CN108463720B - 具有声学振动的剪切模式和纵向模式的增强反射的谐振器结构 - Google Patents

具有声学振动的剪切模式和纵向模式的增强反射的谐振器结构 Download PDF

Info

Publication number
CN108463720B
CN108463720B CN201680075266.XA CN201680075266A CN108463720B CN 108463720 B CN108463720 B CN 108463720B CN 201680075266 A CN201680075266 A CN 201680075266A CN 108463720 B CN108463720 B CN 108463720B
Authority
CN
China
Prior art keywords
layer
acoustic impedance
acoustic
electrode
securely mounted
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201680075266.XA
Other languages
English (en)
Chinese (zh)
Other versions
CN108463720A (zh
Inventor
R.莫尔顿
J.贝尔西克
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qorvo US Inc
Original Assignee
Qorvo US Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qorvo US Inc filed Critical Qorvo US Inc
Publication of CN108463720A publication Critical patent/CN108463720A/zh
Application granted granted Critical
Publication of CN108463720B publication Critical patent/CN108463720B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B06GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06BMETHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0644Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
    • B06B1/0662Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface
    • B06B1/0681Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface and a damping structure
    • B06B1/0685Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface and a damping structure on the back only of piezoelectric elements
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01HMEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H11/00Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
    • G01H11/06Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
    • G01H11/08Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means using piezoelectric devices
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/02Analysing fluids
    • G01N29/022Fluid sensors based on microsensors, e.g. quartz crystal-microbalance [QCM], surface acoustic wave [SAW] devices, tuning forks, cantilevers, flexural plate wave [FPW] devices
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/02Analysing fluids
    • G01N29/036Analysing fluids by measuring frequency or resonance of acoustic waves
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22Details, e.g. general constructional or apparatus details
    • G01N29/24Probes
    • G01N29/2437Piezoelectric probes
    • GPHYSICS
    • G10MUSICAL INSTRUMENTS; ACOUSTICS
    • G10KSOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K11/00Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/02Mechanical acoustic impedances; Impedance matching, e.g. by horns; Acoustic resonators
    • G10K11/04Acoustic filters ; Acoustic resonators
    • GPHYSICS
    • G10MUSICAL INSTRUMENTS; ACOUSTICS
    • G10KSOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K11/00Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/18Methods or devices for transmitting, conducting or directing sound
    • G10K11/24Methods or devices for transmitting, conducting or directing sound for conducting sound through solid bodies, e.g. wires
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02Details
    • H03H9/02007Details of bulk acoustic wave devices
    • H03H9/02086Means for compensation or elimination of undesirable effects
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/171Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
    • H03H9/172Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
    • H03H9/175Acoustic mirrors
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00Indexing codes associated with group G01N29/00
    • G01N2291/01Indexing codes associated with the measuring variable
    • G01N2291/012Phase angle
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00Indexing codes associated with group G01N29/00
    • G01N2291/01Indexing codes associated with the measuring variable
    • G01N2291/014Resonance or resonant frequency
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00Indexing codes associated with group G01N29/00
    • G01N2291/02Indexing codes associated with the analysed material
    • G01N2291/025Change of phase or condition
    • G01N2291/0255(Bio)chemical reactions, e.g. on biosensors
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00Indexing codes associated with group G01N29/00
    • G01N2291/02Indexing codes associated with the analysed material
    • G01N2291/025Change of phase or condition
    • G01N2291/0256Adsorption, desorption, surface mass change, e.g. on biosensors
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00Indexing codes associated with group G01N29/00
    • G01N2291/04Wave modes and trajectories
    • G01N2291/042Wave modes
    • G01N2291/0426Bulk waves, e.g. quartz crystal microbalance, torsional waves

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Multimedia (AREA)
  • Mechanical Engineering (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
CN201680075266.XA 2015-10-21 2016-10-19 具有声学振动的剪切模式和纵向模式的增强反射的谐振器结构 Active CN108463720B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201562244284P 2015-10-21 2015-10-21
US62/244284 2015-10-21
PCT/US2016/057653 WO2017070177A1 (en) 2015-10-21 2016-10-19 Resonator structure with enhanced reflection of shear and longitudinal modes of acoustic vibrations

Publications (2)

Publication Number Publication Date
CN108463720A CN108463720A (zh) 2018-08-28
CN108463720B true CN108463720B (zh) 2021-03-23

Family

ID=57206457

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680075266.XA Active CN108463720B (zh) 2015-10-21 2016-10-19 具有声学振动的剪切模式和纵向模式的增强反射的谐振器结构

Country Status (5)

Country Link
US (1) US10193524B2 (https=)
EP (1) EP3365669B8 (https=)
JP (1) JP6916176B2 (https=)
CN (1) CN108463720B (https=)
WO (1) WO2017070177A1 (https=)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11356071B2 (en) * 2016-03-11 2022-06-07 Akoustis, Inc. Piezoelectric acoustic resonator with improved TCF manufactured with piezoelectric thin film transfer process
DE102017111448B4 (de) * 2017-05-24 2022-02-10 RF360 Europe GmbH SAW-Vorrichtung mit unterdrückten Störmodensignalen
EP3762155B1 (en) 2018-03-09 2023-12-13 BFLY Operations, Inc. Methods for fabricating ultrasound transducer devices
US11750169B2 (en) 2018-07-17 2023-09-05 Ii-Vi Delaware, Inc. Electrode-defined unsuspended acoustic resonator
DE102019115589B4 (de) 2018-07-17 2024-06-13 Ii-Vi Delaware, Inc. Elektrodenbegrenzter resonator
US12076973B2 (en) 2018-07-17 2024-09-03 Ii-Vi Delaware, Inc. Bonded substrate including polycrystalline diamond film
JP2020053966A (ja) * 2018-09-24 2020-04-02 スカイワークス グローバル プライベート リミテッド バルク弾性波デバイスにおける多層隆起フレーム
DE102018132920B4 (de) * 2018-12-19 2020-08-06 RF360 Europe GmbH Elektroakustischer Resonator und Verfahren zu seiner Herstellung
CN109870504A (zh) * 2019-01-16 2019-06-11 东南大学 一种用于液体检测的微流通道声波传感器
WO2020203092A1 (ja) * 2019-03-29 2020-10-08 株式会社村田製作所 弾性波装置
TWI810698B (zh) * 2019-06-12 2023-08-01 美商特拉華公司 電極界定未懸掛之聲波共振器
CN114868015B (zh) * 2019-12-19 2026-03-20 Qorvo美国公司 用于质量传感的谐振器结构
CN111351848B (zh) * 2020-03-19 2020-10-16 山东科技大学 一种传感器的制备方法、传感器以及传感器的检测方法
EP4200981A1 (en) * 2020-09-14 2023-06-28 Huawei Technologies Co., Ltd. Solidly mounted bulk acoustic wave resonator with frequency tuning by mass loading in acoustic reflector and method of manufacturing thereof
DE102021209875A1 (de) 2020-09-18 2022-03-24 Skyworks Global Pte. Ltd. Akustische volumenwellenvorrichtung mit erhöhter rahmenstruktur
CN112350680B (zh) * 2020-10-20 2024-12-10 中芯集成电路(宁波)有限公司 一种薄膜声波谐振器及其制造方法
WO2022168498A1 (ja) * 2021-02-05 2022-08-11 日本碍子株式会社 複合基板、弾性表面波素子および複合基板の製造方法
CN112953447B (zh) * 2021-02-09 2023-08-11 偲百创(深圳)科技有限公司 谐振器及电子设备
CN112910433B (zh) * 2021-03-04 2025-09-16 偲百创(深圳)科技有限公司 横向激励剪切模式的声学谐振器
CN112953449B (zh) * 2021-03-04 2024-10-01 偲百创(深圳)科技有限公司 横向激励剪切模式的声学谐振器的制造方法
CN114285390B (zh) * 2021-03-15 2025-11-18 偲百创(深圳)科技有限公司 厚度方向激励剪切模式的声学谐振器
CN216414272U (zh) * 2021-11-29 2022-04-29 瑞声科技(南京)有限公司 一种压电薄膜声学谐振器
JP2023139785A (ja) * 2022-03-22 2023-10-04 リバーエレテック株式会社 弾性波素子及びそれを用いた原子発振器
CN118891824A (zh) * 2022-03-28 2024-11-01 日本碍子株式会社 复合基板、弹性表面波元件以及复合基板的制造方法
CN116346080B (zh) * 2023-02-15 2024-07-12 上海馨欧集成微电有限公司 一种声表面波滤波器
CN117097283B (zh) * 2023-10-13 2024-01-30 广州市艾佛光通科技有限公司 一种固态装配型谐振器制作方法及固态装配型谐振器
CN119298871B (zh) * 2024-01-31 2025-11-07 上海馨欧集成微电有限公司 一种高频声波谐振器及通信设备
CN118980744A (zh) * 2024-08-28 2024-11-19 集美大学 一种基于AIScN压电薄膜的异质声学结构的表面声波氢气传感器

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4640756A (en) * 1983-10-25 1987-02-03 The United States Of America As Represented By The United States Department Of Energy Method of making a piezoelectric shear wave resonator
DE10124349A1 (de) 2001-05-18 2002-12-05 Infineon Technologies Ag Piezoelektrische Resonatorvorrichtung mit Verstimmungsschichtfolge
JP4037825B2 (ja) * 2001-07-30 2008-01-23 インフィネオン テクノロジーズ アクチエンゲゼルシャフト 音響反射器を備える圧電性共振器装置
DE10251876B4 (de) * 2002-11-07 2008-08-21 Infineon Technologies Ag BAW-Resonator mit akustischem Reflektor und Filterschaltung
JP4321754B2 (ja) * 2003-07-31 2009-08-26 Tdk株式会社 圧電共振器およびそれを用いたフィルタ
US6946928B2 (en) * 2003-10-30 2005-09-20 Agilent Technologies, Inc. Thin-film acoustically-coupled transformer
DE102004035812A1 (de) * 2004-07-23 2006-03-16 Epcos Ag Mit akustischen Volumenwellen arbeitender Resonator
DE102005043034A1 (de) * 2005-09-09 2007-03-15 Siemens Ag Vorrichtung und Verfahren zur Bewegung einer Flüssigkeit
US8089195B2 (en) 2007-12-17 2012-01-03 Resonance Semiconductor Corporation Integrated acoustic bandgap devices for energy confinement and methods of fabricating same
WO2009088307A1 (en) * 2008-01-09 2009-07-16 Angelsen Bjoern A J Multiple frequency band acoustic transducer arrays
CN101246162A (zh) * 2008-03-12 2008-08-20 浙江大学 利用压电薄膜体声波器件的抗体检测生物芯片
CN101277099A (zh) * 2008-03-12 2008-10-01 浙江大学 适用于fbar的金属布拉格声波反射层结构
US9735338B2 (en) * 2009-01-26 2017-08-15 Cymatics Laboratories Corp. Protected resonator
FI123640B (fi) * 2010-04-23 2013-08-30 Teknologian Tutkimuskeskus Vtt Laajakaistainen akustisesti kytketty ohutkalvo-BAW-suodin
US8810108B2 (en) 2010-09-09 2014-08-19 Georgia Tech Research Corporation Multi-mode bulk-acoustic-wave resonators
CN103403538B (zh) 2010-10-20 2016-06-01 快速诊断技术公司 利用共振传感器测量结合动力的装置和方法
WO2012086441A1 (ja) * 2010-12-24 2012-06-28 株式会社村田製作所 弾性波装置及びその製造方法
JP5905677B2 (ja) * 2011-08-02 2016-04-20 太陽誘電株式会社 圧電薄膜共振器およびその製造方法
FI124732B (en) * 2011-11-11 2014-12-31 Teknologian Tutkimuskeskus Vtt Lateral connected bulk wave filter with improved passband characteristics
US9219517B2 (en) 2013-10-02 2015-12-22 Triquint Semiconductor, Inc. Temperature compensated bulk acoustic wave devices using over-moded acoustic reflector layers

Also Published As

Publication number Publication date
US20170117872A1 (en) 2017-04-27
CN108463720A (zh) 2018-08-28
EP3365669A1 (en) 2018-08-29
JP6916176B2 (ja) 2021-08-11
JP2018535595A (ja) 2018-11-29
EP3365669B1 (en) 2023-08-23
US10193524B2 (en) 2019-01-29
EP3365669B8 (en) 2024-03-13
WO2017070177A1 (en) 2017-04-27

Similar Documents

Publication Publication Date Title
CN108463720B (zh) 具有声学振动的剪切模式和纵向模式的增强反射的谐振器结构
US11695384B2 (en) Acoustic resonator device with controlled placement of functionalization material
CN109073601B (zh) 具有增加的动态测量范围的baw传感器流体装置
US10618045B2 (en) Sensor device with BAW resonator and through-substrate fluidic vias
US11353428B2 (en) BAW sensor device with peel-resistant wall structure
US10352904B2 (en) Acoustic resonator devices and methods providing patterned functionalization areas
CN108474764B (zh) 声学谐振器设备和提供气密性及表面功能化的制造方法
US10326425B2 (en) Acoustic resonator with reduced mechanical clamping of an active region for enhanced shear mode response
US10458982B2 (en) Fluidic device including BAW resonators along opposing channel surfaces
US10812045B2 (en) BAW sensor with enhanced surface area active region
US12498352B2 (en) Fluidic device with fluid port orthogonal to functionalized active region
HK1260244A1 (en) Resonator structure with enhanced reflection of shear and longitudinal modes of acoustic vibrations
HK1260244B (zh) 具有声学振动的剪切模式和纵向模式的增强反射的谐振器结构
HK1260247A1 (en) Acoustic resonator devices and fabrication methods providing hermeticity and surface functionalization

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
REG Reference to a national code

Ref country code: HK

Ref legal event code: DE

Ref document number: 1260244

Country of ref document: HK

GR01 Patent grant
GR01 Patent grant