CN108428760A - A kind of High-efficiency photovoltaic solder strip and preparation method thereof - Google Patents
A kind of High-efficiency photovoltaic solder strip and preparation method thereof Download PDFInfo
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- CN108428760A CN108428760A CN201810254457.3A CN201810254457A CN108428760A CN 108428760 A CN108428760 A CN 108428760A CN 201810254457 A CN201810254457 A CN 201810254457A CN 108428760 A CN108428760 A CN 108428760A
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- tin coating
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 24
- 238000002360 preparation method Methods 0.000 title abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 136
- 229910052802 copper Inorganic materials 0.000 claims abstract description 131
- 239000010949 copper Substances 0.000 claims abstract description 131
- 239000000463 material Substances 0.000 claims abstract description 116
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 79
- 238000000576 coating method Methods 0.000 claims abstract description 68
- 239000011248 coating agent Substances 0.000 claims abstract description 67
- 238000003466 welding Methods 0.000 claims abstract description 66
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 23
- 239000000956 alloy Substances 0.000 claims abstract description 23
- 229910052718 tin Inorganic materials 0.000 claims description 74
- 230000000694 effects Effects 0.000 claims description 20
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 238000007747 plating Methods 0.000 claims description 7
- 229910052797 bismuth Inorganic materials 0.000 claims description 6
- 229910052745 lead Inorganic materials 0.000 claims description 6
- 229910001074 Lay pewter Inorganic materials 0.000 claims description 4
- 238000000137 annealing Methods 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000005096 rolling process Methods 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 2
- 238000005253 cladding Methods 0.000 claims 1
- 238000000034 method Methods 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 238000003490 calendering Methods 0.000 description 2
- 230000002500 effect on skin Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000010422 painting Methods 0.000 description 2
- 238000005491 wire drawing Methods 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 239000008199 coating composition Substances 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0512—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module made of a particular material or composition of materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0508—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module the interconnection means having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/054—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means
- H01L31/0547—Optical elements directly associated or integrated with the PV cell, e.g. light-reflecting means or light-concentrating means comprising light concentrating means of the reflecting type, e.g. parabolic mirrors, concentrators using total internal reflection
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/52—PV systems with concentrators
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Photovoltaic Devices (AREA)
Abstract
The invention discloses a kind of High-efficiency photovoltaic solder strip and preparation method thereof, including Copper base material and alloy tin coating, the Copper base material is sequentially connected end to end by multiple Copper base material basic units and is formed, and mark point is formed between adjacent two Copper base materials basic unit；The Copper base material basic unit includes reflective section of Copper base material being wholely set and Copper base material backlight section, the dentate groove that cross sectional shape is isosceles trapezoidal structure is provided on the upper surface of reflective section of the Copper base material, it is provided with arc groove on the lower surface that reflective section of Copper base material, dentate groove two is provided on the upper surface of the Copper base material backlight section；The alloy tin coating includes reflective surface tin coating, lower welding surface tin coating, upper welding surface tin coating.The present invention by the upper surface of Copper base material by being arranged to isosceles trapezoidal structure, then reflective surface tin coating is applied the mode on the dentate groove being located in reflective section of Copper base material so that reflective surface tin coating can form ideal isosceles triangular structure when being coated with.
Description
Technical field
The present invention relates to solar cell module processing technique field, especially a kind of High-efficiency photovoltaic solder strip and its making side
Method.
Background technology
Solar energy power generating is that the photovoltaic effect of interface is radiated at using sunlight, and luminous energy is directly turned
Become a kind of technology of electric energy.Conventional photovoltaic module at present, needs that different cell pieces are together in series using welding, welding one
End is welded on battery front side, and the other end is welded on another cell backside, and is encapsulated into photovoltaic module, the electricity that photovoltaic cell is generated
It can export on busbar, then be sent to user terminal by processing circuit, reach component power output purpose.
Common photovoltaic welding belt does not have reflecting effect, and the luminous energy being irradiated to thereon wastes, reflective photovoltaic welding belt
Have reflection function, is emitted onto light total reflection thereon to generator unit, reduces the output of generated output.
Existing reflective solder strip primary structure is based on copper core, in copper core upper surface（Light-receiving surface）Roll thin silver layer,
Lower surface（Non-illuminated surface）Tin lead layer in calendering, silver layer have special reflective texture, are then cut into required welding ruler again
Very little, although such welding can improve the output power of component, itself has the disadvantages that：1）It is expensive, due to big
The noble silver used is measured, cost is the several times of conventional welding；2）It needs to develop new welding or other is coupled technique, at
This height；3）Silver layer above copper core can not be soldered to cell backside by the welding procedure of existing solar components production line, need to be led to
The connection of other techniques is crossed, complex process is with high costs；4）Since copper core the right and left does not have coating protection, copper core straight after cutting
It connects and is contacted with the EVA in component, increase the probability that component fails in routine use；5）Reflective structure is unreasonable, reflective
Coating composition is improper, and reflective solder strip reflecting effect is undesirable, cannot form total reflection, reflective in reflective solder strip production process
Structure is not easy to reach design requirement.
Invention content
There is provided a kind of High-efficiency photovoltaic solder strips and preparation method thereof for the technical problem to be solved in the invention, general to solve
Logical photovoltaic welding belt does not have reflecting effect and reduces generated output output and existing reflective solder strip is expensive, reflective structure
The unreasonable problem for so that reflecting effect is undesirable, to improve the output of generated output.
In order to solve the above technical problems, the technical solution used in the present invention is as follows.
A kind of High-efficiency photovoltaic solder strip, including Copper base material and the conjunction that is arranged outside Copper base material is coated by air knife Tu tin system
Golden tin coating, the Copper base material are sequentially connected end to end by multiple Copper base material basic units and are formed, adjacent two Copper base materials basic unit
Between form mark point for carrying out image recognition；The Copper base material basic unit includes reflective section of Copper base material being wholely set
With Copper base material backlight section, the zigzag that cross sectional shape is isosceles trapezoidal structure is provided on the upper surface of reflective section of the Copper base material
Groove is provided with arc groove on the lower surface that reflective section of Copper base material, is provided with and cuts on the upper surface of the Copper base material backlight section
Face shape identical dentate groove two with dentate groove shape；The alloy tin coating includes applying to be located at outside dentate groove
The reflective surface tin coating of layer, painting are located at the first cell piece master that arc groove outer layer was used for and was placed on reflective section of lower section of Copper base material
Lower welding surface tin coating that grid line is welded to connect, apply be located at Copper base material backlight section upper surface for and be placed on Copper base material backlight section
The upper welding surface tin coating of the second cell back electrode welding connection of top.
Technical solution is advanced optimized, the reflective surface tin coating is the evenly distributed isosceles with more preferable reflecting effect
Triangular structure.
Technical solution is advanced optimized, the alloy tin coating includes the component of following weight ratio：Sn 60~63%、Bi
0~1%、P 0~1%、P 0~1%、GeP 0~1 %、Pb 36~37%。
Technical solution is advanced optimized, the alloy tin coating includes the component of following weight ratio：Sn 63 %, Bi
36.929 % of 0.02 %, P 0.03 %, P 0.02 %, GeP 0.001 %, Pb.
Technical solution is advanced optimized, the thickness of the reflective surface tin coating is 3 μm or less.
Technical solution is advanced optimized, the thickness of the upper welding surface tin coating is 20 μm ± 5 μm.
Technical solution is advanced optimized, the thickness of the lower welding surface tin coating is 15 μm ± 5 μm.
The production method of High-efficiency photovoltaic solder strip, 1）The copper free wire of certain specification is first pressed onto required size by rolling wheel
Oxygen-free copper stripe；2）It is basic that the die reshaping mechanism that oxygen-free copper stripe passes through on production line so that oxygen-free copper stripe forms multiple Copper base materials
Unit forms mark point between adjacent two Copper base materials basic unit, by Copper base material basic unit be divided into reflective section of Copper base material and
Copper base material backlight section, dentate groove and the edge that setting structure is formed on the reflective surface of reflective section of Copper base material are reflective tiltedly
Face forms arc groove at the back side of reflective section of reflective surface of Copper base material, is formed and reflective section of knot of Copper base material in Copper base material backlight section
The identical dentate groove of structure two；3）Leypewter after annealing, cleaning, fusing, using accurate air knife tinning stack according to
It is secondary formed on the upper surface of reflective section of Copper base material reflective surface tin coating, reflective section of Copper base material lower surface on formed under welding surface
Tin coating, Copper base material backlight section upper surface on form upper welding surface tin coating, the Copper base material backlight section back side for being not coated with tin is formed
Shady face.
As a result of above technical scheme, the invention technological progress is as follows.
It is unique, highly practical that the present invention designs, by the way that the upper surface of Copper base material is arranged to isosceles trapezoidal structure, then will be anti-
Smooth surface tin coating applies the mode on the dentate groove in reflective section of Copper base material of being located at so that reflective surface tin coating be coated with when
Time can form ideal isosceles triangular structure, meet design requirement, greatly increase reflecting effect, to effectively
Solve the problems, such as that photovoltaic welding belt reflecting effect is poor；The setting of arc groove can be in reflective solder strip production process, in arc
It forms a certain amount of coating alloy in groove to retain, to keep photovoltaic welding belt welding reliable, while arc groove structure is due to collection
Skin effect acts on the current-carrying capacity that can effectively increase welding, reduces heat waste of the welding in conduction, improves component power output；Pass through
It is provided with mark point between thinking adjacent two Copper base materials basic unit, image recognition can be carried out.
Description of the drawings
Fig. 1 is the side view of the present invention；
Fig. 2 is the vertical view of the present invention；
Fig. 3 is the sectional view along AA of Fig. 2；
Fig. 4 is the BB of Fig. 2 to sectional view；
Fig. 5 is Copper base material structural schematic diagram of the present invention.
Wherein：1, Copper base material, 2, dentate groove, 3, arc groove, 4, reflective surface tin coating, 5, lower welding surface it is tin plating
Layer, 6, upper welding surface tin coating, 7, shady face, 8, mark point, 9, reflective section of Copper base material, 10, Copper base material backlight section, 11, copper-based
Material basic unit, 12, dentate groove two.
Specific implementation mode
Below in conjunction with specific embodiment, the present invention will be described in further detail.
A kind of High-efficiency photovoltaic solder strip and preparation method thereof, in conjunction with shown in Fig. 1 to Fig. 2, including Copper base material 1 and alloy it is tin plating
Layer.
The oxygen-free copper that Copper base material 1 is double 03, the conductivity of copper is higher, and copper can reach ideal by molding die aftershaping
Angle and surface Glabrous pierce, Copper base material can form smooth reflective surface after tin plating.Copper base material 1 is by multiple copper-based
Material basic unit 11 is sequentially connected end to end composition, and mark point 8 is formed between adjacent two Copper base materials basic unit 11, and mark point 8 is used
In progress image recognition.Copper base material basic unit 11 includes reflective section 9 of Copper base material and Copper base material backlight section 10.Reflective section of Copper base material
Be provided with dentate groove 2 on 9 upper surface, the cross sectional shape of dentate groove 2 is isosceles trapezoidal structure, isosceles trapezoid it is anti-
Photo structure helps to form ideal isosceles triangular structure by Tu tin during photovoltaic welding belt Tu tin, if copper-based
What is directly formed on material is isosceles triangle, then in photovoltaic welding belt after producing Tu tin process, the isosceles triangle of formation
The isosceles triangle angle of design is not achieved, reflecting effect cannot form total reflection with regard to undesirable；Under reflective section 9 of Copper base material
It is provided with arc groove 3 on surface, the design of arc groove structure is in order in reflective solder strip production process, in arc groove
Interior a certain amount of coating alloy of formation retains, and to keep photovoltaic welding belt welding relatively reliable, while arc groove structure is due to collection
Skin effect acts on the current-carrying capacity that can effectively increase welding, reduces heat waste of the welding in conduction, improves component power output.It is copper-based
Dentate groove identical with 2 structure of dentate groove in reflective section 9 of Copper base material two is provided on the surface of material backlight section 10
12。
The plating of alloy tin coating is located on the surface of Copper base material 1, is set as specific thickness, and coating alloy adds by special
There is work specific ingredient, ingredient to contain the bismuth metal of special ratios, and the addition of bismuth metal can increase the bright of welding surface
Degree, to reinforce the reflecting effect on welding surface；Coating alloy contains the P elements of special ratios, and effect is to increase coating in heat
Mobility under molten state, keeps the flute surfaces tin layers that reflective solder strip is formed in tin plating process thin as much as possible, makes reflective
The reflective structure of design angle is formed in welding production process reliable and stablely.It is tin alloy good fluidity that the present invention uses, bright
Degree is high, can form good reflective surface.
Alloy tin coating includes the component of following weight ratio：Sn 60~63%、Bi 0~1%、P 0~1%、P 0~1%、GeP
0~1 %、Pb 36~37%.The group for the weight ratio that alloy tin coating uses in the present embodiment is divided into 63 % of Sn, Bi 0.02 %, P
36.929 % of 0.03 %, P 0.02 %, GeP 0.001 %, Pb.This composition proportion can greatly increase the welding pulling force of alloy；
Increase the brightness of alloy layer, improves reflecting effect；Increase the mobility under alloy hot melt state, makes welding surface alloy coating
Uniform ground increases reflecting effect.
Alloy tin coating includes reflective surface tin coating 4, lower welding surface tin coating 5 and upper welding surface tin coating 6.Reflective surface plates
Tin layers 4, which apply, is located at the outer layer of dentate groove 2, and thickness is 3 μm hereinafter, being the evenly distributed isosceles triangular structure that falls, reflective
Angle design is reasonable, to being irradiated to luminous energy formation total reflection thereon, has more preferable reflecting effect；Lower welding surface tin coating 5 applies
Be located at the outer layer of arc groove 3, thickness is 15 μm ± 5 μm, for the first cell piece for being placed on reflective section 9 lower section of Copper base material
Main gate line is welded to connect, and can effectively improve the conductivity of welding；The upper painting of welding surface tin coating 6 is located in Copper base material backlight section 10
On surface, thickness is 20 μm ± 5 μm, for connecting with the second cell back electrode welding for being placed on 10 top of Copper base material backlight section
It connects.
The sectional view that reflective section 9 of Copper base material is as shown in figure 3, include regularly arranged 3 μm reflective surface tin coatings 4 below, instead
Smooth surface tin coating 4 is the groove of falling isosceles triangle, and the lower section of reflective surface tin coating 4 is Copper base material, and the lower section of Copper base material is 15 μm
± 5 μm of lower welding surface tin coating.
The sectional view of Copper base material backlight section 10 is provided with isosceles trapezoid as shown in figure 4, including Copper base material above Copper base material
The upper welding surface tin coating for being set as that top is arc shape is filled up in the dentate groove two of structure shape, the top of dentate groove two
6, it is arranged to the shady face of concave groove below Copper base material.
Copper base material molding of the present invention is molded by special die, as shown in figure 5, then passing through special air knife Tu tin system
System is formed with groove reflective surface, the welding surface of the spaced arrangement of certain length, and after Tu tin, the base material of certain length is uniform
The isosceles trapezoid of falling of arrangement becomes evenly distributed to isosceles triangle groove reflective surface section, the label for image recognition
Point fills up leypewter groove welding section for welding.The tin thickness of each section is controlled by air knife Tu tin system, is made anti-
Best reflecting angle, the welding surface that light groove reaches design reach good welding effect, concave surface reaches the radian of design to carry
High conductivity.For base material copper using the oxygen-free copper bar of crystal grain refinement, wire drawing coolant liquid uses oil-free wire drawing liquid, make by
Formed in mould welding substrate surface Glabrous thorn is molded and regular reaches design shape.The special coating alloy used, stream
Dynamic property is good, brightness is high, and reflective groove is enable to reach the reflective inverted triangular structure of design, and reflecting surface smooth light when tin plating
Bright reflecting effect is good.
There is the angle that the efficient welding inverted triangular structure has total reflection effect, the sunlight for making to be irradiated to thereon to have
Effect is reflected into generator unit, improves the generated output of component；The concave structure at the welding back side plays the role of kelvin effect,
The conductivity for improving welding reduces the loss of conduction of component, improves the power output of component, is passed through on the component of 270W
On probation, which can make component power be lifted at 4--6 watts.
Present invention life is in production process, and reflective structure molding is simple, and the formation system service life is significantly larger than previous calendering formation
Mechanism.
The production method of High-efficiency photovoltaic solder strip is as follows.
1）The copper free wire of certain specification is first pressed onto to the oxygen-free copper stripe of required size by rolling wheel.
2）It is substantially single that the die reshaping mechanism that oxygen-free copper stripe passes through on production line so that oxygen-free copper stripe forms multiple Copper base materials
Member 11 forms mark point 8 between adjacent two Copper base materials basic unit 11, it is reflective that Copper base material basic unit 11 is divided into Copper base material
Section 9 and Copper base material backlight section 10 forms dentate groove 2 and the side of setting structure on the reflective surface of reflective section 9 of Copper base material
The reflective inclined-plane of edge forms arc groove 3, in the formation of Copper base material backlight section 10 and copper at the back side of reflective section of 9 reflective surfaces of Copper base material
The identical dentate groove of reflective section of 9 structures of base material 2 12.
3）Leypewter is reflective in Copper base material successively using accurate air knife tinning stack after annealing, cleaning, fusing
Formed on the upper surface of section 9 reflective surface tin coating 4, reflective section 9 of Copper base material lower surface on form lower welding surface tin coating 5, copper
Upper welding surface tin coating 6 is formed on the upper surface of base material backlight section 10,10 back side of Copper base material backlight section for being not coated with tin forms backlight
Face 7；4 thickness of reflective surface tin coating of formation is 3 μm hereinafter, the thickness of upper welding surface tin coating 6 is 20 μm ± 5 μm, lower welding
The thickness of face tin coating 5 is 15 μm ± 5 μm.
In establishment of component, the main grid of lower welding surface tin coating and the first cell piece being placed below reflective section of Copper base material
Wire bonding connects, and the back electrode of upper welding surface tin coating and the second cell piece of the side of being placed on it is welded to connect, successively so
Component battery strings are made in periodic weld.
Claims (8)
1. a kind of High-efficiency photovoltaic solder strip, including Copper base material（1）And it is arranged in Copper base material by air knife Tu tin system cladding（1）Outside
Alloy tin coating, it is characterised in that：The Copper base material（1）By multiple Copper base material basic units（11）It is sequentially connected end to end group
At adjacent two Copper base materials basic unit（11）Between form mark point for carrying out image recognition（8）；The Copper base material is basic
Unit（11）Reflective section of Copper base material including being wholely set（9）With Copper base material backlight section（10）, reflective section of the Copper base material（9）'s
The dentate groove that cross sectional shape is isosceles trapezoidal structure is provided on upper surface（2）, reflective section of Copper base material（9）Lower surface on
It is provided with arc groove（3）, the Copper base material backlight section（10）Upper surface on be provided with the same dentate groove of cross sectional shape（2）
The identical dentate groove of shape two（12）；
The alloy tin coating includes applying to be located at dentate groove（2）The reflective surface tin coating of outer layer（4）, apply be located at arc groove
（3）Outer layer is used for and is placed on reflective section of Copper base material（9）The lower welding surface plating that first cell piece main gate line of lower section is welded to connect
Tin layers（5）, apply be located at Copper base material backlight section（10）Upper surface is used for and is placed on Copper base material backlight section（10）Second electricity of top
The upper welding surface tin coating that pond piece back electrode is welded to connect（6）.
2. a kind of High-efficiency photovoltaic solder strip according to claim 1, it is characterised in that：The reflective surface tin coating（4）It is equal
Isosceles triangular structure of the even arrangement with more preferable reflecting effect.
3. a kind of High-efficiency photovoltaic solder strip according to claim 1, which is characterized in that the alloy tin coating includes following heavy
The component of amount ratio：Sn 60~63%、Bi 0~1%、P 0~1%、P 0~1%、GeP 0~1 %、Pb 36~37%.
4. a kind of High-efficiency photovoltaic solder strip according to claim 3, which is characterized in that the alloy tin coating includes following heavy
The component of amount ratio：36.929 % of Sn 63 %, Bi 0.02 %, P 0.03 %, P 0.02 %, GeP 0.001 %, Pb.
5. a kind of High-efficiency photovoltaic solder strip according to claim 1, it is characterised in that：The reflective surface tin coating（4）Thickness
Degree is 3 μm or less.
6. a kind of High-efficiency photovoltaic solder strip according to claim 1, it is characterised in that：The upper welding surface tin coating（6）'s
Thickness is 20 μm ± 5 μm.
7. a kind of High-efficiency photovoltaic solder strip according to claim 1, it is characterised in that：The lower welding surface tin coating（5）'s
Thickness is 15 μm ± 5 μm.
8. a kind of production method of High-efficiency photovoltaic solder strip as described in claim 1 to 7 any one, it is characterised in that：
1）The copper free wire of certain specification is first pressed onto to the oxygen-free copper stripe of required size by rolling wheel；
2）Oxygen-free copper stripe makes oxygen-free copper stripe form multiple Copper base material basic units by the die reshaping mechanism on production line
（11）, adjacent two Copper base materials basic unit（11）Between form mark point（8）, by Copper base material basic unit（11）It is divided into copper-based
Reflective section of material（9）With Copper base material backlight section（10）, in reflective section of Copper base material（9）Reflective surface on formed setting structure zigzag
Groove（2）And the reflective inclined-plane in edge, in reflective section of Copper base material（9）The back side of reflective surface forms arc groove（3）, in Copper base material
Backlight section（10）It is formed and reflective section of Copper base material（9）The identical dentate groove of structure two（12）；
3）Leypewter is after annealing, cleaning, fusing, using accurate air knife tinning stack successively in reflective section of Copper base material
（9）Upper surface on formed reflective surface tin coating（4）, reflective section of Copper base material（9）Lower surface on form lower welding surface tin coating
（5）, Copper base material backlight section（10）Upper surface on form upper welding surface tin coating（6）, it is not coated with the Copper base material backlight section of tin（10）
The back side forms shady face（7）.
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