CN108556161A - 一种硅晶体线切割装置 - Google Patents

一种硅晶体线切割装置 Download PDF

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CN108556161A
CN108556161A CN201810361002.1A CN201810361002A CN108556161A CN 108556161 A CN108556161 A CN 108556161A CN 201810361002 A CN201810361002 A CN 201810361002A CN 108556161 A CN108556161 A CN 108556161A
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parts
silicon crystal
cable
cutting device
stainless steel
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胡莉
朱冬梅
张烨
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Changzhou Lan Sen Environmental Protection Equipment Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
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Abstract

本发明公开了一种硅晶体线切割装置，属于晶体切割技术领域。本发明所述网线导向轮（1）边缘连接切割网线（6）；所述硅晶体固定装置（2）和喷涂装置（7）设置在装置上方；所述喷涂装置（7）由储液罐（3），喷涂罐（4）和导流槽（5）；所述导流槽（5）上方设置储液罐（3）；所述导流槽（5）下端设置喷涂罐（4）；所述喷涂罐（4）中设置喷嘴（8）。本发明提供的硅晶体线切割装置具有优异的切割效率。

Description

一种硅晶体线切割装置
技术领域
本发明公开了一种硅晶体线切割装置，属于晶体切割技术领域。
背景技术
多线切割技术是目前世界上比较先进的晶体硅加工技术，它的原理是通过一根高速运动的钢丝带动附着在钢丝上的切割刃料对半导体等硬脆材料进行摩擦而达到切割效果。多线切割技术与传统的刀锯片、砂轮片及内圆切割相比有具有效率高，产能高，精度高等优点，多线切割技术是目前采用最广泛的半导体等硬脆材料切割技术。
现有的多线切割设备例如晶体硅锭切断机等通常至少包括有：机架，设置于所述机架上用于承载晶体硅锭的工作台，用于绕丝的贮丝筒，多个导线轮及可升降的切割辊等，在对晶体硅锭的切割过程中，作为切割线的钢丝通过十几个导线轮的引导，在多个切割辊之间上形成一张线网，而待加工的晶体硅锭被固定于所述工作台上时，将切割辊降下来，并在压力泵在的作用下，装配在设备上的切割液自动喷洒装置将切割液喷洒至钢丝和晶体硅锭的切削部位，由钢丝带动切割液往复运动，利用切割液中的研磨砂对工件产生切割，以将晶体硅锭一次同时切割为数段。在这一过程中，被喷洒至切削部位的切割液只占到总喷洒量的大约20％的比例，换言之，所述切割液自动喷洒装置实际喷洒的切割液大约有80％都被浪费掉了，而这部分被浪费掉的切割液不易回收，不利于降低加工成本；再者，由于高速运行的切割线在工件伤切割形成的是一条极细的切割缝隙，要保证上述切割液自动喷洒装置喷洒出的切割液充分地落入该缝隙中也非易事，所以在实际切割过程中，时有切割线上并未携带切割液进行切割的情况发生，进而不利于保证工件的切割品质。所以，传统硅晶体线切割装置还存在的切割效率不佳的问题，实为相关领域之业者目前亟待解决的问题。
发明内容
本发明主要解决的技术问题是：针对传统硅晶体线切割装置切割效率不佳的问题，提供了一种硅晶体线切割装置。
为了解决上述技术问题，本发明所采用的技术方案是：
一种硅晶体线切割装置，包括网线导向轮1，硅晶体固定装置2，储液罐3，喷涂罐4，导流槽5，切割网线6，喷涂装置7，喷嘴8；
所述网线导向轮1边缘连接切割网线6；所述硅晶体固定装置2和喷涂装置7设置在装置上方；所述喷涂装置7由储液罐3，喷涂罐4和导流槽5；所述导流槽5上方设置储液罐3；所述导流槽5下端设置喷涂罐4；所述喷涂罐4中设置喷嘴8。
所述网线导向轮1对角设置有四个。
所述网线导向轮1与切割网线6接触位置设置有导向凹槽。
所述储液罐3中设置设置有切割液；所述切割液是由以下重量份数的原料配置而成：30～40份聚乙二醇，8～10份乙二醇胺，10～20份聚乙烯醇液，3～5份巴氏芽孢杆菌，10～20份碳化硅，3～5份葡萄糖溶液，3～5份甘油，3～5份乙二醇，3～5份尿素，3～5份硝酸钙溶液，3～5份十二烷基硫酸钠，3～5份柠檬酸钠，3～5份造纸黑浆。
所述储液罐3下方设置可移动挡片。
所述导流槽5设置为中间高两端低。
所述切割网线6由不锈钢制成；所述不锈钢为不锈钢316，不锈钢304，不锈钢304，不锈钢201或不锈钢200中的任意一种。
所述喷嘴8孔径为0.4～0.5mm。
本发明的有益效果是：
（1）本发明技术方案，在使用过程中，首先，将硅晶体置于硅晶体固定装置，随后打开储液罐下方的可移动挡片，切割液从导流槽进入喷涂罐，再由喷涂罐喷嘴喷出，切割液喷涂在钢丝表面，接着控制网线导向轮快速转动，再通过网线导向轮的传动控制切割网线开始切割工作，由于切割网线上的碳化硅颗粒硬度大于硅片的硬度，在切割网线表面的碳化硅与硅片摩擦切割，从而提升了装置的工作效率；
（2）本发明通过在切割液中添加聚乙烯醇液，在制备过程中，聚乙烯醇可与体系中的钙离子发生配位交联，形成凝胶网络，使得碳化硅颗粒良好的分散在在体系中，在使用过程中，凝胶网络携带碳化硅颗粒附着在钢丝表面，增大碳化硅颗粒与硅晶体接触摩擦阻力，进一步提升了装置的切割效率。
附图说明
图1为本发明硅晶体线切割装置主视图；
图2为本发明硅晶体线切割装置侧视图；
图3为本发明硅晶体线切割装置喷涂罐细节图。
其中，1、网线导向轮；2、硅晶体固定装置；3、储液罐；4、喷涂罐；5导流槽；6、切割网线；7、喷涂装置；8、喷嘴。
具体实施方式
一种硅晶体线切割装置，包括网线导向轮1，硅晶体固定装置2，储液罐3，喷涂罐4，导流槽5，切割网线6，喷涂装置7，喷嘴8；所述网线导向轮1边缘连接切割网线6；所述硅晶体固定装置2和喷涂装置7设置在装置上方；所述喷涂装置7由储液罐3，喷涂罐4和导流槽5；所述导流槽5上方设置储液罐3；所述导流槽5下端设置喷涂罐4；所述喷涂罐4中设置喷嘴8；本发明工作时，首先，聚乙烯醇与水按质量比1：50～1：100置于1号烧杯中，用玻璃棒搅拌10～20min，随后静置溶胀3～4h后，将1号烧杯置于数显测速恒温磁力搅拌器中，于温度为60～80℃，转速为300～500r/min条件下，加热搅拌混合40～60min，得聚乙烯醇液，按重量份数计，将30～40份聚乙二醇，8～10份乙二醇胺，10～20份聚乙烯醇液，3～5份巴氏芽孢杆菌，10～20份碳化硅，3～5份葡萄糖溶液，3～5份甘油，3～5份乙二醇，3～5份尿素，3～5份质量分数为8～10%的硝酸钙溶液，3～5份十二烷基硫酸钠，3～5份柠檬酸钠，3～5份造纸黑浆置于2号烧杯中，于转速为300～500r/min条件下，搅拌混合30～50min，得切割液，随后将硅晶体置于硅晶体固定装置2，随后打开储液罐3下方的可移动挡片，切割液从导流槽5进入喷涂罐4，再由喷涂罐4喷嘴喷出，切割液喷涂在钢丝表面，随后控制网线导向轮1快速转动，随后通过网线导向轮的传动控制切割网线6开始切割工作，待切割任务完成后，停止网线导向轮运作后，关闭储液罐3下方的可移动挡片，即完成切割作业。所述网线导向轮1对角设置有四个。所述网线导向轮1与切割网线6接触位置设置有导向凹槽。所述储液罐3下方设置可移动挡片。所述导流槽5设置为中间高两端低。所述切割网线6由不锈钢制成。所述不锈钢为不锈钢316，不锈钢304，不锈钢304，不锈钢201或不锈钢200中的任意一种。所述喷嘴8孔径为0.4～0.5mm。

Claims (8)

1.一种硅晶体线切割装置，其特征在于：包括网线导向轮（1），硅晶体固定装置（2），储液罐（3），喷涂罐（4），导流槽（5），切割网线（6），喷涂装置（7），喷嘴（8）；
所述网线导向轮（1）边缘连接切割网线（6）；所述硅晶体固定装置（2）和喷涂装置（7）设置在装置上方；所述喷涂装置（7）由储液罐（3），喷涂罐（4）和导流槽（5）；所述导流槽（5）上方设置储液罐（3）；所述导流槽（5）下端设置喷涂罐（4）；所述喷涂罐（4）中设置喷嘴（8）。
2.根据权利要求1所述一种硅晶体线切割装置，其特征在于：所述网线导向轮（1）对角设置有四个。
3.根据权利要求1所述一种硅晶体线切割装置，其特征在于：所述网线导向轮（1）与切割网线（6）接触位置设置有导向凹槽。
4.根据权利要求1所述一种硅晶体线切割装置，其特征在于：所述储液罐（3）中设置设置有切割液；所述切割液是由以下重量份数的原料配置而成：30～40份聚乙二醇，8～10份乙二醇胺，10～20份聚乙烯醇液，3～5份巴氏芽孢杆菌，10～20份碳化硅，3～5份葡萄糖溶液，3～5份甘油，3～5份乙二醇，3～5份尿素，3～5份硝酸钙溶液，3～5份十二烷基硫酸钠，3～5份柠檬酸钠，3～5份造纸黑浆。
5.根据权利要求1所述一种硅晶体线切割装置，其特征在于：所述储液罐（3）下方设置可移动挡片。
6.根据权利要求1所述一种硅晶体线切割装置，其特征在于：所述导流槽（5）设置为中间高两端低。
7.根据权利要求1所述一种硅晶体线切割装置，其特征在于：所述切割网线（6）由不锈钢制成；所述不锈钢为不锈钢316，不锈钢304，不锈钢304，不锈钢201或不锈钢200中的任意一种。
8.根据权利要求1所述一种硅晶体线切割装置，其特征在于：所述喷嘴（8）孔径为0.4～0.5mm。
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109097178A (zh) * 2018-09-20 2018-12-28 薛向东 一种水溶性多晶硅片切削液的制备方法
CN109591196A (zh) * 2018-11-30 2019-04-09 江苏科技大学 机械化学线锯复合切割方法及切割液
CN113211278A (zh) * 2021-05-14 2021-08-06 安徽省景隆电子科技有限公司 一种提高合金电阻落料效率的切割方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109097178A (zh) * 2018-09-20 2018-12-28 薛向东 一种水溶性多晶硅片切削液的制备方法
CN109591196A (zh) * 2018-11-30 2019-04-09 江苏科技大学 机械化学线锯复合切割方法及切割液
CN113211278A (zh) * 2021-05-14 2021-08-06 安徽省景隆电子科技有限公司 一种提高合金电阻落料效率的切割方法

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