CN108485570A - A kind of high temperature resistant SMT Heraeus - Google Patents
A kind of high temperature resistant SMT Heraeus Download PDFInfo
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- CN108485570A CN108485570A CN201810292601.2A CN201810292601A CN108485570A CN 108485570 A CN108485570 A CN 108485570A CN 201810292601 A CN201810292601 A CN 201810292601A CN 108485570 A CN108485570 A CN 108485570A
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- parts
- high temperature
- temperature resistant
- gas
- pigment
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a kind of high temperature resistant SMT Heraeus, including：Modifying epoxy resin by organosilicon, vegetable wax, organobentonite, pigment, epoxide diluent, hydroxyethyl cellulose, thixotropic agent, first kind gas-phase silica and the second gas-like phase white carbon, parts by weight shared by each ingredient in the high temperature resistant SMT Heraeus：3 10 parts of 20 29 parts of modifying epoxy resin by organosilicon, 10 16 parts of vegetable wax, 10 19 parts of organobentonite, 0.6 1.9 parts of pigment, 6 15 parts of epoxide diluent, 11 18 parts of hydroxyethyl cellulose, 9 15 parts of thixotropic agent, 3 10 parts of first kind gas-phase silica and the second gas-like phase white carbon.By the above-mentioned means, high temperature resistant SMT Heraeus provided by the invention, curing performance and adhesion strength greatly promote, and high temperature resistance is excellent.
Description
Technical field
The present invention relates to electronics adhesive fields, more particularly to a kind of high temperature resistant SMT Heraeus.
Background technology
Our electronic product is all to add various capacitances by PCB in general, and the electronic components such as resistance are pressed
Made of the electric circuit diagram design of design, so panoramic electric appliance needs a variety of different SMT patches
Piece glue is bonded.
It can be poor due to the high temperature resistance of Heraeus when during manufacturing after wave-soldering twice or more than twice
And fall part phenomenon, it cannot be satisfied the requirement of the present and following high-end technique.
Invention content
The invention mainly solves the technical problem of providing a kind of high temperature resistant SMT Heraeus, curing performance and adhesion strength
It greatly promotes, and high temperature resistance is excellent.
In order to solve the above technical problems, one aspect of the present invention is：A kind of high temperature resistant SMT patches are provided
Glue, including：Modifying epoxy resin by organosilicon, organobentonite, pigment, epoxide diluent, hydroxyethyl cellulose, touches vegetable wax
Become agent, first kind gas-phase silica and the second gas-like phase white carbon, parts by weight shared by each ingredient in the high temperature resistant SMT Heraeus
Number：20-29 parts of modifying epoxy resin by organosilicon, 10-16 parts of vegetable wax, 10-19 parts of organobentonite, 0.6-1.9 parts of pigment, ring
6-15 parts of oxygen diluent, 11-18 parts of hydroxyethyl cellulose, 9-15 parts of thixotropic agent, 3-10 parts of first kind gas-phase silica and second
3-10 parts of gas-like phase white carbon.
In a preferred embodiment of the present invention, parts by weight shared by each ingredient in the high temperature resistant SMT Heraeus：It is organic
20 parts of silicon modified epoxy resin, 10 parts of vegetable wax, 10 parts of organobentonite, 0.6 part of pigment, 6 parts of epoxide diluent, ethoxy are fine
3 parts of 11 parts of dimension element, 9 parts of thixotropic agent, 3 parts of first kind gas-phase silica and the second gas-like phase white carbon.
In a preferred embodiment of the present invention, parts by weight shared by each ingredient in the high temperature resistant SMT Heraeus：It is organic
22 parts of silicon modified epoxy resin, 11 parts of vegetable wax, 11 parts of organobentonite, 0.8 part of pigment, 7 parts of epoxide diluent, ethoxy are fine
5 parts of 12 parts of dimension element, 10 parts of thixotropic agent, 5 parts of first kind gas-phase silica and the second gas-like phase white carbon.
In a preferred embodiment of the present invention, parts by weight shared by each ingredient in the high temperature resistant SMT Heraeus：It is organic
24 parts of silicon modified epoxy resin, 12 parts of vegetable wax, 13 parts of organobentonite, 0.9 part of pigment, 8 parts of epoxide diluent, ethoxy are fine
7 parts of 13 parts of dimension element, 11 parts of thixotropic agent, 7 parts of first kind gas-phase silica and the second gas-like phase white carbon.
In a preferred embodiment of the present invention, parts by weight shared by each ingredient in the high temperature resistant SMT Heraeus：It is organic
25 parts of silicon modified epoxy resin, 13 parts of vegetable wax, 14 parts of organobentonite, 1.1 parts of pigment, 9 parts of epoxide diluent, ethoxy are fine
8 parts of 15 parts of dimension element, 13 parts of thixotropic agent, 8 parts of first kind gas-phase silica and the second gas-like phase white carbon.
In a preferred embodiment of the present invention, parts by weight shared by each ingredient in the high temperature resistant SMT Heraeus：It is organic
29 parts of silicon modified epoxy resin, 16 parts of vegetable wax, 19 parts of organobentonite, 1.5 parts of pigment, 10 parts of epoxide diluent, ethoxy
9 parts of 16 parts of cellulose, 14 parts of thixotropic agent, 9 parts of first kind gas-phase silica and the second gas-like phase white carbon.
The beneficial effects of the invention are as follows：A kind of high temperature resistant SMT Heraeus that the present invention points out, curing performance and adhesion strength
It greatly promotes, and high temperature resistance is excellent.
Specific implementation mode
The technical scheme in the embodiments of the invention will be clearly and completely described below, it is clear that described implementation
Example is only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, this field is common
All other embodiment that technical staff is obtained without making creative work belongs to the model that the present invention protects
It encloses.
Embodiment 1：
It weighs：20 kilograms of modifying epoxy resin by organosilicon, 10 kilograms of vegetable wax, 10 kilograms of organobentonite, 0.6 kilogram of pigment,
6 kilograms of epoxide diluent, 11 kilograms of hydroxyethyl cellulose, 9 kilograms of thixotropic agent, 3 kilograms of first kind gas-phase silica and the second class
The high temperature resistant SMT Heraeus of the present invention is made in 3 kilograms of gas-phase silica.
Embodiment 2：
It weighs：22 kilograms of modifying epoxy resin by organosilicon, 11 kilograms of vegetable wax, 11 kilograms of organobentonite, 0.8 kilogram of pigment,
7 kilograms of epoxide diluent, 12 kilograms of hydroxyethyl cellulose, 10 kilograms of thixotropic agent, 5 kilograms of first kind gas-phase silica and the second class
The high temperature resistant SMT Heraeus of the present invention is made in 5 kilograms of gas-phase silica.
Embodiment 3：
It weighs：24 kilograms of modifying epoxy resin by organosilicon, 12 kilograms of vegetable wax, 13 kilograms of organobentonite, 0.9 kilogram of pigment,
8 kilograms of epoxide diluent, 13 kilograms of hydroxyethyl cellulose, 11 kilograms of thixotropic agent, 7 kilograms of first kind gas-phase silica and the second class
The high temperature resistant SMT Heraeus of the present invention is made in 7 kilograms of gas-phase silica.
Embodiment 4：
It weighs：25 kilograms of modifying epoxy resin by organosilicon, 13 kilograms of vegetable wax, 14 kilograms of organobentonite, 1.1 kilograms of pigment,
9 kilograms of epoxide diluent, 15 kilograms of hydroxyethyl cellulose, 13 kilograms of thixotropic agent, 8 kilograms of first kind gas-phase silica and the second class
The high temperature resistant SMT Heraeus of the present invention is made in 8 kilograms of gas-phase silica.
Embodiment 5：
It weighs：29 kilograms of modifying epoxy resin by organosilicon, 16 kilograms of vegetable wax, 19 kilograms of organobentonite, 1.5 kilograms of pigment,
10 kilograms of epoxide diluent, 16 kilograms of hydroxyethyl cellulose, 14 kilograms of thixotropic agent, 9 kilograms of first kind gas-phase silica and second
The high temperature resistant SMT Heraeus of the present invention is made in 9 kilograms of gas-like phase white carbon.
High temperature resistant SMT Heraeus prepared by embodiment 1-5, is detected according to relevant criterion, testing result such as table 1.
Table 1：
| Existing product | Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Embodiment 5 | |
| 150 DEG C of curing rates（s） | 160 | 120 | 121 | 119 | 122 | 123 |
| Push/pull（N） | 13 | 14.8 | 14.9 | 15.0 | 14.7 | 14.6 |
| Shear strength（MPa） | 16 | 25.3 | 26.1 | 25.9 | 25.6 | 25.8 |
| Tg（℃） | 160 | 198 | 200 | 201 | 197 | 202 |
In conclusion a kind of high temperature resistant SMT Heraeus that the present invention points out, curing performance and adhesion strength greatly promote, and it is resistance to
High-temperature behavior is excellent.
Example the above is only the implementation of the present invention is not intended to limit the scope of the invention, every to utilize this hair
Equivalent structure or equivalent flow shift made by bright description is applied directly or indirectly in other relevant technology necks
Domain is included within the scope of the present invention.
Claims (6)
1. a kind of high temperature resistant SMT Heraeus, which is characterized in that including：Modifying epoxy resin by organosilicon, vegetable wax, organic swelling
Soil, pigment, epoxide diluent, hydroxyethyl cellulose, thixotropic agent, first kind gas-phase silica and the second gas-like phase white carbon, institute
State parts by weight shared by each ingredient in high temperature resistant SMT Heraeus：20-29 parts of modifying epoxy resin by organosilicon, vegetable wax 10-16
Part, 10-19 parts of organobentonite, 0.6-1.9 parts of pigment, 6-15 parts of epoxide diluent, 11-18 parts of hydroxyethyl cellulose, thixotroping
3-10 parts of 9-15 parts of agent, 3-10 parts of first kind gas-phase silica and the second gas-like phase white carbon.
2. high temperature resistant SMT Heraeus according to claim 1, which is characterized in that in the high temperature resistant SMT Heraeus respectively at
Parts by weight shared by point：20 parts of modifying epoxy resin by organosilicon, 10 parts of vegetable wax, 10 parts of organobentonite, 0.6 part of pigment, ring
6 parts of oxygen diluent, 11 parts of hydroxyethyl cellulose, 9 parts of thixotropic agent, 3 parts of first kind gas-phase silica and the second gas-like phase white carbon 3
Part.
3. high temperature resistant SMT Heraeus according to claim 1, which is characterized in that in the high temperature resistant SMT Heraeus respectively at
Parts by weight shared by point：22 parts of modifying epoxy resin by organosilicon, 11 parts of vegetable wax, 11 parts of organobentonite, 0.8 part of pigment, ring
7 parts of oxygen diluent, 12 parts of hydroxyethyl cellulose, 10 parts of thixotropic agent, 5 parts of first kind gas-phase silica and the second gas-like phase white carbon
5 parts.
4. high temperature resistant SMT Heraeus according to claim 1, which is characterized in that in the high temperature resistant SMT Heraeus respectively at
Parts by weight shared by point：24 parts of modifying epoxy resin by organosilicon, 12 parts of vegetable wax, 13 parts of organobentonite, 0.9 part of pigment, ring
8 parts of oxygen diluent, 13 parts of hydroxyethyl cellulose, 11 parts of thixotropic agent, 7 parts of first kind gas-phase silica and the second gas-like phase white carbon
7 parts.
5. high temperature resistant SMT Heraeus according to claim 1, which is characterized in that in the high temperature resistant SMT Heraeus respectively at
Parts by weight shared by point：25 parts of modifying epoxy resin by organosilicon, 13 parts of vegetable wax, 14 parts of organobentonite, 1.1 parts of pigment, ring
9 parts of oxygen diluent, 15 parts of hydroxyethyl cellulose, 13 parts of thixotropic agent, 8 parts of first kind gas-phase silica and the second gas-like phase white carbon
8 parts.
6. high temperature resistant SMT Heraeus according to claim 1, which is characterized in that in the high temperature resistant SMT Heraeus respectively at
Parts by weight shared by point：29 parts of modifying epoxy resin by organosilicon, 16 parts of vegetable wax, 19 parts of organobentonite, 1.5 parts of pigment, ring
10 parts of oxygen diluent, 16 parts of hydroxyethyl cellulose, 14 parts of thixotropic agent, 9 parts of first kind gas-phase silica and the second gas-like phase hard charcoal
Black 9 parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810292601.2A CN108485570A (en) | 2018-04-04 | 2018-04-04 | A kind of high temperature resistant SMT Heraeus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810292601.2A CN108485570A (en) | 2018-04-04 | 2018-04-04 | A kind of high temperature resistant SMT Heraeus |
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| Publication Number | Publication Date |
|---|---|
| CN108485570A true CN108485570A (en) | 2018-09-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810292601.2A Pending CN108485570A (en) | 2018-04-04 | 2018-04-04 | A kind of high temperature resistant SMT Heraeus |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105315959A (en) * | 2015-11-24 | 2016-02-10 | 苏州盖德精细材料有限公司 | High-temperature-resistant SMT adhesive and preparing method thereof |
-
2018
- 2018-04-04 CN CN201810292601.2A patent/CN108485570A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105315959A (en) * | 2015-11-24 | 2016-02-10 | 苏州盖德精细材料有限公司 | High-temperature-resistant SMT adhesive and preparing method thereof |
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Application publication date: 20180904 |