CN108519751A - A kind of novel solid matrix switching system - Google Patents

A kind of novel solid matrix switching system Download PDF

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Publication number
CN108519751A
CN108519751A CN201810282546.9A CN201810282546A CN108519751A CN 108519751 A CN108519751 A CN 108519751A CN 201810282546 A CN201810282546 A CN 201810282546A CN 108519751 A CN108519751 A CN 108519751A
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China
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channel
switch
signal
port
circuit
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CN201810282546.9A
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CN108519751B (en
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钟景华
唐毅
张燕
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NANJING GLARUN-ATTEN TECHNOLOGY Co Ltd
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NANJING GLARUN-ATTEN TECHNOLOGY Co Ltd
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    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Programme-control systems
    • G05B19/02Programme-control systems electric
    • G05B19/04Programme control other than numerical control, i.e. in sequence controllers or logic controllers
    • G05B19/042Programme control other than numerical control, i.e. in sequence controllers or logic controllers using digital processors
    • G05B19/0423Input/output
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/20Pc systems
    • G05B2219/21Pc I-O input output
    • G05B2219/21116Universal cabling; control interface between processor and devices
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/20Pc systems
    • G05B2219/21Pc I-O input output
    • G05B2219/21168Couple, feedback each output to corresponding input to verify output

Abstract

The present invention discloses a kind of novel solid matrix switching system, and wherein main switch module includes:Down going channel, radiofrequency signal are inputted from ANT, after channel switch A and downmix switch, output to PM.Data feedback channel, radiofrequency signal are inputted from SG, after 18 broadband power-devided circuits, are divided into the individual radiofrequency signal in 8 tunnels, after uplink added martix switch, channel switch B, A, transport to ANT.Additional channel, radiofrequency signal is inputted from SG, after power-devided circuit, after uplink added martix switch and channel switch B, transports to BANT.Calibration and backup path, radiofrequency signal are inputted from CAL, BAK1, BAK2 respectively, after entering calibration and backup matrix switch, transport to PM.Microstrip coupled circuit, radiofrequency signal is inputted from the ends SG, and by exporting 2 road signals after microstrip coupled circuit, wherein main path signal enters in power-devided circuit all the way, and the signal coupled after sampling is exported to Couple.

Description

A kind of novel solid matrix switching system
Technical field
The present invention relates to a kind of solid matrix switching systems of high target, for the signal between test equipment and measured piece Circulation and switching show IP address and pass through the device of network interface connection upper-level system.
Background technology
In Auto-Test System, matrix switch system is mainly by multichannel input or the signal exported switches over and group The equipment of conjunction is especially applied to radio frequency batch production automatic test field.
The matrix switch system of early stage mainly uses relay to switch as channel and switchs, but relay frequency is not high, and Realize that connection and disconnection, mechanical life only have 100,000 times by the way of mechanical contact contact.It is limited to PCB microwave planks simultaneously High frequency characteristics.Therefore upper operational frequency limit can only arrive 3GHz, and the loss of system design is big, and appearance and size also can not be small-sized Change, service life is limited.
Current matrix switch system, it is contemplated that the contradiction of the loss and isolation index of radiofrequency signal, product size is all It is bigger.Port mostly uses the design of microwave glass insulator simultaneously, causes reliability very poor.This system uses the electricity of high integration Road is designed, while ensureing loss of signal and isolation index.Product size is only the 60% of similar product, while also improving end The reliability of mouth.
Invention content
In view of the above problems, the present invention provides a kind of volume smaller, quality is lighter, and switch reliability is higher novel solid State matrix switch system.
In order to solve problem above, present invention employs following technical solutions:A kind of novel solid matrix switching system, It is characterised in that it includes ARM master boards module, digital display module, main switch module;
ARM master board modules use ARM embedded boards, are communicated with host computer by RJ45 interfaces, by parallel Interface realizes that data down transmission communicates with main switch module and digital display module;
Digital display module is as display interface, the serial ports number for being issued ARM main control modules by 74AHC595 chips According to being converted to parallel port data, and it is sent to corresponding 24bit numeral methods section and is shown;
Main switch module is the multichannel input and output application realized to signal;Component part includes down going channel, uplink Channel, additional channel, calibration and backup path, microstrip coupled circuit;
Down going channel circuit is placed on the TOP layers of pcb board, and data feedback channel circuit and additional channel circuit are placed on pcb board BOTTOM layers;Broadband power-devided circuit and microstrip coupled circuit are also disposed in BOTTOM layers;
Down going channel in main switch module, radiofrequency signal is inputted from port ANT, by channel switch A and downmix After switch, it is output to port PM;
Data feedback channel in main switch module, radiofrequency signal are inputted from the ends SG, after the power-devided circuit of the broadbands 1-8, are divided into 8 The individual radiofrequency signal in road, after uplink added martix switch, channel switch B, channel switch A, output port ANT;Wherein The ports ANT can not only be used for the input port of down going channel, also can be used as the output port of data feedback channel, downlink and uplink channel Selection is to realize switching selection by channel switch A;
Additional channel in main switch module, radiofrequency signal is inputted from the ends SG, after the power-devided circuit of the broadbands 1-8, is passed through Uplink added martix is switched with after channel switch B, is output to port BANT;
Calibration in main switch module and backup path, radiofrequency signal are inputted from the end CAL, BAK1, BAK2, are entered respectively After calibration and backup matrix switch, it is output to port PM;
Microstrip coupled circuit in main switch module, radiofrequency signal are inputted by the ends SG, by defeated after microstrip coupled circuit Go out 2 road signals, wherein main path signal enters in the power-devided circuit of the broadbands 1-8 all the way, and the signal coupled after sampling is output to The ports Couple.
Downmix switch in the main switch module, is divided into 3 grades of circuits, and the first order is that 8 independent SP2T are opened It closes, the second level is 2 independent SP4T switches, and the third level is that 1 SP4T is switched;3 grades of circuits are sequentially connected in series;Channel switch A into The input signal of 8 tunnels come independently is switched by 8 SP2T of the first order, is realized load matched, is then passed through the second level 2 SP4T switches, 8 road signals are merged into 2 road signals, i.e. the output end two of the independent SP2T switches of every 4 of the first order connects The input terminal of 1 SP4T switches of the second level;By this 2 road, signal is input to 1 SP4T switch of the third level, the i.e. second level again The input terminal of the output end connection third level SP4T switches of 2 SP4T switches;To merge into 1 road signal and be sent to output end PM。
Uplink added martix switch in the main switch module is made of 8 independent SP2T switches;By the broadbands 1-8 The 8 road signals that power splitter input is come in are connected respectively to 8 SP2T switches in uplink added martix switch, realize load Match, is then output in channel switch B.
The broadbands the 1-8 power-devided circuit is divided into 3 grades, and the power splitter I that the first order is 11 point 2, the second level is 21 point 2 Power splitter II, the third level is 41 point 2 of power splitter III;The output end of power splitter I connects the input terminal of 2 power splitters II, The output end of each power splitter II connects the input terminal of 2 power splitters III;4 power splitters of the third level generate 8 output ends, even It is connected in uplink added martix switch.
The microstrip coupled circuit includes microstrip coupled line, coupling load;And wherein microstrip coupled line uses parallel phase Two adjacent microstrip lines are constituted, and thicker microstrip line is main signal path microstrip line, and thinner microstrip line is that coupling path is micro- The a port of band line, coupling path microstrip line is connected with coupling load;Another port is sampled signal port, is output to The ports Couple.
Further include having the required Switching Power Supply conversion of whole equipment and voltage stabilizing electricity in the ARM master board modules Road, the wide-range direct current voltage of+12V being externally entering~+48V, after the Switching Power Supply of LINEAR models, using phase The LDO voltage stabilizer answered produces the required+5V of system and+3.3V voltages.
The main switch module, pcb board material select the RT model microwave planks of Rogers;The pcb board number of plies of design It is 6 layers, plate thickness 1.2mm;For the second time electroplating technique of pcb board, it is 0.2~0.4 μm to select process thickness, and resistivity is The heavy silver process of 15.86n Ω m.
The charactron selects common cathode charactron;Display content is initial ip address, and display mode is dynamic scan side Formula.
Input/output end port in the main switch module is all made of half cable welding mode;One end is welded on PCB Port pad on, the other end is fixed on the sub-miniature A connector on front and back panel by ring flange.
The broadbands the 1-8 power-devided circuit selects the power splitter of Wilkinsonw structures, this Wilkinsonw structures Power splitter insertion loss is -10.8dB, and interport isolation about -20dB, inband flatness is less than 0.3dB.
The data feedback channel and additional channel has passage consistency requirement, it is desirable that work(between 8 channels of data feedback channel Rate error is less than 0.5dB, and the power error between 8 channels of additional channel is again smaller than 0.5dB;Therefore it is required in circuit design Error between the track lengths in each 8 channels of data feedback channel and additional channel is less than 500mil.
In addition to microstrip coupled circuit, the down going channel, data feedback channel, additional channel, calibration and the isolation of backup path Spend index, it is desirable that isolation is less than -70dB between the channel of heterodoxy, is less than -44dB with isolation between the channel at end.
By microstrip coupled circuit, the coupled signal sampling of realization -21dB ± 2dB in the broadband range of 0.6~6G, and It is output to port Couple.And the circuit is realized within the scope of 2 × 1mm.
The standing-wave ratio of all input/output ports requires to be less than 1.5.
The debud mode of standing wave is:First with the standing wave parameter of different location point on probe detection rf signal line, find Change maximum point, soldering tin amount is then increased or decreased on corresponding location point to change its thickness, and by radio frequency Copper-surfaced skin changes the width of signal wire with cutting on signal wire, to realize the change to the standing-wave ratio of port.
The data-signal of the main switch module and digital display module is passed through by the ARM9 chips of ARM main control modules RJ45 network interfaces receive the user information requirement of host computer, then data are descended into main switch module sum number in a manner of SPI In code display module, then the string-of control data is realized by the two moulds 74AHC595 chips in the block and is converted, and control corresponding Each switch.
Advantageous effect:
Main switch module is used as the switching in the various different channels of internal signal.The broadbands 1-8 power-devided circuit is used for realizing 1 road signal is divided into the circuit of 8 road constant power signals.Microstrip coupled circuit is examined for realizing to the power extraction for inputting SG signals It surveys.
Switching device in main switch module realizes multiple signals using low-loss, the radio frequency SnPT switches of high-isolation The circuit layout designs such as input/output and multiplexed port.Relative to the circuit cloth under domestic pharmaceutical industry said function and index parameter Office, integrated level higher, module size is only the 70% of uniformity module.
The standing wave parameter index of prevention at radio-frequency port in main switch module, the debugging of common port standing wave are typically to pass through increasing Add attenuator circuit to reduce standing wave parameter.The present invention provides a kind of different standing wave debud modes.It is stayed relative to traditional Wave adjustment method, this method have many advantages, such as that loss is small, simplifies circuit, facilitates debugging.
Broadband power-devided circuit is the Wilkinson type power-devided circuits of the 1-8 types of autonomous Design, which uses micro-strip Line+distribution resistive arrangement changes the power-devided circuit in conjunction with the PCB microwave planks of high target parameter according to the layout of PCB circuits Shape and spacing, and obtained by ADS and HFSS softwares fully emulate, index parameter is better than domestic mainstream power-devided circuit, And design size also wants small by 30%.
Microstrip coupled circuit is designed using the microstrip coupled line mode of entirely autonomous design, and common coupling line passes through tune Whole micro-strip line width, line length and line-spacing realize the index of the degree of coupling and standing wave.And the microstrip coupled circuit in this system is completely full The index request of sufficient port standing wave and the degree of coupling.This design both reliably also allows for debugging.
Solid matrix switching system is mainly for the production of automatic test field.It, can be with by solid matrix switching system Multiple measured pieces are connected with test equipment.The requirement that can also be output and input according to system, selects different input channels Radiofrequency signal is output to different output channels by the control inside solid matrix switching system.With a set of test equipment come A variety of tests are completed, without continually disconnecting and connecting.To realize the automatically working of test process, shorten test week Phase improves testing efficiency and improves the integrated test of product and reduce manpower and instrument cost, when accelerating the listing of new product Between.
Description of the drawings
Fig. 1 is the structural schematic diagram of monnolithic case of the present invention.
Fig. 2 is the structural schematic diagram of front panel of the present invention.
Fig. 3 is the structural schematic diagram of rear panel of the present invention.
Fig. 4 is the integral module design diagram of the present invention.
Fig. 5 is each channel design diagram of main switch module in the present invention.
Fig. 6 is the broadbands the 1-8 power-devided circuit schematic diagram in Your Majesty's row of channels in the present invention.
Fig. 7 is the microstrip coupled circuit diagram of main switch module in the present invention.
Fig. 8 is the downmix switch schematic diagram of main switch module in the present invention.
Fig. 9 is the uplink added martix switch schematic diagram of main switch module in the present invention.
Specific implementation mode:
Below in conjunction with the accompanying drawings, the present invention is described in further detail.
As shown in Figure 1, overall appearance is flat, product height is set the complete product gone out designed by the present invention according to 1U standards Meter.It is convenient for carrying and is positioned in standard PC case.The design of front and back panel is as shown in Figures 2 and 3.Panel is compact to design, layout Beauty, visual effect is excellent, while being also convenient for dismantling and replace.
As shown in Figure 1 to 9, the present invention provides a kind of novel solid matrix switching systems, including ARM main control template dies Block, digital display module, main switch module.
Using the design of ARM embedded boards, core devices are Samsung for the principle design of ARM master board modules S3C2416XH chips, the chip are a 32BIT using ARM9 as the processor of kernel, have powerful operational capability and letter Cease processing capacity.ARM master boards can carry out various programmed process under the software environment of Linux or WINCE.In the present invention ARM master boards are write to each other by RJ45 network interfaces with host computer, and pass through parallel interface and other circuit moulds Block is communicated and is controlled.Simultaneously also include the required Switching Power Supply conversion of whole equipment in ARM master boards and steady Volt circuit, the wide-range direct current voltage of+12V being externally entering~+48V after the Switching Power Supply of LINEAR models, then pass through Corresponding LDO voltage stabilizer is crossed, the required+5V of each modular circuit and+3.3V voltages are produced.
Digital display module receives the display data that ARM master board modules issue, then will by 74AHC595 chips Serial data is converted to the parallel port data of display, and is sent to corresponding 24bit numeral methods section, and charactron is selected highlighted Common cathode charactron.And 74AHC595 chips can provide the drawing sink current of at least 50mA, fully meet the driving electricity of charactron Stream requires.Show that content is the initial ip address of this solid matrix switch, display mode is dynamic scan mode.
Main switch module, pcb board material select the RT model microwave planks of Rogers, the plank to have low-k ε R, low dielectric loss tan δ.Its spillage of material is about -0.32dB/inch@5GHz.The pcb board number of plies of design is 6 layers, and plate thickness is 1.2mm.For the second time electroplating technique of pcb board, to ensure lower system loss, it is 0.2~0.4 μm to select process thickness, Resistivity is the heavy silver process of 15.86n Ω m.
Main switch module is the multichannel input and output application realized to signal.Component part includes down going channel, uplink Channel, additional channel, calibration and backup path, termination power.When carrying out pcb board layout, to shorten radio frequency letter to greatest extent Number cabling reduces the signal Insertion Loss in entire channel, and ensures reliable shielding isolation, and down going channel circuit is placed on PCB The TOP layers of plate, data feedback channel circuit and additional channel circuit are placed on the BOTTOM layers of pcb board.Corresponding broadband power-devided circuit It is also disposed in BOTTOM layers with microstrip coupled circuit.
Down going channel in main switch module, radiofrequency signal is inputted from port ANT, by channel switch A and downmix After switch, it is output to port PM.Wherein input and output port is connected respectively to front all by the way of half cable welding On plate and rear panel.
As shown in figure 8, the downmix switch in main switch module, is divided into 3 grades of circuits, the first order is 8 independent SP2T is switched, and the second level is 2 independent SP4T switches, and the third level is that 1 SP4T is switched.3 grades of circuits are sequentially connected in series.It opens in channel It closes the input signal of 8 tunnels come in A independently to switch by 8 SP2T of the first order, realizes load matched, then by the 2 SP4T of two level are switched, and 8 road signals are merged into 2 road signals, then this 2 road signal is input to 1 SP4T of the third level and is opened It closes, to merge into 1 road signal and be sent to output end PM.
Data feedback channel in main switch module, radiofrequency signal are inputted from the ends SG, after the power-devided circuit of the broadbands 1-8, are divided into 8 The individual radiofrequency signal in road, after uplink added martix switch, channel switch B, channel switch A, output port ANT.Wherein The ports ANT can not only be used for the input port of down going channel, also can be used as the output port of data feedback channel, downlink and uplink channel Selection is to realize switching selection by channel switch A.
Additional channel in main switch module, radiofrequency signal is inputted from the ends SG, after the power-devided circuit of the broadbands 1-8, is passed through Uplink added martix is switched with after channel switch B, is output to port BANT.
As shown in figure 9, the uplink added martix switch in main switch module is made of 8 independent SP2T switches.By 1-8 The 8 road signals that broadband power divider input is come in are connected respectively to 8 SP2T switches in uplink added martix switch, realize load Matching, is then output in channel switch B.
Calibration in main switch module and backup path, radiofrequency signal are inputted from the end CAL, BAK1, BAK2, are entered respectively After calibration and backup matrix switch, it is output to port PM.
Microstrip coupled circuit in main switch module, radiofrequency signal are inputted by the ends SG, by defeated after microstrip coupled circuit Go out 2 road signals, wherein main path signal enters in the power-devided circuit of the broadbands 1-8 all the way, and the signal coupled after sampling is output to The ports Couple.As shown in fig. 7, microstrip coupled circuit includes microstrip coupled line, coupling load.And wherein microstrip coupled line uses Parallel two adjacent microstrip lines are constituted, and thicker microstrip line is main signal path microstrip line, and thinner microstrip line is coupling Access microstrip line is closed, one of coupling path microstrip line port is connected with coupling load.This system is 50 Ohms systems, because This load resistance is 50 Ω.Another port is sampled signal port, is output to the ports Couple.
The trace width of all radiofrequency signals is all made of 50 Ω impedance matchings in main switch module, simultaneously for radiofrequency signal Connection between line and the pin port of each device, it is contemplated that between the two of different size changes signal using gradually linear The variation of width size, i.e., so-called transition line design to connect radiofrequency signal and device interface.It is learnt, is penetrated by simulation analysis When spacing between frequency signal lead and the ground of both sides is more than 1.5 times of line widths, then radiofrequency signal cabling is similar to microstrip design. The matching transmission that signal can be achieved in this way, avoids the distortion of signal transmission and standing wave parameter.
Input/output end port in main switch module is all made of half cable welding mode.One end is welded on the port of PCB On pad, the other end is fixed on the sub-miniature A connector on front and back panel by ring flange.The relatively general both-end sub-miniature A connector of the method Mode have lower insertion loss, it is cost-effective.The debugging of port standing wave parameter is also allowed for simultaneously.Because in signal lead The phase of different location is different, and the copper sheet thickness of micro-strip signal lead is different, can lead to the different variations of phase.Therefore Change the phase size of a certain location point of port section, then the standing wave parameter of port can also occur to change accordingly.
Power-devided circuit in main switch module is 1-8 broadband passive power-devided circuits, selects the work(point of Wilkinsonw structures Circuit, the circuit have many advantages, such as that bandwidth, the same phase of output, insertion loss are small.The realization of its circuit model is by HFSS come real The preliminary realization of existing technical indicator, and emulation is optimized to individual index parameters by ADS softwares.As shown in fig. 6, the electricity Road is divided into 3 grades, and the power splitter that the first order is 11 point 2,21 point 2 of power splitter is in the second level, the work(that the third level is 41 point 2 Divide device.Power divider circuit structure with level-one is just the same, and the mean allocation of power can be achieved in this way.Without power splitter at the same level Circuit structure is different, because the watt level born per level-one is different, output power is also different.4 work(of the third level point Device generates 8 output ends, is connected in uplink added martix switch.
The power splitter insertion loss of this Wilkinsonw structures is -10.8dB, interport isolation about -20dB, with interior flat Smooth degree is less than 0.3dB.
Data feedback channel in main switch module and additional channel, also passage consistency requirement, it is desirable that 8 of data feedback channel Power error is less than 0.5dB between channel, and the power error between 8 channels of additional channel is again smaller than 0.5dB.In PCB electricity When road is designed, it is necessary to be strict with the track lengths range in this 8 channels.According to theoretical calculation and practical application, data feedback channel Error between the track lengths in each 8 channels of additional channel is less than 500mil.
The isolation index in each channel in main switch module, it is desirable that isolation is less than -70dB (such as between the channel of heterodoxy ANTm, B_ANTn), it is less than -44dB (such as ANTn, B_ANTn) with isolation between the channel at end.It is learnt by simulation analysis, when When spacing between two components is more than 6cm, isolation can be more than 70dB.For isolation index, in addition on pcb board Ensure enough structural cavity body isolation, be important in its input/output port, the i.e. edge portions of pcb board, more it is noted that screen The requirement for covering isolation prevents the leakage of radiofrequency signal.To ensure the isolation index request between each channel.Therefore it is set in PCB Timing will carry out the process of PCB metal hemming edges, while require to be opened in addition to the cable of output on cavity body structure Hole is handled, remaining whole carries out closing isolation design.In addition the channel switch B switched to data feedback channel and additional channel shields Processing is covered, by mounting 3 layers of microwave absorbing material in the upper cavity structure to each switch corresponding position, carrys out anti-stop signal and passes through The inner space leakage of this switch, to improve isolation index to greatest extent.
Uplink, lower matrix switch in main switch module and the control signal of calibration and backup matrix switch, by control mould The ARM9 chips of block receive the user information requirement of host computer by RJ45 network interfaces, are then issued to master by SPI modes In switch module, then the string-of control data is realized by the 74AHC595 chips in main switch module and is converted, after then converting Parallel port data be sent on uplink, lower matrix switch and calibration and backup matrix switch, realize control to switch.
The solid matrix switching system of the present invention, circuit design parameter are high, and index is close to theoretical value.Structure design is using only Vertical cavity body structure, good airproof performance, isolation are high.Circuit and structure design are all made of optimized design, and are tested by ADS emulation Card, to realize the high target and high reliability of the present invention.
The foregoing is only a preferred embodiment of the present invention, is not restricted to the present invention, for the technology of this field For personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, any made by repair Change, equivalent replacement, improvement etc., should be included within scope of the presently claimed invention.

Claims (16)

1. a kind of novel solid matrix switching system, which is characterized in that including ARM master boards module, digital display module, Main switch module;
ARM master board modules use ARM embedded boards, are communicated with host computer by RJ45 interfaces, pass through parallel interface Realize that data down transmission communicates with main switch module and digital display module;
Digital display module is turned as display interface by the serial data that 74AHC595 chips issue ARM main control modules Parallel port data are changed to, and is sent to corresponding 24bit numeral methods section and is shown;
Main switch module is the multichannel input and output application realized to signal;Component part include down going channel, data feedback channel, Additional channel, calibration and backup path, microstrip coupled circuit;
Down going channel circuit is placed on the TOP layers of pcb board, and data feedback channel circuit and additional channel circuit are placed on pcb board BOTTOM layers;Broadband power-devided circuit and microstrip coupled circuit are also disposed in BOTTOM layers;
Down going channel in main switch module, radiofrequency signal are inputted from port ANT, are switched by channel switch A and downmix Afterwards, it is output to port PM;
Data feedback channel in main switch module, radiofrequency signal is inputted from the ends SG, after the power-devided circuit of the broadbands 1-8, is divided into 8 roads list Only radiofrequency signal, after uplink added martix switch, channel switch B, channel switch A, output port ANT;The wherein ends ANT Mouth can not only be used for the input port of down going channel, also can be used as the output port of data feedback channel, the selection in downlink and uplink channel It is that switching selection is realized by channel switch A;
Additional channel in main switch module, radiofrequency signal is inputted from the ends SG, after the power-devided circuit of the broadbands 1-8, by uplink Added martix is switched with after channel switch B, is output to port BANT;
Calibration in main switch module and backup path, radiofrequency signal are inputted from the end CAL, BAK1, BAK2 respectively, enter calibration And after backup matrix switch, it is output to port PM;
Microstrip coupled circuit in main switch module, radiofrequency signal are inputted by the ends SG, by exporting 2 tunnels after microstrip coupled circuit Signal, wherein main path signal enters in the power-devided circuit of the broadbands 1-8 all the way, and the signal coupled after sampling is output to Couple Port.
2. a kind of novel solid matrix switching system according to claim 1, which is characterized in that the main switch mould Downmix switch in the block is divided into 3 grades of circuits, and the first order is 8 independent SP2T switches, and the second level is 2 independent SP4T is switched, and the third level is that 1 SP4T is switched;3 grades of circuits are sequentially connected in series;The input of 8 tunnels that channel switch A comes in independently Signal is switched by 8 SP2T of the first order, realizes load matched, is then switched by 2 SP4T of the second level, and 8 roads are believed 2 road signals number are merged into, i.e. the output end two of the independent SP2T switches of every 4 of the first order connects 1 SP4T switches of the second level Input terminal;Again by this 2 road signal be input to the third level 1 SP4T switch, i.e. the 2 of the second level SP4T switch output end connect Connect the input terminal of third level SP4T switches;To merge into 1 road signal and be sent to output end PM.
3. a kind of novel solid matrix switching system according to claim 1, which is characterized in that the main switch mould Uplink added martix switch in the block is made of 8 independent SP2T switches;The 8 roads letter come in by the input of 1-8 broadband power dividers The 8 SP2T switches number being connected respectively in uplink added martix switch, realize load matched, are then output to channel switch B In.
4. a kind of novel solid matrix switching system according to claim 1, which is characterized in that the broadbands 1-8 Power-devided circuit is divided into 3 grades, and the power splitter I that the first order is 11 point 2, the second level is 21 point 2 of power splitter II, the third level 4 A 1 point 2 of power splitter III;The output end of power splitter I connects the input terminal of 2 power splitters II, the output end of each power splitter II Connect the input terminal of 2 power splitters III;4 power splitters of the third level generate 8 output ends, are connected to uplink added martix switch In.
5. a kind of novel solid matrix switching system according to claim 1, which is characterized in that the microstrip coupled electricity Road includes microstrip coupled line, coupling load;And wherein microstrip coupled line is constituted using parallel two adjacent microstrip lines, more slightly Microstrip line be main signal path microstrip line, and thinner microstrip line be coupling path microstrip line, the one of coupling path microstrip line A port is connected with coupling load;Another port is sampled signal port, is output to the ports Couple.
6. a kind of novel solid matrix switching system according to claim 1, which is characterized in that the ARM master controls Further include having the required Switching Power Supply conversion of whole equipment and regulator circuit in making sheet module ,+the 12V being externally entering~+ The wide-range direct current voltage of 48V, using corresponding LDO voltage stabilizer, produces after the Switching Power Supply of LINEAR models and is It unites required+5V and+3.3V voltages.
7. a kind of novel solid matrix switching system according to claim 1, which is characterized in that the main switch mould Block, pcb board material select the RT model microwave planks of Rogers;The pcb board number of plies of design is 6 layers, plate thickness 1.2mm;For The second time electroplating technique of pcb board, it is 0.2~0.4 μm to select process thickness, and resistivity is the heavy silver process of 15.86n Ω m.
8. a kind of novel solid matrix switching system according to claim 1, which is characterized in that the charactron choosing With common cathode charactron;Display content is initial ip address, and display mode is dynamic scan mode.
9. a kind of novel solid matrix switching system according to claim 1, which is characterized in that the main switch mould Input/output end port in the block is all made of half cable welding mode;One end is welded on the port pad of PCB, and the other end is logical Cross the sub-miniature A connector that ring flange is fixed on front and back panel.
10. a kind of novel solid matrix switching system according to claim 1 or 4, which is characterized in that the 1-8 Broadband power-devided circuit selects the power splitter of Wilkinsonw structures, and the power splitter insertion loss of this Wilkinsonw structures is- 10.8dB, interport isolation about -20dB, inband flatness are less than 0.3dB.
11. a kind of novel solid matrix switching system according to claim 1, which is characterized in that the uplink is logical Road and additional channel have passage consistency requirement, it is desirable that power error is less than 0.5dB between 8 channels of data feedback channel, adds Power error between 8 channels in channel is again smaller than 0.5dB;Therefore data feedback channel and additional channel are required in circuit design Error between the track lengths in each 8 channels is less than 500mil.
12. a kind of novel solid matrix switching system according to claim 1, which is characterized in that remove microstrip coupled electricity Outside road, the down going channel, data feedback channel, additional channel, calibration and backup path isolation index, it is desirable that the channel of heterodoxy Between isolation be less than -70dB, with end channel between isolation be less than -44dB.
13. a kind of novel solid matrix switching system according to claim 1, which is characterized in that by microstrip coupled Circuit, the coupled signal sampling of realization -21dB ± 2dB in the broadband range of 0.6~6G, and it is output to port Couple.And The circuit is realized within the scope of 2 × 1mm.
14. a kind of novel solid matrix switching system according to claim 1, which is characterized in that all inputs are defeated The standing-wave ratio of exit port requires to be less than 1.5.
15. a kind of novel solid matrix switching system according to claim 13, which is characterized in that the debugging side of standing wave Formula is:First with the standing wave parameter of different location point on probe detection rf signal line, the maximum point of variation is found, then in phase Soldering tin amount is increased or decreased on the location point answered to change its thickness, and by the copper-surfaced skin on rf signal line and cutting come The width for changing signal wire, to realize the change to the standing-wave ratio of port.
16. a kind of novel solid matrix switching system according to claim 1, which is characterized in that the main switch mould The data-signal of block and digital display module, it is upper by the reception of RJ45 network interfaces by the ARM9 chips of ARM main control modules Machine user information requirement, then data are descended into a manner of SPI in main switch module and digital display module, then by this two A mould 74AHC595 chips in the block are realized the string-of control data and are converted, and control corresponding each switch.
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