JPH07128247A - Material identifying device, laser working device, and laser film forming wiring device - Google Patents

Abstract

PURPOSE:To provide a material identifying device, a laser working device, and a laser film forming wiring device having the function of easily and momentarily discriminating the material of an inspection part or working part. CONSTITUTION:A material identifying device has a working laser device 3 for emitting a working laser beam, a converging optical system 5 for converging the working laser beam L1 emitted from the working laser device 3 and emitting it to the working part of a semiconductor circuit base 1; an inspection light source 8 for emitting an inspection light L4 consisting of a light having different reflecting or scattering properties to the insulating protecting film and metal circuit pattern of the semiconductor circuit base; and a CCD camera 7 for detecting the return light by the reflection or scattering of the inspection light L14 from the working part when the inspection light L4 is emitted to the semiconductor circuit base 1 working part, so that it can be momentarily judged whether the member of the working part of the semiconductor circuit base 1 is the insulating protecting film or the metal film by the change of the detection signal of the CCD camera 7.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a material identification device, a laser processing device and a laser film forming / wiring device which can be used for circuit modification at the design / evaluation stage of an integrated circuit and the manufacturing stage.

[0002]

2. Description of the Related Art For example, in the design / evaluation stage of an integrated circuit and the partial correction of integrated circuit wiring in the manufacturing stage,
Cutting circuit wiring and electrical connection between circuit wiring (additional wiring)
There are two types.

Cutting of circuit wiring is performed by a so-called laser processing apparatus, and additional wiring is performed by a so-called laser film-forming wiring apparatus. The laser processing device irradiates a circuit wiring portion to be cut with a processing laser beam to evaporate (ablate) the wiring portion and remove it. Also,
The laser film forming / wiring device forms a thin film of a metal compound formed by laser light irradiation in a region where additional wiring is to be formed, and irradiates a laser light for film formation on this to form a film. Is formed.

By the way, in an integrated circuit substrate which is a target for processing or additional wiring, an insulating protective film is usually overcoated on the entire circuit. Therefore, in the case of cutting the wiring, it is necessary to completely remove both the insulating protective film and the wiring metal film by laser irradiation. At the same time, it is necessary that this cutting process does not give extra damage to the underlying substrate. In the case of additional wiring, it is necessary to first remove the insulating protective film on at least two wiring metal films to be connected by a processing laser device or the like before performing additional wiring. At the same time, it is important that the metal film for wiring under the insulating protective film is not damaged by laser irradiation.

Therefore, in the case of cutting, it is necessary to check as often as possible whether all the wiring has been removed by the cutting process, and immediately stop the process when the wiring is surely removed. , It is necessary to prevent extra damage to the base substrate. In addition, in the case of additional wiring, when removing the insulating protective film on the wiring metal film with the processing laser device, check as often as possible whether the insulating protective film is completely removed by processing, It is necessary to immediately stop the processing when the protective film is reliably removed so as to prevent thermal damage to the underlying wiring metal film.

Since the conventional laser processing apparatus and laser film forming / wiring apparatus have no means for identifying the material of the processing portion and confirming the presence or absence of the wiring metal film, the above-mentioned cutting and additional wiring are not performed. In order to confirm the presence / absence of the metal film, a separate material identification device for identifying the material and determining the presence / absence of the metal film was used.

As a conventional material identifying device of this type, there is a device using a so-called capacitance type probe probe method.

This material identifying device detects the change in electrostatic capacitance by an electric circuit when the probe tip made of metal is gradually brought close to the surface to be inspected and finally brought into contact with it. The capacitance increases as the probe approaches the surface to be inspected, and when the capacitance stops increasing when contacting the surface to be inspected and becomes constant, it is determined that the surface to be inspected is an insulating film. . On the other hand, the capacitance increases as the probe approaches the surface to be inspected, but if it suddenly drops to zero at the moment of contact, it is determined that the surface to be inspected is a conductor surface (metal film). is there. As such a device, for example, a sense chip contact sensor (trade name of Wentworth Laboratories, Inc.) commercially available from Wentworth Laboratories, Inc. in the United States is known.

[0009]

However, in the above-described probe probe method, there is a limit to the miniaturization of the probe probe, and it is practically difficult to cope with the wiring pattern size of the integrated circuit, which is extremely miniaturized. Is coming. Also, in order to prevent damage to the base substrate and metal film for wiring by laser processing, it is necessary to frequently interrupt the processing and operate the probe each time to inspect and confirm, so real-time inspection In addition to the above, there is a problem in that the operation of gradually bringing the probe closer to the surface to be inspected requires skill, so that inspection and processing take a lot of time and labor.

The present invention has been made under the above-mentioned background, and confirms in real time whether or not there is a material identification device that enables material identification to be performed easily and instantaneously, and a conductive film for wiring. A laser processing apparatus that enables cutting of the conductive film for wiring, and a laser deposition that can remove the insulating protective film and perform additional wiring while checking the presence or absence of the insulating protective film in real time It is intended to provide a wiring device.

[0011]

In order to solve the above-mentioned problems, a material identifying apparatus according to the present invention is (Structure 1) A material identifying apparatus for identifying each material of a subject made of a plurality of materials, An inspection light source that emits inspection light composed of light having different reflection or scattering properties for each material, and a return due to reflection or scattering of inspection light from the subject when the inspection light is irradiated to the subject. And a photodetector for detecting light, wherein the material of the subject is identified by a detection signal of the photodetector. As an aspect of the configuration 1, (configuration 2) material of the configuration 1 In the identification device, the inspection light has a property of removing a part of one or more materials of the respective materials, and (Configuration 3) Configuration 1 or For 2 material identification device Te, comprising a device for determining the ratio of the intensity between the intensity of the light emitted from the inspection light source the return light, and a configuration in which wherein the identifying material of the subject by the value of this ratio.

The laser processing apparatus according to the present invention is (Structure 4) is a processing apparatus for removing a part of a workpiece having a plurality of layers, and is a processing laser apparatus for emitting a processing laser beam. And a converging optical system that condenses the processing laser light emitted from the processing laser device and irradiates the processing portion of the processing target with each other, and configures each layer of the processing target. A light source for inspection, which emits inspection light composed of light having different reflection or scattering properties with respect to two or more members, and a processing portion when the processing light of the workpiece is irradiated with the inspection light. And a photodetector for detecting return light due to reflection or scattering of inspection light, wherein a change in a member of a processed portion of the workpiece can be detected by a change in a detection signal of the photodetector. In addition, A laser film forming / wiring device according to the invention is (Configuration 5) is a device for electrically connecting separated portions in a circuit pattern whose surface is coated with an insulating film, wherein a laser beam for processing is applied to each of the portions. By irradiating, the laser processing apparatus part which removes the insulating film at the location to form a plurality of contact holes, and the liquid metal compound applied to the region including these contact holes is irradiated with a film forming laser beam. A laser film forming / wiring apparatus comprising: a film forming laser device section for forming a circuit for electrically connecting separated portions in the circuit pattern by solidifying and forming a film of the liquid metal compound, The apparatus is configured by the laser processing apparatus according to claim 1.

[0013]

According to the above configuration 1, when the inspection light emitted from the inspection light source is applied to the subject and the return light of the inspection light from the subject is detected by the photodetector, Since the detection signal changes depending on the material of the irradiation section, it is possible to identify the material of the subject by this detection signal.
Since this identification is based on light irradiation / detection, it can be performed instantaneously, and, for example, since irradiation / detection can be performed through the same optical path as the laser light for processing, etc. The material can be identified with.

According to the configuration 2, the inspection light has the property of removing a part of each material, so that, for example, by controlling the irradiation time, not only the surface portion of the subject, It is possible to identify the material of the lower layer by removing the film or impurities covering the surface of the subject, or to identify the material inside the subject very easily.

According to the structure 3, since the material of the subject is identified by the value of the ratio of the intensity of the light emitted from the inspection light source and the intensity of the return light, the intensity of the inspection light changes. However, the change is canceled and the ratio value mainly depends only on the material. Therefore, the material can be identified without being affected by the change in the intensity of the inspection light. .

According to the structure 4, an inspection light source which emits inspection light composed of light having different reflection or scattering properties with respect to two or more members constituting each layer of the workpiece,
It is provided with a photodetector that detects return light due to reflection or scattering of the inspection light from the processing portion when the processing light of the processing object is irradiated with the inspection light, and changes in the detection signal of the photodetector. It is possible to detect a change in the member of the processed portion of the workpiece. In addition, since it is relatively easy to configure such detection while processing, if each layer is composed of members having different optical properties, which layer member is currently processed? Can also be configured to be able to know in real time.
Therefore, for example, it becomes possible to easily stop the processing on the surface of a specific layer of the object to be processed and prevent the specific layer from being damaged by the processing.

According to the structure 5, the insulating protective film can be surely removed without damaging the circuit pattern, and reliable additional wiring can be performed without the possibility of causing defects due to processing.

[0018]

【Example】

(First Embodiment) FIG. 1 is a diagram showing a configuration of a laser processing apparatus and a laser film forming / wiring apparatus according to a first embodiment of the present invention, and FIGS. 2 to 6 are laser processing apparatus and laser processing apparatus of the first embodiment. It is processing explanatory drawing by a film wiring apparatus. The first embodiment will be described below with reference to these drawings. This embodiment is an example in which the material identification device and the laser processing device are incorporated as a laser processing device unit in the laser film forming / wiring device.

In FIG. 1, the laser film forming / wiring apparatus of the first embodiment has an XY stage 2 on which a semiconductor circuit substrate 1 is placed and whose XY position can be freely set and moved, and this XY stage. A processing laser device 3 for irradiating the surface of the semiconductor circuit board 1 placed on the stage 2 with the processing laser beam L1, and a film forming laser for a thin film of a metal compound formed on the surface of the semiconductor circuit board 1. Film forming laser device 4 for irradiating light L2
A condensing optical system 5 for condensing these laser lights L1 and L2 on the surface of the semiconductor circuit board 1, an illumination light source 6 for irradiating the semiconductor circuit board 1 with illumination light L3, and the semiconductor circuit board 1
Inspection light source 8 for irradiating the inspection light L4 on the background, and an observation CCD
And a camera 7.

The processing laser device 3 is arranged so that its converging optical system 5 and its optical axis coincide with each other. Beam splitters 42, 72, 61 are arranged on the main optical path L between the processing laser device 3 and the condensing optical system 5. The beam splitter 42 is emitted from the film-forming laser device 4 arranged outside the main optical path L, and the optical fiber 4 is emitted.
The film-forming laser light L2 guided through 1 is introduced onto the main optical path L and guided through the focusing optical system 5 to the semiconductor circuit board 1. Further, the beam splitter 72 guides the light including the image information of the surface of the semiconductor circuit board 1 guided through the main optical path L to the observation CCD camera 7 arranged outside the main optical path L. Further, the beam splitter 61 introduces the irradiation light L3 and the inspection light L4 emitted from the irradiation light source 6 and the inspection light source 8 which are arranged outside the main optical path L onto the main optical path L to collect the light. Through to the surface of the semiconductor circuit board 1. The illumination light L3 emitted from the illumination light source 6 is designed to go straight and be guided to the beam splitter 61, while the inspection light L4 emitted from the inspection light source 8 is emitted to the illumination light source 6 and the beam splitter 61. And the illumination light L3
It is reflected by the beam splitter 81 disposed on the optical path of the above and is guided to the beam splitter 61 through the same optical path as the illumination light L3. Also, C for observation
The image information of the CD camera 7 is sent to an image processing device 71 equipped with a monitor TV or the like, and observation and desired image processing can be performed. Furthermore, the condensing optical system 5
The position can be adjusted in the X, Y, and Z directions by a drive mechanism (not shown).

Here, as the processing laser device 3, N
Second harmonic of d: YAG laser (wavelength λ = 532 nm)
A laser device that can oscillate is used.

As the film forming laser device 4, an Ar ion laser device (for example, commercially available from Spectra Physics, Inc.) capable of non-polarized multi-line (wavelength: 458 to 514.5 nm) oscillation was used.

The illumination light source 6 is a visible light tail light source (H
Cold light (trade name) commercially available from OYA Shot Co., Ltd. was used.

Further, the inspection light source 8 has a wavelength of 36
A mercury lamp capable of emitting 5 nm i-line (ultraviolet light) was used. This i-line is applied to a general polyimide resin as a material of an insulating protective film coated on the surface of the semiconductor circuit substrate 1 such as an integrated circuit and a general silicon substrate as a member constituting a substrate body of the semiconductor circuit substrate. In the case of doing so, most of them are absorbed and reflected return light is hardly generated. On the other hand, when a metal film such as an aluminum film as a material of a circuit pattern formed under the insulating protective film is irradiated, most of it is reflected and a part of it is reflected and returned light.

As the CCD camera 6, the illumination light L
A detector having detection sensitivity for both 3 and the inspection light L4 was used. In this case, the image processing device 71 uses the illumination light L3.
An image having a processing function of switching between the image by the inspection light and the image by the inspection light L4 and displaying them separately, or by combining and displaying by color-coding them is used.

Further, as the focusing optical system 5, a laser beam L
A microscope (for example, commercially available from Mitutoyo Co., Ltd.) capable of condensing the irradiation spot diameters of 1 and L2 to 1 to 10 μm was used.

Next, referring to FIGS. 2 to 6,
The procedure of cutting the circuit pattern of the semiconductor circuit board 1 by the laser film forming and wiring apparatus of the first embodiment and removing the insulating protective film at the stage before the additional wiring will be described.

FIG. 2 is a partial sectional view of the semiconductor circuit board 1 to be processed. This semiconductor circuit board 1 has a circuit pattern 12 made of an aluminum film on a silicon substrate 11.
Is formed, and the insulating protective film 13 made of polyimide resin is formed thereon. Here, the circuit pattern 12 has a long strip shape with a width of several μm in a plan view, and FIG. 2 shows a partial vertical cross section along the longitudinal direction.

To form a contact hole by removing a part of the insulating protective film 13, first, the surface of the semiconductor circuit board 1 is illuminated with the illumination light L3 by the illumination light source 6, and the reflected return light L31 is observed. The surface image of the semiconductor circuit board 1 is displayed on the monitor television of the image processing device 71 by being detected by the CCD camera 7 for use, and the XY stage 2 and the condensing optical system 5 are adjusted while observing this image to process the image. At the same time, the laser irradiation position is set and the laser irradiation is optically adjusted.

Next, the inspection light L emitted from the inspection light source 8
4 is irradiated to the processing portion through the condensing optical system 5, and at the same time, the image processing device 71 is switched to change the screen of the monitor television to the screen by the reflected return light of the inspection light L4. At this point,
Since the inspection light L4 is almost absorbed by the insulating protective film 13 and no reflected return light is generated, the entire screen is displayed dark.

Next, while maintaining the image processing device 71 in the above state, the processing laser beam L1 emitted from the processing laser device 3 is applied to the processed portion of the insulating protective film 13 through the condensing optical system 5. In this case, the irradiation of the processing laser beam L1 is performed by the pulse laser multiple irradiation method with the minimum power required for removing the insulating protective film 13 by ablation. By the irradiation of the processing laser beam L1, the insulating protective film 13 is gradually removed by ablation (see FIG. 3). In this case, circuit pattern 1
The screen of the monitor TV remains dark while the insulating protective film 13 remains on the surface of 2.

If the irradiation of the processing laser beam L1 is continued, the insulating protective film 1 on the circuit pattern 12 in the processed portion will eventually come out.
All 3 are removed and the surface of the circuit pattern 12 is exposed (see FIG. 4). Then, the inspection light L4 is reflected by the exposed surface to generate reflected return light L41, which is detected by the observation CCD camera 7. As a result, in the image on the monitor television screen of the image processing device 71, the exposed portion of the circuit pattern 12 is bright and the other portion (insulating protective film portion) is dark. Therefore, the irradiation of the processing laser beam L4 is immediately stopped when the bright portion reaches a predetermined size. As a result, the contact hole 13a in which only the insulating protective film 13 is completely removed can be formed without giving extra damage to the circuit pattern 12.

Similarly, although not shown, contact holes are formed also in other places where additional wiring is to be performed, and a paste-like metal compound is applied to a region including these contact holes and connecting these by spin coating. It is applied to form a thin film with a uniform thickness of about 3 μm, and heated in an oven for easy handling (about 1 at 80 ° C).
0 minutes). In this case, as the pasty metal compound, MO ink (Enge
A product obtained by diluting (trade name of Lhard Co.) with an organic solvent and further adding a resin to have an appropriate viscosity was used. The resin does not necessarily have to be added. This MO ink is made of a gold organic compound. In addition to MO ink, which is an organic compound of gold, as a metal compound, silver,
Organic compounds such as platinum or palladium can be used. After forming the thin film of the metal compound, the thin film of the metal compound is scanned with the film forming laser beam L3 emitted from the film forming laser device 4 along the area connecting the contact holes. Irradiate. Note that this scanning is performed by moving the XY stage 2. Thereby, the metal compound is formed into a film and the additional wiring is formed.

Further, when the circuit pattern is cut, the same method and procedure as the above-described insulating protective film removing step are performed until the middle of the process, but in the case of the cutting process, the processing laser beam is used. The irradiation power of L1 is increased as compared with the case of removing the protective film, and the irradiation is continued without stopping even if the surface of the circuit pattern 12 is exposed, and the circuit pattern 12 in the processed portion is removed by ablation. The process is repeated until the circuit pattern 12 is completely cut.

In this processing, the entire screen of the monitor television of the image processing apparatus 71 is dark at the beginning of processing, but when the processing reaches the circuit pattern 12, the exposed portion of the circuit pattern 12 is displayed brightly (FIG. 5). In the case of removing the protective film, the processing was stopped immediately when the bright portion became a predetermined size, but in the case of the cutting processing, the irradiation of the processing laser beam L1 was continued even at this time. When the processing further progresses, the surface of the silicon substrate 11 begins to be exposed,
In the initial stage of this exposure, the exposure starts from the portion corresponding to the central portion of the spot of the processing laser beam L1 and eventually extends until the circuit pattern is completely cut off (see FIG. 6). At this time, in the image on the monitor TV screen, a circular dark portion begins to appear in the center of the bright portion of the image in the initial stage of exposure of the silicon substrate 11, but this gradually spreads as the processing progresses, and the circuit pattern 12 is formed. When is completely cut, the image becomes an image in which the bright portion is separated into two by the dark portion. Therefore, in the monitor TV image, the dark part is completely covered by the bright part.
Immediately when the separated image is obtained, the irradiation of the processing laser beam L1 is stopped. As a result, the circuit pattern 12 can be cut without damaging the silicon substrate 11 excessively.

(Second Embodiment) FIG. 7 is a diagram showing the configuration of the second embodiment of the present invention. The second embodiment will be described below with reference to FIG. Note that this embodiment is an example in which the present invention is applied to a laser processing machine called a laser pattern generator, and there is a part in common with the configuration of the above-mentioned first embodiment, so the common parts are the same. And the description thereof is partially omitted.

Here, the purpose of the laser pattern generator is to irradiate a laser on an organic thin film surface uniformly thinly coated on the entire surface of the metal foil to remove the coating material into a specified fine pattern shape to remove the metal surface. Is to expose.

The schematic structure of this embodiment is such that the film forming laser device 4 in the first embodiment is removed, and the processing laser device 3 and the inspection light source 8 are the same UV (ultraviolet) laser device 38. The UV laser device 38 is also arranged at the position of the processing laser device 3 in the first embodiment.

The UV laser device 38 is Nd: YL.
A laser device that pulse-oscillates the third harmonic (wavelength 349 nm) of the F laser was used.

The laser beam L14 emitted from the UV laser device 38 sequentially passes through the beam splitters 72 and 93, and then a metal film is formed on the entire surface of the substrate by the condensing optical system 5, and an organic thin film is coated thereon. It is focused on the surface of the processed body 10. The beam splitter 93 reflects a part of the laser light L14 emitted from the UV laser device 38, makes it enter the photodiode 91, and detects the intensity of the laser light L14 emitted from the UV laser device 38. at the same time,
Part of the return light due to reflection or scattering from the surface of the workpiece 10 is reflected and incident on the photodiode 92, and the intensity of the return light is detected. The detection signals of the photodiodes 91 and 92 are sent to the control / arithmetic unit 9, and it is determined whether the return light is the return light from the organic thin film or the return light from the metal foil. That is, the intensity of the return light from the organic thin film is almost zero, and conversely, the intensity of the return light from the metal foil is high. The control / arithmetic unit 9 continues to emit the laser light L14 from the UV laser device 38 while the return light is almost zero, and immediately stops the laser light 38 when the return light increases to a predetermined intensity. , And controls the UV laser device 38. At the same time, the XY stage 2 is controlled to move the irradiation position to the next predetermined position, start emitting the laser beam L14 again, and thereafter, the same operation is repeated to form the organic thin film in a predetermined pattern. Remove. Here, the observation CCD camera 7 and the image processing device 71 are used as a device for displaying an image by the return light of the laser beam L14 on a monitor television screen for monitoring.

UV which can be used in this embodiment
As the laser, in addition to the harmonics of the Nd: YLF laser adopted in the above embodiment, harmonics of the Nd: YAG solid-state laser (λ = 355 nm, 266 nm etc), nitrogen laser (λ = 337 nm),
An excimer laser (λ = 308 nm, 248 nm etc) can be used.

(Third Embodiment) FIG. 8 is a diagram showing the configuration of the third embodiment of the present invention. The third embodiment will be described below with reference to FIG. It should be noted that in this embodiment, the subject 11
Since it is an inspection device for examining the material distribution of the surface of, there is a part in common with the configuration of the above-mentioned second embodiment,
The common parts are denoted by the same reference numerals and the description thereof is partially omitted.

The schematic configuration of this embodiment is similar to the UV laser device 38 of the second embodiment except that the inspection laser light L is used.
An inspection UV laser device 30 that emits 40 is arranged, and an optical modulator 500 that scans a laser beam between the beam splitter 93 and the condensing optical system 5 is used. And a confocal optical system that can also function as a scanning laser microscope,
In addition, a control / calculation having a function of calculating the ratio of the detection signals of the photodiodes 91 and 92 and comparing it with the data of various materials registered in advance to specify the material of the micro spot area of the subject. The device 90 is used. The control / arithmetic unit 90 also performs necessary control of the light modulator 500, the condensing optical system 5, the XY stage 2, and the like.

The apparatus of this embodiment is particularly effective in promptly determining whether the surface of the subject 11 is an organic substance or a metal. In this embodiment, the inspection UV laser device 3 is used.
A He-Cd laser (λ = 442 nm, 325 nm) was used as 0, but an Ar ion laser (λ = 2) having an oscillation wavelength in the ultraviolet region was used.
75.4 nm to 418.5 nm) are also useful. Further, light of any wavelength may be used as long as it has a property of distinguishing a plurality of materials.

[0045]

As described in detail above, the material identifying apparatus, laser processing apparatus, and laser film forming / wiring apparatus according to the present invention use an inspection light composed of light having different reflection or scattering properties with respect to a plurality of materials. An inspection light source that emits light, and a photodetector that detects return light due to reflection or scattering of the inspection light from the subject when the inspection light is applied to the subject, and the detection signal of the photodetector By having a configuration for identifying the material of the subject, it is possible to easily and instantly identify the material, and a material identification device for the wiring conductive film while confirming the presence or absence of the wiring conductive film in real time. A laser processing apparatus capable of cutting, and a laser film forming and wiring apparatus capable of performing additional wiring by removing the insulating protective film while confirming the presence or absence of the insulating protective film in real time. Made it possible.

[Brief description of drawings]

FIG. 1 is a diagram showing a configuration of a first exemplary embodiment of the present invention.

FIG. 2 is an explanatory view of processing by the laser processing apparatus and the laser film forming / wiring apparatus of the first embodiment.

FIG. 3 is an explanatory view of processing by the laser processing apparatus and the laser film forming / wiring apparatus of the first embodiment.

FIG. 4 is an explanatory view of processing by the laser processing apparatus and the laser film forming / wiring apparatus of the first embodiment.

FIG. 5 is an explanatory view of processing by the laser processing apparatus and the laser film forming / wiring apparatus of the first embodiment.

FIG. 6 is an explanatory view of processing by the laser processing apparatus and the laser film forming / wiring apparatus of the first embodiment.

FIG. 7 is a diagram showing a configuration of a second exemplary embodiment of the present invention.

FIG. 8 is a diagram showing a configuration of a second exemplary embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Semiconductor circuit board, XY stage, 3 ... Laser device for processing, 4 ... Laser device for film formation, 5 ... Focusing optical system, 6 ...
Light source for illumination, 7 ... CCD camera for observation, 8 ... Light source for inspection.

Claims (5)

[Claims] 1. A material identification device for identifying each material of an object made of a plurality of materials, the inspection light source emitting an inspection light composed of light having different reflection or scattering properties with respect to each material, A photodetector for detecting return light due to reflection or scattering of the test light from the test object when the test light is applied to the test object, and a material of the test object is detected by a detection signal of the photodetector. Material identification device characterized by identification. 2. The material identification device according to claim 1, wherein the inspection light has a property of removing a part of one or more materials of the respective materials. Material identification device. 3. The material identification device according to claim 1, further comprising a device that obtains a ratio between the intensity of light emitted from the inspection light source and the intensity of the return light, and the value of the ratio is used to detect the target object. A material identification device characterized by identifying a material of a specimen. 4. An apparatus for performing a process of removing a part of a workpiece having a plurality of layers, the processing laser device emitting a processing laser beam, and the processing laser emitted from the processing laser device. In a laser processing apparatus having a condensing optical system that collects laser light and irradiates the processed portion of the object to be processed, a laser processing device that reflects or scatters two or more members constituting each layer of the object to be processed is provided. An inspection light source that emits inspection light composed of light having different properties, and light that detects return light due to reflection or scattering of inspection light from the processing part when the inspection light is applied to the processing part of the workpiece. A laser processing apparatus comprising: a detector, wherein a change in a member of a processed portion of the workpiece can be detected by a change in a detection signal of the photodetector. 5. A device for electrically connecting spaced apart portions of a circuit pattern whose surface is coated with an insulating film, wherein the insulating film at each portion is irradiated with a processing laser beam. And a laser processing device section for removing a plurality of contact holes to form a plurality of contact holes, and a liquid metal compound applied to an area including these contact holes is irradiated with a film forming laser beam to solidify and form the liquid metal compound. The laser processing apparatus unit according to claim 1, wherein the laser processing apparatus unit is provided with a film forming laser device unit that forms a circuit that electrically connects the separated positions in the circuit pattern by performing the above. A laser film forming / wiring device comprising a laser processing device.