WO2020119489A1 - 一种电子设备的组装方法及其电子设备 - Google Patents

一种电子设备的组装方法及其电子设备 Download PDF

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Publication number
WO2020119489A1
WO2020119489A1 PCT/CN2019/122229 CN2019122229W WO2020119489A1 WO 2020119489 A1 WO2020119489 A1 WO 2020119489A1 CN 2019122229 W CN2019122229 W CN 2019122229W WO 2020119489 A1 WO2020119489 A1 WO 2020119489A1
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WO
WIPO (PCT)
Prior art keywords
bracket
camera
electronic device
screen
opening
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PCT/CN2019/122229
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English (en)
French (fr)
Inventor
严斌
薛康乐
高久亮
曹胜辉
吕焱
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华为技术有限公司
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Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2020119489A1 publication Critical patent/WO2020119489A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
    • H04M1/185—Improving the rigidity of the casing or resistance to shocks

Definitions

  • the present application relates to the field of terminals, and in particular, to an electronic device assembly method and electronic device.
  • the front camera of the mobile terminal device has also become an indispensable component of the mobile terminal device. Only by further reducing the size of the front camera and reducing the gap between the front camera and other surrounding components can the screen ratio be increased. Improve the effect of the full screen.
  • the present application provides an electronic device assembling method and electronic device thereof, which realizes high-precision positioning and assembly of the camera when the camera size is extremely small and the gap between the camera and other components around it is getting smaller and smaller.
  • the reliability of the electronic device falling is enhanced, and the dustproof effect is improved.
  • a method for assembling an electronic device includes a camera, a bracket, and a screen; the screen includes a backlight module, and the backlight module is provided with an opening for placing the lens of the bracket and the camera;
  • the method includes:
  • Buffer and dustproof materials are provided between the bracket and the screen, and between the camera and the bracket.
  • the camera and the bracket By assembling the bracket and the screen, the camera and the bracket using auxiliary positioning, and setting buffer and dustproof materials between the bracket and the screen, and between the camera and the bracket, the camera is extremely small in size and the camera and other components around it are realized. When the gap between them is getting smaller and smaller, high-precision positioning and assembly of the camera enhance the reliability of falling electronic devices and improve the dustproof effect.
  • the bracket and the screen are assembled through auxiliary positioning, including:
  • the hole edge parameters of the screen opening and the center position parameters of the opening are obtained, and the bracket is assembled on the screen according to the hole edge parameters of the opening and the center position parameters of the opening.
  • the camera and the bracket are assembled through auxiliary positioning, including:
  • the first surface of the bracket is conical.
  • the auxiliary positioning includes charge coupled device image sensor (charge coupled device, CCD) positioning or tapered self-positioning to accurately position and assemble the camera of the electronic device.
  • charge coupled device image sensor charge coupled device, CCD
  • the electronic device further includes a middle frame, and the bracket is spaced apart from the middle frame in a first direction, wherein the first direction is a direction perpendicular to the central axis of the camera, and the bracket is kept at a distance from the middle frame for During the assembly process, it plays a role of buffering and avoiding electronic equipment components, and also serves as an assembly gap to facilitate the assembly of electronic equipment.
  • the assembly method further includes:
  • a buffer and dustproof material is provided between the bracket and the middle frame, which further enhances the reliability of falling of the electronic device and further improves the dustproof effect of the electronic device.
  • the electronic device further includes a motherboard; after assembling the camera and the bracket, the method further includes:
  • BTB board-to-board connectors
  • the first surface of the bracket is conical, and the camera and the bracket are assembled, including:
  • the buffer dustproof material includes at least one of foam, viscose, tape, or glue. .
  • an electronic device in a second aspect, includes a screen, a camera, and a bracket; the screen includes a backlight module, and the backlight module is provided with an opening, and the opening is used to place the lens of the bracket and the camera; the camera Placed on the stand, there are buffer and dustproof materials between the camera and the stand, and between the stand and the screen.
  • the electronic device further includes a middle frame, and the bracket maintains a distance from the middle frame in a first direction, where the first direction is a direction perpendicular to the central axis of the camera.
  • the bracket is kept at a distance from the middle frame, which is used to play a role in buffering and avoiding electronic equipment during the assembly process, and is also used as an assembly gap to facilitate the assembly of electronic equipment.
  • a buffer and dustproof material is provided between the bracket and the middle frame, which further enhances the reliability of falling of the electronic device and further improves the dustproof effect of the electronic device.
  • the first surface of the bracket is conical
  • the camera is placed on the first surface of the bracket
  • a buffer and dustproof material is provided between the camera and the first surface between the camera and the first surface between the camera and the first surface between the camera and the first surface therebetween , You can accurately locate the camera placement.
  • the buffer dustproof material includes at least one of foam, viscose, tape, or glue.
  • the camera and the bracket, the bracket and the screen are assembled by auxiliary positioning, and a buffer is provided between the camera and the bracket and the bracket and the screen.
  • FIG. 1 is a schematic structural diagram of a screen and an opening in an electronic device provided by an embodiment of the present application
  • FIG. 2 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of another electronic device provided by an embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of yet another electronic device provided by an embodiment of the present application.
  • FIG. 5 is a schematic flowchart of an electronic device assembly method provided by an embodiment of the present application.
  • FIG. 6(a) is a schematic structural diagram of a camera and a bracket provided by an embodiment of the present application.
  • FIG. 6(b) is a schematic structural diagram of a bracket provided by an embodiment of the present application.
  • 6(c) is a partial structural schematic diagram of a middle frame provided by an embodiment of the present application.
  • 6(d) is a partial schematic diagram of a screen provided by an embodiment of the present application.
  • Embodiments of the present application provide an electronic device assembly method and electronic device.
  • the electronic device may be a device with a camera, such as a mobile phone, a display, a tablet computer, a watch, and a wearable device.
  • the camera is a front camera of an electronic device, and is a front camera punched on the screen.
  • Punching on the screen here refers to punching a hole of a certain depth on the screen, without punching the entire screen, the hole is used to place a camera.
  • the lens of the camera can be protected by not penetrating the screen.
  • the opening on the screen here refers to opening a hole on the backlight module of the screen for placing the camera, but not opening the entire screen, as shown in Figure 1
  • a hole is opened in the backlight module, but no hole is punched in the panel;
  • the panel may include a touch panel (panel) and an organic light-emitting diode (OLED) panel.
  • the camera bracket is added to the electronic device to assist the precise positioning and impact buffering of the camera, and the bracket is provided with a buffer dustproof material, which can prevent the camera from dust and seal, and can also be received by the electronic device. Protect the camera during impact.
  • the camera bracket is simply referred to as a bracket.
  • the electronic device is a mobile phone as an example.
  • 2 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • the electronic device 100 includes a screen 101, a camera 102 and a stand 103.
  • the screen 101 includes a backlight module 1011 and a panel 1012.
  • the backlight module 1011 is provided with an opening for placing the lens of the bracket 103 and the camera 102.
  • the camera 102 is placed on the bracket 103; a buffer dustproof material 104 is provided between the camera 102 and the bracket 103, and between the bracket 103 and the screen 101.
  • the bracket 103 By providing a buffer and dustproof material 104 between the camera 101 and the bracket 103, and between the bracket 103 and the screen 101 bracket, the bracket 103 functions as a double stress buffer in the horizontal direction and the thickness direction, which improves the drop of the electronic device reliability. At the same time, the dustproof effect is improved.
  • the buffer dustproof material 104 may be at least one of foam, glue, tape, viscose, and other materials having a buffering and sticking function.
  • the first surface of the bracket 103 is conical.
  • the first surface is a surface of the holder for placing the camera 102.
  • a buffer and dustproof material is provided between the camera 102 and the first surface of the bracket 103 to protect the camera and prevent dust.
  • the material of the bracket may be plastic or the like.
  • the electronic device further includes a middle frame 105.
  • the bracket 103 maintains a certain distance from the middle frame 105 in the first direction.
  • the first direction is a direction perpendicular to the central axis of the camera 102.
  • the first direction is a direction parallel to the cross section of the screen 101 shown in FIG.
  • the first direction may be referred to as a horizontal direction
  • the direction perpendicular to the horizontal direction may be referred to as a vertical direction.
  • the bracket 103 and the middle frame 105 maintain a certain distance in the horizontal direction, which serves as a buffer to the electronic equipment components in the horizontal direction, and at the same time facilitates the assembly of the electronic equipment to prevent the wear of the bracket 103 and the middle frame 105 during the assembly process.
  • a buffer and dustproof material may also be provided between the bracket 103 and the middle frame 105, which further enhances the reliability of the electronic device in the vertical direction and further improves the dustproof effect.
  • the bracket 103 may also maintain a certain gap with the middle frame 105 in the first direction, and the first direction is a direction perpendicular to the central axis of the camera 102.
  • the electronic equipment When the electronic equipment is squeezed or impacted by an external force, it acts as a buffer to protect the electronic devices and also facilitates the assembly of the electronic equipment.
  • FIG. 3 the difference between FIG. 3 and FIG. 2 is that the bracket 103 in FIG. 2 is only fixed to the screen through the buffer and dustproof material, and the bracket 103 in FIG. 3 is respectively fixed to the middle frame and the screen through the buffer and dustproof material.
  • the electronic device further includes a cover glass for protecting the screen 101.
  • the screen 101 includes not only the backlight module 1011 but also the panel 1012.
  • the electronic equipment may also include other devices, such as a printed circuit board (printed circuit board), which is a support body of electronic components in the electronic equipment and a carrier for electrical connection of electronic components; flexible circuit board (flexible printed circuit (FPC), board-to-board connectors (BTB), etc.
  • a printed circuit board printed circuit board
  • FPC flexible printed circuit
  • BTB board-to-board connectors
  • the electronic device is described above, and the method of assembling the electronic device is described below.
  • FIG. 5 is a schematic flowchart of an electronic device assembly method provided by an embodiment of the present application.
  • the electronic device includes a camera, a bracket, and a screen; the screen includes a backlight module, and the backlight module is provided with an opening, which is used to prevent the bracket and the lens of the camera.
  • the assembly method includes:
  • the hole edge parameters of the opening and the center position parameters of the opening are obtained, and the bracket is assembled on the screen according to the hole edge parameters of the opening and the center position parameters of the opening.
  • the shape of the opening is circular, and through auxiliary positioning, the parameters of the round edge of the opening and the center position of the opening are obtained, and the bracket is assembled on the screen according to the round edge of the opening and the center position of the opening .
  • the auxiliary positioning may include, but is not limited to, charge coupled device image sensor (charge coupled device, CCD) positioning or tapered self-positioning.
  • charge coupled device image sensor charge coupled device, CCD
  • the surface on the support for supporting the camera is called the first surface.
  • Obtain the edge parameters of the first surface of the bracket and the center position parameters of the shape enclosed by the edge through positioning methods such as CCD or cone self-positioning, and form the center position parameters formed according to the edge parameters of the first surface and the edge Assemble the camera on the bracket.
  • the first surface of the bracket is conical, which is advantageous for self-positioning assembly of the camera and the bracket.
  • the circular edge enclosed by the first surface of the bracket and its center position can be obtained by CCD positioning or cone self-positioning, and the camera can be assembled on the bracket according to the circular edge and the center position.
  • the BTB is connected to the main board of the electronic device to obtain the power supply through the main board, and it is also convenient to transmit the video recorded by the camera to the main board, or the static shooting image.
  • the material of the bracket may be plastic or the like.
  • buffer and dustproof materials are added between the camera and the bracket and between the bracket and the screen during the assembly process to protect the camera and prevent dust.
  • the buffer dustproof material includes at least one of foam, glue, tape, viscose and other materials with buffering and pasting functions.
  • FIG. 6(a) shows a schematic diagram of the cooperation between the camera 102 and the bracket 103.
  • the bracket 103 includes an accommodating space similar to the shape of the camera 102. Since the lenses of the camera 102 are mostly circular, the accommodating space has a larger ratio than the The larger diameter of the camera 102 can fix the camera 102 in the accommodating space. In addition, a hole is formed at the bottom of the accommodating space, and a tapered ring is formed at the opening to meet the needs of the camera 102.
  • the contact surface of the bracket 103 and the camera 102 includes a buffer and dustproof material.
  • FIG. 6(b), 6(c), and 6(d) show the assembly process of the bracket 103, the middle frame 105, and the screen 101.
  • the external shape of the bracket 103 accommodating the camera 102 can be seen schematically, wherein the upper edge of the accommodating space includes a protruding portion extending outward of the accommodating space.
  • the protruding portion is used to contact the middle frame 105, and is called a middle frame contact surface.
  • the outer edge of the ring other than the opening at the bottom of the accommodating space is used for contact with the screen, and is called the screen contact surface.
  • the middle frame 105 there is a bracket contact surface carrying the bracket 103, and on the screen 101, there is a portion that contacts the bracket.
  • the camera and the bracket By assembling the bracket and the screen, the camera and the bracket using auxiliary positioning, and setting buffer and dustproof materials between the bracket and the screen, and between the camera and the bracket, the camera is extremely small in size and the camera and other components around it are realized. When the gap between them is getting smaller and smaller, high-precision positioning and assembly of the camera enhance the reliability of falling electronic devices and improve the dustproof effect.
  • the electronic device further includes a middle frame, and the bracket includes a distance from the middle frame in the first direction, where the first direction is a direction perpendicular to the central axis of the camera. It is used to buffer the electronic equipment when it is pressed or impacted by external force, to protect the components of the electronic equipment, and also to assemble, which facilitates the assembly of the electronic equipment.
  • the assembly method may further include:
  • a buffer and dustproof material is provided between the bracket and the middle frame, which further enhances the reliability of the electronic device and further improves the dustproof effect of the electronic device.
  • S203 can be completed in the process of executing S201 and S202, and the execution order of each process should be determined by its function and inherent logic, and should not constitute any limitation on the implementation process of the embodiment of the present invention .
  • the bracket can be made into different shapes and sizes according to different application scenarios. In other words, the brackets with different shapes and sizes are suitable for the assembly method and the electronic device provided by the present application.

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Abstract

本申请提供了一种电子设备的组装方法及其电子设备，该电子设备包括摄像头、支架和屏幕；屏幕包括背光模组，背光模组上设置有开孔，开孔用于防止支架和所述摄像头的镜头；该组装方法包括：通过辅助定位的方式，将支架与屏幕进行组装；通过辅助定位的方式，将摄像头与支架进行组装；在支架与屏幕之间，以及摄像头与支架之间设置缓冲防尘材料。通过辅助定位的方式组装摄像头与支架、支架与屏幕，并在摄像头与支架之间、支架与屏幕之间设置缓冲防尘材料，实现了对电子设备的高精度、定位和组装，同时增强了电子设备跌落时的可靠性，提高了电子设备的防尘效果。

Description

一种电子设备的组装方法及其电子设备
本申请要求在2018年12月13日提交中国国家知识产权局、申请号为201811528212.1、发明名称为“一种电子设备的组装方法及其电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及终端领域，尤其涉及一种电子设备的组装方法及其电子设备。
背景技术
在当前智能手机等移动终端设备的发展趋势下，消费者对移动终端设备等设备全面屏的需求越来越强烈。另外，移动终端设备的前置摄像头也成为移动终端设备必不可少的组件，只有使前置摄像头的尺寸进一步做小，并减少前置摄像头与周围其他组件的间隙，才能够提高屏占比，提升全面屏的效果。
随着前置摄像头尺寸及其与周围其他组件的间隙越来越小，对于前置摄像头的组装方式、定位精度、跌落可靠性、防尘效果等要求更加极致，而传统的组装、定位方式，以及跌落可靠性、防尘效果并不能满足需求。
发明内容
本申请提供了一种电子设备的组装方法及其电子设备，实现了在摄像头尺寸极小、且摄像头与其周围其他组件之间的间隙越来越小的情况下，高精度的定位、组装摄像头，增强了电子设备跌落的可靠性，提高了防尘效果。
第一方面，提供了一种电子设备的组装方法，该电子设备包括摄像头、支架和屏幕；屏幕包括背光模组，背光模组上设置有开孔，开孔用于放置支架和摄像头的镜头；该方法包括：
通过辅助定位的方式将支架与屏幕进行组装；
通过辅助定位的方式将摄像头与支架进行组装；
在支架与屏幕之间，以及摄像头与支架之间设置缓冲防尘材料。
通过采用辅助定位的方式组装支架与屏幕、摄像头与支架，并在支架与屏幕之间，以及摄像头与支架之间设置缓冲防尘材料，实现了在摄像头尺寸极小、且摄像头与其周围其他组件之间的间隙越来越小的情况下，高精度的定位、组装摄像头，增强了电子设备跌落的可靠性，提高了防尘效果。
在一个可能的实现中，通过辅助定位的方式，将支架与屏幕进行组装，包括：
通过辅助定位的方式，获取屏幕开孔的孔边参数，以及开孔的中心位置参数，并根据开孔的孔边参数和开孔的中心位置参数将支架组装在屏幕上。
在一个可能的实现中，通过辅助定位的方式，将摄像头与支架进行组装，包括：
通过辅助定位的方式，获取支架的第一表面的边缘参数，以及第一表面的边缘所围形状的中心位置参数，并根据第一表面的边缘参数和边缘所围成形状的中心位置参数将摄像头组装在支架上，其中，支架的第一表面是用于放置摄像头的表面。
在一个可能的实现中，支架的第一表面呈圆锥形。
在一个可能的实现中，辅助定位包括电荷耦合器件图像传感器(charge couples device，CCD)定位或锥形自定位，以准确定位、组装电子设备的摄像头。
在一个可能的实现中，电子设备还包括中框，支架在第一方向上与中框保持间距，其中，第一方向是与摄像头中轴线垂直的方向，支架与中框保持距离，用于在装配过程中起到对电子设备器件的缓冲避让的作用，同时也用作装配间隙，便于电子设备的组装。
在一个可能的实现中，该组装方法还包括：
在支架和中框之间设置缓冲防尘材料，进一步增强了电子设备跌落的可靠性，进一步提高了电子设备的防尘效果。
在一个可能的实现中，电子设备还包括主板；在将摄像头与支架进行组装之后，该方法还包括：
通过板对板连接器(board-to-board connectors,BTB)将摄像头与主板连接，以便于后续能正常使用摄像头。
在一个可能的实现中，支架的第一表面呈圆锥形，将摄像头与支架进行组装，包括：
将摄像头放置在支架的第一表面上，并在摄像头和之间的第一表面之间设置缓冲防尘材料。
在一个可能的实现中，缓冲防尘材料包括泡棉、粘胶、胶带、或胶水中的至少一种。。
第二方面，提供了一种电子设备，该电子设备包括屏幕、摄像头和支架；屏幕包括背光模组，背光模组上设置有开孔，开孔用于放置所述支架和摄像头的镜头；摄像头放置在支架上，摄像头与支架之间，以及支架与屏幕之间设置有缓冲防尘材料。
通过在摄像头与支架之间，支架与屏幕之间设置缓冲防尘材料，增强了电子设备跌落的可靠性，提高了电子设备的防尘效果。
在一个可能的实现中，电子设备还包括中框，支架在第一方向上与中框保持距离，其中，第一方向是与摄像头中轴线垂直的方向。支架与中框保持距离，用于在装配过程中起到对电子设备器件的缓冲避让的作用，同时也用作装配间隙，便于电子设备的组装。
在一个可能的实现中，支架和中框之间设置有缓冲防尘材料，进一步增强了电子设备跌落的可靠性，进一步提高了电子设备的防尘效果。
在一个可能的实现中，支架的第一表面呈圆锥形，摄像头放置在支架的第一表面，摄像头与之间的第一表面之间设置有缓冲防尘材料，以便于在电子设备组装过程中，可以精准的定位摄像头放置的位置。
在一个可能的实现中，缓冲防尘材料包括泡棉、粘胶、胶带、或胶水中的至少一种。
基于提供的电子设备的组装方法及其电子设备，在电子设备的组装过程中，通过辅助定位的方式组装摄像头与支架、支架与屏幕，并在摄像头与支架之间、支架与屏幕之间设置缓冲防尘材料，实现了对电子设备的高精度、定位和组装，同时增强了电子设备跌落时的可靠性，提高了电子设备的防尘效果。
附图说明
图1是本申请实施例提供的一种电子设备中屏幕与开孔的结构示意图；
图2是本申请实施例提供的一种电子设备的结构示意图；
图3是本申请实施例提供的另一种电子设备的结构示意图；
图4是本申请实施例提供的又一种电子设备的结构示意图；
图5是本申请实施例提供的一种电子设备的组装方法的流程示意图；
图6(a)是本申请实施例提供的一种摄像头与支架配合的结构示意图；
图6(b)是本申请实施例提供的支架结构示意图；
图6(c)是本申请实施例提供的一种中框的局部结构示意图；
图6(d)是本申请实施例提供的一种屏幕的局部示意图；
具体实施方式
本申请实施例提供了一种电子设备的组装方法及其电子设备。该电子设备可以是手机、显示器、平板电脑、手表、可穿戴设备等带有摄像头的设备。其中，摄像头是电子设备的前置摄像头，而且是在屏幕上打孔的前置摄像头。这里的在屏幕上打孔，是指的在屏幕上打一定深度的孔，不将整个屏幕打穿，该孔用于放置摄像头。不将屏幕打穿可以保护摄像头的镜头。
如果该电子设备是手机，包括背光模组的手机，那么这里的在屏幕上打开孔是指在屏幕的背光模组上打开孔，用于放置摄像头，但不是将整个屏幕打开孔，如图1所示，在背光模组上打开孔，但不在面板上打孔；面板可以包括触控面板(touch panel)与有机发光二极管(organic light-emitting dilde，OLED)面板。
在该实施例中，通过在电子设备中增加摄像头支架，对摄像头进行辅助精准定位和冲击缓冲，并且在支架上设有缓冲防尘材料，可以对摄像头进行防尘密封，也可以在电子设备受到冲击时，保护摄像头。需要说明的是，在该实施例中，将摄像头支架简称为支架。
下面结合附图对本发明实施例的电子设备进行描述。在该实施例中，以电子设备为手机为例进行说明。图2是本申请实施例提供的一种电子设备的结构示意图。如图2所示，该电子设备100包括屏幕101、摄像头102和支架103。屏幕101包括背光模组1011和面板1012，背光模组1011上设置有开孔，开孔用于放置支架103和摄像头102的镜头。摄像头102放置在支架103上；摄像头102与支架103之间，以及支架103与屏幕101之间设置有缓冲防尘材料104。通过在摄像头101与支架103之间，以及支架103与屏幕101支架设置缓冲防尘材料104，从而在水平方向和厚度方向，所述支架103起到了双重应力缓冲的作用，提高了电子设备跌落的可靠性。同时提高了防尘效果。
在该实施例中，缓冲防尘材料104可以是泡棉、胶水、胶带、粘胶等具有缓冲、粘贴功能的材料中的至少一种。
在一个实施例中，支架103的第一表面呈圆锥形。第一表面是用于放置摄像头102的支架的一个表面。为了保护摄像头102，在摄像头102与支架103的第一表面之间设置有缓冲防尘材料，起到保护摄像头，及防尘的效果。可选地，在该实施例中，支架的材质可以是塑料等。
其中，电子设备还包括中框105。如图2所示，支架103在第一方向上与中框105保持一定的距离。其中，第一方向是与摄像头102中轴线垂直的方向，换句话讲，第一方向是与图2所示屏幕101截面平行的方向。在该实施例中，可以将第一方向称为水平方向，与该水平方向垂直的方向称为垂直方向。支架103与中框105在水平方向保持一定距离，起到对电子设备器件在水平方向的缓冲，同时也便于电子设备的组装，防止装配过程中造成支架103与中框105的磨损。
在一个实施例中，如图3所示，支架103与中框105之间也可以设置有缓冲防尘材料，进一步在垂直方向增强了电子设备的可靠性，进一步提高了防尘效果。
如图3所示，在该实施例中，支架103在第一方向上与中框105也可以保持一定的间隙， 第一方向是与摄像头102中轴线垂直的方向。当电子设备收到外力挤压或撞击时，起到缓冲作用，对电子器件进行保护，也便于电子设备的组装。
需要说明的是，图3与图2的区别在于，图2中的支架103通过缓冲防尘材料只与屏幕固定，而图3中的支架103分别通过缓冲防尘材料与中框、屏幕固定。
在该实施例中，该电子设备还包括盖板玻璃，用于保护屏幕101。其中，在该实施例中，屏幕101不仅包括背光模组1011，，还包括面板1012。
另外，该电子设备还可以包括其他器件，例如，印制电路板(printed cricuit board，PCB),是电子设备中电子元器件的支撑体，是电子元器件电器连接的载体；柔性电路板(flexible printed circuit，FPC)，板对板连接器(board-to-board connectors，BTB)等。具体的电子设备的器件示意图如图4所示。
上面对电子设备进行了描述，下面对电子设备组装的方法进行描述。
图5是本申请实施例提供的一种电子设备组装的方法流程示意图。该电子设备包括摄像头、支架和屏幕；屏幕包括背光模组，背光模组上设置有开孔，开孔用于防止支架和摄像头的镜头。如图5所示，该组装方法包括：
S201，通过辅助定位的方式，将支架与屏幕进行组装。
通过辅助定位的方式，获取开孔的孔边参数，以及开孔的中心位置参数，并根据开孔的孔边参数和开孔的中心位置参数将支架组装在屏幕上。
例如，开孔的形状是圆形，通过辅助定位的方式，获取开孔的圆边参数，以及开孔的圆心位置，并根据开孔的圆边和开孔的圆心位置将支架组装在屏幕上。
在该实施例中，辅助定位可以包括但不限于电荷耦合器件图像传感器(charge coupled device，CCD)定位或锥形自定位。
S202，通过辅助定位的方式将摄像头与支架进行组装。
在该实施例中，将支架上用于支撑放置摄像头的表面称为第一表面。通过CCD或锥形自定位等定位的方式，获取支架的第一表面的边缘参数，以及边缘所围形状的中心位置参数，并根据第一表面的边缘参数和边缘所围成形成的中心位置参数将摄像头组装在支架上。
可选地，在一个实施例中，支架的第一表面呈圆锥形，有利于自定位组装摄像头与支架。可以通过CCD定位或者锥形自定位获取支架第一表面所围成的圆边，以及其圆心位置，并根据圆边和圆心位置将摄像头组装在支架上。
可选地，在该实施例中，完成摄像头与支架的组装后，通过BTB与电子设备的主板进行连接，以通过主板得到电能的供应，也便于向主板传输摄像头录制的视频，或拍摄的静态图像。
可选地，在该实施例中，支架的材质可以是塑料等。
S203，在支架与屏幕之间，以及摄像头与支架之间设置缓冲防尘材料。
为了保护电子设备，摄像头，在组装过程中，在摄像头与支架之间，以及支架与屏幕之间加入缓冲防尘材料，起到保护摄像头，及防尘的效果。其中，缓冲防尘材料包括泡棉、胶水、胶带、粘胶等具有缓冲、粘贴功能的材料中的至少一种。
图6(a)示出了摄像头102与支架103配合的示意图，所述支架103包括与摄像头102外形相似的容纳空间，由于摄像头102的镜头以圆形居多，所以所述容纳空间具有比所述摄像头102更大的直径，可以使摄像头102固定在所述容纳空间内。另外，在所述容纳空间的底部开孔，并在所述开孔处形成锥形环，以满足所述摄像头102的需要。在所述支架103和所述摄像头102的接触面包括了缓冲防尘材料。
图6(b)、图6(c)、和图6(d)示出了支架103与中框105、屏幕101组装的过程。其中，从图6(b)中，可以示意性的看到容纳所述摄像头102的支架103的外部形状，其中，在所述容纳空间的上边缘包括向容纳空间外部延伸的凸出部分。所述凸出部分用于和中框105接触，称为中框接触面。在所述容纳空间底部开孔以外的圆环外边缘用于和屏幕接触，称为屏幕接触面。相应的，在中框105上，具有承载所述支架103的支架接触面，在屏幕101上，具有与所述支架接触的部分。
通过采用辅助定位的方式组装支架与屏幕、摄像头与支架，并在支架与屏幕之间，以及摄像头与支架之间设置缓冲防尘材料，实现了在摄像头尺寸极小、且摄像头与其周围其他组件之间的间隙越来越小的情况下，高精度的定位、组装摄像头，增强了电子设备跌落的可靠性，提高了防尘效果。
可选地，在一个实施例中，电子设备还包括中框，支架在第一方向上与中框包括距离，其中第一方向是与摄像头中轴线垂直的方向。用于当电子设备收到外力挤压或者撞击时，起到缓冲作用，用于保护电子设备的器件，同时也起到装配作用，便于电子设备的组装。
可选地，在一个实施例中，该组装的方法还可以包括：
在支架与中框之间设置缓冲防尘材料，进一步增强了电子设备的可靠性，进一步提高了电子设备的防尘效果。
需要说明的是，在该实施例中，S203可以在执行S201和S202的过程中完成，各过程的执行顺序应以其功能和内在逻辑确定，而不应对本发明实施例的实施过程构成任何限定。在该实施例中，可以根据不同的应用场景，将支架制作成不同的形状和尺寸，换句话讲，不同形状和尺寸的支架均适用与本申请提供的电子设备的组装方法以及电子设备。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以所述权利要求的保护范围为准。

Claims (14)

  1. 一种电子设备的组装方法，其特征在于，所述电子设备包括摄像头、支架和屏幕，所述屏幕包括背光模组，所述背光模组上设置有开孔，所述开孔用于放置所述支架和所述摄像头的镜头；所述组装方法包括：
    通过辅助定位的方式，将所述支架与所述屏幕进行组装；
    通过辅助定位的方式，将所述摄像头与所述支架进行组装；
    在所述支架与所述屏幕之间，以及所述摄像头与所述支架之间设置缓冲防尘材料。
  2. 根据权利要求1所述的方法，其特征在于，所述通过辅助定位的方式，将所述支架与所述屏幕进行组装，包括：
    通过辅助定位的方式，获取所述开孔的孔边参数，以及所述开孔的中心位置参数，并根据所述开孔的孔边参数和所述开孔的中心位置参数将所述支架组装在所述屏幕上。
  3. 根据权利要求1或2所述的方法，其特征在于，所述通过辅助的方式，将所述摄像头与所述支架进行组装，包括：
    通过辅助定位的方式，获取所述支架的第一表面的边缘参数，以及所述边缘所围形状的中心位置参数，并根据所述第一表面的边缘参数和所述边缘所围成形状的中心位置参数将所述摄像头组装在所述支架上；其中，所述支架的第一表面是用于放置所述摄像头的表面。
  4. 根据权利要求3所述的方法，其特征在于，所述支架的第一表面呈圆锥形。
  5. 根据权利要求1至4任一项所述的组装方法，其特征在于，所述辅助定位包括电荷耦合器件图像传感器CCD定位或锥形自定位。
  6. 根据权利要求1至5任一项所述的组装方法，其特征在于，所述电子设备还包括中框；所述支架在第一方向上与所述中框保持间距，其中，所述第一方向是与所述摄像头中轴线垂直的方向。
  7. 根据权利要求6所述的组装方法，其特征在于，所述组装方法还包括：
    在所述支架与所述中框之间设置缓冲防尘材料。
  8. 根据权利要求1至7任一项所述的组装方法，其特征在于，所述电子设备还包括主板；在将所述摄像头与所述支架进行组装之后，所述方法还包括：
    通过板对板连接器BTB将所述摄像头与所述主板连接。
  9. 根据权利要求1至8任一项所述的组装方法，其特征在于，所述缓冲防尘材料包括泡棉、粘胶、胶带、或胶水中的至少一种。
  10. 一种电子设备，其特征在于，所述电子设备包括屏幕、摄像头和支架；所述屏幕包括背光模组，所述背光模组上设置有开孔，所述开孔用于放置所述支架和所述摄像头的镜头；所述摄像头放置在所述支架上，所述摄像头与所述支架之间，以及所述支架与所述屏幕之间设置有缓冲防尘材料。
  11. 根据权利要求10所述的电子设备，其特征在于，所述电子设备还包括中框，所述支架在第一方向上与所述中框保持距离，其中，所述第一方向是与所述摄像头中轴线垂直的方 向。
  12. 根据权利要求11所述的电子设备，其特征在于，所述支架和所述中框之间设置有缓冲防尘材料。
  13. 根据权利要求10至12任一项所述的电子设备，其特征在于，所述支架的第一表面呈圆锥形，所述摄像头放置在所述支架的第一表面上，所述摄像头与所述支架的第一表面之间设置有缓冲防尘材料。
  14. 根据权利要求10至13任一项所述的电子设备，其特征在于，所述缓冲防尘材料包括泡棉、粘胶、胶带、或胶水中的至少一种。
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CN107682477A (zh) * 2017-09-25 2018-02-09 捷开通讯(深圳)有限公司 一种摄像头组件及终端

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CN112714241A (zh) * 2020-12-31 2021-04-27 深圳微步信息股份有限公司 一种终端设备
CN116055596A (zh) * 2022-08-08 2023-05-02 荣耀终端有限公司 电子设备及电子设备的制作方法
CN116055596B (zh) * 2022-08-08 2023-10-20 荣耀终端有限公司 电子设备及电子设备的制作方法

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