CN108461289A - A kind of ceramic capacitor with adjustable pin - Google Patents
A kind of ceramic capacitor with adjustable pin Download PDFInfo
- Publication number
- CN108461289A CN108461289A CN201810419315.8A CN201810419315A CN108461289A CN 108461289 A CN108461289 A CN 108461289A CN 201810419315 A CN201810419315 A CN 201810419315A CN 108461289 A CN108461289 A CN 108461289A
- Authority
- CN
- China
- Prior art keywords
- pin
- electrode layer
- capacitor
- ceramic
- insulation crust
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000003985 ceramic capacitor Substances 0.000 title claims abstract description 13
- 239000000919 ceramic Substances 0.000 claims abstract description 27
- 239000003990 capacitor Substances 0.000 claims abstract description 25
- 238000009413 insulation Methods 0.000 claims abstract description 24
- 238000005452 bending Methods 0.000 claims abstract description 15
- 238000010276 construction Methods 0.000 claims abstract description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 32
- 229910052759 nickel Inorganic materials 0.000 claims description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 13
- 238000005245 sintering Methods 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 9
- 230000017525 heat dissipation Effects 0.000 abstract description 5
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 229920004934 Dacron® Polymers 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
A kind of ceramic capacitor with adjustable pin, it is related to technical field of electronic components, more particularly to a kind of ceramic capacitor with adjustable pin, it includes capacitor body and pin, capacitor body includes insulation crust, ceramic chip, electrode layer, ceramic chip is located in insulation crust, the tow sides in ceramic chip are arranged in electrode layer, there are two pins for the bottom setting of insulation crust, wire coil is provided between pin and electrode layer, pin is connected by wire coil with electrode layer, pin is disposed with sliding block from top to bottom, linkage section, bending section, construction section, telescopic segment, needle point section, the bottom of insulation crust is provided with slideway, sliding block can horizontally slip on slideway, pin is connect by sliding block with capacitor body.After adopting the above technical scheme, the present invention has the beneficial effect that：It not only can adjust the spacing and length of pin, meet different actual demands, and be easily installed, good heat dissipation effect, and dielectric properties are good.
Description
Technical field
The present invention relates to technical field of electronic components, and in particular to a kind of ceramic capacitor with adjustable pin.
Background technology
With making rapid progress for electronic information technology, the update speed of digital electronic goods is getting faster, with tablet
Consumer electronics product volume of production and marketing sustainable growth based on the products such as TV (LCD and PDP), laptop, digital camera, band
The growth of capacitor industry is moved.It can be divided by the difference of manufacture material：Leaded Ceramic Disc Capacitor, electric capacity of the dacron, electrolytic capacitor, tantalum electricity
Hold, also advanced polypropylene capactive etc..Wherein Leaded Ceramic Disc Capacitor is by low cost, high reliability, long-life and small size etc.
Advantage is widely used.
Existing ceramic capacitor is generally installed with pin, and the spacing and length of pin are non-adjustable, therefore is applicable in model
It encloses narrow, can not be generally applicable in different circuit or electric appliance, nor be easily installed, the ceramic condenser after causing because of installation
The situation that device is close to circuit board and influences heat dissipation occurs, short so as to cause the service life of capacitor.
Invention content
In view of the defects and deficiencies of the prior art, the present invention intends to provide a kind of ceramics with adjustable pin
Capacitor, it not only can adjust the spacing and length of pin, meets different actual demands, and be easily installed, heat dissipation effect
Good, dielectric properties are good.
To achieve the above object, the present invention is using following technical scheme：It includes capacitor body 1 and pin 2, capacitance
Device ontology 1 includes insulation crust 11, ceramic chip 12, electrode layer 13, and ceramic chip 12 is located in insulation crust 11, electrode layer 13
Tow sides in ceramic chip 12 are set, the bottom setting of insulation crust 11 there are two pin 2, pin 2 and electrode layer 13 it
Between be provided with wire coil 3, pin 2 is connected by wire coil 3 with electrode layer 13, and pin 2 is disposed with from top to bottom
Sliding block 21, linkage section 22, bending section 23, construction section 24, telescopic segment 25, needle point section 26, the bottom of insulation crust 11 are provided with cunning
Road 4, sliding block 21 can horizontally slip on slideway 4, and pin 2 is connect by sliding block 21 with capacitor body 1.
The insulation crust 11 is epoxy package.Epoxy resin after solidification has good physics, chemically
Can, it has excellent adhesive strength to the surface of metal and nonmetallic materials, and dielectric properties are good.
The ceramic chip 12 can be separately provided one, or the series connection sintering of multiple ceramic chips 12 is formed
Chipset.The dielectric constant of capacitor can be improved in the chipset that the series connection sintering of ceramic chip 12 is formed, specifically can be according to practical feelings
Condition adjusts the quantity of ceramic chip 12.
Soldering-tin layer 5 is provided on the electrode layer 13, one end of pin 2 is welded on electrode layer 13 by soldering-tin layer 5
The other end in outside, pin 2 extends to outside insulation crust 11.The effect of soldering-tin layer 5 is that pin 2 is facilitated to be welded on electrode layer 13
On, keep its connection more secured.
The electrode layer 13 is disposed with tin layers 131, nickel layer 132, layers of copper 133, tin layers 131 and nickel layer from outside to inside
It is provided with conducting resinl 134 between 132, conducting resinl 134 is also equipped between nickel layer 132 and layers of copper 133.Electric conductivity is good
Tin layers 131, nickel layer 132,133 lamination of layers of copper are fabricated to electrode layer 13, improve the dielectric properties of electrode layer 13, and tin layers 131,
The low manufacture cost of nickel layer 132, layers of copper 133 can save the total production cost of capacitor；The effect of conducting resinl 134 is securely
Tin layers 131, nickel layer 132, layers of copper 133 are connected, and there is good electric conductivity.
The bending section 23 is straight line bending structure.The effect of bending section 23 is to increase creepage distance, be convenient for simultaneously
The screens of capacitor is installed.
After adopting the above technical scheme, the present invention has the beneficial effect that：It not only can adjust the spacing and length of pin, meet
Different actual demands, and be easily installed, good heat dissipation effect, dielectric properties are good.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention without having to pay creative labor, may be used also for those of ordinary skill in the art
With obtain other attached drawings according to these attached drawings.
Fig. 1 is the structural schematic diagram of the present invention；
Fig. 2 is the upward view of insulation crust 11 in the present invention；
Fig. 3 is the structural schematic diagram of electrode layer 13 in the present invention.
Reference sign：Capacitor body 1, pin 2, insulation crust 11, ceramic chip 12, electrode layer 13, metal wire
Circle 3, sliding block 21, linkage section 22, bending section 23, construction section 24, telescopic segment 25, needle point section 26, slideway 4, soldering-tin layer 5, tin layers
131, nickel layer 132, layers of copper 133, conducting resinl 134.
Specific implementation mode
Shown in Fig. 1-Fig. 3, present embodiment the technical solution adopted is that：It includes capacitor body 1 and draws
Foot 2, capacitor body 1 include insulation crust 11, ceramic chip 12, electrode layer 13, and ceramic chip 12 is located in insulation crust 11,
The tow sides in ceramic chip 12 are arranged in electrode layer 13, and there are two pin 2, pin 2 and electricity for the bottom setting of insulation crust 11
Pole layer 13 between be provided with wire coil 3, pin 2 is connected by wire coil 3 with electrode layer 13, pin 2 from top to bottom according to
It is secondary to be provided with sliding block 21, linkage section 22, bending section 23, construction section 24, telescopic segment 25, needle point section 26, the bottom of insulation crust 11
It is provided with slideway 4, sliding block 21 can horizontally slip on slideway 4, and pin 2 is connect by sliding block 21 with capacitor body 1.
The insulation crust 11 is epoxy package.Epoxy resin after solidification has good physics, chemically
Can, it has excellent adhesive strength to the surface of metal and nonmetallic materials, and dielectric properties are good.
The ceramic chip 12 can be separately provided one, or the series connection sintering of multiple ceramic chips 12 is formed
Chipset.The dielectric constant of capacitor can be improved in the chipset that the series connection sintering of ceramic chip 12 is formed, specifically can be according to practical feelings
Condition adjusts the quantity of ceramic chip 12.
Soldering-tin layer 5 is provided on the electrode layer 13, one end of pin 2 is welded on electrode layer 13 by soldering-tin layer 5
The other end in outside, pin 2 extends to outside insulation crust 11.The effect of soldering-tin layer 5 is that pin 2 is facilitated to be welded on electrode layer 13
On, keep its connection more secured.
The electrode layer 13 is disposed with tin layers 131, nickel layer 132, layers of copper 133, tin layers 131 and nickel layer from outside to inside
It is provided with conducting resinl 134 between 132, conducting resinl 134 is also equipped between nickel layer 132 and layers of copper 133.Electric conductivity is good
Tin layers 131, nickel layer 132,133 lamination of layers of copper are fabricated to electrode layer 13, improve the dielectric properties of electrode layer 13, and tin layers 131,
The low manufacture cost of nickel layer 132, layers of copper 133 can save the total production cost of capacitor；The effect of conducting resinl 134 is securely
Tin layers 131, nickel layer 132, layers of copper 133 are connected, and there is good electric conductivity.
The bending section 23 is straight line bending structure.The effect of bending section 23 is to increase creepage distance, be convenient for simultaneously
The screens of capacitor is installed.
The operation principle of the present invention：In use, the pin 2 of capacitor can be adjusted according to actual conditions, by slideway 4 and slide
The cooperation of block 21 accordingly adjusts the spacing between two pins 2.In addition, pin 2 is provided with telescopic segment 25, pin 2 can adjust
Length；Bending section 23 increases creepage distance, effectively prevents the generation of creepage phenomenon, while bending section 23 is also beneficial to capacitance
Facilitate screens when device is installed on circuit board, solving influences heat dissipation due to the ceramic capacitor after installation is close on circuit boards
The problem of.
The above is merely illustrative of the technical solution of the present invention and unrestricted, and those of ordinary skill in the art are to this hair
The other modifications or equivalent replacement that bright technical solution is made, as long as it does not depart from the spirit and scope of the technical scheme of the present invention,
It is intended to be within the scope of the claims of the invention.
Claims (6)
1. a kind of ceramic capacitor with adjustable pin, it is characterised in that：It includes capacitor body (1) and pin (2),
Capacitor body (1) includes insulation crust (11), ceramic chip (12), electrode layer (13), and it is outer that ceramic chip (12) is located at insulation
In shell (11), the tow sides in ceramic chip (12) are arranged in electrode layer (13), and there are two the bottom settings of insulation crust (11)
Pin (2), is provided with wire coil (3) between pin (2) and electrode layer (13), pin (2) passes through wire coil (3) and electrode
Layer (13) is connected, and pin (2) is disposed with sliding block (21), linkage section (22), bending section (23), construction section from top to bottom
(24), the bottom of telescopic segment (25), needle point section (26), insulation crust (11) is provided with slideway (4), and sliding block (21) can be in slideway
(4) it horizontally slips on, pin (2) is connect by sliding block (21) with capacitor body (1).
2. a kind of ceramic capacitor with adjustable pin according to claim 1, it is characterised in that：The insulation
Shell (11) is epoxy package.
3. a kind of ceramic capacitor with adjustable pin according to claim 1, it is characterised in that：The ceramics
Chip (12) can be separately provided one, or the chipset that multiple ceramic chip (12) series connection sintering are formed.
4. a kind of ceramic capacitor with adjustable pin according to claim 1, it is characterised in that：The electrode
It is provided with soldering-tin layer (5) on layer (13), one end of pin (2) is welded on the outside of electrode layer (13), pin by soldering-tin layer (5)
(2) the other end extends to insulation crust (11) outside.
5. a kind of ceramic capacitor with adjustable pin according to claim 1, it is characterised in that：The electrode
Layer (13) is disposed with tin layers (131), nickel layer (132), layers of copper (133) from outside to inside, tin layers (131) and nickel layer (132) it
Between be provided with conducting resinl (134), conducting resinl (134) is also equipped between nickel layer (132) and layers of copper (133).
6. a kind of ceramic capacitor with adjustable pin according to claim 1, it is characterised in that：The bending
Section (23) is straight line bending structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810419315.8A CN108461289A (en) | 2018-05-04 | 2018-05-04 | A kind of ceramic capacitor with adjustable pin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810419315.8A CN108461289A (en) | 2018-05-04 | 2018-05-04 | A kind of ceramic capacitor with adjustable pin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108461289A true CN108461289A (en) | 2018-08-28 |
Family
ID=63215076
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810419315.8A Withdrawn CN108461289A (en) | 2018-05-04 | 2018-05-04 | A kind of ceramic capacitor with adjustable pin |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108461289A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109817460A (en) * | 2019-04-12 | 2019-05-28 | 成都信息工程大学 | A kind of adjustable multi-layer ceramic capacitor |
| CN110880426A (en) * | 2018-09-06 | 2020-03-13 | 天津翔驰电子有限公司 | Soft packet of super capacitor connector |
| CN112490723A (en) * | 2020-11-18 | 2021-03-12 | 苏州浪潮智能科技有限公司 | Retractable stitch |
| CN117374032A (en) * | 2023-12-08 | 2024-01-09 | 深圳长微科技半导体有限公司 | MOS pipe of stacked multilayer direct-insert structure |
-
2018
- 2018-05-04 CN CN201810419315.8A patent/CN108461289A/en not_active Withdrawn
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110880426A (en) * | 2018-09-06 | 2020-03-13 | 天津翔驰电子有限公司 | Soft packet of super capacitor connector |
| CN110880426B (en) * | 2018-09-06 | 2023-11-24 | 天津翔驰电子有限公司 | Soft package super capacitor connector |
| CN109817460A (en) * | 2019-04-12 | 2019-05-28 | 成都信息工程大学 | A kind of adjustable multi-layer ceramic capacitor |
| CN109817460B (en) * | 2019-04-12 | 2023-08-11 | 成都信息工程大学 | Adjustable laminated ceramic capacitor |
| CN112490723A (en) * | 2020-11-18 | 2021-03-12 | 苏州浪潮智能科技有限公司 | Retractable stitch |
| CN117374032A (en) * | 2023-12-08 | 2024-01-09 | 深圳长微科技半导体有限公司 | MOS pipe of stacked multilayer direct-insert structure |
| CN117374032B (en) * | 2023-12-08 | 2024-02-06 | 深圳长微科技半导体有限公司 | MOS pipe of stacked multilayer direct-insert structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180828 |