CN108493358B - Screen boring device and screen boring method - Google Patents
Screen boring device and screen boring method Download PDFInfo
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- CN108493358B CN108493358B CN201810457436.1A CN201810457436A CN108493358B CN 108493358 B CN108493358 B CN 108493358B CN 201810457436 A CN201810457436 A CN 201810457436A CN 108493358 B CN108493358 B CN 108493358B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Drilling And Boring (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The present invention relates to a kind of screen boring device and screen boring method, screen boring device includes: work head, the cutting portion including work head main body and set on work head main body one end；Driving structure, driving structure and work head are sequentially connected；Wherein, equipped with the discharge port for offering connection outside and storage cavity on storage cavity and work head main body in work head main body.Above-mentioned screen boring device, storage cavity is for storing encapsulating material.During cutting portion opens up mounting hole to screen, encapsulating material in storage cavity is simultaneously from discharge port output to be coated on the hole wall of mounting hole, so, the screen boring device can synchronize the hole wall of encapsulation mounting hole during opening up mounting hole, efficiency and sealing effect are opened up to improve mounting hole, water oxygen is avoided to influence the service life of screen and being exposed to outer hole wall and entering in screen.
Description
Technical field
The present invention relates to screen manufacture fields, more particularly to a kind of screen boring device and screen boring method.
Background technique
With the development and the progress of science and technology of society, the application of the smart machine with display screen is increasingly extensive, and organic
Luminous display unit is due to having the actively characteristics such as luminous, high brightness, wide viewing angle, high contrast, deflection, low energy consumption,
Start to be widely used on the various smart machines such as mobile phone.Organic light-emitting display device passes through internal OLED (organic light emission two
Pole pipe, Organic Light-Emitting Diode) device carry out it is luminous, and since OLED device is outer to steam and oxygen etc.
Boundary's factor is very sensitive, and the stability for touching the OLED device of steam and oxygen can be deteriorated and the service life can reduce, therefore needs
Steam, oxygen intrusion are prevented, using effective encapsulating structure to extend the service life of OLED device.
Currently, the encapsulation of screen generallys use following methods: firstly, evaporator is under vacuum conditions, organic material is saturating
Mask plate is crossed to be deposited to the limited area of LTPS substrate (Low Temperature Poly-silicon, low-temperature polysilicon silicon technology)
On.Then by the LTPS base plate transfer to packaging station after vapor deposition, using the methods of chemical vapor deposition, inkjet printing pair
LTPS substrate is packaged.
But in this context, as what screen accounting of the people to smart machine (especially smart phone) required constantly mentions
Height, with superelevation screen accounting ultra-narrow frame even Rimless be designed to current development trend, be accordingly used in realize camera shooting,
The electronic device of the functions such as recognition of face be usually installed within the scope of display screen to avoid occupy display platen edge on the outside of sky
Between and increase border width, so as to cause needing to form receiving hole inside the thin-film packing structure for encapsulating OLED device to install
The electronic devices such as camera, it is therefore desirable to carry out punching on the screen after packaging and be formed for installing the electronic devices such as camera
Mounting hole, and the formation of mounting hole can destroy the leakproofness of above-mentioned encapsulation, lead to water oxygen invasion screen and reduce making for screen
With service life and job stability.
Summary of the invention
Based on this, it is necessary to which aiming at the problem that punching destroys screen leakproofness on screen after packaging, providing one kind can
The screen boring device and screen boring method to solve the above problems.
A kind of screen boring device, the screen boring device include:
Work head, the cutting portion including work head main body and set on work head main body one end；
Driving structure is sequentially connected to drive the work head to move with the work head；
Wherein, it is equipped with storage cavity in the work head main body, and offers connection outside and institute in the work head main body
State the discharge port of storage cavity.
Set is laminated along the central axial direction of the work head main body in multiple storage cavitys in one of the embodiments,
If
Central axis circumferential array of multiple storage cavitys around the work head main body.
Above-mentioned screen boring device, storage cavity is for storing encapsulating material.The mistake of mounting hole is opened up to screen in cutting portion
Cheng Zhong, the encapsulating material in storage cavity is simultaneously from discharge port output to be coated on the hole wall of mounting hole, in this way, the screen aperture
Device can be synchronized during opening up mounting hole encapsulation mounting hole hole wall, thus improve mounting hole open up efficiency with it is close
Effect is sealed, water oxygen is avoided to influence the service life of screen and being exposed to outer hole wall and entering in screen.
The storage cavity includes the first storing section and the second storing section, first storing in one of the embodiments,
Section is connected to the first storing section and leans on circumferentially around the central axis for being set to the work head main body, described second storing section one end
Nearly described cutting portion one end, the other end of the second storing section along the radial direction of the work head main body extend to it is described go out
Material mouth.
The discharge port extends along the central axial direction of the work head main body in one of the embodiments, described
Screen boring device further includes moving structure, and the moving structure and the storage cavity are sequentially connected, and the moving structure is used for
The storage cavity is driven to move along the central axial direction of the work head main body relative to the work head main body.
The screen boring device includes the discharging knot for being set to the work head main body in one of the embodiments,
Structure, the discharging structure include discharge piston, the discharge piston can in the storage cavity relative to the storage cavity it is mobile with
To applying pressure in the storage cavity.
The screen boring device further includes consolidated structures in one of the embodiments, and the consolidated structures are installed on
In the work head main body and it is located at outside the storage cavity, the storage cavity is around the consolidated structures surrounding.
The screen boring device further includes distance measuring structure in one of the embodiments, and the distance measuring structure is set to institute
It states on the outside of work head main body.
A kind of screen boring method, the screen boring method the following steps are included:
Screen is placed in the Working position of workbench；
The default position of opening of work head alignment screen；
It moves along a straight line while the work head is rotated around center axis along center axis direction to cut
It states screen and forms mounting hole, and coat encapsulating material in the hole wall of the mounting hole to form the hole wall for covering the mounting hole
Encapsulated layer.
Along center axis side while the work head is rotated around center axis in one of the embodiments,
Mounting hole is formed to cut the screen to linear motion, and coats encapsulating material in the hole wall of the mounting hole to form covering
The step of encapsulated layer of the hole wall of the mounting hole specifically includes the following steps:
Measure distance L of the hole wall of mounting hole apart from work head central axis；
When distance L is in H0-H1Between when, the mounting hole hole wall coat the first encapsulating material to form the first encapsulation
Layer；
When distance L is in H1-H2Between when, the second encapsulating material is coated on first encapsulated layer to be formed described in cladding
Second encapsulated layer of the first encapsulated layer；
When distance L is in H2-H3Between when, on second encapsulated layer coat third encapsulating material to be formed described in cladding
The third encapsulated layer of second encapsulated layer；
Wherein, the radius of the work head is H0, first encapsulating material and the third encapsulating material are inorganic material
Material, second encapsulating material are organic material.
Along center axis side while the work head is rotated around center axis in one of the embodiments,
Mounting hole is formed to cut the screen to linear motion, and coats encapsulating material in the hole wall of the mounting hole to form covering
The step of encapsulated layer of the hole wall of the mounting hole, is further comprising the steps of:
Solidify the encapsulating material to form the encapsulated layer.
Detailed description of the invention
Fig. 1 is the front view of the screen boring device of an embodiment；
Fig. 2 is the side view of screen boring device shown in FIG. 1；
Fig. 3 is the top view of screen boring device shown in FIG. 1；
Fig. 4 is the flow chart of the screen boring method of an embodiment.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing
Give presently preferred embodiments of the present invention.But the invention can be realized in many different forms, however it is not limited to this paper institute
The embodiment of description.On the contrary, purpose of providing these embodiments is keeps the understanding to the disclosure more thorough
Comprehensively.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement are for illustrative purposes only.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more phases
Any and all combinations of the listed item of pass.
As shown in Figure 1-Figure 3, a kind of screen boring device 100 of this better embodiment, including work head 10 and driving
Structure.The screen boring device 100 is used to open up the mounting hole for accommodating the electronic devices such as camera on the display screen.
Wherein, the transmission connection of work head 10 is in driving structure, and driving structure is for driving work head 10 around central axis
Line rotates (i.e. main motion), while moving along a straight line (i.e. feed motion) along center axis direction towards screen, to complete to pacify
Dress hole opens up.Work head 10 includes work head main body 12 and the cutting portion 14 set on 12 one end of work head main body, cutting portion 14
With the cutting edge for forming mounting hole for cutting screen.Storage cavity 126 and work head main body 12 are equipped in work head main body 12
On offer the external discharge port 124 with storage cavity 126 of connection.
Above-mentioned screen boring device 100, storage cavity 126 is for storing encapsulating material.Peace is opened up to screen in cutting portion 14
During filling hole, the encapsulating material in storage cavity 126 is exported simultaneously from discharge port 124 to be coated on the hole wall of mounting hole,
In this way, the screen boring device 100 can synchronize the hole wall of encapsulation mounting hole during opening up mounting hole, to improve peace
Dress hole opens up efficiency and sealing effect, and water oxygen is avoided to influence the use of screen and being exposed to outer hole wall and entering in screen
Service life.
Please continue to refer to Fig. 1-Fig. 3, specifically, work head main body 12 is substantially in hollow column structure, including is formed and held
It receives the side wall of slot 122, and offers connection holding tank 122 and external discharge port 124 on the side wall, discharge port 124 is along work
The central axial direction of head main body 12 extends through work head main body 12 far from 14 one end of cutting portion.Screen boring device 100
It further include moving structure (not shown), moving structure and storage cavity 126 are sequentially connected to drive storage cavity 126 along work head main body
12 central axial direction is mobile relative to work head main body 12 and is connected to always with discharge port 124.In this way, moving structure can drive
Storage cavity 126 moves back and forth along the central axial direction of work head main body 12 in work head main body 12 and adjusts package position.
Further, storage cavity 126 is multiple, and multiple storage cavitys 126 are laminated along the central axial direction of work head 10
Setting.In this way, being equipped with multiple storage cavitys 126 in work head main body 12 to accommodate different types of encapsulating material, different encapsulation
Material can form the encapsulated layer of different function to reach different packaging effects.
Storage cavity 126 includes the first storing section 1262 and the second storing section 1264, and the first storing section 1262 circumferentially surrounds
The central axis of work head 10 is simultaneously located in holding tank 122, and it is close that 1264 one end of the second storing section is connected to the first storing section 1262
The other end of 14 one end of cutting portion, the second storing section 1264 extends to discharge port 124 along the radial direction of work head main body 12.Such as
This, encapsulating material can flow to the second storing section 1264 from the first storing section 1262, and then flow out work head by discharge port 124
Main body 12.When storage cavity 126 moves in work head main body 12, the first storing section 1262 moves in holding tank 122, and second
Storing section 1264 is then moved along discharge port 124 and is in communication with the outside always.
Specifically in the present embodiment, discharge port 124 there are two being opened up in work head main body 12, and two discharge ports 124
Positioned at the wherein both ends diametrically of work head main body 12.Storage cavity 126 there are three being set in work head main body 12, three storings
The size of first storing section 1262 of chamber 126 is sequentially increased and is stacked in holding tank 122.Each first storing section 1262
It is all connected with two the second storing sections 1264 difference that the same first storing section 1262 is connected to there are two the second storing section 1264
Two discharge ports 124 are connected to across holding tank 122, and are connected to three second storings of three the first storing sections 1262
Section 1264 is sequentially arranged at intervals in the central axial direction (i.e. 124 extending direction of discharge port) of work head main body 12.It is appreciated that
The quantity for the storage cavity 126 being equipped in work head main body 12 is without being limited thereto, to meet the package material of storage variety classes and quantity
The needs of material.
In this way, the encapsulating material in storage cavity 126 is uniformly distributed circumferentially in avoiding work head in work head main body 12
10 in rotary course unbalance stress and influence machining accuracy.When work head 10 carries out aperture operation to screen, storage cavity 126
It can be transported in work head main body 12 along central axial direction straight line while following work head main body 12 around center axis thereof
It is dynamic, to encapsulating material is coated uniformly on the hole wall for the mounting hole that the cutting of cutting portion 14 is formed.
In another embodiment, central axis circumferential array of multiple storage cavitys 126 around work head 10.In the embodiment party
In formula, storage cavity 126 also includes the first storing section 1262 and the second storing section 1264, and the first storing section 1262 is circumferentially around being set to
The central axis of work head 10,1264 one end of the second storing section are connected to the first storing section 1262 close to 14 one end of cutting portion, and second
The other end of storing section 1264 extends to discharge port 124 along the radial direction of work head 10.
Further, in this embodiment, discharge port 124 there are three being opened up in work head main body 12, and three discharge ports
124 and work head main body 12 central axis line between angle be in 120 °.Three storage cavitys 126 are around the center of work head 10
Axis circumferential array, and the cross section of the first storing section 1262 is arc-shaped and central angle is 120 °, is connected to three
Three the second storing sections 1264 of the first storing section 1262 are respectively corresponded along 12 radial direction of work head main body extends to one out
Material mouth 124, and adjacent second storing section 1264 is also in 120 ° of angles.
In above-mentioned two embodiment, the first encapsulating material, the second package material are separately filled in three storage cavitys 126
Material and third encapsulating material.Wherein, the first encapsulating material and third encapsulating material can be silica, silicon nitride, aluminium oxide, dioxy
Change the inorganic material such as titanium or graphene, to have good resistance to water oxygen performance.Second encapsulating material can be acrylic resin, gather
The organic materials such as terephthaldehyde's acids plastics, pressure sensitive adhesive, polyethylene naphthalate or Parylene, to have good
Shock resistance.It is appreciated that the first encapsulating material, the type of the second encapsulating material and third encapsulating material are without being limited thereto, it can
It is set as needed.
Further, work head 10 can be flexible to change outer diameter size along itself radial direction.In this way, being encapsulated in mounting hole
After the completion, the reduced diameter of work head 10 is covered with the hole wall of encapsulating material and avoids damage to encapsulating material to exit.Due to work
The structure for making first 10 outer radius variable is the state of the art, and therefore, not repeat them here.
In one embodiment, screen boring device 100 includes the discharging structure 50 for being set to work head 10, discharging structure 50
Including discharge piston, discharge piston can be mobile with to applying in storage cavity 126 relative to storage cavity 126 in 126 one end of storage cavity
Pressure, so that the encapsulating material in storage cavity 126 is squeezed out storage cavity 126 and is coated on the side wall of aperture.Specifically, it discharges
Structure 50 includes the hydraulic pump for being connected to discharge piston, and hydraulic pump can drive discharge piston to move in storage cavity 126.In this reality
It applies in mode, a discharging structure 50 is respectively equipped in three storage cavitys 126 to be independently packaged work.It is appreciated that going out
Expect that the specific structure of structure 50 is unlimited, can be set as needed.
In one embodiment, screen boring device 100 further includes consolidated structures 70, and consolidated structures 70 are installed on work head master
In body 12 and it is located at outside storage cavity 126, around 70 surrounding of consolidated structures, which is used for being coated on storage cavity 126
Encapsulating material on the hole wall of mounting hole is heating and curing to improve packaging efficiency.In this way, when storage cavity 126 completes package material
After the coating of material, moving structure can drive storage cavity 126 to move up, and the heat that consolidated structures 70 generate at this time can pass through discharging
Encapsulating material on 124 pairs of hole walls of mouth is heating and curing, without influencing the encapsulating material in storage cavity 126.When solidification is completed
Afterwards, storage cavity 126 can drop to certain position under the drive of moving structure and continue to coat encapsulating material on hole wall.
In one embodiment, screen boring device 100 further includes distance measuring structure 90, and distance measuring structure 90 is set to work head main body
12 outsides are to measure the radius of the hole wall of mounting hole, to obtain the thickness of encapsulating material in real time and control encapsulating structure 120
Working condition.Specifically, in the present embodiment, distance measuring structure 90 can to screen emissions light beam and receive by screen or package material
The light beam being reflected back is expected to obtain the radius of hole wall.It is appreciated that the working principle of distance measuring structure 90 is without being limited thereto, it can be according to need
Select the distance measuring structure 90 with different operating mode.
Above-mentioned screen boring device 100, since different types of encapsulating material can be used during to screen aperture
Hole wall is encapsulated, therefore hole wall can be sealed in time and water oxygen is avoided to enter in screen from hole wall, improves screen packaging efficiency,
Extend the service life of screen.
As shown in figure 4, a kind of screen boring method of this better embodiment, for being opened up on the display screen for holding
Receive the mounting holes of the electronic devices such as camera.The screen boring method the following steps are included:
S110: screen is placed in the Working position of workbench.
S120: work head 10 is directed at default position of opening.
Specifically, the work head 10 that suitable dimension is selected according to the diameter of mounting hole, then by the work head of work head 10
Main body 12 is installed on driving structure far from 14 one end of cutting portion, and moving driving structure later makes the cutting of 12 one end of work head main body
Portion 14 is directed at default position of opening.
S130: it moves along a straight line while work head 10 is rotated around center axis along center axis direction to cut
Screen forms mounting hole, and coats encapsulating material in the hole wall of mounting hole to form the encapsulated layer of the hole wall of covering mounting hole.
Specifically, step S130: to screen aperture and simultaneously encapsulate machined surface the step of specifically includes the following steps:
S131: distance L of the hole wall of mounting hole apart from 10 central axis of work head is measured.
Specifically, the hole wall of 90 real-time measurement mounting hole of distance measuring structure of work head 10 is installed on apart from 10 center of work head
The distance of axis.
S132: when distance L is in H0-H1Between when, mounting hole hole wall coat the first encapsulating material to form the first encapsulation
Layer.
Specifically, during cutting portion 14 cuts screen and forms mounting hole, hole of the work head main body 12 to mounting hole
Wall coats the first encapsulating material to form the first encapsulated layer.Specifically, the first encapsulating material can be silica, silicon nitride, oxidation
The inorganic material such as aluminium, titanium dioxide or graphene, to prevent the hole wall of mounting hole from being corroded by water oxygen.
S134: when distance L is in H1-H2Between when, the second encapsulating material is coated on the first encapsulated layer to form cladding first
Second encapsulated layer of encapsulated layer.
Specifically, after forming the first encapsulated layer, work head main body 12 can continue to coat the second envelope on the first encapsulated layer
Package material is to form the second encapsulated layer.Specifically, the second encapsulating material can for acrylic resin, poly terephthalic acid class plastics,
The organic materials such as pressure sensitive adhesive, polyethylene naphthalate or Parylene, to there is good shock resistance.
S135: when distance L is in H2-H3Between when, on the second encapsulated layer coat third encapsulating material to form cladding second
The third encapsulated layer of encapsulated layer.
Specifically, after forming the second encapsulated layer, work head main body 12 can continue to coat third envelope on the second encapsulated layer
Package material is to form third encapsulated layer.Specifically, the first encapsulating material can for silica, silicon nitride, aluminium oxide, titanium dioxide or
The inorganic material such as graphene, to prevent the second encapsulating material from being corroded by water oxygen.
Wherein, the radius of work head main body 12 is H0, so that opening up radius is H0Mounting hole.In this way, can be according to practical need
The thickness of the first encapsulated layer, the second encapsulated layer and third encapsulated layer is accurately controlled, to reach good packaging effect.It can be with
Understand, the type of encapsulating material and the number of plies of encapsulated layer are without being limited thereto, can form different materials and different layers of as needed
Encapsulated layer.
Step forms envelope to screen aperture and simultaneously in machined surface coating encapsulating material in one of the embodiments,
It is further comprising the steps of to fill layer:
Encapsulating material is formed by curing encapsulated layer.
Specifically, storage cavity 126 can move up under the drive of moving structure and leave mounting hole, at this time consolidated structures
70 can in time solidify encapsulated layer and avoid encapsulating material from flowing downward under gravity and influence packaging effect, and
It avoids influencing the encapsulating material in storage cavity 126.Specifically, after coating the first encapsulating material, after the second encapsulating material of coating
And after coating third encapsulating material, encapsulating material can be solidified respectively, to improve each layer of package quality.
Above-mentioned screen boring method can be packaged the hole wall of mounting hole while opening up mounting hole to screen, from
And it avoids opening up service life and job stability that mounting hole leads to water oxygen invasion screen and shortens screen.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of screen boring device, which is characterized in that the screen boring device includes:
Work head, the cutting portion including work head main body and set on work head main body one end；
Driving structure is sequentially connected to drive the work head to move with the work head；
Wherein, it is equipped with the storage cavity for storing encapsulating material in the work head main body, and is offered in the work head main body
The external discharge port with the storage cavity of connection.
2. screen boring device according to claim 1, which is characterized in that multiple storage cavitys are along the work head master
The central axial direction stacking of body is arranged, or
Central axis circumferential array of multiple storage cavitys around the work head main body.
3. screen boring device according to claim 2, which is characterized in that the storage cavity includes the first storing Duan Yu
Two storing sections, the first storing section is circumferentially around the central axis for being set to the work head main body, the second storing section one
End is connected to the first storing section close to described cutting portion one end, and the other end of the second storing section is along the work head main body
Radial direction extend to the discharge port.
4. screen boring device according to claim 1, which is characterized in that the discharge port is along the work head main body
Central axial direction extends, and the screen boring device further includes moving structure, and the moving structure and the storage cavity are driven
Connection, the moving structure is for driving central axial direction relatively described work of the storage cavity along the work head main body
Head main body is mobile.
5. screen boring device according to claim 1, which is characterized in that the screen boring device includes being set to institute
The discharging structure of work head main body is stated, the discharging structure includes discharge piston, and the discharge piston can be in the storage cavity
It is mobile with to applying pressure in the storage cavity relative to the storage cavity.
6. screen boring device according to claim 1, which is characterized in that the screen boring device further includes solidification knot
Structure, the consolidated structures are installed in the work head main body and are located at outside the storage cavity, and the storage cavity is around described solid
Change structure surrounding.
7. screen boring device according to claim 1, which is characterized in that the screen boring device further includes ranging knot
Structure, the distance measuring structure are set on the outside of the work head main body.
8. a kind of screen boring method, which is characterized in that carry out aperture, the screen aperture to screen using screen boring device
Device includes work head, and the work head includes work head main body and the cutting portion set on work head main body one end, described
It is equipped with storage cavity in work head main body, and offers the external discharge port with the storage cavity of connection in the work head main body,
The storage cavity for storing encapsulating material, the screen boring method the following steps are included:
Screen is placed in the Working position of workbench；
The default position of opening of the work head alignment screen；
It moves along a straight line while the work head is rotated around center axis along center axis direction to cut the screen
Curtain forms mounting hole, and hole wall coating encapsulating material while forming the mounting hole in the mounting hole is to form covering
The encapsulated layer of the hole wall of the mounting hole.
9. screen boring method according to claim 8, which is characterized in that the work head is rotated around center axis
While moved along a straight line along center axis direction to cut the screen and form mounting hole, and forming the mounting hole
The tool the step of hole wall of the mounting hole coats encapsulated layer of the encapsulating material to form the hole wall for covering the mounting hole simultaneously
Body the following steps are included:
Measure distance L of the hole wall of mounting hole apart from work head central axis；
When distance L is in H0-H1Between when, the mounting hole hole wall coat the first encapsulating material to form the first encapsulated layer；
When distance L is in H1-H2Between when, the second encapsulating material is coated on first encapsulated layer with formed cladding described first
Second encapsulated layer of encapsulated layer；
When distance L is in H2-H3Between when, on second encapsulated layer coat third encapsulating material with formed cladding described second
The third encapsulated layer of encapsulated layer；
Wherein, the radius of the work head is H0, first encapsulating material and the third encapsulating material are inorganic material, institute
Stating the second encapsulating material is organic material.
10. screen boring method according to claim 8, which is characterized in that the work head turns around center axis
It moves along a straight line while dynamic along center axis direction to cut the screen and form mounting hole, and is forming the mounting hole
While hole wall coating encapsulated layer of the encapsulating material to form the hole wall for covering the mounting hole of the mounting hole the step of
It is further comprising the steps of:
Solidify the encapsulating material to form the encapsulated layer.
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| CN201810457436.1A CN108493358B (en) | 2018-05-14 | 2018-05-14 | Screen boring device and screen boring method |
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| CN203129151U (en) * | 2013-04-03 | 2013-08-14 | 福建岩土工程勘察研究院 | Grouting head capable of drilling and grouting synchronously |
| CN103611227A (en) * | 2013-07-30 | 2014-03-05 | 陈苏 | Drilling and through-wall fire extinguishing device |
| CN105842950A (en) * | 2014-11-14 | 2016-08-10 | 元太科技工业股份有限公司 | Display panel |
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| CN108493358A (en) | 2018-09-04 |
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Application publication date: 20180904 Assignee: Bazhou Yungu Electronic Technology Co., Ltd.|Kunshan Institute of technology new flat panel display technology center Co., Ltd.|Kunshan Guoxian photoelectric Co., Ltd Assignor: The valley (Guan) Technology Co. Ltd. Contract record no.: X2019990000149 Denomination of invention: Screen opening device and screen opening method Granted publication date: 20191025 License type: Common License Record date: 20191030 |
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Effective date of registration: 20191212 Address after: No. 2 Xiangshan Avenue, Yongning Street, Zengcheng District, Guangzhou, Guangdong province (the core of Zengcheng economic and Technological Development Zone) Patentee after: Guangzhou Guoxian Technology Co., Ltd Address before: 065500 Hebei Langfang County Guan emerging industry demonstration area Patentee before: The valley (Guan) Technology Co. Ltd. |