CN108562988B - 一种用于金属光学薄膜的孤立导体处理结构 - Google Patents

一种用于金属光学薄膜的孤立导体处理结构 Download PDF

Info

Publication number
CN108562988B
CN108562988B CN201810598249.5A CN201810598249A CN108562988B CN 108562988 B CN108562988 B CN 108562988B CN 201810598249 A CN201810598249 A CN 201810598249A CN 108562988 B CN108562988 B CN 108562988B
Authority
CN
China
Prior art keywords
metal
elastic
optical
optical device
isolated conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201810598249.5A
Other languages
English (en)
Other versions
CN108562988A (zh
Inventor
宋崇金
席红霞
曲海波
陈丽
安俊洁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Institute of Technical Physics of CAS
Original Assignee
Shanghai Institute of Technical Physics of CAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Institute of Technical Physics of CAS filed Critical Shanghai Institute of Technical Physics of CAS
Priority to CN201810598249.5A priority Critical patent/CN108562988B/zh
Publication of CN108562988A publication Critical patent/CN108562988A/zh
Application granted granted Critical
Publication of CN108562988B publication Critical patent/CN108562988B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/15—Pins, blades or sockets having separate spring member for producing or increasing contact pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Light Guides In General And Applications Therefor (AREA)

Abstract

本发明公开了一种用于金属光学薄膜的孤立导体处理结构。即在光学器件安装槽的四个角处设计圆形缺口，圆形缺口中心有金属立柱，将弹性金属薄片沿着金属机座圆形缺口和金属立柱之间的缝隙放入，弹性金属薄片的两端依靠弹性变形恢复力紧贴在事先用硅橡胶固定的光学器件的金属光学薄膜上，在金属机座的圆形缺口和金属立柱之间的缝隙内点加导电胶将金属机座和弹性金属薄片固定在一起。本发明的优点在于结构导通接触良好，操作方便，弹性金属薄片表面进行抛光处理且柔性接触对光学元器件无损伤。

Description

一种用于金属光学薄膜的孤立导体处理结构
技术领域：
本发明涉及到所有航天领域的孤立导体处理问题。具体是指镀有金属光学薄膜的光学元器件的孤立导体处理。
背景技术：
任何一个航天器甚至航天器上的一个单机都是一种光机电集成的系统。光学器件主要是由镀有金属导电薄膜的光学元器件组成。大部分光学元器件是通过硅橡胶粘接在金属机座上，从而形成孤立导体，当空间环境发生剧烈变化，航天器会遭到高密度、高温度的等离子体进而充电到很低的负电位，会引起孤立导体表面静电放电，对电子元器件造成很大的损伤。因此孤立导体的处理在航空航天领域尤其重要，传统的孤立导体处理方法是运用导电胶直接将光学元器件表面的金属导电薄膜与金属机壳地连接导通，导电胶直接与光学元器件表面接触会引起光学元器件产生内应力，会影响单机的成像质量或精度。此外光学元器件一般是以石英为基体材料，表面也无法进行焊接操作，因此针对光学类元器件的孤立导体的处理难度较大。
发明内容
为解决上述问题，本发明提出了一种用于金属光学薄膜的孤立导体处理结构，金属机座1的安装槽的四个角处设计圆形缺口，圆形缺口中心有金属立柱5，先将光学器件2安放在金属机座1安装槽内，在光学器件2和金属机座1的安装槽之间的缝隙内点硅橡胶3将光学器件2固定，然后再将弹性金属薄片4沿着金属机座1圆形缺口和金属立柱5之间的缝隙放入，并在圆形缺口和金属立柱5之间点导电胶将弹性金属薄片4固定，弹性金属薄片4的两端在弹性恢复力的作用下紧贴在光学器件2表面的金属导电薄膜上。
优点；导通接触良好，操作方便，弹性金属薄片表面进行抛光处理且柔性接触对光学元器件无损伤。
附图说明：
图1为一种用于金属光学薄膜的孤立导体处理结构。
具体实施方式：
如图1所示是一种用于金属光学薄膜的孤立导体处理结构，1为金属机座，2为光学器件，3为硅橡胶，4为弹性金属薄片，5为金属立柱。光学器件2的顶面和侧面均镀有金属光学薄膜，装配时将光学器件2安装在金属机座1的安装槽内，在金属机座1和光学器件2之间缝隙内涂硅橡胶3。硅橡胶3凝固后金属机座1与光学器件2上的金属导电薄膜绝缘而形成孤立导体，此时将弹性金属薄片4沿着金属机座1圆形缺口和金属立柱5之间的缝隙放入，弹性金属薄片4的两端在弹性变形恢复力的作用下紧贴在光学器件2的金属光学薄膜上，再在金属机座1的圆形缺口和金属立柱5之间的缝隙内点导电胶，将弹性金属薄片4固定，等导电胶完全凝固后再在导电胶表面点硅橡胶完全固定。

Claims (1)

1.一种用于金属光学薄膜的孤立导体处理结构，其特征在于：
光学器件(2)的安装槽的四个角处设计圆形缺口，圆形缺口中心有金属立柱(5)，将弹性金属薄片(4)沿着金属机座(1)圆形缺口和金属立柱(5)之间的缝隙放入，弹性金属薄片(4)的两端依靠弹性变形恢复力紧贴在事先用硅橡胶(3)固定的光学器件(2)的金属光学薄膜上，在金属机座(1)的圆形缺口和金属立柱(5)之间的缝隙内点加导电胶将金属机座(1)和弹性金属薄片(4)固定在一起，弹性金属薄片(4)经过抛光处理用于防止划伤光学器件表面的金属光学薄膜。
CN201810598249.5A 2018-06-12 2018-06-12 一种用于金属光学薄膜的孤立导体处理结构 Active CN108562988B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810598249.5A CN108562988B (zh) 2018-06-12 2018-06-12 一种用于金属光学薄膜的孤立导体处理结构

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810598249.5A CN108562988B (zh) 2018-06-12 2018-06-12 一种用于金属光学薄膜的孤立导体处理结构

Publications (2)

Publication Number Publication Date
CN108562988A CN108562988A (zh) 2018-09-21
CN108562988B true CN108562988B (zh) 2023-09-08

Family

ID=63553385

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810598249.5A Active CN108562988B (zh) 2018-06-12 2018-06-12 一种用于金属光学薄膜的孤立导体处理结构

Country Status (1)

Country Link
CN (1) CN108562988B (zh)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1574888A1 (en) * 2004-03-10 2005-09-14 Fujitsu Limited Optical module, manufacturing method therefor, protective component for a light guide, and protective component having electric wiring
CN101227787A (zh) * 2008-02-18 2008-07-23 深圳华为通信技术有限公司 防静电的电子设备及其防静电方法
CN102099731A (zh) * 2008-05-30 2011-06-15 3M创新有限公司 悬挂式光学膜
CN102334058A (zh) * 2011-07-20 2012-01-25 香港应用科技研究院有限公司 用于小型成像装置的磁体结构
CN208224570U (zh) * 2018-06-12 2018-12-11 中国科学院上海技术物理研究所 用于金属光学薄膜的孤立导体处理结构

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007033688A (ja) * 2005-07-25 2007-02-08 Fuji Xerox Co Ltd 光導波路フィルム、及び光送受信モジュール

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1574888A1 (en) * 2004-03-10 2005-09-14 Fujitsu Limited Optical module, manufacturing method therefor, protective component for a light guide, and protective component having electric wiring
CN101227787A (zh) * 2008-02-18 2008-07-23 深圳华为通信技术有限公司 防静电的电子设备及其防静电方法
CN102099731A (zh) * 2008-05-30 2011-06-15 3M创新有限公司 悬挂式光学膜
CN102334058A (zh) * 2011-07-20 2012-01-25 香港应用科技研究院有限公司 用于小型成像装置的磁体结构
CN208224570U (zh) * 2018-06-12 2018-12-11 中国科学院上海技术物理研究所 用于金属光学薄膜的孤立导体处理结构

Also Published As

Publication number Publication date
CN108562988A (zh) 2018-09-21

Similar Documents

Publication Publication Date Title
US20210134755A1 (en) Chip transfer method, display device, chip and target substrate
US8454851B2 (en) Manufacturing method of the flexible display device
KR100586928B1 (ko) 진공시스템에서의 기판홀딩장치와 이를 이용한 기판 척킹및 디척킹장치
JP6503323B2 (ja) 低背の電力およびデータ接点
KR101145756B1 (ko) 고무 점착식 척킹기구 및 이를 이용한 기판 합착장치
WO2020119489A1 (zh) 一种电子设备的组装方法及其电子设备
KR20190053714A (ko) 정전척 제조방법 및 정전척
US20150228529A1 (en) Clamping mechanism for processing of a substrate within a substrate carrier
JP2017027974A (ja) 吸着プレート、半導体装置の試験装置および半導体装置の試験方法
US9257316B2 (en) Semiconductor testing jig and transfer jig for the same
WO2013122089A1 (ja) ウェーハ保持具
CN108562988B (zh) 一种用于金属光学薄膜的孤立导体处理结构
US20100230469A1 (en) Conductive ball mounting apparatus and conductive ball mounting method
KR101361819B1 (ko) 패턴 형성용 기판 홀딩 어셈블리 및 이를 구비하는 유기 박막 증착 장치
CN208224570U (zh) 用于金属光学薄膜的孤立导体处理结构
US8363377B2 (en) Electrostatic chuck and apparatus having the same
CN111028680B (zh) 用于插入柔性印刷电路板的装置及其方法
TWI666683B (zh) 精密零組件用的保持夾具及其製造方法
KR100640693B1 (ko) 진공 척
KR20170011297A (ko) 기판 이송장치
JP2015153920A (ja) 電子機器
CN218137605U (zh) 一种治具以及贴合系统
KR20050013887A (ko) 기판 연마장치
US20050180088A1 (en) Substrate attaching device and method
WO2017146435A1 (ko) 가이드 결합형 컨택터 및 이를 구비한 휴대용 전자장치

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant