CN108521753A - A kind of conductive structure for realizing high-efficiency heat conduction function - Google Patents
A kind of conductive structure for realizing high-efficiency heat conduction function Download PDFInfo
- Publication number
- CN108521753A CN108521753A CN201810766643.5A CN201810766643A CN108521753A CN 108521753 A CN108521753 A CN 108521753A CN 201810766643 A CN201810766643 A CN 201810766643A CN 108521753 A CN108521753 A CN 108521753A
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- China
- Prior art keywords
- chip
- thermally conductive
- conductive sheet
- heat conduction
- conductive structure
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention provides a kind of conductive structure for realizing high-efficiency heat conduction function, including wiring board, chip, chip, which is fixed, is arranged conductive structure above chip in the circuit board；Conductive structure includes thermally conductive sheet main body, is Z-shaped；Protruding portion is arranged in thermally conductive sheet bottom part body quadrangle, and screw hole is arranged on the protruding portion；Thermally conductive sheet main body is fitted in chip upper surface.Present invention aims at a kind of thermally conductive sheet for realizing high-efficiency heat conduction function is provided, chip running environment can be improved, reduce environment temperature.
Description
Technical field
The invention belongs to field of radiating, and in particular to a kind of conductive structure for realizing high-efficiency heat conduction function.
Background technology
Aluminium alloy is the alloy general name using aluminium as base.Main alloy element has copper, silicon, magnesium, zinc, manganese.Secondary alloying element
There are nickel, iron, titanium, chromium, lithium etc..Aluminium alloy density is low, but intensity is relatively high, and near or above high-quality steel, shaping is good, easy processing
At various proximate matters, there is excellent electric conductivity, thermal conductivity and corrosion stability, be industrially widely used, at present on using measurement
It has been only second to steel.
Aluminium alloy has superior superelevation operating temperature, electrical and thermal conductivity performance, high intensity and hardness, extra-strong corrosion resistant, density
The features such as small light-weight.It is used widely in the mainstreams such as electronic apparatus, the communication apparatus, auto industry, medical instrument field.But
The conduction of heat, chip processor can't be carried out between the thermally conductive sheet and chip processor that are current aluminum alloy material well
Generated hot high temperature easily detracts chip service life during long-play, influences chip processing capabilities, while
It can influence its stability, the also unresolved this problem of existing technology.
Invention content
To solve the deficiencies in the prior art, present invention aims at providing a kind of thermally conductive sheet that realizing high-efficiency heat conduction function,
Chip running environment can be improved, reduce environment temperature.
A kind of conductive structure for realizing high-efficiency heat conduction function, including wiring board, chip, chip fix its spy in the circuit board
Sign is, conductive structure is arranged above the chip；
The conductive structure includes thermally conductive sheet main body, is Z-shaped；
Protruding portion is arranged in the thermally conductive sheet bottom part body quadrangle, and screw hole is arranged on the protruding portion；
The thermally conductive sheet main body is fitted in chip upper surface.
Further, the thermally conductive sheet main body using polylith perpendicular to bottom plate etc. big aluminium alloy thermally conductive sheet.
Further, the aluminium alloy thermally conductive sheet is Z-shaped.
Further, the bolts through bolt holes that outer attached spring is arranged fix thermally conductive sheet main body in the circuit board.
Further, layer of silica gel is set between the thermally conductive sheet main body and chip, and silica gel usage amount is that chip area three divides
Two.
The present invention can improve chip running environment, solve produced hot height during chip processor long-play
The defect that temperature detracts chip service life avoids chip because high temperature influences its speed of service and stability, greatly prolongs
Long chip processor service life.
Description of the drawings
Fig. 1 is the side view of the present invention.
Fig. 2 is vertical view of the present invention.
Fig. 3 is the dimensional structure diagram of thermally conductive sheet main body of the present invention.
Specific implementation mode
A kind of conductive structure for realizing high-efficiency heat conduction function of the present invention, including wiring board 1, chip 2, chip 2 are fixed on
1 on wiring board, conductive structure is arranged in 2 top of chip.
The conductive structure of the present invention includes thermally conductive sheet main body 3, is Z-shaped；Protruding portion 4 is arranged in thermally conductive sheet bottom part body quadrangle,
Screw hole is set on protruding portion, passes through screw hole to fix thermally conductive sheet main body in assist side 1 by the screw 5 of outer attached spring.
Thermally conductive sheet main body is fitted in chip upper surface, and thermally conductive sheet main body is using polylith perpendicular to bottom plate（Fig. 3 is not shown）Equal big Z-shaped aluminium
Alloy thermally conductive sheet 6.Setting can be arranged silica gel and is bonded between thermally conductive sheet main body and chip, constitute tripe glue-line（Do not show in figure
Go out）, silica gel usage amount is chip area 2/3rds.
More preferably to realize that the high-efficiency heat conduction function of thermally conductive sheet, chips area of the present invention are less than thermally conductive sheet area, such core
The hot high temperature that piece long-play generates can carry out heat by the relatively large thermally conductive sheet of area and continually unidirectionally pass
It passs.Chip own temperature is reduced with this, good running environment is provided, greatly extends the service life of chip.
For preferably realize the unidirectional heat between chip and thermally conductive sheet conduct, enough fittings can be carried out with heat conductive silica gel,
The high temperature generated in preventing chip from running cannot be well transferred to Z-shaped thermally conductive sheet.Wherein the usage amount of silica gel is chip area
2/3, excessively will appear silica gel overflow situation.Why thermally conductive sheet uses Z-shaped, is because the shape can generate chip
Heat unidirectionally upward gradient is conducted, be not in heat passback problem, while maximum is also reached to the utilization rate of material,
The case where being not in waste.The fixing screws of the present invention（Outer attached spring）Extra external force in installation process can be realized rebound,
It reduces the degree of wear between thermally conductive sheet and chip and promotes stability.
The thermally conductive sheet quantity and chip area size that thermally conductive sheet main body of the present invention uses are proportional, and general quantity is 10
Piece or so is realized to passing effect and is maximized there are the interval of certain distance between every thermally conductive sheet.Extend chip with this and uses the longevity
Life.
All above-mentioned this intellectual properties of primarily implementation, there is no this new products of implementation of setting limitation other forms
And/or new method.Those skilled in the art will utilize this important information, the above modification, to realize similar execution feelings
Condition.But all modifications or transformation belong to the right of reservation based on new product of the present invention.
The above described is only a preferred embodiment of the present invention, being not that the invention has other forms of limitations, appoint
What those skilled in the art changed or be modified as possibly also with the technology contents of the disclosure above equivalent variations etc.
Imitate embodiment.But it is every without departing from technical solution of the present invention content, according to the technical essence of the invention to above example institute
Any simple modification, equivalent variations and the remodeling made, still fall within the protection domain of technical solution of the present invention.
Claims (5)
1. a kind of conductive structure for realizing high-efficiency heat conduction function, including wiring board, chip, chip fixes its feature in the circuit board
It is, conductive structure is set above the chip；
The conductive structure includes thermally conductive sheet main body, is Z-shaped；
Protruding portion is arranged in the thermally conductive sheet bottom part body quadrangle, and screw hole is arranged on the protruding portion；
The thermally conductive sheet main body is fitted in chip upper surface.
2. a kind of conductive structure for realizing high-efficiency heat conduction function according to claim 1, which is characterized in that the heat conduction
Piece main body using polylith perpendicular to bottom plate etc. big aluminium alloy thermally conductive sheet.
3. a kind of conductive structure for realizing high-efficiency heat conduction function according to claim 2, which is characterized in that the aluminium closes
Golden thermally conductive sheet is Z-shaped.
4. a kind of conductive structure for realizing high-efficiency heat conduction function according to claim 1, which is characterized in that the outer attached bullet of setting
The bolts through bolt holes of spring fix thermally conductive sheet main body in the circuit board.
5. a kind of conductive structure for realizing high-efficiency heat conduction function according to claim 1, which is characterized in that the heat conduction
Layer of silica gel is set between piece main body and chip, and silica gel usage amount is chip area 2/3rds.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810766643.5A CN108521753A (en) | 2018-07-13 | 2018-07-13 | A kind of conductive structure for realizing high-efficiency heat conduction function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810766643.5A CN108521753A (en) | 2018-07-13 | 2018-07-13 | A kind of conductive structure for realizing high-efficiency heat conduction function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108521753A true CN108521753A (en) | 2018-09-11 |
Family
ID=63428658
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810766643.5A Pending CN108521753A (en) | 2018-07-13 | 2018-07-13 | A kind of conductive structure for realizing high-efficiency heat conduction function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108521753A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5896269A (en) * | 1996-11-27 | 1999-04-20 | Gateway 2000, Inc. | Positive pressure heat sink conduit |
| CN101170887A (en) * | 2006-10-27 | 2008-04-30 | 富准精密工业(深圳)有限公司 | Radiator combination |
| CN201541414U (en) * | 2009-07-28 | 2010-08-04 | 中国科学院西安光学精密机械研究所 | Heat sink device |
| CN101848622A (en) * | 2009-03-24 | 2010-09-29 | 富准精密工业(深圳)有限公司 | Radiator and electronic device |
| CN105611804A (en) * | 2015-12-30 | 2016-05-25 | 杭州华为数字技术有限公司 | Heat conducting pad, heat radiator and electronic product |
| CN205946467U (en) * | 2016-07-01 | 2017-02-08 | 深圳市傲睿智存科技有限公司 | Heat abstractor and electronic product of fin, PCB subassembly |
| CN206542691U (en) * | 2017-03-20 | 2017-10-03 | 广东小天才科技有限公司 | Electronic equipment and heat radiation structure thereof |
-
2018
- 2018-07-13 CN CN201810766643.5A patent/CN108521753A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5896269A (en) * | 1996-11-27 | 1999-04-20 | Gateway 2000, Inc. | Positive pressure heat sink conduit |
| CN101170887A (en) * | 2006-10-27 | 2008-04-30 | 富准精密工业(深圳)有限公司 | Radiator combination |
| CN101848622A (en) * | 2009-03-24 | 2010-09-29 | 富准精密工业(深圳)有限公司 | Radiator and electronic device |
| CN201541414U (en) * | 2009-07-28 | 2010-08-04 | 中国科学院西安光学精密机械研究所 | Heat sink device |
| CN105611804A (en) * | 2015-12-30 | 2016-05-25 | 杭州华为数字技术有限公司 | Heat conducting pad, heat radiator and electronic product |
| CN205946467U (en) * | 2016-07-01 | 2017-02-08 | 深圳市傲睿智存科技有限公司 | Heat abstractor and electronic product of fin, PCB subassembly |
| CN206542691U (en) * | 2017-03-20 | 2017-10-03 | 广东小天才科技有限公司 | Electronic equipment and heat radiation structure thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180911 |