CN108429564B - The design method and mobile terminal of impedance matching circuit - Google Patents
The design method and mobile terminal of impedance matching circuit Download PDFInfo
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- CN108429564B CN108429564B CN201810115557.8A CN201810115557A CN108429564B CN 108429564 B CN108429564 B CN 108429564B CN 201810115557 A CN201810115557 A CN 201810115557A CN 108429564 B CN108429564 B CN 108429564B
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
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Abstract
The application provides a kind of design method of impedance matching circuit, it include: that impedance matching circuit is set on a printed circuit, including the first, second, and third matching element, the layout direction of second and third matching element is vertical with the layout direction of the first matching element.First copper foil layer of printed circuit board is equipped with the first, second cabling, and the first, second cabling is used to impedance matching circuit accessing signal transmitting and receiving path.First pad of the first matching element and first are walked into wire bonding, and the second pad of the first matching element and second are walked into wire bonding；It is grounded by the first pad solder of the first pad of the second matching element and the first matching element, and by the second pad of the second matching element；It is grounded by the second pad solder of the first pad of third matching element and the first matching element, and by the second pad of third matching element.In addition, the application also provides a kind of mobile terminal.The method can effectively shorten the signal transmission path between matching element.
Description
The application is application No. is 201610105396.5, and the applying date is on 2 25th, 2016, entitled " impedance
The divisional application of the design method and mobile terminal of match circuit ".
Technical field
This application involves the design methods and a kind of movement of electronic technology field more particularly to a kind of impedance matching circuit eventually
End.
Background technique
In the mobile terminals such as mobile phone, tablet computer, RF front-end circuit is as the key on radiofrequency signal transceiver path
The quality of component, performance directly affects the communication quality of mobile terminal.For promoted RF front-end circuit signal transmitting and receiving quality,
Reduce signal reflex, the overall performance of mobile terminal is promoted, in RF front-end circuit, it usually needs using impedance matching electricity
Road, to meet the specific matching relationship in signals transmission between antenna impedance and the internal driving of rf chip.Resistance
Anti- match circuit is usually made of components such as capacitor, resistance, inductance, and there are commonly Pi type match circuits and T-type match circuit.
However, whether the layout of match circuit rationally directly affects during the manufacturing of the mobile terminals such as mobile phone, tablet computer
To the impedance matching performance of match circuit, and then influence the signal transmitting and receiving performance of mobile terminal.Therefore, how to optimize impedance matching
The design and layout of circuit are the key that promote mobile terminal signal transmitting-receiving performance.
Summary of the invention
The application provides a kind of design method of impedance matching circuit, to promote the impedance matching of impedance matching circuit
Can, reduce the reflection in signals transmission, promotion signal tranception-quality.
In addition, the application also provides a kind of mobile terminal of design method using the impedance matching circuit.
The application first aspect provides a kind of design method of impedance matching circuit, comprising:
Impedance matching circuit is set on a printed circuit, wherein the impedance matching circuit include the first matching element,
The layout direction of second matching element and third matching element, second matching element and the third matching element is and institute
The layout direction for stating the first matching element is vertical, and the printed circuit board includes the first copper foil layer, sets on first copper foil layer
There are the first cabling and the second cabling, first cabling and second cabling are used to the impedance matching circuit accessing signal
Transceiver path；
First pad of first matching element is walked into wire bonding with described first, and by first matching element
Second pad and described second walks wire bonding；
By the first pad solder of the first pad of the second matching element and first matching element, and by described second
Second pad of matching element is grounded；
By the second pad solder of the first pad of third matching element and first matching element, and by the third
Second pad of matching element is grounded.
The application second aspect provides a kind of mobile terminal, including printed circuit board and is set on the printed circuit board
Impedance matching circuit, the printed circuit board includes the first copper foil layer, and first copper foil layer is equipped with the first cabling and the
Two cablings, first cabling and second cabling are used to the impedance matching circuit accessing signal transmitting and receiving path；
The impedance matching circuit include the first matching element, the second matching element and third matching element, described first
Matching element, second matching element and the third matching element include the first pad and the second pad, and described second
The layout direction of matching element and the third matching element is vertical with the layout direction of first matching element；
First pad of first matching element walks wire bonding, the second weldering of first matching element with described first
Disk and described second walks wire bonding；
First pad solder of the first pad of second matching element and first matching element, described second
The second pad ground connection with element；
Second pad solder of the first pad of the third matching element and first matching element, the third
The second pad ground connection with element.
The application third aspect provides a kind of design method of impedance matching circuit, comprising:
Impedance matching circuit is set on a printed circuit, wherein the impedance matching circuit include the first matching element,
The layout direction of second matching element and third matching element, second matching element and the third matching element is and institute
The layout direction for stating the first matching element is vertical, and the printed circuit board includes the first copper foil layer, sets on first copper foil layer
There are the first cabling and the second cabling, first cabling and second cabling are used to the impedance matching circuit accessing signal
Transceiver path；
By the first pad of the first pad of the second matching element and third matching element with first matching element
The first pad solder, and by the second pad of first matching element be grounded；
Second pad of second matching element and described first is walked into wire bonding；
Second pad of the third matching element and described second is walked into wire bonding.
The application fourth aspect provides a kind of mobile terminal, including printed circuit board and is set on the printed circuit board
Impedance matching circuit, the printed circuit board includes the first copper foil layer, and first copper foil layer is equipped with the first cabling and the
Two cablings, first cabling and second cabling are used to the impedance matching circuit accessing signal transmitting and receiving path；
The impedance matching circuit include the first matching element, the second matching element and third matching element, described first
Matching element, second matching element and the third matching element include the first pad and the second pad, and described second
The layout direction of matching element and the third matching element is vertical with the layout direction of first matching element；
First pad of first matching element is matched with the first pad of second matching element and the third
First pad solder of element, the second pad ground connection of first matching element；
Second pad of second matching element and described first walks wire bonding；Second weldering of the third matching element
Disk and described second walks wire bonding.
The design method of the impedance matching circuit, which passes through, directly matches member with described first for second matching element
First pad solder of part, and the second pad solder by the third matching element directly with first matching element, or
First pad solder of the person by second matching element and the third matching element directly with first matching element,
Effectively shorten the signal transmission road between first matching element, second matching element and the third matching element
Diameter is conducive to promote impedance matching performance, reduces the reflection in signals transmission, promotion signal tranception-quality.
Detailed description of the invention
In order to illustrate the technical solutions in the embodiments of the present application or in the prior art more clearly, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of application for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is the flow diagram of the design method of the first impedance matching circuit provided by the embodiments of the present application；
Fig. 2 is the flow diagram of the design method of second of impedance matching circuit provided by the embodiments of the present application；
Fig. 3 is the structural schematic diagram of the first mobile terminal provided by the embodiments of the present application；
Fig. 4 is the structural schematic diagram of second of mobile terminal provided by the embodiments of the present application.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present application, technical solutions in the embodiments of the present application carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of embodiments of the present application, instead of all the embodiments.It is based on
Embodiment in the application, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall in the protection scope of this application.
For ease of description, may be used herein such as " ... under ", " ... below ", "lower", " ... on ", "upper"
Spaces relative terms are waited to describe the relationship of an elements or features and another (a little) elements or features as illustrated in the drawing.
It is appreciated that be referred to as in another element or layer "upper", " being connected to " or " being couple to " another element when an element or layer or
When layer, it can directly on another element or layer, be directly connected to or be couple to another element or layer, or there may be occupy
Between element or layer.
It is appreciated that terminology used here is merely to description specific embodiment, is not intended to limit the application.Herein
In use, clearly stating unless the context otherwise, otherwise singular " one ", "the" and " described " are also intended to while including plural number
Form.Further, when used in this manual, term " includes " and/or "comprising" show the feature, entirety, step
Suddenly, the presence of element and/or component, but be not excluded for other one or more features, entirety, step, element, component and/or its
Combined presence or increase.
Referring to Fig. 1, a kind of design method of impedance matching circuit is provided in the application one embodiment, it is described to set
Meter method includes at least following steps:
Step S101: groove is opened up in the predeterminated position of printed circuit board (Printed Circuit Board, PCB), institute
Groove is stated through the first copper foil layer of the PCB and is extended in the substrate layer adjacent with first copper foil layer；
Step S102: the first matching element is embedded in backwards in the groove, and makes the first of first matching element
Pad and the second pad are concordant with first copper foil layer；Wherein, refer to backwards to insertion and first matching element is embedded in institute
When stating in groove, the first pad and the second pad for keeping first matching element make towards the opening direction of the groove
First matching element is obtained to be in contact backwards to the one side of first pad and the second pad with the substrate layer.
Step S103: walking wire bonding for the first of the first pad of first matching element and first copper foil layer,
And wire bonding is walked by the second of the second pad of first matching element and first copper foil layer；Wherein, it described first walks
Line and second cabling are used to first matching element accessing signal transmitting and receiving path；
Step S104: by the first pad solder of the first pad of the second matching element and first matching element, and
Second pad of second matching element is grounded；
Step S105: by the second pad solder of the first pad of third matching element and first matching element, and
Second pad of the third matching element is grounded.
Wherein, first copper foil layer includes the PCB trace for being used to form the signal transmitting and receiving path, the predeterminated position
It can be to be reserved in the signal transmitting and receiving path for the position of impedance matching circuit to be arranged, the PCB trace is described
Predetermined position is respectively formed first cabling and second cabling.In the present embodiment, first matching element is
Resistance, second matching element and the third matching element are inductance, first matching element, the second matching member
Part and the third matching element collectively form Pi type impedance matching circuit.
Wherein, in the first pad solder of first pad by the second matching element and first matching element,
And when being grounded the second pad of second matching element, the layout direction of second matching element is matched with described first
The layout direction of element is vertical；In the second pad of first pad by third matching element and first matching element
Welding, and when the second pad of the third matching element is grounded, the layout direction of the third matching element and described the
The layout direction of one matching element is vertical.
Referring to Fig. 2, a kind of design method of impedance matching circuit is provided in another embodiment of the application, it is described
Design method includes at least following steps:
Step S201: groove is opened up in the predeterminated position of printed circuit board (Printed Circuit Board, PCB), institute
Groove is stated through the first copper foil layer of the PCB and is extended in the substrate layer adjacent with first copper foil layer；
Step S202: the first matching element is embedded in backwards in the groove, and makes the first of first matching element
Pad and the second pad are concordant with first copper foil layer；Wherein, refer to backwards to insertion and first matching element is embedded in institute
When stating in groove, the first pad and the second pad for keeping first matching element make towards the opening direction of the groove
First matching element is obtained to be in contact backwards to the one side of first pad and the second pad with the substrate layer.
Step S203: by the first pad of the first pad of the second matching element and third matching element with described first
First pad solder of matching element, and the second pad of first matching element is grounded；
Step S204: wire bonding is walked by the first of the second pad of second matching element and first copper foil layer；
Wherein, first cabling is used to second matching element accessing signal transmitting and receiving path；
Step S205: wire bonding is walked by the second of the second pad of the third matching element and first copper foil layer；
Wherein, second cabling is used to the third matching element accessing signal transmitting and receiving path.
Wherein, first copper foil layer includes the PCB trace for being used to form the signal transmitting and receiving path, the predeterminated position
It can be to be reserved in the signal transmitting and receiving path for the position of impedance matching circuit to be arranged, the PCB trace is described
Predetermined position is respectively formed first cabling and second cabling.In the present embodiment, first matching element, institute
Stating the second matching element and the third matching element is capacitor, first matching element, second matching element and
The third matching element collectively forms T-type impedance matching circuit.
Wherein, the first pad of the first pad of the second matching element and third matching element is being matched with described first
When the first pad solder of element, the layout direction of second matching element and the third matching element is with described first
The layout direction of matching element is vertical.
Referring to Fig. 3, providing a kind of mobile terminal 100, including printed circuit board in the application one embodiment
(Printed Circuit Board, PCB) the 110 and impedance matching circuit 130 being set on the printed circuit board 110, institute
State the substrate layer 113 that printed circuit board 110 includes the first copper foil layer 111 and is disposed adjacent with first copper foil layer 111.Institute
It states the first copper foil layer 111 and includes the first cabling 1111 and the second cabling 1113, first cabling 1111 and second cabling
1113 for accessing corresponding signal transmitting and receiving path for the impedance matching circuit 130.The impedance matching circuit 130 includes the
One matching element 131, the second matching element 133 and third matching element 135.
Wherein, in the present embodiment, first matching element 131 includes the first pad 1311 and the second pad 1313,
Second matching element 133 includes the first pad 1331 and the second pad (not shown), and the third matching element 135 includes
First pad 1351 and the second pad (not shown)；Fluted S is opened up on the printed circuit board 110, the groove S runs through institute
It states the first copper foil layer 111 and extends in the substrate layer 113；First matching element 131 is embedded in the groove S backwards
Interior, the first pad 1311 and the second pad 1313 of first matching element 131 are concordant with 111 layers of first copper foil；Institute
The first pad 1311 and first cabling 1111 for stating the first matching element 131 weld, and the of first matching element 131
Two pads 1313 are welded with second cabling 1113；The first pad 1331 and described first of second matching element 133
First pad 1311 of matching element 131 welds, the second pad (not shown) ground connection of second matching element 133；It is described
Second pad 1313 of the first pad 1351 and first matching element 131 of third matching element 135 welds, the third
Second pad (not shown) of matching element 135 is grounded.Wherein, refer to backwards to insertion and be embedded in first matching element 131
When in the groove S, the first pad 1311 and the second pad 1313 for keeping first matching element 131 are towards the groove
The opening direction of S so that first matching element 131 backwards to first pad 1311 and the second pad 1313 one side with
The substrate layer 113 is in contact.
In the present embodiment, first matching element 131 is resistance, second matching element 133 and the third
Matching element 135 is inductance, first matching element 131, second matching element 133 and the third matching element
135 collectively form Pi type impedance matching circuit.The layout direction of second matching element 133 and first matching element
131 layout direction is vertical；The layout side in the layout direction and first matching element 131 of the third matching element 135
To vertical.
Referring to Fig. 4, providing a kind of mobile terminal 200, including printed circuit board in the application one embodiment
(Printed Circuit Board, PCB) the 210 and impedance matching circuit 230 being set on the printed circuit board 210, institute
State the substrate layer 213 that printed circuit board 210 includes the first copper foil layer 211 and is disposed adjacent with first copper foil layer 211；Institute
It states the first copper foil layer 211 and includes the first cabling 2111 and the second cabling 2113, first cabling 2111 and second cabling
2113 for accessing signal transmitting and receiving path for the impedance matching circuit 230.The impedance matching circuit 230 includes the first matching
Element 231, the second matching element 233 and third matching element 235；First matching element 231 includes the first pad 2311
With the second pad (not shown), second matching element 233 includes the first pad 2331 and the second pad 2333, the third
Matching element 235 includes the first pad 2351 and the second pad 2353.Fluted S is opened up on the printed circuit board 210, it is described
Groove S is through first copper foil layer 211 and extends in the substrate layer 213；First matching element 231 is backwards to insertion
In in the groove S, the first pad 2311 of first matching element 231 and the second pad (not shown) and first bronze medal
211 layers of foil concordant；First pad of the first pad 2311 and second matching element 233 of first matching element 231
2331 and the third matching element 235 the first pad 2351 welding, first matching element 231 the second pad (figure
Do not show) ground connection；Second pad 2333 of second matching 233, member is welded with first cabling 2111；The third
The second pad 2353 with element 235 is welded with second cabling 2113.In the present embodiment, the impedance matching circuit
230 be T-type impedance matching circuit.Wherein, refer to backwards to insertion when being embedded in first matching element 231 in the groove S,
The first pad 2311 for keeping first matching element 231 and the second pad (not shown) are towards the opening side of the groove S
To so that first matching element 231 backwards to first pad 2311 and the second pad (not shown) one side with it is described
Substrate layer 213 is in contact.
In the present embodiment, first matching element 231, second matching element 233 and third matching member
Part 235 is capacitor, and first matching element 231, second matching element 233 and the third matching element 235 are total
With composition T-type impedance matching circuit.The layout direction and institute of second matching element 233 and the third matching element 235
The layout direction for stating the first matching element 231 is vertical.
It is appreciated that the mobile terminal 100,200 can be but not limited to: mobile phone, tablet computer, digital camera, intelligence
The mobile terminals such as energy wrist-watch.
The design method of the impedance matching circuit passes through opens up the groove on the pcb, and by described first
It is embedded in the groove backwards with element, so that the first pad and the second pad of first matching element are with the PCB's
First copper foil layer is concordant；And then the first pad of second matching element is directly welded with the first of first matching element
Disk welding, and the second pad solder by the first pad of the third matching element directly with first matching element, with
Form Pi type match circuit；Or by the first pad of the first pad of second matching element and third matching element with
First pad solder of first matching element, to form T-type match circuit.Due to formed the Pi type match circuit or
It is direct between first matching element, second matching element and the third matching element when T-type match circuit
It is welded directly together by pad, to effectively shorten first matching element, second matching element and described
Signal transmission path between third matching element is conducive to promote impedance matching performance, reduces anti-in signals transmission
It penetrates, promotion signal tranception-quality.
Counter structure, material, movement and all devices or step in the following claims and function element etc.
Same form (if present) is intended to include any structure, the material for being used to execute the function in conjunction with other elements being distinctly claimed
Material or movement.The description of the present application for example and the purpose of description are presented, but be not intended to exhaustion or by this Shen
It please be limited in disclosed form.Without departing from scope of the present application and spirit, a variety of modifications and variations are for this
The technical staff in field is apparent.Embodiment is selected and describes, to preferably explain the principle and reality of the application
Using, and those skilled in the art is made to can be appreciated that the application, the various embodiments for having various modifications are suitable for special-purpose.
Above disclosed is only the preferred embodiment of the application, cannot limit the right of the application with this certainly
Range, those skilled in the art can understand all or part of the processes for realizing the above embodiment, and according to the application right
Equivalent variations made by it is required that, still falls within the range that the application is covered.
Claims (10)
1. a kind of design method of impedance matching circuit, which is characterized in that the described method includes:
Groove is set on a printed circuit, and the first matching element is embedded in backwards in the groove, wherein the printing electricity
Road plate includes the first copper foil layer, and first copper foil layer is equipped with the first cabling and the second cabling；
First pad of first matching element is walked into wire bonding with described first, and by the of first matching element
Two pads and described second walk wire bonding, wherein first cabling and second cabling are used for the first matching member
Part accesses signal transmitting and receiving path；
First pad of the second matching element is arranged in above the first pad of first matching element, and makes described second
The layout direction of matching element is vertical with the layout direction of first matching element；
First pad of second matching element and the first pad of first matching element are welded directly together, with
And the second pad of second matching element is grounded；
First pad of third matching element is arranged in above the second pad of first matching element, and makes the third
The layout direction of matching element is vertical with the layout direction of first matching element；
First pad of the third matching element and the second pad of first matching element are welded directly together, with
And the second pad of the third matching element is grounded.
2. design method as described in claim 1, which is characterized in that first matching element be resistance, described second
It is inductance, first matching element, second matching element and the third with element and the third matching element
Pi type impedance matching circuit is collectively formed with element.
3. design method as described in claim 1, which is characterized in that the printed circuit board further includes and first copper foil
The adjacent substrate layer of layer, it is described that groove is set on a printed circuit, and the first matching element is embedded in backwards in the groove
Include:
Groove is opened up in the predeterminated position of printed circuit board, the groove is through first copper foil layer and extends to the substrate
In layer；
First matching element is embedded in backwards in the groove, and makes the first pad and second of first matching element
Pad is concordant with first copper foil layer.
4. a kind of mobile terminal, special including printed circuit board and the impedance matching circuit being set on the printed circuit board
Sign is that the printed circuit board includes the first copper foil layer, and first copper foil layer is equipped with the first cabling and the second cabling；
The impedance matching circuit includes the first matching element, the second matching element and third matching element, first matching
Element, second matching element and the third matching element include the first pad and the second pad, second matching
The layout direction of element and the third matching element is vertical with the layout direction of first matching element；
It is arranged fluted on the printed circuit board, first matching element is embedded in backwards in the groove；
First pad of first matching element walks wire bonding with described first, the second pad of first matching element with
Described second walks wire bonding, and first cabling and second cabling are used to first matching element accessing signal transmitting and receiving
Path；
First pad of second matching element is arranged in above the first pad of first matching element, and with described
First pad of one matching element is welded directly together, the second pad ground connection of second matching element；
First pad of the third matching element is arranged in above the second pad of first matching element, and with described
Second pad of one matching element is welded directly together, the second pad ground connection of the third matching element.
5. mobile terminal as claimed in claim 4, which is characterized in that first matching element be resistance, described second
It is inductance, first matching element, second matching element and the third with element and the third matching element
Pi type impedance matching circuit is collectively formed with element.
6. a kind of design method of impedance matching circuit, which is characterized in that the described method includes:
Groove is set on a printed circuit, and the first matching element is embedded in backwards in the groove, wherein the printing electricity
Road plate includes the first copper foil layer, and first copper foil layer is equipped with the first cabling and the second cabling；
First pad of the first pad of the second matching element and third matching element is separately positioned on first matching
Above first pad of element, and make the layout direction of second matching element and the third matching element with described the
The layout direction of one matching element is vertical；
First pad of the first pad of second matching element and the third matching element is matched with described first
First pad of element is welded directly together, and the second pad of first matching element is grounded；
Second pad of second matching element and described first is walked into wire bonding, wherein first cabling is used for institute
State the second matching element access signal transmitting and receiving path；
Second pad of the third matching element and described second is walked into wire bonding, wherein second cabling is used for institute
State third matching element access signal transmitting and receiving path.
7. design method as claimed in claim 6, which is characterized in that first matching element, second matching element
It is capacitor with the third matching element, first matching element, second matching element and third matching member
Part collectively forms T-type impedance matching circuit.
8. design method as claimed in claim 6, which is characterized in that the printed circuit board further includes and first copper foil
The adjacent substrate layer of layer, it is described that groove is set on a printed circuit, and the first matching element is embedded in backwards in the groove
Include:
Groove is opened up in the predeterminated position of printed circuit board, the groove is through first copper foil layer and extends to the substrate
In layer；
First matching element is embedded in backwards in the groove, and makes the first pad and second of first matching element
Pad is concordant with first copper foil layer.
9. a kind of mobile terminal, special including printed circuit board and the impedance matching circuit being set on the printed circuit board
Sign is that the printed circuit board includes the first copper foil layer, and first copper foil layer is equipped with the first cabling and the second cabling；
The impedance matching circuit includes the first matching element, the second matching element and third matching element, first matching
Element, second matching element and the third matching element include the first pad and the second pad, second matching
The layout direction of element and the third matching element is vertical with the layout direction of first matching element；
It is arranged fluted on the printed circuit board, first matching element is embedded in backwards in the groove；
First pad of the first pad of second matching element and the third matching element is separately positioned on described first
Above first pad of matching element, and the first pad with first matching element is welded directly together respectively, described
Second pad of the first matching element is grounded；
Second pad of second matching element walks wire bonding with described first, and first cabling is for second matching
Element accesses signal transmitting and receiving path；Second pad of the third matching element and described second walks wire bonding, and described second walks
Line is used to the third matching element accessing signal transmitting and receiving path.
10. mobile terminal as claimed in claim 9, which is characterized in that first matching element, second matching element
It is capacitor with the third matching element, first matching element, second matching element and third matching member
Part collectively forms T-type impedance matching circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201810115557.8A CN108429564B (en) | 2016-02-25 | 2016-02-25 | The design method and mobile terminal of impedance matching circuit |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810115557.8A CN108429564B (en) | 2016-02-25 | 2016-02-25 | The design method and mobile terminal of impedance matching circuit |
| CN201610105396.5A CN105790787B (en) | 2016-02-25 | 2016-02-25 | The design method and mobile terminal of impedance matching circuit |
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| CN201610105396.5A Division CN105790787B (en) | 2016-02-25 | 2016-02-25 | The design method and mobile terminal of impedance matching circuit |
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| CN108282169A (en) * | 2018-01-31 | 2018-07-13 | 上海康斐信息技术有限公司 | A kind of radio-frequency match structure and radio frequency matching circuit being easy to debugging |
| CN109033528B (en) * | 2018-06-28 | 2022-03-22 | 郑州云海信息技术有限公司 | Generation method, device, equipment and medium for differential pair pad routing avoidance area |
| CN113766731A (en) * | 2020-06-02 | 2021-12-07 | 苏州旭创科技有限公司 | Assembling method of circuit board assembly |
| WO2021244530A1 (en) * | 2020-06-02 | 2021-12-09 | 苏州旭创科技有限公司 | Circuit board assembly, assembling method, and optical module |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| DE19531628C2 (en) * | 1995-08-28 | 1999-08-12 | Siemens Ag | Heatsink |
| DE10332015A1 (en) * | 2003-07-14 | 2005-03-03 | Infineon Technologies Ag | Optoelectronic module with transmitter chip and connector for the module to an optical fiber and to a circuit board, and method of making the same |
| JP5065780B2 (en) * | 2007-07-03 | 2012-11-07 | 株式会社日立製作所 | RFID tag mounting board |
| CN101801162A (en) * | 2010-02-25 | 2010-08-11 | 中兴通讯股份有限公司 | Wireless communication module |
| CN101847627B (en) * | 2010-05-31 | 2012-11-21 | 锐迪科科技有限公司 | Semiconductor chip of integrated passive element and power amplifier element |
| CN103997304B (en) * | 2014-06-04 | 2017-12-26 | 泉州市琪祥电子科技有限公司 | A kind of high power vehicular radio station rf power amplifier circuit |
-
2016
- 2016-02-25 CN CN201810115557.8A patent/CN108429564B/en active Active
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| CN105790787B (en) | 2018-03-02 |
| CN108429564A (en) | 2018-08-21 |
| CN105790787A (en) | 2016-07-20 |
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