CN108447815A - 一种晶圆表面加工用的载台 - Google Patents
一种晶圆表面加工用的载台 Download PDFInfo
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- CN108447815A CN108447815A CN201810298294.9A CN201810298294A CN108447815A CN 108447815 A CN108447815 A CN 108447815A CN 201810298294 A CN201810298294 A CN 201810298294A CN 108447815 A CN108447815 A CN 108447815A
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- 239000013078 crystal Substances 0.000 title claims abstract description 15
- 239000012530 fluid Substances 0.000 claims abstract description 44
- 239000011159 matrix material Substances 0.000 claims abstract description 36
- 239000007788 liquid Substances 0.000 claims abstract description 29
- 238000003860 storage Methods 0.000 claims abstract description 28
- 241000276425 Xiphophorus maculatus Species 0.000 claims abstract description 12
- 230000005284 excitation Effects 0.000 claims abstract description 11
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 5
- 230000004044 response Effects 0.000 claims abstract description 3
- 238000007789 sealing Methods 0.000 claims description 13
- 238000000034 method Methods 0.000 abstract description 8
- 230000008569 process Effects 0.000 abstract description 8
- 238000012797 qualification Methods 0.000 abstract description 3
- 239000000969 carrier Substances 0.000 abstract description 2
- 239000011521 glass Substances 0.000 description 12
- 238000010586 diagram Methods 0.000 description 4
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- 239000000463 material Substances 0.000 description 2
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- 235000011613 Pinus brutia Nutrition 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Liquid Crystal (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810298294.9A CN108447815B (zh) | 2018-04-03 | 2018-04-03 | 一种晶圆表面加工用的载台 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810298294.9A CN108447815B (zh) | 2018-04-03 | 2018-04-03 | 一种晶圆表面加工用的载台 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108447815A true CN108447815A (zh) | 2018-08-24 |
CN108447815B CN108447815B (zh) | 2020-04-03 |
Family
ID=63199416
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810298294.9A Active CN108447815B (zh) | 2018-04-03 | 2018-04-03 | 一种晶圆表面加工用的载台 |
Country Status (1)
Country | Link |
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CN (1) | CN108447815B (zh) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020081943A1 (en) * | 2000-12-11 | 2002-06-27 | Hendron Jeffrey J. | Semiconductor substrate and lithographic mask processing |
JP2013169620A (ja) * | 2012-02-21 | 2013-09-02 | Tok Engineering Kk | マグネットストレーナ及びそれを用いた研磨装置 |
CN106881609A (zh) * | 2017-03-01 | 2017-06-23 | 大连理工大学 | 一种薄壁平板磁流变液柔性支撑方法 |
CN107322347A (zh) * | 2017-09-05 | 2017-11-07 | 河北工业大学 | 一种新型多功能柔性夹具及其使用方法 |
-
2018
- 2018-04-03 CN CN201810298294.9A patent/CN108447815B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020081943A1 (en) * | 2000-12-11 | 2002-06-27 | Hendron Jeffrey J. | Semiconductor substrate and lithographic mask processing |
JP2013169620A (ja) * | 2012-02-21 | 2013-09-02 | Tok Engineering Kk | マグネットストレーナ及びそれを用いた研磨装置 |
CN106881609A (zh) * | 2017-03-01 | 2017-06-23 | 大连理工大学 | 一种薄壁平板磁流变液柔性支撑方法 |
CN107322347A (zh) * | 2017-09-05 | 2017-11-07 | 河北工业大学 | 一种新型多功能柔性夹具及其使用方法 |
Also Published As
Publication number | Publication date |
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CN108447815B (zh) | 2020-04-03 |
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PB01 | Publication | ||
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Effective date of registration: 20200220 Address after: Ganquan road Shushan District of Hefei City, Anhui Province, 230000 West hillock road to the South Wild Garden commercial office building room B-1512 Applicant after: Anhui Eagle Dragon Industrial Design Co., Ltd. Address before: 315700 36 households in lower salt Village, Shi Pu town, Xiangshan County, Ningbo, Zhejiang, 36 Applicant before: Han Sai |
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TA01 | Transfer of patent application right |
Effective date of registration: 20200306 Address after: 211400 building A5, No.9, Mintai Avenue, Yizheng Economic Development Zone, Yangzhou City, Jiangsu Province Applicant after: Jiangsu super core star Semiconductor Co., Ltd Address before: Ganquan road Shushan District of Hefei City, Anhui Province, 230000 West hillock road to the South Wild Garden commercial office building room B-1512 Applicant before: Anhui Eagle Dragon Industrial Design Co., Ltd. |
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