10~100nm.
S2. the sputter at least layer of conductive film layer on insulation material layer.
Magnetic control sputtering plating a layer thickness is the corronil film of 200nm, the temperature of magnetic control sputtering plating successively on insulation material layer
Degree control is at 70 DEG C.
S3. conductive membrane layer is portrayed as antenna loop.
Using photoetching lithographic techniques, above-mentioned conductive membrane layer is portrayed as antenna loop.It is coated with photoresist and selects range of viscosities
In the photoresist of 10cps, and the pre-baked 5min at 80 DEG C.Then, it is exposed development under the exposure intensity of 220mJ, is developed in
It is carried out at 20 DEG C, developing powder is controlled in 1m/min.It is moved to after development at 130 DEG C and toasts 2min, and carried out at 45 DEG C
Etching, etching speed are controlled in 6m/min.After the completion of etching, stripping is carried out at 65 DEG C, stripping speed control is in 4m/min.
S4. antenna loop is covered with insulating coating.
Glass back cover has to the one side whole face spray insulation coating of antenna loop, the thickness control of insulating coating 1~
10μm。
In conclusion a kind of method making antenna in glass back cover provided by the present invention, using sputter conductive thin
Film layer, then it is portrayed as the mode of antenna loop, it successfully realizes of different shapes in plane, cambered surface, bilateral curved surface, four side curved surfaces etc.
It is integrated with antenna function in glass back cover, accurate Drawing can be carried out to antenna loop using this method, precision can reach ±
0.005mm, compared to traditional printing technology, the dimensional accuracy higher of antenna.The present invention also provides a kind of with antenna
Glass back cover uses the above method to be integrated with antenna function in glass back cover, more frivolous, communication effect is more preferable, and shape
Shape is rich and changeful.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, any made by repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of method making antenna in glass back cover, which is characterized in that including:On the protection ink layer of glass back cover
Sputter insulation material layer;Sputter at least layer of conductive film layer over which layer of insulating material;The conductive membrane layer is used
Photoetching lithographic is portrayed as antenna loop;The antenna loop is covered with insulating coating.
2. the method according to claim 1 for making antenna in glass back cover, which is characterized in that in 100~150 DEG C
Under, the insulation material layer described in magnetic control sputtering plating on the protection ink layer.
3. the method according to claim 2 for making antenna in glass back cover, which is characterized in that the insulation material layer
Material be SiO2, the thickness of the insulation material layer is 10~100nm.
4. the method according to claim 1 for making antenna in glass back cover, which is characterized in that at 70~120 DEG C,
Conductive membrane layer described in magnetic control sputtering plating over which layer of insulating material.
5. the method according to claim 4 for making antenna in glass back cover, which is characterized in that the conductive membrane layer
For metallic film or alloy firm.
6. the method according to claim 4 for making antenna in glass back cover, which is characterized in that the conductive membrane layer
Sheet resistance be 0.1~1 Ω/.
7. the method according to claim 1 for making antenna in glass back cover, which is characterized in that the glass back cover
Preparation method includes:Element glass substrate is physically or chemically strengthened;It is printed on the element glass substrate after reinforcing
Brush or at least one layer of protection ink layer of spraying.
8. the method according to claim 7 for making antenna in glass back cover, which is characterized in that at 350~450 DEG C
Chemical strengthening is carried out to the element glass substrate, enhanced time is 3~5h.
9. the method according to claim 8 for making antenna in glass back cover, which is characterized in that the element after reinforcing
The surface stress value of glass substrate is more than 600MPa, and stress layer depth is more than 20 μm.
10. a kind of glass back cover with antenna, which is characterized in that using if claim 1~9 any one of them is in glass
The method for making antenna is covered afterwards to be made.
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CN203799350U (en) * | 2014-04-18 | 2014-08-27 | 宸鸿科技(厦门)有限公司 | Touch panel |
CN205355245U (en) * | 2015-12-14 | 2016-06-29 | 东莞华清光学科技有限公司 | Lid printed antenna behind cell -phone glass |
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