CN111152128A - Grinding device for failed wafer - Google Patents
Grinding device for failed wafer Download PDFInfo
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- CN111152128A CN111152128A CN202010073595.9A CN202010073595A CN111152128A CN 111152128 A CN111152128 A CN 111152128A CN 202010073595 A CN202010073595 A CN 202010073595A CN 111152128 A CN111152128 A CN 111152128A
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- grinding
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- polishing
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- wafer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
A spent wafer polishing apparatus comprising: the grinding table is provided with a grinding surface and is used for grinding the surface to be ground of the failed wafer; and the automatic grinding liquid titration unit is used for uniformly dripping grinding liquid onto the grinding surface of the grinding table when the grinding table grinds the surface to be ground of the failed wafer. The grinding device for the failed wafer comprises an automatic grinding liquid titration unit, wherein the automatic grinding liquid titration unit can uniformly drop grinding liquid into the grinding surface of the grinding table when the grinding table grinds the surface to be ground of the failed wafer, so that the dropping speed and the dropping amount of the grinding liquid can be accurately controlled, the waste of the grinding liquid caused by manually dropping the grinding liquid is avoided, the grinding uniformity of the failed wafer can be improved, and when the back of the failed wafer needs to be pressed during grinding, an operator or a detector can press the back of the failed wafer with two hands, and the grinding uniformity of the failed wafer is improved.
Description
Technical Field
The invention relates to the field of failure wafer detection, in particular to a failure wafer grinding device.
Background
Generally, the failure of the chip during development, production and use is inevitable. With the continuous improvement of the requirements of people on product quality and reliability, the failure analysis work is more and more important, and through the chip failure analysis, the integrated circuit designer can be helped to find the problems of design defects, mismatching of process parameters, improper design and operation and the like. Specifically, the significance of failure analysis is mainly shown in the following aspects: failure analysis is a necessary means to determine the failure mechanism of a chip; failure analysis provides necessary information for effective fault diagnosis; failure analysis provides necessary feedback information for design engineers to continuously improve or repair the design of the chip so as to make the chip more consistent with the design specification; the failure analysis can evaluate the effectiveness of different test vectors, provide necessary supplement for production test and provide necessary information basis for verifying test flow optimization.
Proper failure analysis is critical to improving the quality of the chip. Incorrect failure analysis may lengthen the cycle time required to develop and upgrade chip products. Generally, failure analysis includes external inspection, non-destructive analysis, electrical property detection, destructive analysis, and the like.
As the degree of integration of chips increases, the structure of elements forming the chips becomes a three-dimensional complex structure in order to obtain a sufficiently large capacity in a limited area. The increase in complexity of the chip makes it impossible to accurately analyze the source of the failure by external inspection or electrical performance detection, which requires that a delamination process is used to open the semiconductor package layer and remove the coating layer, such as the silicon layer and the oxide layer, on the wafer to be tested, so as to expose the failure condition of the stacked structure of the chip or expose the failure position.
The conventional common thin-layer processing technology includes chemical mechanical polishing, which is performed on a failed wafer polishing device, and when masking a failed wafer, the surface to be polished of the failed wafer needs to be attached to a polishing table of the failed wafer polishing device, then the back of the failed wafer is pressed, polishing liquid is manually added to the polishing table, and the polishing table rotates to polish the surface to be polished of the failed wafer. When the traditional invalid wafer grinding device grinds an invalid wafer, the problems of uneven grinding, great waste of grinding liquid and the like are easily caused.
Disclosure of Invention
The invention aims to solve the technical problem of how to improve the grinding uniformity and reduce the waste of grinding liquid when grinding a failed wafer.
The invention provides a failure wafer grinding device, which comprises:
the grinding table is provided with a grinding surface and is used for grinding the surface to be ground of the failed wafer;
and the automatic grinding liquid titration unit is used for uniformly dripping grinding liquid onto the grinding surface of the grinding table when the grinding table grinds the surface to be ground of the failed wafer.
Optionally, the automatic titration unit of lapping liquid includes stock solution bottle, support and burette, the stock solution bottle is used for storing the lapping liquid, the support is used for supporting the stock solution bottle for the stock solution bottle is located grinding table top, the burette with the stock solution bottle is connected, the lapping liquid in the stock solution bottle through the even instiling of burette on the abrasive surface of grinding table.
Optionally, the automatic titration unit of lapping liquid includes stock solution bottle, support and burette, the stock solution bottle is used for storing the lapping liquid, the support is used for supporting the stock solution bottle for the stock solution bottle is located grinding table top, the burette with the stock solution bottle is connected, the lapping liquid in the stock solution bottle drips into through the burette is even under the effect of gravity on the abrasive surface of grinding table.
Optionally, a switch is arranged between the liquid storage bottle and the dropper, and the switch is used for controlling the on-off of the grinding liquid flowing into the dropper from the liquid storage bottle and controlling the dropping speed of the grinding liquid in the dropper.
Optionally, the switch is a manual switch, and the manual switch is manually turned on and off by a device technician.
Optionally, the manual switch is a valve switch, the valve switch includes an inlet end and an outlet end and a regulating valve located between the inlet end and the outlet end, the inlet end is connected with the liquid storage bottle, the outlet end is connected with the dropper, and the regulating valve is manually regulated to control the on-off of the grinding fluid flowing into the dropper from the liquid storage bottle and the dropping speed of the grinding fluid in the dropper.
Optionally, the dropper is a hose, the manual switch is a clamping switch, the clamping switch is clamped on the hose, the clamping switch includes a supporting portion and a clamping portion matched with the supporting portion, the supporting portion has a gradually raised supporting surface, the clamping portion is arranged above the supporting surface, the dropper passes through the clamping portion and the supporting surface, and the distance between the clamping portion and the supporting surface is reduced by sliding the clamping portion, so that the dropper is pressed, a passage in the dropper is blocked or the aperture of the passage is reduced, and the on-off of the grinding fluid flowing into the dropper from the liquid storage bottle and the dropping speed of the grinding fluid in the dropper are controlled.
Optionally, the switch is an automatic switch, and the automatic switch is controlled to be turned on and off by a switch control signal.
Optionally, the failed wafer grinding device further comprises a base and a grinding table driving unit, the grinding table driving unit is located on the base, and the grinding table driving unit is connected with the grinding table and used for driving the grinding table to rotate and driving the grinding table to move up and down.
Optionally, the failed wafer polishing apparatus further includes a control unit, where the control unit is configured to send a polishing control signal to the polishing table driving unit, so as to control the work of the polishing table through the polishing table driving unit, and control the rotation speed and the rotation time of the polishing table through the polishing table driving unit.
Optionally, when the switch is an automatic switch, the control unit is further configured to send a control switch control signal to the automatic switch, the automatic switch is turned on and off under the control of the switch control signal to control the on-off of the grinding fluid in the dropper, and the automatic switch can also control the size of the switch under the control of the switch control signal to control the dropping speed of the grinding fluid in the dropper.
Optionally, the control unit sends a switch control signal after sending the grinding control signal.
Optionally, a grinding fluid waste liquid collecting tank is arranged in the base around the grinding table.
Optionally, the support includes horizontal support and the vertical support of being connected with horizontal support, horizontal support is connected with the stock solution bottle, through adjusting the position of horizontal support or vertical support, or through adjusting the position regulation stock solution bottle of horizontal support and vertical support.
Optionally, the positions of the transverse support and the longitudinal support are manually adjusted.
Optionally, the support driving unit is connected with the transverse support and the longitudinal support, and the positions of the transverse support and the longitudinal support are adjusted by the driving of the support driving unit.
Optionally, the liquid storage bottle is a closed liquid storage bottle, and an air pressure adjusting port or an air pressure adjusting pipe is arranged on the liquid storage bottle, so that air can enter the liquid storage bottle from the air pressure adjusting port or the air pressure adjusting pipe instead of entering the liquid storage bottle from a dropper, and the pressure in the liquid storage bottle can be adjusted.
Compared with the prior art, the technical scheme of the invention has the following advantages:
the invention relates to a grinding device for a failed wafer, which comprises: the grinding table is provided with a grinding surface and is used for grinding the surface to be ground of the failed wafer; and the automatic grinding liquid titration unit is used for uniformly dripping grinding liquid onto the grinding surface of the grinding table when the grinding table grinds the surface to be ground of the failed wafer. The grinding device for the failed wafer comprises an automatic grinding liquid titration unit, wherein the automatic grinding liquid titration unit can uniformly drop grinding liquid into the grinding surface of the grinding table when the grinding table grinds the surface to be ground of the failed wafer, so that the dropping speed and the dropping amount of the grinding liquid can be accurately controlled, the waste of the grinding liquid caused by manually dropping the grinding liquid is avoided, the grinding uniformity of the failed wafer can be improved, and when the back of the failed wafer needs to be pressed during grinding, an operator or a detector can press the back of the failed wafer with two hands, and the grinding uniformity of the failed wafer is improved.
Further, the automatic titration unit of lapping liquid includes stock solution bottle, support and burette, the stock solution bottle is used for storing the lapping liquid, the support is used for supporting the stock solution bottle for the stock solution bottle is located grinding table top, the burette with the stock solution bottle is connected, the lapping liquid in the stock solution bottle is even through dripping into of burette on the abrasive surface of grinding table, the automatic titration unit of lapping liquid of aforementioned structure simple structure to can realize that the lapping liquid is even drips into on the abrasive surface of grinding table.
Further, when the liquid storage bottle is airtight liquid storage bottle, can set up atmospheric pressure regulation mouth or atmospheric pressure control pipe on the liquid storage bottle for the air can be rather than getting into the liquid storage bottle from the burette from atmospheric pressure regulation mouth or atmospheric pressure control pipe in getting into the liquid storage bottle, with the pressure in adjusting the liquid storage bottle, thereby make the abrasive fluid in the liquid storage bottle can be more even drip the abrasive surface on the grinding bench down, improve the homogeneity to the wafer grinding that became invalid.
Further, a switch is arranged between the liquid storage bottle and the dropper and used for controlling the on-off of the grinding liquid flowing into the dropper from the liquid storage bottle and the dropping speed of the grinding liquid in the dropper so as to meet various grinding requirements and be beneficial to controlling the dropping uniformity of the grinding liquid, thereby further improving the grinding uniformity of the failed wafer.
Further, a switch is arranged between the liquid storage bottle and the dropper, the switch is an automatic switch, the failure wafer grinding device further comprises a control unit, the control unit is further used for sending control switch control telecommunication to the automatic switch, the automatic switch is opened and closed under the control of the switch control signal to control the on-off of the grinding liquid in the dropper, and the automatic switch can also control the opening size of the switch under the control of the switch control signal to control the dropping speed of the grinding liquid in the dropper. And the control unit sends a switch control signal after sending the grinding control signal. The setting mode of the switch and the corresponding control mode can accurately control the grinding starting time and the dropping time of the grinding liquid, accurately control the dropping speed of the grinding liquid in the dropper, and further improve the grinding uniformity of the failed wafer.
Drawings
FIG. 1 is a schematic view of a failed wafer polishing apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a failed wafer polishing apparatus according to another embodiment of the present invention.
Detailed Description
As mentioned in the background, the conventional failed wafer polishing apparatus is prone to cause problems such as uneven polishing and great waste of polishing slurry when polishing a failed wafer.
Research shows that when the conventional failed wafer grinding device is used for grinding a failed wafer, grinding fluid is manually added, the adding amount of the grinding fluid and the flow rate of the grinding fluid are difficult to control, the problems of waste of the grinding fluid, uneven grinding and the like are easily caused, one hand is required to press the back of the failed wafer during grinding, the other hand is required to add the grinding fluid, the grinding fluid is not beneficial to grinding by two hands, and the grinding uniformity of the failed wafer is further influenced.
Therefore, the invention provides a failed wafer grinding device, which comprises: the grinding table is provided with a grinding surface and is used for grinding the surface to be ground of the failed wafer; and the automatic grinding liquid titration unit is used for uniformly dripping grinding liquid onto the grinding surface of the grinding table when the grinding table grinds the surface to be ground of the failed wafer. The grinding device for the failed wafer comprises an automatic grinding liquid titration unit, wherein the automatic grinding liquid titration unit can uniformly drop grinding liquid into the grinding surface of the grinding table when the grinding table grinds the surface to be ground of the failed wafer, so that the dropping speed and the dropping amount of the grinding liquid can be accurately controlled, the waste of the grinding liquid caused by manually dropping the grinding liquid is avoided, the grinding uniformity of the failed wafer can be improved, and when the back of the failed wafer needs to be pressed during grinding, an operator or a detector can press the back of the failed wafer with two hands, and the grinding uniformity of the failed wafer is improved.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In describing the embodiments of the present invention in detail, the drawings are not to be considered as being enlarged partially in accordance with the general scale, and the drawings are only examples, which should not be construed as limiting the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in the actual fabrication.
An embodiment of the present invention provides a device for grinding a failed wafer, referring to fig. 1, including:
a grinding table 101, wherein the grinding table 101 has a grinding surface for grinding the surface to be ground of the failed wafer 102;
the automatic polishing solution titration unit 210 is configured to drop the polishing solution 205 uniformly onto the polishing surface of the polishing table 101 when the polishing table 101 polishes the surface to be polished of the failed wafer.
Specifically, the polishing table 101 is used for supporting the wafer 102 to be failed and polishing the surface to be polished of the failed wafer 102 by a polishing surface. The polishing table 101 may include a base and a polishing surface on the base, the base may be made of metal or other hard and rigid materials, and the polishing surface may be specifically an abrasive cloth or an abrasive pad fixed on the base.
The polishing table 101 can rotate, and the height of the polishing table 101 can also be adjusted (the polishing table 101 can move up and down), in an embodiment, the rotation and height adjustment of the polishing table 101 can be realized by a polishing table driving unit 104, and the polishing table driving unit 104 can specifically include a polishing table rotation driving unit and a polishing table height driving unit. The grinding table driving unit 104 at least includes a motor (such as a stepping motor or a motor driving circuit) connected to the motor, the motor includes a rotating shaft, one end of the rotating shaft is connected to the grinding table, and the rotating shaft of the motor drives the grinding table to rotate when rotating.
The apparatus further includes a base 100, and the polishing table driving unit 104 is disposed on the base 100. The failed wafer polishing device further comprises a control unit 107, wherein the control unit 107 is configured to send a polishing control signal to the polishing table driving unit 104, so as to control the operation of the polishing table 102 through the polishing table driving unit 104, and control the rotation speed and the rotation time of the polishing table 101 through the polishing table driving unit 104. In a specific embodiment, the control unit 107 may include a human-machine interaction panel or control buttons, and an operator or a tester may adjust the rotation speed or the rotation time of the grinding table 101 through the human-machine interaction panel or control buttons.
A slurry waste collection tank 106 is provided in the base 100 around the polishing table 101 to collect and discharge slurry waste into a lower discharge pipe of a factory during polishing.
The failed wafer 102 is a wafer to be subjected to failure analysis, and the failed wafer polishing apparatus according to the embodiment of the present invention is used to polish the surface of the failed wafer 102 to remove an unnecessary coating, such as a plastic package layer, a passivation layer, a dielectric layer (such as a silicon oxide layer) or a metal layer, to expose a failure condition of a stacked structure in the failed wafer 102 or expose a failure location. The failed wafer 102 may be a sample wafer or a product wafer after a certain semiconductor process (e.g., photolithography, etching, ion implantation, chemical mechanical polishing) is performed, or a wafer after plastic encapsulation is performed.
When polishing is performed, the surface to be polished of the failed wafer 102 is attached to the polishing surface of the polishing table 101, the back surface (the surface opposite to the surface to be polished) of the failed wafer 102 is pressed by a human hand or a related holding mechanism (the mechanism may be a part of a failed wafer polishing apparatus), and the surface of the failed wafer 102 is polished when the polishing table 101 rotates.
In the present invention, the failed wafer polishing apparatus includes an automatic titration unit 210 of polishing slurry, and the automatic titration unit 210 of polishing slurry can uniformly drop the polishing slurry 205 onto the polishing surface of the polishing table 101 when the polishing table 101 polishes the surface to be polished of the failed wafer. Therefore, the dropping speed and the dropping amount of the grinding liquid can be accurately controlled, the waste of the grinding liquid caused by manually dropping the grinding liquid is avoided, the grinding uniformity of the failed wafer can be improved, when the back of the failed wafer needs to be pressed during grinding, an operator or a detector can press the back of the failed wafer by two hands, and the grinding uniformity of the failed wafer is improved.
In an embodiment, the automatic titration unit 210 for polishing slurry includes a liquid bottle 202, a support 201 and a dropper 203, the liquid bottle 202 is used for storing the polishing slurry 205, the support 210 is used for supporting the liquid bottle 202, so that the liquid bottle 202 is located above the polishing table 101, the dropper 203 is connected to the liquid bottle 205, the polishing slurry in the liquid bottle 205 is uniformly dripped onto the polishing surface of the polishing table 101 through the dropper 203 under the action of gravity, the automatic titration unit 210 for polishing slurry with the above structure is simple in structure, and the polishing slurry can be uniformly dripped onto the polishing surface of the polishing table 101.
In an embodiment, the top of the liquid storage bottle 202 has a liquid inlet to facilitate adding the grinding fluid into the liquid inlet, a bottle cap may be disposed on the liquid inlet, and after the liquid is added, the bottle cap may be screwed to seal the liquid inlet, so as to maintain the sealed state of the liquid storage bottle 202 and prevent the contaminants from entering the liquid storage bottle. In an embodiment, when the liquid storage bottle 202 is kept in a sealed state or when the liquid storage bottle 202 is a sealed liquid storage bottle, an air pressure adjusting port or an air pressure adjusting pipe may be disposed on the liquid storage bottle 202, so that air may enter the liquid storage bottle from the air pressure adjusting port or the air pressure adjusting pipe instead of entering the liquid storage bottle 202 from the dropper 203 to adjust the pressure in the liquid storage bottle 202, thereby enabling the grinding fluid 205 in the liquid storage bottle to more uniformly drop onto the grinding surface on the grinding table 101, and improving the uniformity of grinding the failed wafer. In other embodiments, the top of the reservoir 202 may be open.
A switch 204 is arranged between the liquid storage bottle 202 and the dropper 203, and the switch 204 is used for controlling the on-off of the grinding fluid 205 flowing into the dropper 203 from the liquid storage bottle 202 and controlling the dropping speed of the grinding fluid 205 in the dropper 204 so as to meet various grinding requirements and facilitate the control of the dropping uniformity of the grinding fluid 205, thereby further improving the grinding uniformity of the failed wafer.
In one embodiment, the switch 204 may be a manual switch that is manually turned on and off by a plant technician.
In a specific embodiment, the manual switch (204) is a valve type switch (as shown in fig. 1), the valve type switch (204) includes an inlet end and an outlet end, and a regulating valve 211 located between the inlet end and the outlet end, the inlet end is connected to the liquid storage bottle 202, the outlet end is connected to the dropper 203, and the regulating valve 211 is manually adjusted to control on/off of the grinding fluid flowing from the liquid storage bottle into the dropper 203 and control the dropping speed of the grinding fluid in the dropper 203.
In another specific embodiment, the dropper 203 is a hose, the manual switch is a snap switch, the snap switch is snapped on the hose 203, the snap switch comprises a support portion and a snap portion engaged with the support portion, the support portion has a gradually raised support surface, the snap portion is disposed above the support surface, the dropper 203 passes between the snap portion and the support surface, and the distance between the snap portion and the support surface is reduced by sliding the snap portion, so as to press the dropper 203, so that the passage in the dropper 203 is blocked or the aperture of the passage is reduced, thereby controlling the on/off of the grinding fluid 205 flowing into the dropper 203 from the liquid storage bottle 202 and controlling the dropping speed of the grinding fluid 205 in the dropper 203.
The setting mode of the two manual switches is simple to operate and low in cost.
In another embodiment, referring to fig. 2, the switch 204 is an automatic switch, and the automatic switch (204) is controlled to be turned on and off by a switch control signal.
Specifically, the control unit 107 is further configured to send a control switch control signal to the automatic switch 204, the automatic switch 204 is turned on and off under the control of the switch control signal to control the on/off of the polishing liquid in the dropping pipe 203, and the automatic switch 204 can also control the on size of the switch under the control of the switch control signal to control the dropping speed of the polishing liquid in the dropping pipe 203. The control unit 107 sends a switching control signal after sending the grinding control signal. The setting mode of the switch and the corresponding control mode can accurately control the grinding starting time and the dropping time of the grinding liquid, and accurately control the dropping speed of the grinding liquid in the dropper 203, thereby further improving the grinding uniformity of the failed wafer.
The support 201 comprises a transverse support 2011 and a longitudinal support 2012 connected with the transverse support 2011, the transverse support 2011 is connected with the liquid storage bottle 202 and is fixed to the liquid storage bottle 202, and one end, connected with the transverse support 2011, of the longitudinal support 2011 is fixed to a base 200. The positions of the liquid storage bottles 202 are adjusted by adjusting the positions of the transverse support 2011 or the longitudinal support 2012, or by adjusting the positions of the transverse support 211 and the longitudinal support 2012, so that the grinding fluid 205 in the liquid storage bottles 202 can be dripped to a specific position on the grinding table 101, and different grinding requirements are met.
In an embodiment, the positions of the lateral and longitudinal brackets 2011, 21 may be manually adjusted by an operator or a human inspector.
In another embodiment, a support driving unit (not shown in the drawings) is further included, and the support driving unit is connected to the transverse support 2011 and the longitudinal support 2012, and the positions of the transverse support 2011 and the longitudinal support 2012 are adjusted by the driving of the support driving unit.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (16)
1. A device for polishing a failed wafer, comprising:
the grinding table is provided with a grinding surface and is used for grinding the surface to be ground of the failed wafer;
and the automatic grinding liquid titration unit is used for uniformly dripping grinding liquid onto the grinding surface of the grinding table when the grinding table grinds the surface to be ground of the failed wafer.
2. The apparatus for grinding a waste wafer according to claim 1, wherein the automatic titration unit of the polishing slurry comprises a liquid bottle for storing the polishing slurry, a holder for supporting the liquid bottle such that the liquid bottle is located above the polishing table, and a dropper connected to the liquid bottle, wherein the polishing slurry in the liquid bottle is uniformly dropped onto the polishing surface of the polishing table by the dropper under the action of gravity.
3. The apparatus for polishing a defective wafer as claimed in claim 2, wherein a switch is provided between the liquid storage bottle and the dropping tube, and the switch is used for controlling the on-off of the slurry flowing from the liquid storage bottle into the dropping tube and the dropping speed of the slurry in the dropping tube.
4. The apparatus of claim 3, wherein the switch is a manual switch that is manually turned on and off by a facility technician.
5. The apparatus for polishing a failed wafer as claimed in claim 4, wherein the manual switch is a valve switch, the valve switch comprises an inlet end and an outlet end and a regulating valve between the inlet end and the outlet end, the inlet end is connected to the liquid storage bottle, the outlet end is connected to the dropping tube, and the regulating valve is manually adjusted to control the on/off of the slurry flowing from the liquid storage bottle into the dropping tube and the dropping speed of the slurry in the dropping tube.
6. The apparatus for polishing waste wafer as claimed in claim 4, wherein the dropper is a hose, the manual switch is a snap switch, the snap switch is snapped on the hose, the snap switch includes a support portion and a snap portion engaged with the support portion, the support portion has a gradually raised support surface, the snap portion is disposed above the support surface, the dropper passes between the snap portion and the support surface, and the distance between the snap portion and the support surface is reduced by sliding the snap portion, so as to press the dropper, so that the passage in the dropper is blocked or the diameter of the passage is reduced, thereby controlling the on/off of the slurry flowing from the liquid bottle into the dropper and the dropping rate of the slurry in the dropper.
7. The apparatus of claim 4, wherein the switch is an automatic switch, and wherein the automatic switch is controlled to be turned on and off by a switch control signal.
8. The apparatus of claim 1 or 7, further comprising a base and a polishing table driving unit, wherein the polishing table driving unit is disposed on the base, and the polishing table driving unit is connected to the polishing table for driving the polishing table to rotate and driving the polishing table.
9. The apparatus of claim 8, further comprising a control unit for sending a polishing control signal to the polishing table driving unit to control the operation of the polishing table by the polishing table driving unit and to control the rotation speed and the rotation time of the polishing table by the polishing table driving unit.
10. The apparatus for polishing waste wafer as claimed in claim 9, wherein when the switch is an automatic switch, the control unit is further configured to send a control switch control signal to the automatic switch, the automatic switch is turned on and off under the control of the switch control signal to control the on/off of the slurry in the dropping pipe, and the automatic switch is further configured to control the on-off of the switch under the control of the switch control signal to control the dropping speed of the slurry in the dropping pipe.
11. The apparatus of claim 11, wherein the control unit sends a switch control signal after sending the polishing control signal.
12. The apparatus of claim 8, wherein the base surrounding the polishing table has a slurry waste collection trough therein.
13. The apparatus of claim 2, wherein the holder comprises a lateral holder and a longitudinal holder connected to the lateral holder, the lateral holder is connected to the reservoir, and the position of the reservoir is adjusted by adjusting the position of the lateral holder or the longitudinal holder, or by adjusting the positions of the lateral holder and the longitudinal holder.
14. The apparatus of claim 13, wherein the position of the lateral and longitudinal supports is manually adjusted.
15. The apparatus for polishing a defective wafer as claimed in claim 13, further comprising a carrier driving unit connected to the lateral carrier and the longitudinal carrier, the positions of the lateral carrier and the longitudinal carrier being adjusted by driving of the carrier driving unit.
16. The apparatus for polishing a defective wafer as claimed in claim 1, wherein the liquid storage bottle is a sealed liquid storage bottle, and an air pressure adjusting port or an air pressure adjusting tube is provided on the liquid storage bottle, so that air can enter the liquid storage bottle from the air pressure adjusting port or the air pressure adjusting tube instead of entering the liquid storage bottle from the dropper, thereby adjusting the pressure in the liquid storage bottle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010073595.9A CN111152128A (en) | 2020-01-22 | 2020-01-22 | Grinding device for failed wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010073595.9A CN111152128A (en) | 2020-01-22 | 2020-01-22 | Grinding device for failed wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111152128A true CN111152128A (en) | 2020-05-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010073595.9A Pending CN111152128A (en) | 2020-01-22 | 2020-01-22 | Grinding device for failed wafer |
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| CN (1) | CN111152128A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112548847A (en) * | 2020-12-09 | 2021-03-26 | 苏州斯尔特微电子有限公司 | Static pressure carrying platform for wafer grinding |
| CN115091352A (en) * | 2022-07-14 | 2022-09-23 | 长鑫存储技术有限公司 | Grinder, grinding fluid flow control method and device, storage medium and equipment |
-
2020
- 2020-01-22 CN CN202010073595.9A patent/CN111152128A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112548847A (en) * | 2020-12-09 | 2021-03-26 | 苏州斯尔特微电子有限公司 | Static pressure carrying platform for wafer grinding |
| CN112548847B (en) * | 2020-12-09 | 2022-09-09 | 苏州斯尔特微电子有限公司 | Static pressure carrying platform for wafer grinding |
| CN115091352A (en) * | 2022-07-14 | 2022-09-23 | 长鑫存储技术有限公司 | Grinder, grinding fluid flow control method and device, storage medium and equipment |
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