CN108538796A - 应用于石墨烯散热机构的高散热性能石墨烯散热膜 - Google Patents
应用于石墨烯散热机构的高散热性能石墨烯散热膜 Download PDFInfo
- Publication number
- CN108538796A CN108538796A CN201810280833.6A CN201810280833A CN108538796A CN 108538796 A CN108538796 A CN 108538796A CN 201810280833 A CN201810280833 A CN 201810280833A CN 108538796 A CN108538796 A CN 108538796A
- Authority
- CN
- China
- Prior art keywords
- support plate
- graphene
- bottom support
- plate
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3738—Semiconductor materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
- H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810280833.6A CN108538796A (zh) | 2018-04-02 | 2018-04-02 | 应用于石墨烯散热机构的高散热性能石墨烯散热膜 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810280833.6A CN108538796A (zh) | 2018-04-02 | 2018-04-02 | 应用于石墨烯散热机构的高散热性能石墨烯散热膜 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN108538796A true CN108538796A (zh) | 2018-09-14 |
Family
ID=63481948
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810280833.6A Withdrawn CN108538796A (zh) | 2018-04-02 | 2018-04-02 | 应用于石墨烯散热机构的高散热性能石墨烯散热膜 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN108538796A (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110880629A (zh) * | 2019-11-19 | 2020-03-13 | 安徽省聚科石墨烯科技股份公司 | 一种石墨烯辅助相变材料散热的电池组装置 |
US20210079282A1 (en) * | 2019-09-18 | 2021-03-18 | Nanotek Instruments, Inc. | Polymer-derived elastic heat spreader films |
-
2018
- 2018-04-02 CN CN201810280833.6A patent/CN108538796A/zh not_active Withdrawn
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20210079282A1 (en) * | 2019-09-18 | 2021-03-18 | Nanotek Instruments, Inc. | Polymer-derived elastic heat spreader films |
CN110880629A (zh) * | 2019-11-19 | 2020-03-13 | 安徽省聚科石墨烯科技股份公司 | 一种石墨烯辅助相变材料散热的电池组装置 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20190821 Address after: 233000 Anhui province Bengbu City Choi Road No. 10 Applicant after: Tao Yong Address before: 212327 Xinxing Street, Huangtang Town, Danyang City, Zhenjiang City, Jiangsu Province Applicant before: Danyang Zhong Gu new material technology Co., Ltd. |
|
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20191122 Address after: No.101, China (Bengbu) microelectronics technology park, No.10 Caiyuan Road, Bengbu Economic Development Zone, 233000, Anhui Province Applicant after: Anhui carbon China New Material Technology Co., Ltd Address before: 233000 Anhui province Bengbu City Choi Road No. 10 Applicant before: Tao Yong |
|
TA01 | Transfer of patent application right | ||
WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180914 |
|
WW01 | Invention patent application withdrawn after publication |