CN108483917A - A kind of improved enamel not adhering process method - Google Patents
A kind of improved enamel not adhering process method Download PDFInfo
- Publication number
- CN108483917A CN108483917A CN201810571301.8A CN201810571301A CN108483917A CN 108483917 A CN108483917 A CN 108483917A CN 201810571301 A CN201810571301 A CN 201810571301A CN 108483917 A CN108483917 A CN 108483917A
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- CN
- China
- Prior art keywords
- enamel
- adhering process
- process method
- even application
- organosilicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The invention discloses a kind of improved enamel not adhering process methods, belong to coating technology field comprising following processing step：（1）Enamel high temperature sintering, 830~850 DEG C of temperature；（2）600~650 DEG C are cooled to, makes enamel surfaces jelly；（3）Even application is atomized the organosilicon of shape, 4~5kg of spray pressure；（4）Enamel surfaces rapid cooling is to 450~480 DEG C, the uniform pin hole of Surface Creation；（5）One strata tetrafluoroethene of even application；（6）Stand cooling.The enamel of a modification of the present invention not adhering process method keeps enamel surfaces no longer brittle due to being permeated with organosilicon in enamel surfaces, and being stuck in the polytetrafluorethylecoatings coatings that will not fall off in pin hole then has excellent non-stick.
Description
Technical field
The invention belongs to coating technology field, more particularly, to a kind of improved enamel not adhering process method.
Background technology
Enamel has the excellent performances such as hardness height, high temperature resistant, anticorrosion, wear-resisting and insulation, beauty, but the disadvantage is that easily
It is broken, it can glue, to affect the use of enamel.
Invention content
The purpose of the present invention is to provide a kind of improved enamel not adhering process methods, solve existing for existing enamel
Problem that is frangible, can gluing.
To achieve the above object, technical scheme is as follows：A kind of improved enamel not adhering process method, including with
Lower processing step：
（1）Enamel high temperature sintering, 830~850 DEG C of temperature；
（2）600~650 DEG C are cooled to, makes enamel surfaces jelly；
（3）Even application is atomized the organosilicon of shape, 4~5kg of spray pressure；
（4）Enamel surfaces rapid cooling is to 450~480 DEG C, the uniform pin hole of Surface Creation；
（5）One strata tetrafluoroethene of even application；
（6）Stand cooling.
The beneficial effects of the present invention are：
Adhering process method does not make enamel surfaces to the enamel of a modification of the present invention due to being permeated with organosilicon in enamel surfaces
It is no longer brittle, and being stuck in the polytetrafluorethylecoatings coatings that will not fall off in pin hole then has excellent non-stick.
Specific implementation mode
Below in conjunction with the embodiment of the present invention, technical scheme of the present invention is clearly and completely described, it is clear that
Described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Based on the implementation in the present invention
Example, every other embodiment obtained by those of ordinary skill in the art without making creative efforts belong to
The scope of protection of the invention.
Embodiment 1
A kind of improved enamel not adhering process method, comprises the following steps that：
（1）Enamel high temperature sintering, 830 DEG C of temperature；
（2）600 DEG C are cooled to, makes enamel surfaces jelly；
（3）Even application is atomized the organosilicon of shape, spray pressure 4kg；
（4）Enamel surfaces rapid cooling is to 450 DEG C, the uniform pin hole of Surface Creation；
（5）One strata tetrafluoroethene of even application；
（6）Stand cooling.
Embodiment 2
A kind of improved enamel not adhering process method, comprises the following steps that：
（1）Enamel high temperature sintering, 850 DEG C of temperature；
（2）650 DEG C are cooled to, makes enamel surfaces jelly；
（3）Even application is atomized the organosilicon of shape, spray pressure 5kg；
（4）Enamel surfaces rapid cooling is to 480 DEG C, the uniform pin hole of Surface Creation；
（5）One strata tetrafluoroethene of even application；
（6）Stand cooling.
Embodiment 3
A kind of improved enamel not adhering process method, comprises the following steps that：
（1）Enamel high temperature sintering, 840 DEG C of temperature；
（2）630 DEG C are cooled to, makes enamel surfaces jelly；
（3）Even application is atomized the organosilicon of shape, spray pressure 4.5kg；
（4）Enamel surfaces rapid cooling is to 460 DEG C, the uniform pin hole of Surface Creation；
（5）One strata tetrafluoroethene of even application；
（6）Stand cooling.
The enamel of a modification of the present invention not adhering process method, after enamel high temperature sintering, temperature from Celsius 830~
850 degree start back to drop to 600~650 degree, enamel surfaces still jelly when, with 4~5kg pressure being atomized heat safe organosilicon
Even application generates uniform pin hole in enamel surfaces, the rapid cooling of enamel surfaces meeting at this time to 450~480 degree or so, then
A strata tetrafluoroethene is sprayed again, is statically placed in sintering furnace until cooling.
Adhering process method does not make enamel to the enamel of a modification of the present invention due to being permeated with organosilicon in enamel surfaces
Surface is no longer brittle, and being stuck in the polytetrafluorethylecoatings coatings that will not fall off in pin hole then has excellent non-stick.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
Understanding without departing from the principles and spirit of the present invention can carry out these embodiments a variety of variations, modification, replace
And modification, the scope of the present invention is defined by the appended.
Claims (1)
1. a kind of improved enamel not adhering process method, it is characterised in that：It comprises the following steps that：
（1）Enamel high temperature sintering, 830~850 DEG C of temperature；
（2）600~650 DEG C are cooled to, makes enamel surfaces jelly；
（3）Even application is atomized the organosilicon of shape, 4~5kg of spray pressure；
（4）Enamel surfaces rapid cooling is to 450~480 DEG C, the uniform pin hole of Surface Creation；
（5）One strata tetrafluoroethene of even application；
（6）Stand cooling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810571301.8A CN108483917B (en) | 2018-06-06 | 2018-06-06 | Improved enamel non-stick process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810571301.8A CN108483917B (en) | 2018-06-06 | 2018-06-06 | Improved enamel non-stick process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108483917A true CN108483917A (en) | 2018-09-04 |
| CN108483917B CN108483917B (en) | 2021-03-23 |
Family
ID=63342218
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810571301.8A Active CN108483917B (en) | 2018-06-06 | 2018-06-06 | Improved enamel non-stick process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108483917B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1050351A (en) * | 1989-09-19 | 1991-04-03 | 张兴信 | Method with the mending enamelled reactor of polyflon |
| CN1061628A (en) * | 1991-11-28 | 1992-06-03 | 王戈岩 | The method of mending enamelled equipment |
| CN1319684A (en) * | 1999-10-12 | 2001-10-31 | 东陶机器株式会社 | Enamel products |
| CN1629356A (en) * | 2003-12-15 | 2005-06-22 | 许相熙 | Metallic plate coated with enamel layer and containing fluorine polymer, and method for making same |
| CN101353268A (en) * | 2008-08-16 | 2009-01-28 | 吴永宣 | Production process of ceramic non-stick container having ground glaze layer |
| CN101492820A (en) * | 2009-02-25 | 2009-07-29 | 王崇哲 | Boiler surface treating method |
| CN104909830A (en) * | 2015-05-29 | 2015-09-16 | 上海大学 | Method for reinforcing silica-based ceramic core by using silicon resin to enhance mechanical properties |
| CN205649345U (en) * | 2015-12-11 | 2016-10-19 | 九阳股份有限公司 | Pan and electric heat pot |
-
2018
- 2018-06-06 CN CN201810571301.8A patent/CN108483917B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1050351A (en) * | 1989-09-19 | 1991-04-03 | 张兴信 | Method with the mending enamelled reactor of polyflon |
| CN1061628A (en) * | 1991-11-28 | 1992-06-03 | 王戈岩 | The method of mending enamelled equipment |
| CN1319684A (en) * | 1999-10-12 | 2001-10-31 | 东陶机器株式会社 | Enamel products |
| CN1629356A (en) * | 2003-12-15 | 2005-06-22 | 许相熙 | Metallic plate coated with enamel layer and containing fluorine polymer, and method for making same |
| CN101353268A (en) * | 2008-08-16 | 2009-01-28 | 吴永宣 | Production process of ceramic non-stick container having ground glaze layer |
| CN101492820A (en) * | 2009-02-25 | 2009-07-29 | 王崇哲 | Boiler surface treating method |
| CN104909830A (en) * | 2015-05-29 | 2015-09-16 | 上海大学 | Method for reinforcing silica-based ceramic core by using silicon resin to enhance mechanical properties |
| CN205649345U (en) * | 2015-12-11 | 2016-10-19 | 九阳股份有限公司 | Pan and electric heat pot |
Non-Patent Citations (1)
| Title |
|---|
| 钟继年: "用PPS树脂修补搪瓷设备", 《腐蚀与防护》 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108483917B (en) | 2021-03-23 |
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