CN108463720B - 具有声学振动的剪切模式和纵向模式的增强反射的谐振器结构 - Google Patents
具有声学振动的剪切模式和纵向模式的增强反射的谐振器结构 Download PDFInfo
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- CN108463720B CN108463720B CN201680075266.XA CN201680075266A CN108463720B CN 108463720 B CN108463720 B CN 108463720B CN 201680075266 A CN201680075266 A CN 201680075266A CN 108463720 B CN108463720 B CN 108463720B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
- B06B1/0662—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface
- B06B1/0681—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface and a damping structure
- B06B1/0685—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface and a damping structure on the back only of piezoelectric elements
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
- G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
- G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
- G01H11/08—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means using piezoelectric devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/02—Analysing fluids
- G01N29/022—Fluid sensors based on microsensors, e.g. quartz crystal-microbalance [QCM], surface acoustic wave [SAW] devices, tuning forks, cantilevers, flexural plate wave [FPW] devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/02—Analysing fluids
- G01N29/036—Analysing fluids by measuring frequency or resonance of acoustic waves
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
- G01N29/2437—Piezoelectric probes
-
- G—PHYSICS
- G10—MUSICAL INSTRUMENTS; ACOUSTICS
- G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
- G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
- G10K11/02—Mechanical acoustic impedances; Impedance matching, e.g. by horns; Acoustic resonators
- G10K11/04—Acoustic filters ; Acoustic resonators
-
- G—PHYSICS
- G10—MUSICAL INSTRUMENTS; ACOUSTICS
- G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
- G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
- G10K11/18—Methods or devices for transmitting, conducting or directing sound
- G10K11/24—Methods or devices for transmitting, conducting or directing sound for conducting sound through solid bodies, e.g. wires
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02007—Details of bulk acoustic wave devices
- H03H9/02086—Means for compensation or elimination of undesirable effects
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
- H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
- H03H9/175—Acoustic mirrors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/01—Indexing codes associated with the measuring variable
- G01N2291/012—Phase angle
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/01—Indexing codes associated with the measuring variable
- G01N2291/014—Resonance or resonant frequency
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/025—Change of phase or condition
- G01N2291/0255—(Bio)chemical reactions, e.g. on biosensors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/025—Change of phase or condition
- G01N2291/0256—Adsorption, desorption, surface mass change, e.g. on biosensors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/04—Wave modes and trajectories
- G01N2291/042—Wave modes
- G01N2291/0426—Bulk waves, e.g. quartz crystal microbalance, torsional waves
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Multimedia (AREA)
- Mechanical Engineering (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562244284P | 2015-10-21 | 2015-10-21 | |
| US62/244284 | 2015-10-21 | ||
| PCT/US2016/057653 WO2017070177A1 (en) | 2015-10-21 | 2016-10-19 | Resonator structure with enhanced reflection of shear and longitudinal modes of acoustic vibrations |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108463720A CN108463720A (zh) | 2018-08-28 |
| CN108463720B true CN108463720B (zh) | 2021-03-23 |
Family
ID=57206457
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201680075266.XA Active CN108463720B (zh) | 2015-10-21 | 2016-10-19 | 具有声学振动的剪切模式和纵向模式的增强反射的谐振器结构 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10193524B2 (https=) |
| EP (1) | EP3365669B8 (https=) |
| JP (1) | JP6916176B2 (https=) |
| CN (1) | CN108463720B (https=) |
| WO (1) | WO2017070177A1 (https=) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11356071B2 (en) * | 2016-03-11 | 2022-06-07 | Akoustis, Inc. | Piezoelectric acoustic resonator with improved TCF manufactured with piezoelectric thin film transfer process |
| DE102017111448B4 (de) * | 2017-05-24 | 2022-02-10 | RF360 Europe GmbH | SAW-Vorrichtung mit unterdrückten Störmodensignalen |
| EP3762155B1 (en) | 2018-03-09 | 2023-12-13 | BFLY Operations, Inc. | Methods for fabricating ultrasound transducer devices |
| US11750169B2 (en) | 2018-07-17 | 2023-09-05 | Ii-Vi Delaware, Inc. | Electrode-defined unsuspended acoustic resonator |
| DE102019115589B4 (de) | 2018-07-17 | 2024-06-13 | Ii-Vi Delaware, Inc. | Elektrodenbegrenzter resonator |
| US12076973B2 (en) | 2018-07-17 | 2024-09-03 | Ii-Vi Delaware, Inc. | Bonded substrate including polycrystalline diamond film |
| JP2020053966A (ja) * | 2018-09-24 | 2020-04-02 | スカイワークス グローバル プライベート リミテッド | バルク弾性波デバイスにおける多層隆起フレーム |
| DE102018132920B4 (de) * | 2018-12-19 | 2020-08-06 | RF360 Europe GmbH | Elektroakustischer Resonator und Verfahren zu seiner Herstellung |
| CN109870504A (zh) * | 2019-01-16 | 2019-06-11 | 东南大学 | 一种用于液体检测的微流通道声波传感器 |
| WO2020203092A1 (ja) * | 2019-03-29 | 2020-10-08 | 株式会社村田製作所 | 弾性波装置 |
| TWI810698B (zh) * | 2019-06-12 | 2023-08-01 | 美商特拉華公司 | 電極界定未懸掛之聲波共振器 |
| CN114868015B (zh) * | 2019-12-19 | 2026-03-20 | Qorvo美国公司 | 用于质量传感的谐振器结构 |
| CN111351848B (zh) * | 2020-03-19 | 2020-10-16 | 山东科技大学 | 一种传感器的制备方法、传感器以及传感器的检测方法 |
| EP4200981A1 (en) * | 2020-09-14 | 2023-06-28 | Huawei Technologies Co., Ltd. | Solidly mounted bulk acoustic wave resonator with frequency tuning by mass loading in acoustic reflector and method of manufacturing thereof |
| DE102021209875A1 (de) | 2020-09-18 | 2022-03-24 | Skyworks Global Pte. Ltd. | Akustische volumenwellenvorrichtung mit erhöhter rahmenstruktur |
| CN112350680B (zh) * | 2020-10-20 | 2024-12-10 | 中芯集成电路(宁波)有限公司 | 一种薄膜声波谐振器及其制造方法 |
| WO2022168498A1 (ja) * | 2021-02-05 | 2022-08-11 | 日本碍子株式会社 | 複合基板、弾性表面波素子および複合基板の製造方法 |
| CN112953447B (zh) * | 2021-02-09 | 2023-08-11 | 偲百创(深圳)科技有限公司 | 谐振器及电子设备 |
| CN112910433B (zh) * | 2021-03-04 | 2025-09-16 | 偲百创(深圳)科技有限公司 | 横向激励剪切模式的声学谐振器 |
| CN112953449B (zh) * | 2021-03-04 | 2024-10-01 | 偲百创(深圳)科技有限公司 | 横向激励剪切模式的声学谐振器的制造方法 |
| CN114285390B (zh) * | 2021-03-15 | 2025-11-18 | 偲百创(深圳)科技有限公司 | 厚度方向激励剪切模式的声学谐振器 |
| CN216414272U (zh) * | 2021-11-29 | 2022-04-29 | 瑞声科技(南京)有限公司 | 一种压电薄膜声学谐振器 |
| JP2023139785A (ja) * | 2022-03-22 | 2023-10-04 | リバーエレテック株式会社 | 弾性波素子及びそれを用いた原子発振器 |
| CN118891824A (zh) * | 2022-03-28 | 2024-11-01 | 日本碍子株式会社 | 复合基板、弹性表面波元件以及复合基板的制造方法 |
| CN116346080B (zh) * | 2023-02-15 | 2024-07-12 | 上海馨欧集成微电有限公司 | 一种声表面波滤波器 |
| CN117097283B (zh) * | 2023-10-13 | 2024-01-30 | 广州市艾佛光通科技有限公司 | 一种固态装配型谐振器制作方法及固态装配型谐振器 |
| CN119298871B (zh) * | 2024-01-31 | 2025-11-07 | 上海馨欧集成微电有限公司 | 一种高频声波谐振器及通信设备 |
| CN118980744A (zh) * | 2024-08-28 | 2024-11-19 | 集美大学 | 一种基于AIScN压电薄膜的异质声学结构的表面声波氢气传感器 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4640756A (en) * | 1983-10-25 | 1987-02-03 | The United States Of America As Represented By The United States Department Of Energy | Method of making a piezoelectric shear wave resonator |
| DE10124349A1 (de) | 2001-05-18 | 2002-12-05 | Infineon Technologies Ag | Piezoelektrische Resonatorvorrichtung mit Verstimmungsschichtfolge |
| JP4037825B2 (ja) * | 2001-07-30 | 2008-01-23 | インフィネオン テクノロジーズ アクチエンゲゼルシャフト | 音響反射器を備える圧電性共振器装置 |
| DE10251876B4 (de) * | 2002-11-07 | 2008-08-21 | Infineon Technologies Ag | BAW-Resonator mit akustischem Reflektor und Filterschaltung |
| JP4321754B2 (ja) * | 2003-07-31 | 2009-08-26 | Tdk株式会社 | 圧電共振器およびそれを用いたフィルタ |
| US6946928B2 (en) * | 2003-10-30 | 2005-09-20 | Agilent Technologies, Inc. | Thin-film acoustically-coupled transformer |
| DE102004035812A1 (de) * | 2004-07-23 | 2006-03-16 | Epcos Ag | Mit akustischen Volumenwellen arbeitender Resonator |
| DE102005043034A1 (de) * | 2005-09-09 | 2007-03-15 | Siemens Ag | Vorrichtung und Verfahren zur Bewegung einer Flüssigkeit |
| US8089195B2 (en) | 2007-12-17 | 2012-01-03 | Resonance Semiconductor Corporation | Integrated acoustic bandgap devices for energy confinement and methods of fabricating same |
| WO2009088307A1 (en) * | 2008-01-09 | 2009-07-16 | Angelsen Bjoern A J | Multiple frequency band acoustic transducer arrays |
| CN101246162A (zh) * | 2008-03-12 | 2008-08-20 | 浙江大学 | 利用压电薄膜体声波器件的抗体检测生物芯片 |
| CN101277099A (zh) * | 2008-03-12 | 2008-10-01 | 浙江大学 | 适用于fbar的金属布拉格声波反射层结构 |
| US9735338B2 (en) * | 2009-01-26 | 2017-08-15 | Cymatics Laboratories Corp. | Protected resonator |
| FI123640B (fi) * | 2010-04-23 | 2013-08-30 | Teknologian Tutkimuskeskus Vtt | Laajakaistainen akustisesti kytketty ohutkalvo-BAW-suodin |
| US8810108B2 (en) | 2010-09-09 | 2014-08-19 | Georgia Tech Research Corporation | Multi-mode bulk-acoustic-wave resonators |
| CN103403538B (zh) | 2010-10-20 | 2016-06-01 | 快速诊断技术公司 | 利用共振传感器测量结合动力的装置和方法 |
| WO2012086441A1 (ja) * | 2010-12-24 | 2012-06-28 | 株式会社村田製作所 | 弾性波装置及びその製造方法 |
| JP5905677B2 (ja) * | 2011-08-02 | 2016-04-20 | 太陽誘電株式会社 | 圧電薄膜共振器およびその製造方法 |
| FI124732B (en) * | 2011-11-11 | 2014-12-31 | Teknologian Tutkimuskeskus Vtt | Lateral connected bulk wave filter with improved passband characteristics |
| US9219517B2 (en) | 2013-10-02 | 2015-12-22 | Triquint Semiconductor, Inc. | Temperature compensated bulk acoustic wave devices using over-moded acoustic reflector layers |
-
2016
- 2016-10-19 JP JP2018520475A patent/JP6916176B2/ja active Active
- 2016-10-19 EP EP16787698.6A patent/EP3365669B8/en active Active
- 2016-10-19 US US15/297,508 patent/US10193524B2/en active Active
- 2016-10-19 WO PCT/US2016/057653 patent/WO2017070177A1/en not_active Ceased
- 2016-10-19 CN CN201680075266.XA patent/CN108463720B/zh active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US20170117872A1 (en) | 2017-04-27 |
| CN108463720A (zh) | 2018-08-28 |
| EP3365669A1 (en) | 2018-08-29 |
| JP6916176B2 (ja) | 2021-08-11 |
| JP2018535595A (ja) | 2018-11-29 |
| EP3365669B1 (en) | 2023-08-23 |
| US10193524B2 (en) | 2019-01-29 |
| EP3365669B8 (en) | 2024-03-13 |
| WO2017070177A1 (en) | 2017-04-27 |
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