CN102012728A - Centralized radiation type computer case - Google Patents
Centralized radiation type computer case Download PDFInfo
- Publication number
- CN102012728A CN102012728A CN2010105608250A CN201010560825A CN102012728A CN 102012728 A CN102012728 A CN 102012728A CN 2010105608250 A CN2010105608250 A CN 2010105608250A CN 201010560825 A CN201010560825 A CN 201010560825A CN 102012728 A CN102012728 A CN 102012728A
- Authority
- CN
- China
- Prior art keywords
- heat
- chamber
- casing
- pipe
- concentrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to a centralized radiation type computer case. The centralized radiation type computer case comprises a case body, a centralized heat pipe radiator and a heat transfer pipe, wherein the case body is provided with a case body cavity; and a seal clapboard is arranged in the case body cavity and divides the case body cavity into a seal cavity and a radiation cavity. The seal cavity is completely independent of the external environment, so that dust and air in the external environment cannot enter the seal cavity. The radiation cavity is communicated with the external environment, so that air flows and exchanges between the radiation cavity and the external environment and the heat in the radiation cavity is dissipated into the external environment. The heat generated in the seal cavity is transferred onto the centralized heat pipe radiator through the heat transfer pipe, then the heat of the centralized heat pipe radiator is dissipated into the radiation cavity, and the heat in the radiation cavity is dissipated into the external environment by means of the air flow and exchange between the radiation cavity and the external environment finally. Therefore, the whole radiation process is finished.
Description
Technical field
The present invention relates to a kind of computer housing, be meant a kind of computer housing that utilizes the seal isolation plate that cabinets cavity is separated into annular seal space and dispels the heat the chamber and by heat pipe the electronic component in the annular seal space is dispelled the heat especially.
Background technology
As everyone knows, can promote the apparatus very general life that has entered into people now of people's quality of the life along with the progress of society is various, in the present very general life that is applied in people of PC, it structurally generally comprises display, keyboard, mouse and cabinet for PC, wherein, cabinet is in order to hold the core electron element of one-piece computer, along with the continuous rising of computer fittings power consumption, good cabinet is requisite to be the heat dispersion that it possesses.In this, producer adds fan at the top of cabinet; Install fan additional in the bottom of chassis power supply; Even at the CD-ROM drive panel, the interface of reservation just interpolation the such as cabinet lower panel fan and sign etc.These designs all reach the big thermal diffusivity that strengthens cabinet.In addition, nowadays the function that only just can seem on brand name computer also had been transplanted to DIY cabinet market in the past.Such as, the temperature control demonstration sees some brand computers the earliest, promptly inlays a liquid crystal display on the cabinet panel, can directly show information such as cabinet internal temperature above.Now, this technology has been used on some high-grade cabinets.Also have those dual-mode functions that on brand computer, obtained better application also to be introduced by cabinet manufacturer one after another and come, released the cabinet product that possesses two/multi-mode function.Remove in addition, the design of some hommizations is also embodied on the power supply in the cabinet suit, as exempts from the 4PIN power interface of switch, and directly being connected on can not start shooting on the CD just appreciates CD.
Material part at cabinet aspect the material formation can be divided into the steel part of frame shell and the parts of plastics of panel.The plastics of high-quality case front panel, what all adopt is that the ABS engineering plastics are made.The produced case front panel of this plastics is durable stable, and the hardness height uses colour-fast and cracking for a long time, compares the aspect in the time of wiping.And the common plastics that cabinet inferior just adopts, the just jaundice of time one lead aircraft case front panel, easy fracture is cracked in the process of dismounting.The high-quality cabinet adopts SECC or SGCC galvanized steel plain sheet, adopts the cabinet steel plate color of this material shinny, and the gloss of metal is arranged, and the advantage of this steel plate is that resistance to corrosion is good.But some cabinet of poor quality adopts tin plate, just so-called tinplate, cabinet steel plate color burnt hair.
Along with the develop rapidly of computer, its thermal value is also along with development, so the heat dissipation design of cabinet also becomes more and more important.Have only good heat dissipation design, the heat that computer could be produced in time be drained, otherwise will cause deadlock, causes the problems such as lifetime of computer.The heat dissipation design good ventilation smoothness of high-quality cabinet, heat radiation are good, and casing is roomy, and front panel has abundant air vent, and the case fan installation site is all left in front and back.And the heat dissipation design of cabinet inferior is very poor, and the cabinet space inside is narrow and small, does not have air vent, even the also not reservation of the position of case fan, causes heat can not obtain getting rid of like this, causes a series of problems.
But aforesaid its cabinets cavity of traditional computer housing all is connected with external environment condition, such structural design dust in the external environment condition in convenient heat radiation also is easy to along with air-flow enters into cabinet, thereby must deposit the duty that a large amount of dusts influences computer in the cabinet that accumulates over a long period like this, and this is the major defect for conventional art.
Summary of the invention
The invention provides a kind of concentrated heat pipe heat radiation type computer housing, it utilizes the seal isolation plate that cabinets cavity is separated into annular seal space and heat radiation chamber, the sealing chamber is independent fully with respect to external environment condition, make dust and gas in the external environment condition can not enter into the sealing chamber, this heat radiation chamber is connected with external environment condition, make and to carry out the gas flow exchange between this heat radiation chamber and the external environment condition, thereby the heat in the chamber of will dispelling the heat is distributed in the external environment condition, utilize above-mentioned technology under the situation that does not influence case radiation, to stop the dust progress and reach the dustproof effect, and this is a fundamental purpose of the present invention to cabinet inside.
The technical solution used in the present invention is: a kind of concentrated heat dissipation type computer housing, it comprises casing, concentrates heat-pipe radiator and heat transferred pipe, wherein, this casing has cabinets cavity, be provided with the seal isolation plate in this cabinets cavity, this cabinets cavity be separated into annular seal space and heat radiation chamber by the sealing division board.
The sealing chamber is independent fully with respect to external environment condition, make dust and gas in the external environment condition can not enter into the sealing chamber, this heat radiation chamber is connected with external environment condition, make and to carry out the gas flow exchange between this heat radiation chamber and the external environment condition, thereby the heat in the chamber of will dispelling the heat is distributed in the external environment condition.
Should concentrate heat-pipe radiator to be arranged in this heat radiation chamber of this casing, this heat transferred pipe has link and heating radiator link in the casing, wherein, the interior link of this casing passes the sealing division board of this casing and extends in the sealing chamber, this heating radiator link is connected on this concentrated heat-pipe radiator, the heat that produces in the sealing chamber at first is delivered on this concentrated heat-pipe radiator by this heat transferred pipe, then should concentrate the heat of heat-pipe radiator to be dispersed in this heat radiation chamber, exchange by the gas flow of carrying out between this heat radiation chamber and the external environment condition at last, the heat in this heat radiation chamber is distributed in the external environment condition to finish the integral heat sink process.
Offer transfer tube through hole and power supply through hole on the sealing division board of aforesaid this casing, be provided with mainboard in the sealing chamber of this casing, CPU, video card, sound card, network interface card, link is connected to this mainboard in this casing of this heat transferred pipe, this CPU, this video card, this sound card, on this network interface card, this heat transferred pipe is plugged in this transfer tube through hole, link extends in the sealing chamber in this casing of this heat transferred pipe, be provided with computer power in this heat radiation chamber of this casing, the power lead of this computer power is inserted in the sealing chamber by this power supply through hole of sealing division board, for the electronic component in the sealing chamber provides electric power.
Be provided with O-ring seal in aforesaid this transfer tube through hole and this power supply through hole.
Aforesaid this heat radiation chamber is connected with external environment condition by thermal window, is provided with fan in this heat radiation chamber.
The aforesaid heat-pipe radiator of should concentrating comprises heat-dissipating casing, and this heat-dissipating casing has a heat radiation chamber, is filled with cooling fluid in this heat radiation chamber, and this heat transferred pipe has the transmission chamber, and this transmission chamber was connected with concentrating this heat radiation chamber of heat-pipe radiator,
This cooling fluid has liquid state and two kinds of physical states of gaseous state in this heat radiation chamber, when the electronic component work in the sealing chamber is generated heat, this heat at first is passed in this heat transferred pipe by link in this casing, then, heat transferred by this heat transferred pipe is concentrated in the heat-pipe radiator to being somebody's turn to do, in this process, the vaporization of being heated of this cooling fluid, this cooling fluid that is vaporized is motion from bottom to top in this concentrated heat-pipe radiator, when this cooling fluid that is vaporized moves upward and touches this heat-dissipating casing, this cooling fluid that is vaporized is caught a cold and is condensed into liquid state and flows downward by the effect of the gravity inside surface along this heat-dissipating casing, so move in circles, in this process, the heat transferred that the electronic component work in the sealing chamber is produced is concentrated in the heat-pipe radiator to being somebody's turn to do, and heat is distributed in external environment condition by this heat radiation chamber by this cooling fluid.
The aforesaid heat-pipe radiator of should concentrating vertically is arranged in this heat radiation chamber of this casing, and this heat radiation chamber is positioned at top, sealing chamber.
The aforesaid heat-pipe radiator of should concentrating is provided with some heat radiator.
Aforesaid this heat transferred pipe comprises some transfer tubes, and each bar transfer tube all has link and heating radiator link in the casing.
The aforesaid horizontal level of heating radiator of should concentrating is than the horizontal level height that is arranged on the heat-generating electronic elements in the sealing chamber.
Beneficial effect of the present invention is: the present invention is in concrete enforcement, electronic component in the computer housing all is arranged in the sealing chamber of this casing, such as, mainboard, CPU, video card, sound cards etc. all are arranged in the sealing chamber, because the sealing chamber is independent fully with respect to external environment condition, dust in the external environment condition and gas can not enter into the sealing chamber, can not be subjected to the dust in the external environment condition and the pollution of gas fully so be arranged on electronic component in the sealing chamber of this casing, thereby electronic component in the sealing chamber is worked under ashless environment can improve the serviceable life of electronic component greatly, and in the process that one-piece computer uses, do not need electronic component is often carried out dust removal process, be convenient for people to use, and be arranged on the heat that the electronic component work in the sealing chamber of this casing is produced, can at first be delivered on this concentrated heat-pipe radiator as mentioned above by this heat transferred pipe, then should concentrate the heat of heat-pipe radiator to be dispersed in this heat radiation chamber, exchange by the gas flow of carrying out between this heat radiation chamber and the external environment condition at last, heat in this heat radiation chamber is distributed in the external environment condition to finish the integral heat sink process, link is connected on the electronic component in each sealing chamber, to make things convenient for the effect of integral heat sink process in this casing of this heat transferred pipe in above-mentioned heat transfer process.
Description of drawings
Fig. 1 is a structural representation of the present invention;
Fig. 2 is the diagrammatic cross-section of seal isolation plate of the present invention;
Fig. 3 is the structural representation of concentrated heat-pipe radiator of the present invention and heat transferred pipe.
Embodiment
As shown in Figures 1 to 3, a kind of concentrated heat dissipation type computer housing, it comprises casing 10, concentrates heat-pipe radiator 20 and heat transferred pipe 30, wherein, this casing 10 has cabinets cavity 11, be provided with seal isolation plate 12 in this cabinets cavity 11, this cabinets cavity 11 be separated into annular seal space 13 and heat radiation chamber 14 by sealing division board 12.
This heat radiation chamber 14 is connected with external environment condition, make to carry out the gas flow exchange between this heat radiation chamber 14 and the external environment condition, thereby the heat in the chamber 14 of will dispelling the heat is distributed in the external environment condition.
Should concentrate heat-pipe radiator 20 to be arranged in this heat radiation chamber 14 of this casing 10.
This heat transferred pipe 30 has link 31 and heating radiator link 32 in the casing, wherein, the interior link 31 of this casing passes the sealing division board 12 of this casing 10 and extends in the sealing chamber 13, and this heating radiator link 32 is connected on this concentrated heat-pipe radiator 20.
The heat that produces in the sealing chamber 13 at first is delivered on this concentrated heat-pipe radiator 20 by this heat transferred pipe 30, then should concentrate the heat of heat-pipe radiator 20 to be dispersed in this heat radiation chamber 14, exchange by the gas flow of carrying out between this heat radiation chamber 14 and the external environment condition at last, the heat in this heat radiation chamber 14 is distributed in the external environment condition to finish the integral heat sink process.
The present invention is in concrete enforcement, electronic component in the computer housing all is arranged in the sealing chamber 13 of this casing 10, such as, mainboard, CPU, video card, sound cards etc. all are arranged in the sealing chamber 13, because sealing chamber 13 is independent fully with respect to external environment condition, dust in the external environment condition and gas can not enter into sealing chamber 13, can not be subjected to the dust in the external environment condition and the pollution of gas fully so be arranged on electronic component in the sealing chamber 13 of this casing 10, thereby electronic component in the sealing chamber 13 is worked under ashless environment can improve the serviceable life of electronic component greatly, and in the process that one-piece computer uses, do not need electronic component is often carried out dust removal process, be convenient for people to use.
And be arranged on the heat that the electronic component work in the sealing chamber 13 of this casing 10 is produced, can at first be delivered on this concentrated heat-pipe radiator 20 as mentioned above by this heat transferred pipe 30, then should concentrate the heat of heat-pipe radiator 20 to be dispersed in this heat radiation chamber 14, exchange by the gas flow of carrying out between this heat radiation chamber 14 and the external environment condition at last, heat in this heat radiation chamber 14 is distributed in the external environment condition to finish the integral heat sink process, link 31 is connected on the electronic component in each sealing chamber 13, to make things convenient for the integral heat sink process in this casing of this heat transferred pipe 30 in above-mentioned heat transfer process.
Offer transfer tube through hole 121 and power supply through hole 122 on the sealing division board 12 of this casing 10.
O-ring seal can be set with better sealing sealing chamber 13 in this transfer tube through hole 121 and this power supply through hole 122.
Be provided with mainboard, CPU, video card, sound card, network interface card in the sealing chamber 13 of this casing 10, link 31 is connected on this mainboard, this CPU, this video card, this sound card, this network interface card in this casing of this heat transferred pipe 30.
This heat transferred pipe 30 is plugged in this transfer tube through hole 121, and link 31 extends in the sealing chamber 13 in this casing of this heat transferred pipe 30.
Be provided with computer power 141 in this heat radiation chamber 14 of this casing 10, the power lead of this computer power 141 is inserted in the sealing chamber 13 by this power supply through hole 122 of sealing division board 12, for the electronic component in the sealing chamber 13 provides electric power.
This heat radiation chamber 14 is connected with external environment condition by thermal window 142.
Fan can be set to strengthen the radiating effect of this heat radiation chamber 14 in this heat radiation chamber 14 to external environment condition.
Should concentrate heat-pipe radiator 20 to comprise heat-dissipating casing 21, this heat-dissipating casing 21 has a heat radiation chamber 22, is filled with cooling fluid 23 in this heat radiation chamber 22.
This heat transferred pipe 30 has the chamber 33 of transmission, and this transmission chamber 33 was connected with concentrating this heat radiation chamber 22 of heat-pipe radiator 20.
This cooling fluid 23 has liquid state and two kinds of physical states of gaseous state in this heat radiation chamber 22, when the electronic component work in the sealing chamber 13 is generated heat, this heat at first is passed in this heat transferred pipe 30 by link 31 in this casing, then, heat transferred by this heat transferred pipe 30 is concentrated in the heat-pipe radiator 20 to being somebody's turn to do, in this process, the vaporization of being heated of this cooling fluid 23, this cooling fluid 23 that is vaporized is motion from bottom to top in this concentrated heat-pipe radiator 20, when this cooling fluid 23 that is vaporized moves upward and touch this heat-dissipating casing 21, this cooling fluid 23 that is vaporized is caught a cold and is condensed into liquid state and flows downward by the effect of the gravity inside surface along this heat-dissipating casing 21, so move in circles, in this process, the heat transferred that the electronic component work in the sealing chamber 13 is produced is concentrated in the heat-pipe radiator 20 to being somebody's turn to do, and heat is distributed in external environment condition to reach the purpose of heat radiation by this heat radiation chamber 14 by this cooling fluid 23.
Should concentrate heat-pipe radiator 20 vertically to be arranged in this heat radiation chamber 14 of this casing 10, and this heat radiation chamber 14 is positioned at 13 tops, sealing chamber.
Should concentrate on the heat-pipe radiator 20 and some heat radiator can be set with further enhancing radiating effect.
This heat transferred pipe 30 comprises some transfer tubes in concrete enforcement, and each bar transfer tube all has link and heating radiator link in the casing.
The present invention should concentrate the horizontal level of heating radiator 20 than the horizontal level height that is arranged on the heat-generating electronic elements in the sealing chamber 13 in concrete enforcement.
Claims (9)
1. concentrated heat dissipation type computer housing, it is characterized in that: it comprises casing, concentrates heat-pipe radiator and heat transferred pipe, wherein, this casing has cabinets cavity, be provided with the seal isolation plate in this cabinets cavity, by the sealing division board this cabinets cavity is separated into annular seal space and heat radiation chamber
The sealing chamber is independent fully with respect to external environment condition, make dust and gas in the external environment condition can not enter into the sealing chamber, this heat radiation chamber is connected with external environment condition, make and to carry out the gas flow exchange between this heat radiation chamber and the external environment condition, thereby the heat in the chamber of will dispelling the heat is distributed in the external environment condition
Should concentrate heat-pipe radiator to be arranged in this heat radiation chamber of this casing, this heat transferred pipe has link and heating radiator link in the casing, wherein, the interior link of this casing passes the sealing division board of this casing and extends in the sealing chamber, this heating radiator link is connected on this concentrated heat-pipe radiator, the heat that produces in the sealing chamber at first is delivered on this concentrated heat-pipe radiator by this heat transferred pipe, then should concentrate the heat of heat-pipe radiator to be dispersed in this heat radiation chamber, exchange by the gas flow of carrying out between this heat radiation chamber and the external environment condition at last, the heat in this heat radiation chamber is distributed in the external environment condition to finish the integral heat sink process.
2. a kind of concentrated heat dissipation type computer housing as claimed in claim 1, it is characterized in that: offer transfer tube through hole and power supply through hole on the sealing division board of this casing, be provided with mainboard in the sealing chamber of this casing, CPU, video card, sound card, network interface card, link is connected to this mainboard in this casing of this heat transferred pipe, this CPU, this video card, this sound card, on this network interface card, this heat transferred pipe is plugged in this transfer tube through hole, link extends in the sealing chamber in this casing of this heat transferred pipe, be provided with computer power in this heat radiation chamber of this casing, the power lead of this computer power is inserted in the sealing chamber by this power supply through hole of sealing division board, for the electronic component in the sealing chamber provides electric power.
3. a kind of concentrated heat dissipation type computer housing as claimed in claim 2 is characterized in that: be provided with O-ring seal in this transfer tube through hole and this power supply through hole.
4. a kind of concentrated heat dissipation type computer housing as claimed in claim 2, it is characterized in that: this heat radiation chamber is connected with external environment condition by thermal window, is provided with fan in this heat radiation chamber.
5. a kind of concentrated heat dissipation type computer housing as claimed in claim 2, it is characterized in that: this concentrated heat-pipe radiator comprises heat-dissipating casing, this heat-dissipating casing has a heat radiation chamber, be filled with cooling fluid in this heat radiation chamber, this heat transferred pipe has the transmission chamber, this transmission chamber was connected with concentrating this heat radiation chamber of heat-pipe radiator
This cooling fluid has liquid state and two kinds of physical states of gaseous state in this heat radiation chamber, when the electronic component work in the sealing chamber is generated heat, this heat at first is passed in this heat transferred pipe by link in this casing, then, heat transferred by this heat transferred pipe is concentrated in the heat-pipe radiator to being somebody's turn to do, in this process, the vaporization of being heated of this cooling fluid, this cooling fluid that is vaporized is motion from bottom to top in this concentrated heat-pipe radiator, when this cooling fluid that is vaporized moves upward and touches this heat-dissipating casing, this cooling fluid that is vaporized is caught a cold and is condensed into liquid state and flows downward by the effect of the gravity inside surface along this heat-dissipating casing, so move in circles, in this process, the heat transferred that the electronic component work in the sealing chamber is produced is concentrated in the heat-pipe radiator to being somebody's turn to do, and heat is distributed in external environment condition by this heat radiation chamber by this cooling fluid.
6. a kind of concentrated heat dissipation type computer housing as claimed in claim 5 is characterized in that: this concentrated heat-pipe radiator vertically is arranged in this heat radiation chamber of this casing, and this heat radiation chamber is positioned at top, sealing chamber.
7. a kind of concentrated heat dissipation type computer housing as claimed in claim 5, it is characterized in that: this concentrated heat-pipe radiator is provided with some heat radiator.
8. a kind of concentrated heat dissipation type computer housing as claimed in claim 5, it is characterized in that: this heat transferred pipe comprises some transfer tubes, each bar transfer tube all has link and heating radiator link in the casing.
9. a kind of concentrated heat dissipation type computer housing as claimed in claim 6, it is characterized in that: the horizontal level of this concentrated heating radiator is than the horizontal level height that is arranged on the heat-generating electronic elements in the sealing chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105608250A CN102012728A (en) | 2010-11-26 | 2010-11-26 | Centralized radiation type computer case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105608250A CN102012728A (en) | 2010-11-26 | 2010-11-26 | Centralized radiation type computer case |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102012728A true CN102012728A (en) | 2011-04-13 |
Family
ID=43842920
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105608250A Pending CN102012728A (en) | 2010-11-26 | 2010-11-26 | Centralized radiation type computer case |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102012728A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105466545A (en) * | 2015-11-30 | 2016-04-06 | 蚌埠大洋传感系统工程有限公司 | Novel weighing display instrument |
| CN106612596A (en) * | 2015-10-27 | 2017-05-03 | 研祥智能科技股份有限公司 | Split partition-type case and electronic equipment with split partition-type case |
| CN107122018A (en) * | 2017-04-24 | 2017-09-01 | 贵州省仁怀市西科电脑科技有限公司 | The manufacture method of fast radiating computer housing |
| CN107257618A (en) * | 2017-08-16 | 2017-10-17 | 合肥庆响网络科技有限公司 | Communication apparatus contacting radiator |
| CN110785067A (en) * | 2019-11-11 | 2020-02-11 | 北京机械设备研究所 | Closed space phase change heat dissipation device and closed space phase change heat dissipation method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6130818A (en) * | 1999-05-27 | 2000-10-10 | Hamilton Sundstrand Corporation | Electronic assembly with fault tolerant cooling |
| CN1437088A (en) * | 2002-02-07 | 2003-08-20 | 联想(北京)有限公司 | Separate low-noise heat dissipating system of great-power very thin computer system unit |
| CN1702599A (en) * | 2005-06-15 | 2005-11-30 | 娄晓洲 | Centralized heat dissipation type heat pipe cabinet apparatus |
| CN101025345A (en) * | 2006-02-17 | 2007-08-29 | 富准精密工业(深圳)有限公司 | Heat pipe |
-
2010
- 2010-11-26 CN CN2010105608250A patent/CN102012728A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6130818A (en) * | 1999-05-27 | 2000-10-10 | Hamilton Sundstrand Corporation | Electronic assembly with fault tolerant cooling |
| CN1437088A (en) * | 2002-02-07 | 2003-08-20 | 联想(北京)有限公司 | Separate low-noise heat dissipating system of great-power very thin computer system unit |
| CN1702599A (en) * | 2005-06-15 | 2005-11-30 | 娄晓洲 | Centralized heat dissipation type heat pipe cabinet apparatus |
| CN101025345A (en) * | 2006-02-17 | 2007-08-29 | 富准精密工业(深圳)有限公司 | Heat pipe |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106612596A (en) * | 2015-10-27 | 2017-05-03 | 研祥智能科技股份有限公司 | Split partition-type case and electronic equipment with split partition-type case |
| CN105466545A (en) * | 2015-11-30 | 2016-04-06 | 蚌埠大洋传感系统工程有限公司 | Novel weighing display instrument |
| CN105466545B (en) * | 2015-11-30 | 2018-02-27 | 蚌埠大洋传感系统工程有限公司 | A kind of novel weighing display instrument |
| CN107122018A (en) * | 2017-04-24 | 2017-09-01 | 贵州省仁怀市西科电脑科技有限公司 | The manufacture method of fast radiating computer housing |
| CN107122018B (en) * | 2017-04-24 | 2020-05-01 | 贵州省仁怀市西科电脑科技有限公司 | Method for manufacturing quick-radiating computer case |
| CN107257618A (en) * | 2017-08-16 | 2017-10-17 | 合肥庆响网络科技有限公司 | Communication apparatus contacting radiator |
| CN110785067A (en) * | 2019-11-11 | 2020-02-11 | 北京机械设备研究所 | Closed space phase change heat dissipation device and closed space phase change heat dissipation method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102012728A (en) | Centralized radiation type computer case | |
| CN205058632U (en) | Semiconductor refrigeration thermostatic type desktop level 3D printer | |
| CN205721588U (en) | A kind of have the computer installation that can isolate strengthening chiller | |
| CN109407781A (en) | Reinforcing cabinet based on two-stage phase transformation level-one liquid-cooling heat radiation technology | |
| CN208209474U (en) | Cold, heat and power triple supply system gives data center's power supply bus duct | |
| CN101655729A (en) | CPU radiator | |
| CN206178624U (en) | Computer radiating device | |
| CN205864941U (en) | A kind of heat-radiating device of electric component | |
| CN200989742Y (en) | Heat conducting pipe structure capable of sectionally conducting heat | |
| CN206788697U (en) | A kind of high-efficient heat-dissipating computer motherboard | |
| CN206610224U (en) | A kind of mainframe box | |
| CN201876789U (en) | Centralized radiating type computer case | |
| CN109283743A (en) | A kind of liquid crystal display die set | |
| CN202118707U (en) | Backlight module and liquid crystal display device | |
| CN205121466U (en) | Mainframe box easily dispels heat | |
| CN209167955U (en) | A kind of computer main board that thermal diffusivity is good | |
| CN209014869U (en) | A kind of liquid crystal display die set | |
| CN208638870U (en) | A kind of cabinet | |
| CN201689377U (en) | Novel drawing type notebook computer heat radiation board | |
| CN209086831U (en) | A kind of industrial computer of perfect heat-dissipating | |
| CN208224968U (en) | High power consumption PCIE board heat radiation module in cabinet is reinforced in a kind of totally-enclosed | |
| CN204833106U (en) | Quick -witted case of computer heat dissipation | |
| CN203378194U (en) | Heat dissipation piece | |
| CN202939534U (en) | Non-fan embedded tablet personal computer case | |
| CN204856359U (en) | All -in -one cooling system and all -in -one |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110413 |