CN108449974A - Stain detection device, laser boring processing unit (plant) and laser boring processing method - Google Patents
Stain detection device, laser boring processing unit (plant) and laser boring processing method Download PDFInfo
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- CN108449974A CN108449974A CN201680074173.5A CN201680074173A CN108449974A CN 108449974 A CN108449974 A CN 108449974A CN 201680074173 A CN201680074173 A CN 201680074173A CN 108449974 A CN108449974 A CN 108449974A
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- Prior art keywords
- laser
- interarea
- insulating layer
- light
- test section
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/389—Removing material by boring or cutting by boring of fluid openings, e.g. nozzles, jets
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/55—Specular reflectivity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
- G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
- G01N21/64—Fluorescence; Phosphorescence
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
Abstract
Exciting light exit portion (33) outgoing of laser boring processing unit (plant) (1) generates the exciting light of fluorescence on the resin of insulating layer (92) for forming multilager base plate (9).Exciting light is irradiated to along the path (J1) of the laser boring processing laser from object lens (322) to the interarea of multilager base plate (9) and perpendicular to the interarea on the interarea.In insulating layer test section, by receiving the fluorescence generated on the resin of insulating layer (92) via object lens (322), to detect the presence with insulating layer (92) in the through-hole in laser forming process.As a result, in laser boring processing, the presence of stain in the through-hole in forming process can be accurately detected.
Description
Technical field
The present invention relates to a kind of stain detection device, laser boring processing unit (plant) and laser boring processing methods.
Background technology
All the time, when manufacturing the multilager base plate of alternatively laminated wiring layer and insulating layer, laser boring processing is carried out.
In laser boring processing, on multilager base plate in the fabrication process, irradiated by a part for the wiring layer to being used as top layer
Laser forms the insulating layer for the downside for penetrating through the wiring layer and the wiring layer and using the wiring layer of the downside of the insulating layer bottom of as
Through-hole (referred to as hole.).On the medial surface of through-hole, by subsequent processing plated with copper (Cu) etc., to ensure wiring layer up and down
Between electrical connection (conducting state).
In addition, in Japanese Unexamined Patent Publication 2003-149558 bulletins, Japanese Unexamined Patent Publication 2007-38202 bulletins and Japanese Unexamined Patent Publication
In 2008-147321 bulletins, the device for the defect for correcting the pattern on glass substrate is disclosed.In the apparatus, carry out self-excitation
The laser of light device is irradiated to via object lens on substrate, is modified to defect.In addition, the light from regulation light source shines via object lens
It is mapped on substrate, reflected light is directed into CCD camera via object lens etc., shoots the defect on substrate.
Therefore, in laser boring processing, the CO for being for example difficult to be absorbed by wiring layer is used2(carbon dioxide swashs laser
Light device).However, if the irradiation time of laser is long, because the thickness of downside wiring layer is different, through-hole can penetrate through the wiring sometimes
Layer and cause the electrical connection for connecting up interlayer difficult.In addition, if the irradiation time of laser is too short, the residual of the resin of insulating layer is formed
Slag, that is, stain (Smear) can remain on the wiring layer of downside, and connecting up the reliability of the electrical connection of interlayer can reduce.In fact,
Although the irradiation time by managing laser can control etch amount to a certain extent, due to wiring material and resin material
Characteristic be different or each layer thickness is different, therefore if only managing irradiation time, be not easy to appropriate landform
At through-hole.
In addition, after laser boring processing, visually inspected with magnifying glass etc., confirms there are when stain, also removed
Go the abatement processes of stain.However, in laser boring processing, due to being formed with thousands of to hundreds thousand of a through-holes, thus visually
Inspection takes a long time, and carries out abatement processes and be also required to the regular hour.
Invention content
The present invention relates in the laser boring processing when manufacturing the multilager base plate of alternatively laminated wiring layer and insulating layer, use
In the existing stain detection device for detecting stain in through-hole, it is intended that in laser boring processing, accurately detect
The presence of the stain in through-hole in forming process, and it is appropriate and through-hole is efficiently formed.
The stain detection device of the present invention has：Exciting light exit portion, is emitted exciting light, and the exciting light is used in be formed
The resin of the insulating layer of multilager base plate in manufacturing process generates fluorescence, and the exciting light exit portion makes the exciting light along laser
The path of the laser of perforation processing is irradiated to the interarea of the multilager base plate, and the path is from object lens to the road of the interarea
Diameter, and perpendicular to the interarea；Insulating layer test section, by the fluorescence that will be generated on the resin is via the object lens
Receive, come detect by it is described it is laser-formed during through-hole described in insulating layer presence.
According to the present invention stain in the through-hole in forming process can be accurately detected in laser boring processing
In the presence of.As a result, it is possible to appropriate and be effectively formed through-hole.
A preferred embodiment of the present invention is that stain detection device also has wiring layer test section, wiring layer inspection
Survey portion is received by by the reflected light for being irradiated to the illumination light of the interarea along the path via the object lens, to detect
State the presence of wiring layer in the through-hole in forming process.
At this time, it is preferable that the illumination light is the laser.It is highly preferred that the insulating layer test section and the wiring
Layer test section shares same light receiver, and the laser and the exciting light are irradiated to the interarea with defined sequence alternate.
In addition, stain detection device can also also have end point determination portion, the end point determination portion to be based on the insulating layer test section and institute
The output for stating wiring layer test section detects the formation terminal of the through-hole.
The present invention also relates to laser boring processing is carried out when manufacturing the multilager base plate of alternatively laminated wiring layer and insulating layer
Laser boring processing unit (plant).Laser boring processing unit (plant) have shoot laser perforation processing laser laser, will be described
The optical system and above-mentioned stain detection device of the interarea guiding of multilager base plate of the laser into manufacturing process.
The present invention also relates to the laser boring processing sides when manufacturing the multilager base plate of alternatively laminated wiring layer and insulating layer
Method.Laser boring processing method has：The laser of laser boring processing is irradiated to along path in manufacturing process by a) process
The interarea of multilager base plate, the path are from object lens to the path of the interarea, and perpendicular to the interarea；B) process will swash
It shines and is irradiated to the interarea along the path, the exciting light makes the resin for being used to form the insulating layer of the multilager base plate
Generate fluorescence；C) process, concurrently with the b) process, by the fluorescence that will be generated on the resin is via the object lens
Received by insulating layer test section, come detect by it is described it is laser-formed during through-hole described in insulating layer presence.
Above-mentioned purpose and other purposes, feature, form and advantage carry out the present invention by referring to the attached drawing paid is added
It is described further below and become apparent from.
Description of the drawings
Fig. 1 is the figure for the structure for showing laser boring processing unit (plant).
Fig. 2 is the figure for the functional structure for showing control unit.
Fig. 3 is the figure for the flow for showing laser boring working process.
Fig. 4 is the figure on the outgoing opportunity for showing laser and exciting light.
Fig. 5 is the figure for the variation for showing intensity of reflected light and fluorescence intensity.
Fig. 6 A are the figures for showing the through-hole in forming process.
Fig. 6 B are the figures for showing the through-hole in forming process.
Fig. 6 C are the figures for showing the through-hole in forming process.
Fig. 6 D are the figures for showing the through-hole in forming process.
Specific implementation mode
Fig. 1 is the figure of the structure for the laser boring processing unit (plant) 1 for showing one embodiment of the present invention.Laser boring is processed
Device 1 is for carrying out laser boring processing when manufacturing multilager base plate 9, i.e., on laser multilager base plate 9 in the fabrication process
Form through-hole.Laser boring processing is to manufacture a part for the connection process during multilager base plate 9.For multilager base plate 9,
For example, replacing laminated cloth line layer 91 and insulating layer 92 in the plate or laminal base material 90 formed with resin.Wiring layer 91
It is the wiring pattern formed by the conductive material of copper etc..Insulating layer 92 is formed by resins such as polyimides, is made adjacent to each other
It insulate between wiring layer 91.In the following description, the multilager base plate 9 in manufacturing process is referred to as " substrate 9 ".
Laser boring processing unit (plant) 1 has workbench 21, movable workbench mechanism 22, head 3,23 and of head moving mechanism
Control unit 4.Workbench 21 keeps substrate 9.Movable workbench mechanism 22 makes workbench 21 in the first direction of the interarea along substrate 9
Upper movement.The configuration of head 3 is opposed with the wiring layer 91 of the top layer as substrate 9 in the top of substrate 9.Head moving mechanism
23 make head 3 be moved up in the second party of interarea vertical with first direction and along substrate 9.In fact, adding in laser boring
During tooling sets 1, it is provided with multiple heads 3 and multiple head moving mechanisms 23.
Head 3 has laser 31, laser optical system 32, exciting light exit portion 33, light receiver 34 and detection optics
System 35.Laser 31 is such as CO2Laser (carbon dioxide laser), outgoing make the absorptance insulating layer 92 of wiring layer 91
Less and the laser of the big wavelength of reflectivity insulating layer 92.Laser 31 can also be other lasers.Laser optical system 32
With collimating mirror 321 and object lens 322.The laser being emitted from laser 31 is directed into base by collimating mirror 321 and object lens 322
The interarea of plate 9, and assembled on the interarea.As described later, laser is processed for laser boring.It in Fig. 1, will be from laser
The path of the laser of 31 interarea via collimating mirror 321 and object lens 322 and to substrate 9, the i.e. optical axis of laser optical system 32, are used
The chain-dotted line for indicating reference numeral J1 indicates.Interareas of the path J1 perpendicular to substrate 9.
Exciting light exit portion 33 is such as LED, is emitted from ultraviolet to the light of visible wavelength region.From exciting light exit portion 33
Outgoing includes (following for generating the light of fluorescence on the resin for forming insulating layer 92 from ultraviolet to the light of visible wavelength region
Referred to as " exciting light "), the fluorescence as caused by the irradiation of exciting light is not generated in wiring layer 91.Detection optical system 35 has standard
Straight mirror 351, dichronic mirror 352, half-reflecting mirror 353 and imaging len 354.Exciting light from exciting light exit portion 33 is via collimation
Mirror 351 is directed to dichronic mirror 352.352 reflected excitation light of dichronic mirror simultaneously makes the light of other wavelength penetrate.It is anti-by dichronic mirror 352
The exciting light penetrated is conducted towards half-reflecting mirror 353.Half-reflecting mirror 353 configured on the J1 of path collimating mirror 321 and object lens 322 it
Between, the exciting light reflected by half-reflecting mirror 353 is directed to the interarea of substrate 9 via object lens 322.Exciting light is substantially focused at this
On interarea.
The path of exciting light from object lens 322 to the interarea of substrate 9 is roughly the same with the path J1 of laser.In addition, substrate 9
Interarea on exciting light irradiation position it is identical as the irradiation position of laser, in the following description, the two is referred to as " to shine
Penetrate position ".In this way, the exciting light being emitted from exciting light exit portion 33 hangs down along from object lens 322 to the interarea of substrate 9 and with the interarea
The path J1 of straight laser, is radiated on the interarea.
Light receiver 34 is such as photodiode.The light of object lens 322 is incident on by half along path J1 from the interarea of substrate 9
Speculum 353 reflects, and is incident on light receiver 34 via dichronic mirror 352 and imaging len 354.About luminous ray, preferably
The light receiving surface of light receiver 34 and the interarea optical conjugate of substrate 9.In light receiver 34, make opposite with the incident intensity of light
The electric current for the size answered is exported to control unit 4.
On head 3, it can realize that coaxial fall penetrates illumination, that is, the light of the interarea of substrate 9 is irradiated to via object lens 322
Path is vertical with the interarea, and the path is consistent with the path of light of object lens 322 is incident on from the interarea of substrate 9.The light on head 3
The structure of system can change as appropriate.For example, it is also possible to use the filter etc. for only transmitting or absorbing specific wavelength.
Fig. 2 is the figure for the functional structure for showing control unit 4.In fig. 2, the structure of the part on head 3 is also shown.Control
Portion 4 processed has outgoing control unit 41, intensity detecting portion 42 and end point determination portion 43.It is emitted control unit 41 and exciting light exit portion 33
And laser 31 connects.Outgoing control unit 41 controls the outgoing opportunity of the exciting light from exciting light exit portion 33 and carrys out self-excitation
The outgoing opportunity of the laser of light device 31.Intensity detecting portion 42 is connect with light receiver 34, obtains the light for being irradiated to light receiver 34
Intensity.Output (information) of the end point determination portion 43 based on intensity detecting portion 42 detects the formation terminal of through-hole.
Fig. 3 is the figure of the flow for the laser boring working process for showing laser boring processing unit (plant) 1.It is beaten in the laser of Fig. 1
In hole processing device 1, if substrate 9 is placed on workbench 21, control unit 4 controls movable workbench mechanism 22 and head is moved
Motivation structure 23 so that a preset Working position is configured in irradiation position (step S11) on substrate 9.Then, pass through
It is emitted the control of control unit 41, starts the laser from 31 outgoing pulse shape of laser, initially forms through-hole (step S12).
Fig. 4 is the figure on the outgoing opportunity for showing laser and exciting light.Laser 31 is pulse laser, as marked in Fig. 4
Shown in the rectangle of parallel diagonal lines, the laser of outgoing pulse shape.Irradiation position of the laser on the interarea that path J1 is irradiated to substrate 9
It sets.Irradiation with laser concurrently, the reflected light of the laser on the interarea via object lens 322 etc. be directed to light receiver 34 from
And it is received (step S13).Output current from light receiver 34 is input to intensity detecting portion 42, to obtain the anti-of laser
Penetrate the luminous intensity (hereinafter referred to as " intensity of reflected light " of light.).Intensity of reflected light is output to end point determination portion 43.
There are intensities of reflected light when wiring layer 91 to become larger on irradiation position.It therefore, can by obtaining intensity of reflected light
Detect the presence of wiring layer 91.In laser boring processing unit (plant) 1, by receiving the anti-of the laser being irradiated onto on irradiation position
It penetrates the light receiver 34 of light and obtains the intensity detecting portion 42 of intensity of reflected light, to realize the wiring layer on detection irradiation position
91 existing wiring layer test section.
As shown in black rectangle in Fig. 4, when outgoing control unit 41 makes laser 31 stop shoot laser, go out from exciting light
Penetrate the exciting light (step S14) of 33 outgoing pulse shape of portion.Irradiation position of the exciting light on the interarea that path J1 is irradiated to substrate 9
It sets.As previously mentioned, exciting light to generate fluorescence on the resin for forming insulating layer 92.There are the resins on irradiation position
When, concurrently, the fluorescence generated by resin is directed to light receiver 34 via object lens 322 etc. and is connect the irradiation with exciting light
It receives (step S15).At this point, since dichronic mirror 352 is almost totally reflected exciting light, thus the exciting light on the interarea of substrate 9 is anti-
Light receiver 34 will not be directed to by penetrating light.Output current from light receiver 34 is input to intensity detecting portion 42, to obtain
The luminous intensity (hereinafter referred to as " fluorescence intensity " of fluorescence.).Fluorescence intensity is output to end point determination portion 43.In addition, working as light-receiving
When the optical receiver sensitivity of exciting light in portion 34 is sufficiently below the optical receiver sensitivity of the light of the wave-length coverage other than exciting light,
Dichronic mirror 352 can also be replaced using half-reflecting mirror.
When irradiation position has the insulating layer 92 being formed by resin, fluorescence intensity can become larger.Therefore, by obtaining fluorescence
Intensity can detect the presence of insulating layer 92.In laser boring processing unit (plant) 1, by receiving the fluorescence caused by exciting light
Light receiver 34 and obtain the intensity detecting portion 42 of fluorescence intensity, to realize that the insulating layer 92 on detection irradiation position is deposited
Insulating layer test section.
In laser boring processing unit (plant) 1, it is alternately repeated the action of above-mentioned steps S12~S15, i.e. the laser of pulse type
The reception of the reflected light of outgoing and the laser and the outgoing of the exciting light of pulse type and the reception of the fluorescence caused by the exciting light.
Repetition with above-mentioned steps S12~S15 concurrently, in end point determination portion 43, by aftermentioned algorithm, judges whether to detect
The formation terminal (step S16) of through-hole.In figure 3, for the ease of illustration, using step S16 as with step S12~S15 phases
Continuous processing and show, but as previously mentioned, the detection process of the terminal carried out by end point determination portion 43 be with step S12~
What the repetition of S15 carried out parallel.
Fig. 5 is the figure of the variation of the intensity of reflected light and fluorescence intensity that show that intensity detecting portion 42 is obtained.Line in Fig. 5
L1 shows that intensity of reflected light, line L2 show fluorescence intensity.As shown in Figure 6A, T1 at the time of just initially forming after through-hole,
There is only the wiring layer 91a as top layer for irradiation position on the interarea of substrate 9.Therefore, intensity of reflected light is high, fluorescence intensity
It is low.As shown in Figure 6B, T2 at the time of from the moment, T1 was begun to pass through after certain time, to the irradiation on the interarea of substrate 9
Position is performed etching with laser, and the bottom surface of the through-hole 93 in forming process, the part of wiring layer 91a tails off, insulating layer 92
A part is exposed.Intensity of reflected light becomes lower than the luminous intensity of moment T1 as a result,.In addition, fluorescence intensity becomes than moment T1's
Luminous intensity is high.
Then, as shown in Figure 6 C, the partial disappearance of wiring layer 91a, in moment T3, the irradiation position on the interarea of substrate 9
It sets, i.e., the bottom surface of the through-hole 93 during being formed by laser, there is only insulating layers 92.Therefore, intensity of reflected light becomes
Luminous intensity than moment T2 is lower.In addition, fluorescence intensity becomes the luminous intensity higher than moment T2.As shown in Figure 6 D, it is being formed
The bottom surface of through-hole 93 in the process, the T4 at the time of part of insulating layer 92 almost disappears, the wiring of the downside of the insulating layer 92
Layer 91b exposes.Intensity of reflected light becomes higher than the luminous intensity of moment T3 as a result,.In addition, fluorescence intensity becomes the light than moment T3
Intensity is low.
In end point determination portion 43, whenever from 42 input reflection luminous intensity of intensity detecting portion, the nearest setting phase will be calculated
Between intensity of reflected light (during presetting, for example, during several pulse~tens pulses for being equivalent to laser)
Average value.If after the average value becomes less than first threshold, confirms that it is more than second threshold, be then judged as in forming process
In through-hole 93 bottom surface expose downside wiring layer 91b.First threshold and second threshold and aftermentioned third threshold value and
4th threshold value is preset.
In addition, whenever inputting fluorescence intensity from intensity detecting portion 42, the fluorescence intensity during nearest setting will be calculated
Average value.If after the average value becomes larger than third threshold value, confirms that it is less than the 4th threshold value, be then judged as being formed
The bottom surface of through-hole 93 in journey has eliminated insulating layer 92.The state for eliminating insulating layer 92 is that there is no be used to form insulation
The state of residue, that is, stain of the resin of layer 92.
As described above, in end point determination portion 43, the variation of intensity of reflected light and the variation of fluorescence intensity are monitored in real-time,
If confirming, the wiring layer 91b of downside exposes and insulating layer 92 has been removed, and is judged as reaching the formation terminal (inspection of through-hole 93
Measure terminal) (step S16).The repetition for stopping the action of above-mentioned steps S12~S15 as a result, completes the shape of through-hole 93
At.A diameter of such as tens μm (microns) of through-hole 93.In fact, whenever the Working position on substrate 9 is configured in each head 3
Irradiation position on when (step S11), above-mentioned steps S12~S16 will be carried out, to form through-hole 93.In end point determination portion 43,
The formation terminal of through-hole 93 can also be detected by algorithm unlike those described above.
In addition it is also possible to blackening layer be formed on the surface of wiring layer 91a by advance Darkening process, to promote by swashing
Etching of the light to wiring layer 91a.At this point, the intensity of reflected light after just starting irradiation laser is lower than example shown in fig. 5, but
The variation for eliminating the intensity of reflected light after the blackening layer on irradiation position is identical as Fig. 5.After completing laser boring processing,
Blackening layer on wiring layer 91a is removed.
As discussed above, in the laser boring of laser boring processing unit (plant) 1 processing, from exciting light exit portion
The exciting light of 33 outgoing is radiated on the interarea of substrate 9.In addition, the insulation that light receiver 34 and intensity detecting portion 42 are realized
Layer test section receives the fluorescence generated on the resin of insulating layer 92 by the irradiation of exciting light, to detect in forming process
Through-hole 93 in insulating layer 92 presence.As a result, in laser boring processing, can accurately it detect logical in forming process
The presence of stain in hole 93.In laser boring processing unit (plant) 1, with exciting light exit portion 33 and insulating layer test section for main structure
The existing stain detection device for detecting stain in through-hole 93 is realized at element.
In addition, in laser boring processing unit (plant) 1, when no longer detect stain there are when, shone to substrate 9 by stopping
Penetrate laser, can effectively and the appropriate through-hole 93 for reducing stain is formed more reliably.As a result, it is possible to realize reliability height
Laser boring processing.
In stain detection device, the wiring layer test section that light receiver 34 and intensity detecting portion 42 are realized passes through reception
It is radiated at the reflected light of the laser on irradiation position, so as to accurately detect wiring layer in the through-hole 93 in forming process
The presence of 91a, 91b.In addition, same light receiver 34 is common to insulating layer test section and wiring layer test section, laser and swash
It shines and is alternately irradiated on the interarea of substrate 9.It is arranged individually on insulating layer test section and wiring layer test section as a result,
Light receiver the case where compare, the number of components of stain detection device (laser boring processing unit (plant) 1) can be reduced.
The formation end point determination of through-hole 93 in end point determination portion 43 is to be based on insulating layer test section and wiring layer test section
The output of the two and carry out, it is thus possible to more accurately detect the terminal.In addition, even if existing in through-hole 93 producing
In the case of the exceptions such as the foreign matter different from wiring layer 91a, 91b and insulating layer 92, it can also be based on fluorescence intensity and reflective light intensity
Degree, detects the exception in through-hole 93.
Above-mentioned laser boring processing unit (plant) 1 and stain detection device can carry out various modifications.
In wiring layer test section, it can also will go out from the other light sources different from laser 31 and exciting light exit portion 33
The light penetrated is used as illumination light, to obtain the illumination light reflected light luminous intensity.For example, being emitted from the other light sources
Illumination light be incident on object lens 322 via half-reflecting mirror etc. in the same manner as exciting light, and the interarea of substrate 9 is irradiated to along path J1
On.Also, wiring layer test section receives the reflected light of the illumination light via object lens 322, to detect in forming process
The presence of wiring layer 91a, 91b in through-hole 93.Laser, exciting light and illumination light are alternately irradiated on substrate 9 in order.Another party
Face, it is above-mentioned with using in the above-mentioned laser boring processing unit (plant) 1 for using the laser being emitted from laser 31 as illumination light
The case where other light sources, is compared, and number of components can be reduced.
Exciting light need not be emitted with the period identical with laser, for example, it is also possible to N times of laser (N be 2 or more it is whole
Number) period outgoing.That is, laser and exciting light are irradiated to defined sequence alternate on the interarea of substrate 9.
Alternatively, it is also possible to which individual light receiver is arranged in insulating layer test section and wiring layer test section.At this point, also may be used
With by the way that the optical element that can detach the reflected light of laser with fluorescence (such as color separation is arranged in detection optical system 35
Mirror), to be irradiated on substrate 9 and obtain intensity of reflected light and fluorescence intensity simultaneously by laser and exciting light.
According to the difference of the design of laser boring processing unit (plant) 1, galvanometer mirror (Galvanometer can also be passed through
The irradiation position of deflectors movement laser such as Mirror).For example, setting should in the top of bigger object lens (such as f θ lens)
Laser and exciting light are alternately incident on deflector on irradiation position consistent opportunity, and make the reflected light of laser by deflector
Or the fluorescence caused by exciting light is received via object lens and deflector in light receiver.In this case, from object lens to base
The path of the laser of the interarea of plate 9 is also perpendicularly to the interarea, realizes coaxially to fall and penetrates illumination.
In the above-described embodiment, the variation based on intensity of reflected light and the variation of fluorescence intensity detect the shape of through-hole 93
The difference of precision at terminal, but needed for end point determination, can also be merely with the variation of fluorescence intensity.
The light receiver (for example, CCD camera) by multiple light receiving element two-dimensional arrangements assortments can also be used to obtain
Obtain the image (image for showing stain) of the interarea of substrate 9.
As long as the structure in the above embodiment and each variation is not conflicting, can be appropriately combined.
Although having been described in and illustrating the present invention, above-mentioned explanation is only to be illustrated and not limited
It is fixed.It therefore, can there are many deformation and forms without departing from the scope of the present invention.
Reference sign
1 laser boring processing unit (plant)
9 substrates
31 lasers
32 laser optical systems
33 exciting light exit portion
34 light receivers
42 intensity detecting portions
43 end point determination portions
91,91a, 91b wiring layer
92 insulating layers
93 through-holes
322 object lens
The paths J1
S11~S16 steps
Claims (11)
1. a kind of stain detection device, the laser boring in multilager base plate made of manufacturing alternatively laminated wiring layer and insulating layer
In processing, the presence of stain in through-hole is detected, which is characterized in that having：
Exciting light exit portion, is emitted exciting light, and the exciting light is used in the insulating layer to form the multilager base plate in manufacturing process
Resin generate fluorescence, the exciting light exit portion makes the exciting light be irradiated to along the path of the laser of laser boring processing
The interarea of the multilager base plate, the path are from object lens to the path of the interarea, and perpendicular to the interarea；With
Insulating layer test section passes through institute by being received via the object lens fluorescence generated on the resin to detect
State it is laser-formed during through-hole described in insulating layer presence.
2. stain detection device according to claim 1, which is characterized in that
Also there is wiring layer test section, the wiring layer test section along the path by will be irradiated to the illumination light of the interarea
Reflected light received via the object lens, to detect the presence of wiring layer in the through-hole during the formation.
3. stain detection device according to claim 2, which is characterized in that
The illumination light is the laser.
4. stain detection device according to claim 3, which is characterized in that
The insulating layer test section and the wiring layer test section share same light receiver,
The laser and the exciting light are irradiated to defined sequence alternate on the interarea.
5. stain detection device according to any one of claim 2 to 4, which is characterized in that
Also have end point determination portion, the end point determination portion defeated based on the insulating layer test section and the wiring layer test section
Go out, detects the formation terminal of the through-hole.
6. a kind of laser boring processing unit (plant) is swashed when manufacturing alternatively laminated wiring layer with multilager base plate made of insulating layer
Light perforation processing, which is characterized in that have：
The interarea guiding of the laser of shoot laser perforation processing laser, the multilager base plate by the laser into manufacturing process
Optical system and any one of claim 1 to 5 described in stain detection device.
7. a kind of laser boring processing method, special for manufacturing alternatively laminated wiring layer and multilager base plate made of insulating layer
Sign is,
The laser of laser boring processing is irradiated to along path the interarea of the multilager base plate in manufacturing process by a) process, described
Path is from object lens to the path of the interarea, and perpendicular to the interarea；
Exciting light is irradiated to the interarea by b) process along the path, and the exciting light to be used to form the multilayer base
The resin of the insulating layer of plate generates fluorescence；
C) process, concurrently with the b) process, by exhausted by the fluorescence that will be generated on the resin is via the object lens
Edge layer test section receive, come detect by it is described it is laser-formed during through-hole described in insulating layer presence.
8. laser boring processing method according to claim 7, which is characterized in that also have：
D) process, by connecting up by will be irradiated to the reflected light of the illumination light of the interarea along the path via the object lens
Layer test section receives, to detect the existing process of wiring layer in the through-hole during the formation.
9. laser boring processing method according to claim 8, which is characterized in that
The illumination light is the laser.
10. laser boring processing method according to claim 9, which is characterized in that
The insulating layer test section and the wiring layer test section share same light receiver,
The exciting light in the laser and the b) process in a) process, is irradiated to defined sequence alternate
On the interarea.
11. the laser boring processing method according to any one of claim 8 to 10, which is characterized in that
Also have the output based on the insulating layer test section and the wiring layer test section whole come the formation for detecting the through-hole
The process of point.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016015294 | 2016-01-29 | ||
| JP2016-015294 | 2016-01-29 | ||
| PCT/JP2016/085367 WO2017130555A1 (en) | 2016-01-29 | 2016-11-29 | Smear detection device, laser via processing device, and laser via processing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108449974A true CN108449974A (en) | 2018-08-24 |
Family
ID=59398007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201680074173.5A Pending CN108449974A (en) | 2016-01-29 | 2016-11-29 | Stain detection device, laser boring processing unit (plant) and laser boring processing method |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6636543B2 (en) |
| CN (1) | CN108449974A (en) |
| WO (1) | WO2017130555A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7142197B2 (en) * | 2017-09-11 | 2022-09-27 | パナソニックＩｐマネジメント株式会社 | Laser processing head, optical fiber inspection device, and optical fiber inspection method |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07128247A (en) * | 1993-10-29 | 1995-05-19 | Hoya Corp | Material identifying device, laser working device, and laser film forming wiring device |
| JPH11166903A (en) * | 1997-12-03 | 1999-06-22 | Fujitsu Ltd | Via hole inspecting device |
| JP3488614B2 (en) * | 1998-01-09 | 2004-01-19 | 三菱電機株式会社 | Laminate material recess inspection device and laser processing device |
| JP2000013027A (en) * | 1998-06-26 | 2000-01-14 | Matsushita Electric Ind Co Ltd | Manufacture of multi-layer substrate |
| WO2000009993A1 (en) * | 1998-08-10 | 2000-02-24 | Mitsubishi Denki Kabushiki Kaisha | Device for inspecting printed boards |
| JP3530129B2 (en) * | 2000-11-16 | 2004-05-24 | 住友重機械工業株式会社 | Laser processing apparatus and processing method |
| JP3980289B2 (en) * | 2001-03-27 | 2007-09-26 | 住友重機械工業株式会社 | Laser processing equipment |
-
2016
- 2016-11-29 WO PCT/JP2016/085367 patent/WO2017130555A1/en active Application Filing
- 2016-11-29 JP JP2017563717A patent/JP6636543B2/en active Active
- 2016-11-29 CN CN201680074173.5A patent/CN108449974A/en active Pending
Non-Patent Citations (1)
| Title |
|---|
| 高克林 等: "《精密激光光谱学研究前沿》", 31 October 2014 * |
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| Publication number | Publication date |
|---|---|
| JP6636543B2 (en) | 2020-01-29 |
| WO2017130555A1 (en) | 2017-08-03 |
| JPWO2017130555A1 (en) | 2018-09-06 |
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