CN108521416A - A kind of ECN boards - Google Patents

A kind of ECN boards Download PDF

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Publication number
CN108521416A
CN108521416A CN201810296170.7A CN201810296170A CN108521416A CN 108521416 A CN108521416 A CN 108521416A CN 201810296170 A CN201810296170 A CN 201810296170A CN 108521416 A CN108521416 A CN 108521416A
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CN
China
Prior art keywords
trdp
data
frames
mac
ecn
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Granted
Application number
CN201810296170.7A
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Chinese (zh)
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CN108521416B (en
Inventor
陈幸
侯振龙
严明铭
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Shanghai Ren Tong Electronic Technology Co Ltd
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Shanghai Ren Tong Electronic Technology Co Ltd
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Priority to CN201810296170.7A priority Critical patent/CN108521416B/en
Publication of CN108521416A publication Critical patent/CN108521416A/en
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Publication of CN108521416B publication Critical patent/CN108521416B/en
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Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04LTRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L69/00Network arrangements, protocols or services independent of the application payload and not provided for in the other groups of this subclass
    • H04L69/26Special purpose or proprietary protocols or architectures
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04LTRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L12/00Data switching networks
    • H04L12/28Data switching networks characterised by path configuration, e.g. LAN [Local Area Networks] or WAN [Wide Area Networks]
    • H04L12/40Bus networks
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04LTRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L69/00Network arrangements, protocols or services independent of the application payload and not provided for in the other groups of this subclass
    • H04L69/22Parsing or analysis of headers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04LTRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L12/00Data switching networks
    • H04L12/28Data switching networks characterised by path configuration, e.g. LAN [Local Area Networks] or WAN [Wide Area Networks]
    • H04L12/40Bus networks
    • H04L2012/40267Bus for use in transportation systems
    • H04L2012/40293Bus for use in transportation systems the transportation system being a train

Abstract

The invention discloses a kind of ECN boards, include and the Network Interface Module of external device communication, the data processing module communicated with Network Interface Module by MAC interface and the memory module communicated with data processing module;Network Interface Module for realizing Ethernet waveform and RMII network level signals mutual conversion, data processing module is for calling TRDP protocol stacks, it is the first TRDP frames by the first MAC data Packet analyzing, the first TRDP frames is resolved into the first data, and the first data are sent to host computer;Or, the second data received from host computer are packaged as the 2nd TRDP frames, the 2nd TRDP frames are combined as the second MAC data packet, and send by stating MAC interface.As it can be seen that the present invention realizes the emulation testing to ECN bus application functions in such a way that ECN boards are interacted with external equipment, host computer.

Description

A kind of ECN boards
Technical field
The present invention relates to emulation testing technical fields, more particularly to a kind of ECN boards.
Background technology
ECN (Ethernet Consist Network, train Ethernet bus) is newest train bus-line form, The performance indicators such as its bandwidth, flexibility, extended capability be far above existing TCN (Train Communication Network, Train Communication Network) train bus-line.As new bus form, the country is for the networking of ECN bus apparatus, Train Control and management The emulation testing tool of system (TCMS, Train Control and Management System) application function has urgently It is general in track field seriously to hinder ECN buses however, this kind of tool is at home and abroad but in space state at present for demand And the process with popularization.
Invention content
In order to solve the above technical problems, an embodiment of the present invention provides a kind of ECN boards, to solve to exist in the prior art The problem of, technical solution is as follows:
A kind of ECN boards, including:
With the Network Interface Module of external device communication, pass through MAC interface, the data communicated with the Network Interface Module Processing module, the memory module communicated with the data processing module;
The Network Interface Module, for the Ethernet waveform received from the external equipment to be converted to the first RMII nets Network level signal, and the first RMII network level signals are sent to by the data processing module by the MAC interface; Or, receiving the 2nd RMII network level signals, the 2nd RMII networks level signal and the data by the MAC interface The second MAC data packet that processing module is sent corresponds to, and the 2nd RMII network level signals are converted to Ethernet waveform It is sent to the external equipment;
The data processing module, for receiving the first MAC data corresponding with the first RMII network level signals Packet, and call TRDP protocol stacks, be the first TRDP frames by the first MAC data Packet analyzing, the first TRDP frames are parsed For the first data of upper function identification, and first data are sent to host computer;Or, receiving second from the host computer Second data are packaged as the 2nd TRDP frames by data, and the 2nd TRDP frames are combined as the second MAC data packet, And the second MAC data packet is sent by the MAC interface;
Memory module, for storing the TRDP protocol stacks.
Preferably, the data processing module, including:
Flash start units, the core processing unit communicated with the Flash start units and the core processing list The buffer unit of member communication;
The Flash start units, for driving the core processing unit to start;
The buffer unit is used under the control of the core processing unit to the first TRDP frames or described second TRDP frames are cached;
The core processing unit, for receiving the first MAC data corresponding with the first RMII network level signals Packet, and call the TRDP protocol stacks, be the first TRDP frames by the first MAC data Packet analyzing, by the first TRDP frames The first data of upper function identification are resolved to, and first data are sent to the host computer;Or, from the host computer The second data are received, second data are packaged as the 2nd TRDP frames, the 2nd TRDP frames are combined as described Two MAC data packets, and the second MAC data packet is sent by the MAC interface.
Preferably, the core processing unit, including:
The PLC technology logic that is connected with cpci bus by CPCI interfaces and by inner high speed bus with it is described can The processor of programming Control logic communication, the cpci bus are connected with the host computer;
The PLC technology logic removes the first MAC data packet for receiving the first MAC data packet Control message part obtains data portion, and the data portion is sent to the processor;Receive what the processor was sent The first TRDP frames, and the first TRDP frames are resolved into first data, institute is sent to by the CPCI interfaces State host computer;Or, receiving second data, second data are sent to the processor;Receive the processor hair The 2nd TRDP frames are sent, the 2nd TRDP frames are combined as the second MAC data packet, and institute is sent by the MAC interface State the second MAC data packet;
The processor is also communicated by DMA interface with the buffer unit, for calling the TRDP protocol stacks, by institute It states data portion and resolves to the first TRDP frames, and by the first TRDP frame buffers to the buffer unit, delay from described Memory cell reads the first TRDP frames, and is sent to the PLC technology logic;Or, the TRDP protocol stacks are called, it will Second data are combined as the 2nd TRDP frames, and the 2nd TRDP frame buffers to the buffer unit are delayed from described Memory cell reads the 2nd TRDP frames, and is sent to the PLC technology logic.
Preferably, the core processing unit, including:
Process data processing subelement and message data handle subelement;
When the first MAC data packet and second data are process data format, by the process data processing Subelement calls the TRDP protocol stacks, is the first TRDP frames by the first MAC data Packet analyzing, by described first TRDP frames resolve to first data, and first data are sent to the host computer;Or, second data are beaten Packet is the 2nd TRDP frames, the 2nd TRDP frames is combined as the second MAC data packet, and pass through the MAC interface Send the second MAC data packet;
When the first MAC data packet and second data are message data format, handled by the message data Subelement calls the TRDP protocol stacks, is the first TRDP frames by the first MAC data Packet analyzing, by described first TRDP frames resolve to first data, and first data are sent to the host computer;Or, second data are beaten Packet is the 2nd TRDP frames, the 2nd TRDP frames is combined as the second MAC data packet, and pass through the MAC interface Send the second MAC data packet.
Preferably, further include:
Power module, for obtaining backboard voltage from the backboard power supply of the host computer, to be supplied for the ECN boards Electricity.
Preferably, the power module includes:
Power conversion unit, for the backboard voltage to be respectively converted into the data processing module and the storage mould Supply voltage needed for block;
Electrifying timing sequence unit is distinguished for storing electrifying timing sequence, and according to the electrifying timing sequence, according to the supply voltage It powers for the data processing module and the memory module.
Preferably, further include:
Debugging interface, the communication for debugging the ECN boards and the host computer.
Preferably, further include:
It is used to indicate communications status indicator light that the external equipment is communicated with the ECN boards and the debugging interface The debugging indicator light of debugging mode.
Preferably, the core processing unit further includes:
Consistency treatment subelement for obtaining the first TRDP frames and the 2nd TRDP frames, and extracts described With the relevant information of TRDP protocol conformances in one TRDP frames and the 2nd TRDP frames, and described information is sent on described Position machine, so that the host computer carries out TRDP protocol conformance analyses according to institute's information.
Preferably, further include:
Ethernet interface, for realizing the connection of the external equipment and the ECN boards.
ECN boards provided by the invention include with the Network Interface Module of external device communication, by MAC interface and net The data processing module of network interface module communication and the memory module communicated with data processing module;Network Interface Module is for real The mutual conversion of existing Ethernet waveform and RMII network level signals, data processing module are used to call TRDP protocol stacks, by the One MAC data Packet analyzing is the first TRDP frames, the first TRDP frames is resolved to the first data, and first data are sent to Host computer;Or, the second data received from host computer are packaged as the 2nd TRDP frames, the 2nd TRDP frames are combined as the 2nd MAC Data packet, and sent by MAC interface.As it can be seen that example of the present invention is in such a way that ECN boards are interacted with external equipment, host computer Realize the emulation testing to ECN bus application functions.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this Some embodiments of invention without having to pay creative labor, may be used also for those of ordinary skill in the art With obtain other attached drawings according to these attached drawings.
A kind of a kind of structural schematic diagram for ECN boards that Fig. 1 is provided by the embodiment of the present invention;
A kind of structural schematic diagram for the data processing module that Fig. 2 is provided by the embodiment of the present invention;
A kind of structural schematic diagram for the embedded software that Fig. 3 is provided by the embodiment of the present invention;
A kind of another structural schematic diagram for ECN boards that Fig. 4 is provided by the embodiment of the present invention.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation describes, it is clear that described embodiment is only a part of the embodiment of the present invention, instead of all the embodiments.Based on this Embodiment in invention, every other reality obtained by those of ordinary skill in the art without making creative efforts Example is applied, shall fall within the protection scope of the present invention.
Referring to Fig. 1, Fig. 1 is a kind of a kind of structural schematic diagram of ECN boards provided in an embodiment of the present invention, the ECN plates Card includes:
The Network Interface Module 102 communicated with external equipment 101 is communicated by MAC interface, with Network Interface Module 102 Data processing module 103, the memory module 104 communicated with data processing module 103.
In practical application, the size of the ECN boards in the present embodiment can be 3U-2HP, can be used for the cPCI machines of standard Case.The Ethernet interface for including M12 or RJ45 forms on the panel of ECN boards, for realizing the company of external equipment and ECN boards It connects.
External equipment by Ethernet interface realize with after the connections of ECN boards, by Network Interface Module 102 realize with The communication of data processing module 103.In practical application, Network Interface Module 102 can include network transformer element (Magnetic) and PHY (Physical Layer) element 100Mbit/s and 1000Mbit/s speed rates, are supported, it will be external Equipment 101 is converted to RMII (Reduced Media Independent by the Ethernet waveform that Ethernet interface transmits Interface) network level signal.
The ECN boards of the present embodiment to data when carrying out emulation testing, including two kinds of situations, one is from external equipment 101 receive TRDP data, another to send TRDP data to external equipment 101, therefore distinguish below for above two situation Explanation:
When realizing from the reception TRDP data of external equipment 101:
Network Interface Module 102, the Ethernet waveform for will be received from external equipment 101 are converted to the first RMII networks Level signal, and the first RMII network level signals are sent to by data processing module 103 by MAC interface;
Data processing module 103, for receiving the first MAC data packet corresponding with the first RMII network level signals, and It calls TRDP protocol stacks, be the first TRDP frames by the first MAC data Packet analyzing, the first TRDP frames are resolved into 105 energy of host computer First data of identification, and the first data are sent to host computer 105.
When realizing transmission TRDP data to external equipment 101:
Network Interface Module 102, for receiving the 2nd RMII network level signals, the 2nd RMII by MAC interface Network level signal is corresponding with the second MAC data packet that the data processing module 103 is sent, and by the 2nd RMII network level Signal is converted to Ethernet waveform and is sent to external equipment 101.
Second data are packaged as the 2nd TRDP by data processing module 103 for receiving the second data from host computer 105 2nd TRDP frames are combined as the second MAC data packet, and send the second MAC data packet by MAC interface by frame.
Memory module 104, for storing TRDP protocol stacks.
There can also be protocol stack arrangement subelement in memory module 104, the second number transmitted for parsing host computer 105 According to being configured to the operating parameter of TRDP protocol stacks, operating parameter includes system function service, the poll of also every message Period, QoS, TTL, the transmitting-receiving behaviors such as sourcesink IP address and multicast/broadcast.
ECN boards provided in an embodiment of the present invention include being connect with the Network Interface Module of external device communication, by MAC The mouth data processing module communicated with Network Interface Module and the memory module communicated with data processing module;Network Interface Module For realizing the mutual conversion of Ethernet waveform and RMII network level signals, data processing module calls TRDP protocol stacks, will First MAC data Packet analyzing is the first TRDP frames, the first TRDP frames is resolved to the first data, and the first data are sent to Position machine;Or, the second data received from host computer are packaged as the 2nd TRDP frames, the 2nd TRDP frames are combined as the second MAC number It is sent according to packet, and by MAC interface.As it can be seen that the present embodiment is real in such a way that ECN boards are interacted with external equipment, host computer The emulation testing to ECN bus application functions is showed.
Referring to Fig. 2, Fig. 2 is a kind of structure of the data processing module provided on the basis of Fig. 1 corresponding embodiments Schematic diagram, the data processing module include:
Flash start units 201, the core processing unit 202 communicated with Flash start units 201 and core processing list The buffer unit 203 of 202 yuan of communication;
Flash start units 201, for driving core processing unit 202 to start;
Buffer unit 203, for being carried out to the first TRDP frames or the 2nd TRDP frames under the control of core processing unit 202 Caching;
In the present embodiment, buffer unit 203 can be realized by DDR chips, the processor in core processing unit 202 2022 access external DDR chips by the DDR controller that its own is internally integrated, by the first TRDP frames and the 2nd TRDP frame buffers In DDR chips.
Core processing unit 202 for receiving the first MAC data packet, and calls TRDP protocol stacks, by the first MAC data Packet analyzing is the first TRDP frames, the first TRDP frames is resolved to the first data, and the first data are sent to host computer 105;Or, The second data are received from host computer 105, the second data are packaged as the 2nd TRDP frames, the 2nd TRDP frames are combined as the 2nd MAC Data packet, and the second MAC data packet is sent by MAC interface.
In practical application, according to the format for the first MAC data packet and the second data that core processing unit 202 receives, core Heart processing unit 202 can be divided into two classes, respectively process data processing subelement and Message Processing subelement;
When the first MAC data packet and the second data are process data format, called by process data processing subelement First MAC data Packet analyzing is the first TRDP frames by TRDP protocol stacks, and the first TRDP frames are resolved to the first data, and by the One data are sent to host computer 105;Or, the second data are packaged as the 2nd TRDP frames, the 2nd TRDP frames are combined as the 2nd MAC Data packet, and the second MAC data packet is sent by MAC interface;
When the first MAC data packet and the second data are message data format, called by message data processing subelement First MAC data Packet analyzing is the first TRDP frames by TRDP protocol stacks, and the first TRDP frames are resolved to the first data, and by the One data are sent to host computer 105;Or, the second data are packaged as the 2nd TRDP frames, the 2nd TRDP frames are combined as the 2nd MAC Data packet, and the second MAC data packet is sent by MAC interface.
Wherein, process data processing subelement includes the packet sending and receiving function of both of which:PUSH patterns and PULL patterns; Message data processing subelement includes the packet sending and receiving function of Three models:The request of no reply has reply but asking without confirmation It asks, have reply and the request with confirmation.
Core processing unit 202 may include the PLC technology logic 2021 being connected with cpci bus by CPCI interfaces With the processor 2022 communicated with PLC technology logic 2021 by inner high speed bus, cpci bus and 105 phase of host computer Even, processor 2022 is also connected by DMA interface with buffer unit 203;
Processor 2022 is high-performance, the processing core of low-power consumption;PLC technology logic 2021 can be used as processor 2022 peripheral expansion, for example, serial ports, network interface extension, also can be used as main equipment, 2022 operation of control processor.
PLC technology logic 2021 extends Ethernet interface, can provide four tunnel MAC interfaces and be connected to network interface Module 102.Cpci bus interface function is realized in PLC technology logic 2021, instead of cpci bus interface chip.
There is provided only by inner high speed bus communication, internal bus between processor 2022 and PLC technology logic 2021 Vertical data transmission, receiving channel, i.e. the carry out data interaction of reading and writing data channel parallel, improve data throughout.
It is directed to " receiving TRDP data from external equipment 101 " individually below and " sends TRDP data to external equipment 101 " both situations illustrate PLC technology logic 2021 and processor 2022:
When realizing from the reception TRDP data of external equipment 101:
PLC technology logic 2021 removes the control information portion of the first MAC data packet for receiving the first MAC data packet Get data portion, data portion is sent to processor 2022;The first TRDP frames that processor 2022 is sent are received, and will First TRDP frames resolve to the first data, are sent to host computer 105 by CPCI interfaces;
Processor 2022 is for calling TRDP protocol stacks, data portion is resolved to the first TRDP frames, and by the first TRDP Frame buffer reads the first TRDP frames to buffer unit 203, from buffer unit 203, and is sent to PLC technology logic 2021;
When realizing transmission TRDP data to external equipment 101:
PLC technology logic 2021 receives the second data, and the second data are sent to processor 2022;Receive processor 2022 send the 2nd TRDP frames, the 2nd TRDP frames are combined as the second MAC data packet, and send the second MAC number by MAC interface According to packet;
Second data are combined as the 2nd TRDP frames, by the 2nd TRDP frames by processor 2022 for calling TRDP protocol stacks Caching reads the 2nd TRDP frames to buffer unit 203, from buffer unit 203, and is sent to PLC technology logic 2021.
In order to which the consistency to TRDP agreements is analyzed, core processing unit further includes:
The consistency treatment subelement 2023 communicated with processor 2022, for obtaining the first TRDP from processor 2022 Frame and the 2nd TRDP frames, and extract with the relevant information of TRDP protocol conformances in the first TRDP frames and the 2nd TRDP frames, and it will Information is sent to host computer, so that host computer carries out TRDP protocol conformance analyses according to institute's information.
Wherein, it can specifically include with the relevant information of TRDP protocol conformances:TRDP process datas and message data Frame head parses, and the check code (FCS) of frame head and data segment parses, and starts the time stamp squeezed into Ether frame data segment.
Technical solution provided in an embodiment of the present invention, including consistency treatment subelement so that ECN boards with it is outer When portion's devices exchange TRDP frame messages, in comprehensive analysis TRDP frames with the relevant information of consistency, TRDP frames can be carried out TRDP protocol conformances are analyzed.
Referring to Fig. 3, Fig. 3 is the one of the embedded software of the ECN boards provided on the basis of Fig. 2 corresponding embodiments Kind structural schematic diagram, which is responsible for driving ECN board hardware circuits inside core processing unit 202, real The processing and transmission of existing protocol stack and data;
The embedded software includes:
MAC interface 301, CPCI interfaces 302, operating system OS303, abstract/virtual OS304, TRDP protocol stack arrangement end 305;
MAC interface 301 realizes the MAC interface function of PLC technology logic 2021;
CPCI interfaces 302 realize the CPCI interface functions of PLC technology logic 2021;
Operating system OS303 is stored in memory module 104, is responsible for the scheduling of ECN boards;
Operating system OS303 is stored in memory module 104, when needing to run operating system OS303, core processing Unit calls operating system OS303 from memory module 104 and runs operating system OS303.Abstract/virtual OS304 exists On the basis of OS, the system function service to be used of TRDP protocol stacks operation, including memory configurations, socket are further encapsulated Word (Socket) management, system time management, thread configuration, queue management and mutual exclusion lock function etc..Abstract/virtual OS handles The operation system function to be used of TRDP protocol stacks is removed with practical OS's type, it is convenient to be transplanted to protocol stack Each type operating system, such as Linux, VxWorks, Windows etc.;
TRDP protocol stack arrangements end 305 is the core in embedded software, including process data processing subelement 3052, message data processing subelement 3053 and consistency treatment subelement 3054, in practical application, the TRDP protocol stack arrangements End 305 can also include protocol stack arrangement subelement 3051 and the driving communicated with host computer and api interface 3055.
It should be noted that protocol stack arrangement subelement 3051 is stored in memory module 104, when needing to run the agreement When stack configures the TRDP protocol stacks in subelement 3051, core processing unit calls the TRDP protocol stacks from memory module 104. Protocol stack arrangement subelement 3051 for parsing the second data that host computer 105 transmits, to the operating parameters of TRDP protocol stacks into Row configuration, operating parameter includes system function service, the polling cycle of also every message, QoS, TTL, transmitting-receiving sourcesink IP The behaviors such as location and multicast/broadcast;
Before process data processing subelement 3052, message data processing subelement 3053 and consistency treatment subelement 3054 Face has been described, and does not repeat herein;
The driving communicated with host computer and api interface 3055 include the necessary activation bit communicated with host computer 105, with And API is received and dispatched for the process data transmitting-receiving of 105 software transfer of host computer and message data, the API is for controlling TRDP protocol stacks Operation, the specific transmitting-receiving message behavior of TRDP protocol stacks is operated with pattern.
Technical solution provided in an embodiment of the present invention, embedded software include operating system and abstract/virtual OS, be abstracted/ The virtual OS operation system functions that TRDP protocol stacks are used are removed with practical OS's type, to realize easily Protocol stack is transplanted to each type operating system.ECN boards are interacted with external equipment in addition, consistency treatment subelement realizes TRDP messages consistency desired result.
Referring to Fig. 4, Fig. 4 is another structural schematic diagram of ECN boards provided in an embodiment of the present invention, the ECN boards Including:
The Network Interface Module 402 communicated with external equipment 401 is communicated by MAC interface, with Network Interface Module 402 Data processing module 403, the memory module 404 communicated with data processing module 403;
Network Interface Module 402, the Ethernet waveform for will be received from external equipment 401 are converted to the first RMII networks Level signal, and the first RMII network level signals are sent to by data processing module 403 by MAC interface;Or, passing through MAC The 2nd RMII network level signals of interface, the 2nd RMII networks level signal and the second of the transmission of data processing module 403 MAC data packet corresponds to, and the 2nd RMII network level signals are sent to external equipment 401;
Data processing module 403, for receiving the first MAC data packet corresponding with the first RMII network level signals, and It calls TRDP protocol stacks, be the first TRDP frames by the first MAC data Packet analyzing, the first TRDP frames are resolved into 406 energy of host computer First data of identification, and the first data are sent to host computer 406;Or, the second data are received from host computer 406, by second Data are packaged as the 2nd TRDP frames, the 2nd TRDP frames are combined as the second MAC data packet, and send the 2nd MAC by MAC interface Data packet;
Memory module 404, for storing TRDP protocol stacks.
Power module 405, for obtaining backboard voltage from the backboard power supply of host computer 406, to power for ECN boards;
Preferably, power module 405 includes:
Power conversion unit 4051, for backboard voltage to be respectively converted into needed for data processing module and memory module Supply voltage;
Electrifying timing sequence unit 4052 is respectively number for storing electrifying timing sequence, and according to electrifying timing sequence, according to supply voltage It powers according to processing module and memory module.
Debugging interface 407, the communication for debugging ECN boards and host computer 406;
It is used to indicate the debugging mode of communications status indicator light 408 and debugging interface that external equipment is communicated with ECN boards Debugging indicator light 409.
Technical solution provided in an embodiment of the present invention includes being connect with the Network Interface Module of external device communication, by MAC The mouth data processing module communicated with Network Interface Module and the memory module communicated with data processing module;Network Interface Module For realizing the mutual conversion of Ethernet waveform and RMII network level signals, data processing module is for calling TRDP agreements First MAC data Packet analyzing is the first TRDP frames, the first TRDP frames is resolved to the first data, and described first is counted by stack According to being sent to host computer;Or, the second data received from host computer are packaged as the 2nd TRDP frames, the 2nd TRDP frames are combined as Second MAC data packet, and sent by MAC interface.As it can be seen that the present embodiment is interacted by ECN boards with external equipment, host computer Mode realize the emulation testing to ECN bus application functions.
Term " first ", " second ", " third " " in description and claims of this specification and above-mentioned attached drawing The (if present)s such as four " are for distinguishing similar object, without being used to describe specific sequence or precedence.It should manage The data that solution uses in this way can be interchanged in the appropriate case, so that the embodiment of the present invention described herein for example can be to remove Sequence other than those of illustrating or describe herein is implemented.In addition, term " comprising " and " having " and theirs is any Deformation, it is intended that cover it is non-exclusive include, for example, containing the process of series of steps or unit, method, system, production Product or equipment those of are not necessarily limited to clearly to list step or unit, but may include not listing clearly or for this The intrinsic other steps of processes, method, product or equipment or unit a bit.
For device or system embodiment, since it essentially corresponds to embodiment of the method, so related place referring to The part of embodiment of the method illustrates.Device or system embodiment described above is only schematical, wherein described The unit illustrated as separating component may or may not be physically separated, and the component shown as unit can be with It is or may not be physical unit, you can be located at a place, or may be distributed over multiple network units.It can It is achieved the purpose of the solution of this embodiment with selecting according to the actual needs some or all of module therein.This field is common Technical staff is without creative efforts, you can to understand and implement.
In several embodiments provided by the present invention, it should be understood that disclosed system, device and method are not having It has more than in the spirit and scope of the present invention, can realize in other way.Current embodiment is a kind of demonstration Example, should not be taken as limiting, given particular content should in no way limit the purpose of the present invention.For example, the unit or The division of subelement, only a kind of division of logic function, formula that in actual implementation, there may be another division manner, such as multiple lists First or multiple subelements combine.In addition, multiple units can with or component may be combined or can be integrated into another and be System, or some features can be ignored or not executed.
In addition, the schematic diagram of described system, device and method and different embodiments, without departing from the scope of the present invention It is interior, it can be with other systems, module, techniques or methods combination or integrated.Another point, shown or discussed mutual coupling Close or direct-coupling or communication connection can be by some interfaces, the INDIRECT COUPLING or communication connection of device or unit, can be with It is electrical, machinery or other forms.
The above is only the specific implementation mode of the present invention, it is noted that for the ordinary skill people of the art For member, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also answered It is considered as protection scope of the present invention.

Claims (10)

1. a kind of ECN boards, which is characterized in that including:
With the Network Interface Module of external device communication, pass through MAC interface, the data processing communicated with the Network Interface Module Module, the memory module communicated with the data processing module;
The Network Interface Module, for the Ethernet waveform received from the external equipment to be converted to the first RMII network electricity Ordinary mail number, and the first RMII network level signals are sent to by the data processing module by the MAC interface;Or, The 2nd RMII network level signals are received by the MAC interface, at the 2nd RMII networks level signal and the data It manages the second MAC data packet that module is sent to correspond to, and the 2nd RMII network level signals is converted into Ethernet waveform hair It send to the external equipment;
The data processing module, for receiving the first MAC data packet corresponding with the first RMII network level signals, and It calls TRDP protocol stacks, be the first TRDP frames by the first MAC data Packet analyzing, the first TRDP frames are resolved to upper First data of function identification, and first data are sent to host computer;Or, the second data are received from the host computer, Second data are packaged as the 2nd TRDP frames, the 2nd TRDP frames are combined as the second MAC data packet, and pass through The MAC interface sends the second MAC data packet;
Memory module, for storing the TRDP protocol stacks.
2. ECN boards according to claim 1, which is characterized in that the data processing module, including:
Flash start units, the core processing unit communicated with the Flash start units lead to the core processing unit The buffer unit of letter;
The Flash start units, for driving the core processing unit to start;
The buffer unit is used under the control of the core processing unit to the first TRDP frames or the 2nd TRDP Frame is cached;
The core processing unit, for receiving the first MAC data packet corresponding with the first RMII network level signals, and It calls the TRDP protocol stacks, be the first TRDP frames by the first MAC data Packet analyzing, the first TRDP frames are resolved to First data of upper function identification, and first data are sent to the host computer;Or, receiving the from the host computer Second data are packaged as the 2nd TRDP frames by two data, and the 2nd TRDP frames are combined as second MAC number The second MAC data packet is sent according to packet, and by the MAC interface.
3. ECN boards according to claim 2, which is characterized in that the core processing unit, including:
The PLC technology logic that is connected with cpci bus by CPCI interfaces and by inner high speed bus with it is described programmable The processor of control logic communication, the cpci bus are connected with the host computer;
The PLC technology logic removes the control of the first MAC data packet for receiving the first MAC data packet Message part obtains data portion, and the data portion is sent to the processor;Receive the described of the processor transmission First TRDP frames, and the first TRDP frames are resolved into first data, are sent on described by the CPCI interfaces Position machine;Or, receiving second data, second data are sent to the processor;It receives the processor and sends the The 2nd TRDP frames are combined as the second MAC data packet by two TRDP frames, and send described the by the MAC interface Two MAC data packets;
The processor is also communicated by DMA interface with the buffer unit, for calling the TRDP protocol stacks, by the number It is the first TRDP frames according to part analysis, and by the first TRDP frame buffers to the buffer unit, from caching list Member reads the first TRDP frames, and is sent to the PLC technology logic;Or, the TRDP protocol stacks are called, it will be described Second data are combined as the 2nd TRDP frames, single from the caching by the 2nd TRDP frame buffers to the buffer unit Member reads the 2nd TRDP frames, and is sent to the PLC technology logic.
4. ECN boards according to claim 2, which is characterized in that the core processing unit, including:
Process data processing subelement and message data handle subelement;
It is single by process data processing when the first MAC data packet and second data are process data format TRDP protocol stacks described in metacall, by the first MAC data Packet analyzing be the first TRDP frames, by the first TRDP frames First data are resolved to, and first data are sent to the host computer;Or, second data are packaged as institute The 2nd TRDP frames are stated, the 2nd TRDP frames are combined as the second MAC data packet, and institute is sent by the MAC interface State the second MAC data packet;
When the first MAC data packet and second data are message data format, it is single that son is handled by the message data TRDP protocol stacks described in metacall, by the first MAC data Packet analyzing be the first TRDP frames, by the first TRDP frames First data are resolved to, and first data are sent to the host computer;Or, second data are packaged as institute The 2nd TRDP frames are stated, the 2nd TRDP frames are combined as the second MAC data packet, and institute is sent by the MAC interface State the second MAC data packet.
5. ECN boards according to claim 1, which is characterized in that further include:
Power module, for obtaining backboard voltage from the backboard power supply of the host computer, to power for the ECN boards.
6. ECN boards according to claim 5, which is characterized in that the power module includes:
Power conversion unit, for the backboard voltage to be respectively converted into the data processing module and memory module institute The supply voltage needed;
Electrifying timing sequence unit is respectively institute for storing electrifying timing sequence, and according to the electrifying timing sequence, according to the supply voltage State data processing module and memory module power supply.
7. ECN boards according to claim 1, which is characterized in that further include:
Debugging interface, the communication for debugging the ECN boards and the host computer.
8. ECN boards according to claim 7, which is characterized in that further include:
It is used to indicate the debugging of communications status indicator light and the debugging interface that the external equipment is communicated with the ECN boards The debugging indicator light of state.
9. according to claim 2-4 any one of them ECN boards, which is characterized in that the core processing unit further includes:
Consistency treatment subelement for obtaining the first TRDP frames and the 2nd TRDP frames, and extracts described first With the relevant information of TRDP protocol conformances in TRDP frames and the 2nd TRDP frames, and described information is sent to described upper Machine, so that the host computer carries out TRDP protocol conformance analyses according to institute's information.
10. ECN boards according to claim 1, which is characterized in that further include:
Ethernet interface, for realizing the connection of the external equipment and the ECN boards.
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