CN108544362B - Chemical mechanical polishing equipment - Google Patents
Chemical mechanical polishing equipment Download PDFInfo
- Publication number
- CN108544362B CN108544362B CN201810276853.6A CN201810276853A CN108544362B CN 108544362 B CN108544362 B CN 108544362B CN 201810276853 A CN201810276853 A CN 201810276853A CN 108544362 B CN108544362 B CN 108544362B
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- Prior art keywords
- main body
- container
- chemical mechanical
- polishing
- mechanical polishing
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention discloses a chemical mechanical polishing device, which comprises a main body and is characterized in that a clamping device capable of clamping a polishing body is arranged in the main body, a polishing surface detection device is arranged on one side of the main body, and a rotary switching container mechanism capable of polishing a workpiece is arranged on the upper side of the main body.
Description
Technical Field
The invention relates to the technical field of polishing equipment, in particular to chemical mechanical polishing equipment.
Background
The existing chemical polishing is a method for eliminating grinding marks and etching and leveling by means of selective dissolution of chemical reagents on uneven areas on the surface of a sample. The chemical polishing equipment is simple, can handle the part that the shape is more complicated, and current chemical mechanical polishing equipment does not have the convenient equipment of switching chemical reagent, and is very inconvenient when other reagents need to be switched.
Accordingly, further improvements are needed in existing chemical mechanical polishing apparatuses.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provide chemical mechanical polishing equipment.
In order to achieve the purpose, the invention adopts the following scheme:
a chemical mechanical polishing device comprises a main body and is characterized in that a clamping device capable of clamping a polishing body is arranged in the main body, a polishing surface detection device is arranged on one side of the main body, and a rotary switching container mechanism capable of polishing a workpiece is arranged on the upper side of the main body.
The chemical mechanical polishing device is characterized in that the clamping device comprises a rotating motor arranged on the lower surface in the main body, a workpiece table is arranged at the upper end of the rotating motor, an L-shaped support frame is arranged on the upper surface of the rear side of the workpiece table, an electric telescopic rod is arranged on the lower surface of the L-shaped support frame, a distance measuring sensor is arranged on one side of the electric telescopic rod, a chuck is arranged at the lower end of the electric telescopic rod, and the chuck is arranged at the upper end of the workpiece table.
As above a chemical mechanical polishing equipment, its characterized in that polished surface detection device including set up the dwang motor at main part front end upper wall, the dwang has been installed to dwang motor upper end, is equipped with the roughness measurement appearance at the dwang tip, dwang motor one side is equipped with spacing sensor.
The chemical mechanical polishing device is characterized in that the rotary switching container mechanism comprises a fixed shaft arranged on the upper wall of an L-shaped support frame, a fixed table is arranged at the upper end of the fixed shaft, a single opening of a guide rail is arranged on the front side of the surface of the fixed table, a chemical liquid guide groove is arranged at the center of the single opening of the guide rail, an annular guide rail is arranged on the periphery of the surface ring of the fixed table, a rotary shaft is arranged at the center of the upper surface of the fixed table, a hand stirring handle is arranged at the top end of the rotary shaft, a plurality of container claws uniformly distributed along the periphery are arranged in the middle section of the rotary shaft, a container is arranged in each container claw, a top plate is arranged at the upper end of the rotary shaft, springs are arranged on the lower wall of the top plate and the upper wall of the container, a bottle mouth is arranged at the lower end of the container, an ejector pin is, a liquid outlet penetrating and connecting to the outside of the bottle mouth is arranged in the bottle mouth, the closing plate is arranged right below the liquid outlet, a flow channel is arranged on the lower wall of the L-shaped support frame, and a water faucet is arranged at the lower end of the flow channel.
A chemical mechanical polishing apparatus as set forth above, characterized in that a rotating plate is provided at one side of said main body.
The chemical mechanical polishing apparatus as described above, wherein a PLC controller is provided at the front side of the main body.
In summary, compared with the prior art, the invention has the beneficial effects that:
the invention has simple structure and convenient use, and compared with the prior art, when various chemical reagents are needed to polish the workpiece, different reagents can be placed in different containers, and the reagents can be switched by simple operation during switching, thereby being very convenient.
Drawings
FIG. 1 is a perspective view of the present invention;
FIG. 2 is an exploded view of the present invention;
fig. 3 is an exploded view of the present invention.
Detailed Description
The invention will be further described with reference to the following description and embodiments in conjunction with the accompanying drawings:
a chemical mechanical polishing apparatus as shown in fig. 1 to 3, comprising a main body 1, characterized in that a clamping device 2 capable of clamping a polishing body is provided in the main body 1, a polishing surface detection device 3 is provided at one side of the main body 1, a rotary switching container mechanism 4 capable of polishing a workpiece is provided at an upper side of the main body 1, when in operation, the workpiece is clamped by the clamping device, the rotary switching container mechanism transfers a suitable container, a reagent placed therein is used for polishing the workpiece, and the polishing surface detection device detects the polishing surface accuracy for the workpiece.
The clamping device 2 of the invention comprises a rotating motor 21 arranged on the inner lower surface of a main body 1, a workpiece table 22 is arranged at the upper end of the rotating motor 21, an L-shaped support frame 23 is arranged on the upper surface of the rear side of the workpiece table 22, an electric telescopic rod 24 is arranged on the lower surface of the L-shaped support frame 23, a distance measuring sensor 25 is arranged at one side of the electric telescopic rod 24, a chuck 26 is arranged at the lower end of the electric telescopic rod 24, the chuck 26 is arranged at the upper end of the workpiece table 22, when the electric chuck works, the input end of the electric telescopic rod and the input end of the rotating motor are both electrically connected with the output end of the PLC controller, the output end of the distance measuring sensor is electrically connected with the input end of the PLC controller, the distance measuring sensor is used for detecting the moving distance of the chuck, and the PLC controller intelligently controls the switch of the electric telescopic rod to control the electric telescopic rod to clamp the workpiece on the workbench, and the rotating motor can drive the workbench to rotate.
The polished surface detection device 3 comprises a rotating rod motor 31 arranged on the upper wall of the front end of a main body 1, a rotating rod 32 is arranged at the upper end of the rotating rod motor 31, a surface roughness measuring instrument 33 is arranged at the end part of the rotating rod 32, a limit sensor 34 is arranged on one side of the rotating rod motor 31, the surface roughness measuring instrument is electrically connected with a PLC in a two-way mode during working, the rotating rod motor drives the surface roughness measuring instrument to rotate below a part through the rotating rod to detect the part, and whether the roughness reaches the polishing standard or not is judged through the PLC.
The rotary switching container mechanism 4 comprises a fixed shaft 41 arranged on the upper wall of an L-shaped support frame 23, a fixed table 42 is arranged at the upper end of the fixed shaft 41, a single guide rail opening 404 is arranged on the front side of the surface of the fixed table 42, a chemical liquid guide groove 43 is arranged in the center of the single guide rail opening 404, an annular guide rail 44 is arranged on the periphery of the surface ring of the fixed table 42, a rotary shaft 405 is arranged at the center of the upper surface of the fixed table 42, a hand stirring handle 401 is arranged at the top end of the rotary shaft 405, a plurality of container claws 45 uniformly distributed along the periphery are arranged in the middle section of the rotary shaft 405, a container 46 is arranged in the container claws 45, a top plate 47 is arranged at the upper end part of the rotary shaft 405, a spring 48 is arranged between the lower wall of the top plate 47 and the upper wall of the container 46, a bottle mouth 49 is arranged at the lower end of the, a closing plate 406 is arranged at the middle section of the thimble 40, a liquid outlet 407 penetrating to the outside of the bottle mouth is arranged in the bottle mouth, the closing plate 406 is arranged right below the liquid outlet 407, a flow channel 402 is arranged on the lower wall of the L-shaped support frame 23, a water tap 403 is arranged at the lower end of the flow channel 402, and when the L-shaped support frame works, when the container needs to be switched and other reagents are used, the hand stirring handle can be rotated by hand, the container is rotated immediately, due to the action of the spring, the container slides down in the only opening of the guide rail, when the bottle mouth of the container moves to the chemical liquid guide groove, the thimble falls downwards, the closing plate leaves the liquid outlet immediately, the liquid outlet is not closed, the liquid flows out to the flow passage and flows out from the water tap, when the hand stirring handle is rotated again, the container slides out of the chemical liquid guide groove and moves into the annular guide rail, the thimble is upward at the moment, the container is closed again, and the container can move up and down in the container claw.
According to the polishing machine, the rotating plate 5 is arranged on one side of the main body 1, and when the polishing machine works, the rubber pads are arranged on the side surfaces of the rotating plate, so that when chips falling in the polishing process need to be cleaned, the rotating plate can be opened for cleaning.
According to the invention, the PLC controller 6 is arranged on the front side of the main body 1, and when the PLC controller works, the input end of the PLC controller is electrically connected with the output end of an external power supply.
While there have been shown and described the fundamental principles and principal features of the invention and advantages thereof, it will be understood by those skilled in the art that the invention is not limited by the embodiments described above, which are given by way of illustration of the principles of the invention, but is susceptible to various changes and modifications without departing from the spirit and scope of the invention as defined by the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (4)
1. A chemical mechanical polishing apparatus comprising a main body (1), characterized in that: the polishing machine is characterized in that a clamping device (2) capable of clamping a polishing body is arranged in the main body (1), a polishing surface detection device (3) is arranged on one side of the main body (1), a rotary switching container mechanism (4) capable of polishing a workpiece is arranged on the upper side of the main body (1), the clamping device (2) comprises a rotary motor (21) arranged on the inner lower surface of the main body (1), a workpiece table (22) is arranged at the upper end of the rotary motor (21), an L-shaped support frame (23) is arranged on the upper surface of the rear side of the workpiece table (22), an electric telescopic rod (24) is arranged on the lower surface of the L-shaped support frame (23), a distance measurement sensor (25) is arranged on one side of the electric telescopic rod (24), a chuck (26) is arranged at the lower end of the electric telescopic rod (24), the chuck (26) is arranged at the upper end of the workpiece table (22), the rotary switching container mechanism (4) comprises a fixed shaft, the device is characterized in that a fixed table (42) is arranged at the upper end of the fixed shaft (41), a guide rail unique opening (404) is arranged on the front side of the surface of the fixed table (42), a chemical liquid guide groove (43) is arranged at the center of the guide rail unique opening (404), an annular guide rail (44) is arranged on the periphery of the surface ring of the fixed table (42), a rotating shaft (405) is arranged at the center of the upper surface of the fixed table (42), a hand stirring handle (401) is arranged at the top end of the rotating shaft (405), a plurality of container claws (45) uniformly distributed along the periphery are arranged in the middle section of the rotating shaft (405), a container (46) is arranged in the container claws (45), a top plate (47) is arranged at the upper end of the rotating shaft (405), a spring (48) is arranged between the lower wall of the top plate (47) and the upper wall of the container (46), a bottle mouth (49) is, the thimble (40) is inserted into the bottle neck and is provided with a thimble clamping piece (407), the middle section of the thimble (40) is provided with a sealing plate (406), a liquid outlet (407) penetrating to the outside of the bottle neck is arranged in the bottle neck, the sealing plate (406) is arranged under the liquid outlet (407), the lower wall of the L-shaped support frame (23) is provided with a flow passage (402), and the lower end of the flow passage (402) is provided with a water tap (403).
2. The chemical mechanical polishing apparatus according to claim 1, wherein the polishing surface detecting device (3) comprises a rotating rod motor (31) disposed on the upper wall of the front end of the main body (1), a rotating rod (32) is mounted on the upper end of the rotating rod motor (31), a surface roughness measuring instrument (33) is disposed at the end of the rotating rod (32), and a limit sensor (34) is disposed at one side of the rotating rod motor (31).
3. A chemical mechanical polishing apparatus according to claim 1, characterized in that a rotating plate (5) is provided at one side of said main body (1).
4. A chemical mechanical polishing apparatus according to claim 1, characterized in that a PLC controller (6) is provided at the front side of said main body (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810276853.6A CN108544362B (en) | 2018-03-30 | 2018-03-30 | Chemical mechanical polishing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810276853.6A CN108544362B (en) | 2018-03-30 | 2018-03-30 | Chemical mechanical polishing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108544362A CN108544362A (en) | 2018-09-18 |
| CN108544362B true CN108544362B (en) | 2020-11-03 |
Family
ID=63517521
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810276853.6A Active CN108544362B (en) | 2018-03-30 | 2018-03-30 | Chemical mechanical polishing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108544362B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116273259A (en) * | 2023-04-28 | 2023-06-23 | 广西鑫来农业发展有限公司 | Polishing machine and polishing method for polished rice processing |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4524643B2 (en) * | 2005-05-18 | 2010-08-18 | 株式会社Ｓｕｍｃｏ | Wafer polishing method |
| JP4819523B2 (en) * | 2006-02-21 | 2011-11-24 | 株式会社ディスコ | Processing fluid supply device |
| US10065288B2 (en) * | 2012-02-14 | 2018-09-04 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chemical mechanical polishing (CMP) platform for local profile control |
| KR101660898B1 (en) * | 2014-08-13 | 2016-09-28 | 주식회사 엘지실트론 | Apparatus for supplying slurry and polishing apparatus including the same |
| EA201700108A1 (en) * | 2014-09-09 | 2017-07-31 | Орора Лабс Лимитед | METHOD OF BULK PRINTING AND PRINTING DEVICE |
-
2018
- 2018-03-30 CN CN201810276853.6A patent/CN108544362B/en active Active
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| Publication number | Publication date |
|---|---|
| CN108544362A (en) | 2018-09-18 |
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| Date | Code | Title | Description |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20201009 Address after: No.309, building 1, No.168, Fenghuang West Road, pharmaceutical hi tech Industrial Development Zone, Taizhou City, Jiangsu Province 225300 Applicant after: Taizhou honghang Information Technology Co., Ltd Address before: 528400 A01, two floor, 15 industrial building, jiangtau Kang Yi Road, Torch Development Zone, Zhongshan, Guangdong. Applicant before: ZHONGSHAN GUANGYI AUTOMATION EQUIPMENT Co.,Ltd. |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20211013 Address after: 402760 No.92 Donglin Avenue, Biquan street, Bishan District, Chongqing Patentee after: Chongqing high tech Industry Research Institute Co., Ltd Address before: Room 309, building 1, 168 Fenghuang West Road, Taizhou pharmaceutical hi tech Industrial Development Zone, Jiangsu Province 225300 Patentee before: Taizhou honghang Information Technology Co., Ltd |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20211208 Address after: 402760 factory building B4, 100 Jianshan Road, Biquan street, Bishan District, Chongqing Patentee after: Chongqing Landai Transmission Machinery Co.,Ltd. Address before: 402760 No.92 Donglin Avenue, Biquan street, Bishan District, Chongqing Patentee before: Chongqing high tech Industry Research Institute Co., Ltd |