CN108427492A - Storage device radiator structure - Google Patents
Storage device radiator structure Download PDFInfo
- Publication number
- CN108427492A CN108427492A CN201810449480.8A CN201810449480A CN108427492A CN 108427492 A CN108427492 A CN 108427492A CN 201810449480 A CN201810449480 A CN 201810449480A CN 108427492 A CN108427492 A CN 108427492A
- Authority
- CN
- China
- Prior art keywords
- accommodating space
- casing
- air
- storage device
- air inlet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005855 radiation Effects 0.000 claims abstract description 44
- 125000006850 spacer group Chemical group 0.000 claims description 18
- 238000005266 casting Methods 0.000 claims description 7
- 230000017525 heat dissipation Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 238000005265 energy consumption Methods 0.000 description 5
- 238000005192 partition Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 241000208340 Araliaceae Species 0.000 description 2
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 2
- 235000003140 Panax quinquefolius Nutrition 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011469 building brick Substances 0.000 description 2
- 235000008434 ginseng Nutrition 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 241000883990 Flabellum Species 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 238000005138 cryopreservation Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention relates to a kind of storage device radiator structure, including：One casing, casing internal is separated by central baffle as the first accommodating space and the second accommodating space, the multiple air inlets of downside setting of casing, upside one first exhaust of the setting outlet of casing, and a side of casing is arranged a second exhaust and exports, and a radiator fan is arranged in the second accommodating space；When storage device is operated with a heat loss through convection pattern, fan is not actuated, and is acted on by thermal convection current so that the air of casing internal is exported from first exhaust and is discharged, and extraneous air enters casing internal via air inlet；When storage device is radiated with a forced heat radiation pattern, radiator fan starts to be discharged with generating a forced heat radiation air-flow and being exported via second exhaust, and extraneous air enters casing internal via air inlet and first exhaust outlet.
Description
Technical field
The present invention relates to a kind of storage device radiator structures, particularly relate to a kind of storage device for information storage applications
Radiator structure.
Background technology
The storage device of the types such as existing network storage equipment (NAS), micro server is due to processing function and fortune
The requirement of calculation ability is higher and higher, and must use the stronger processor of operational capability or control chip, therefore also results in storage
The challenge of cryopreservation device radiator structure.
The radiator structure of existing storage device is broadly divided into two kinds of passive heat radiation structure and active radiator structure.Quilt
Dynamic formula radiator structure is by thermal convection principle, and hot-air when storage device being allowed to operate in casing is because of thermal convection current effect discharge
On the outside of to casing, and the cold air free convection outside casing is allowed to enter in casing.And active radiator structure is then by dissipating
Hot-air fan generates radiating airflow, and the temperature of electronic building brick in casing is reduced by radiating airflow.
Active forced heat radiation structure because having a preferable radiating efficiency, therefore suitable for it is existing using high power or
Operational capability stronger processing chip or the storage device for controlling chip use, however because radiator fan must consume electric power, because
This increases the energy consumption of storage device.
Although passive heat radiation structure is without the use of fan, and it can achieve the purpose that saving energy consumption, however passive type
The heat dissipation effect of radiator structure is limited, therefore is not suitable for using the heat dissipation purposes in high power electronic component, so that using quilt
The storage device of dynamic formula radiator structure can only use the processor and control chip of low-power.
The disadvantage in existing storage device radiator structure use is caused due to above, therefore how to be changed by structure
It is good, to solve the problems, such as aforementioned items, it has also become this cause one of the important topic to be solved.
Invention content
Main purpose of the present invention is that saving energy consumption can be reached under the premise of taking into account heat dissipation by providing one kind
The storage device radiator structure of purpose.
In order to solve the above-mentioned technical problem, according to a wherein embodiment of the invention, a kind of storage device radiator structure is provided,
Including：One storage device, the storage device have a casing, and be placed in the casing a circuit board,
Multiple disk modules and a radiator fan；Wherein, the casing has opposite upside and downside, opposite front side and rear side,
And opposite left side and right side, the casing can define orthogonal first axis and second axially, the casing
Upside and downside are located at the casing in the opposite both sides of the first axis, and position is distinguished on left side and the right side of the casing
In the casing in the described second axially opposing both sides, front side and the rear side of the casing be located at the casing and institute
State the opposite sides of first axis and the second axially vertical direction；The casing includes a central baffle, and the central baffle is situated between
Between the front side and rear side of the casing, the casing internal is partitioned by one first accommodating space by the central baffle
And one second accommodating space, multiple disk modules are placed in first accommodating space, the circuit board is placed in
In second accommodating space, and the radiator fan is set in second accommodating space and is located at the circuit board in institute
State second axial a side；At least one first air inlet and at least one second air inlet are provided on the downside of the casing, until
Few first air inlet is connected to first accommodating space, at least 1 the described second accommodating sky of the second air inlet connection
Between；Multiple ventilative through holes are arranged in the central baffle, with so that first accommodating space and the second accommodating space energy
Enough it is interconnected by multiple ventilative through holes；One first exhaust of setting exports on the upside of the casing, and the first exhaust goes out
Mouth is connected to first accommodating space；The casing position is set in second axis direction relative to a side of the radiator fan
It sets a second exhaust to export, the second accommodating space described in the second exhaust outlet；The storage device is configured to
It is operated with a heat loss through convection pattern and a forced heat radiation pattern, when the storage device is operated with the heat loss through convection pattern
When, the radiator fan is inoperative, and the air in second accommodating space is passed to described via multiple ventilative through holes
In first accommodating space, and the first exhaust exports to form sky inside first accommodating space and second accommodating space
The passing away of gas, and first air inlet and second air inlet are respectively formed first accommodating space and described
The inlet channel of two accommodating spaces；When the storage device is operated with the forced heat radiation pattern, the radiator fan starts,
And it generates one and is discharged from the radiator fan by the circuit board and second exhaust outlet and second air inlet
Forced heat radiation air-flow, and the air in first accommodating space is by the radiator fan and the forced heat radiation air-flow
The effect of suction, and being entered in second accommodating space from multiple ventilative through holes, and first exhaust outlet with
And first air inlet forms the inlet channel of first accommodating space.
One embodiment of the present invention, wherein the casing further includes a lower housing, a first shell and a second shell,
The wherein described lower housing is located at the downside of the casing, the first shell and the second shell be located at the center every
The opposite two sides of plate, the first shell, the second shell close to one end of the lower housing respectively with the lower housing
Linking, the space between the first shell and the central baffle form first accommodating space, the second shell and
Space between the central baffle forms second accommodating space.
One embodiment of the present invention, wherein the upside of the first shell forms a top plate, the top plate is covered in institute
The upside for stating the first accommodating space and second accommodating space, to form the upside of the casing；The first exhaust goes out
Mouth is set to position of the second shell on the upside of the casing；The upside of the central baffle forms a upper spacer, institute
The upside that upper spacer is shielded in second accommodating space is stated, the height of the upper spacer is less than the height of first exhaust outlet
Degree, and keep a spacing between the top surface of the upper spacer and the bottom surface of the top plate and make top surface and the institute of the upper spacer
State the gap that formation one is connected to first accommodating space and the first exhaust exports between the bottom surface of top plate.
One embodiment of the present invention is set wherein having an at least pyrotoxin in the circuit board on the pyrotoxin
Set a radiating fin；The pyrotoxin and the radiating fin of the circuit board are arranged in the stream of the forced heat radiation air-flow
On dynamic path.
One embodiment of the present invention, wherein second accommodating space is located at the flow path of the forced heat radiation air-flow
An at least port plate is arranged in position on the upside of the casing, and institute can not be diffused into limit the forced heat radiation air-flow
It states in the second accommodating space in the space above the port plate.
One embodiment of the present invention, the plurality of ventilative through hole include it is multiple be set to it is right in the central baffle
The first ventilative through hole and multiple central baffles that are set to for answering the radiator fan position correspond to the circuit board position
Second ventilative through hole.
One embodiment of the present invention, wherein the radiator fan includes：One blower-casting, at least an air inlet notch and
An at least exhaust outlet, wherein the exhaust outlet is located at the direction that the blower-casting is exported towards the second exhaust.
The position of one embodiment of the present invention, plurality of first ventilative through hole corresponds to the institute of the radiator fan
State air inlet gap position.
One embodiment of the present invention, wherein first air inlet and second air inlet be respectively arranged at it is described under
One bottom surface of shell, and the bottom surface of the lower housing also has a lug boss, the height of the lug boss bottom surface is less than described the
The height of one air inlet and second air inlet, and make the casing when being positioned on a desktop or a planar object, energy
The desktop or the planar object are enough contacted by the lug boss, and make first air inlet and described second into
A spacing is kept between gas port and the desktop or the planar object, so as to make first air inlet and described second into
Gas port is kept unimpeded.
The method have the advantage is capable of the load conditions of foundation storage device or operation temperature to determine to use nature
Heat loss through convection pattern or forced heat radiation pattern operation, and can by with free convection preferentially add intelligent fan supplemented by it is energy saving
Combination Design effectively achievees the purpose that power saving.
For the enabled feature and technology contents for being further understood that the present invention, please refer to below in connection with the present invention specifically
Bright and attached drawing, however appended attached drawing is only for reference and description, the person of being not intended to limit the present invention.
Description of the drawings
Fig. 1 is the three-dimensional combination figure of storage device radiator structure of the present invention.
Fig. 2 is storage device radiator structure of the present invention three-dimensional combination figure shown in another angle.
Fig. 3 is the stereogram exploded view of storage device radiator structure of the present invention.
Fig. 4 is the part isometric exploded view under the first shell disassembly status of storage device radiator structure of the present invention.
Fig. 5 is the part isometric exploded view under the second shell disassembly status of storage device radiator structure of the present invention.
Fig. 6 be storage device radiator structure of the present invention under heat loss through convection pattern, taken from the second air inlet position stand
Body combination section.
Fig. 7 be storage device radiator structure of the present invention under heat loss through convection pattern, taken from third air inlet position stand
Body combination section.
Fig. 8 be storage device radiator structure of the present invention under forced heat radiation pattern, taken from the second air inlet position stand
Body combination section.
Fig. 9 is storage device radiator structure of the present invention using the three-dimensional part section under forced heat radiation mode operation state
Figure.
Specific implementation mode
It please refers to Fig.1 to shown in Fig. 9, being the embodiment of the present invention, the present invention provides a kind of heat dissipation knot of storage device
Structure.It need to first illustrate, the correlated measure mentioned by the present embodiment respective figure and external form, only be used for specifically describing the present invention
Embodiment, in order to understand present disclosure, rather than for limiting to protection scope of the present invention.
As shown in Figure 1 to Figure 3, it is a storage device 1 for using radiator structure of the present invention.As shown in figure 3, the storage dress
Setting 1 includes：One casing 10, and be placed in the casing 10 multiple disk modules 20, a circuit board 30 and one heat dissipation
Fan 40.
As shown in Figure 1, the casing 10 has opposite a upside and downside, opposite left side and right side and opposite
Front side and rear side, for ease of illustration for the sake of, the casing 10 can define the axial directions of a first axis D1 and one second D2, described
First axis D1 and the second axial direction D2 are mutually perpendicular to.And as shown, the upside of the casing 10 is located at downside
The both sides opposite on the first axis D1 of the casing 10, left side and the right side of the casing 10 are located at the casing
10 both sides opposite on the second axial direction D2, and the front side of the casing 10 and rear side be located at the casing 10 with
Opposite sides on the perpendicular directions the axial direction D2 of the first axis D1 and second.
In the present embodiment, the casing 10 includes a first shell 11, a second shell 12, a lower housing 13 and a center
Partition board 14.The wherein described lower housing 13 is located at the downside of the casing 10, the central baffle 14 along with the first axis
The axial directions of D1 and second direction parallel D2 is set to the position inside the casing 10 between the front side and rear side of casing 10,
10 inner space of the casing one first accommodating space C1 (ginseng Fig. 4) and one second is partitioned by the central baffle 14 to hold
Empty a C2 (ginseng Fig. 5).
As shown in Figures 4 to 6, upside one top plate 111 of formation of the first shell 11 works as institute as shown in Figure 1 and Figure 6
It states after casing 10 is completed, the top plate 111 of first shell 11 can form the upside of casing 10, and it is accommodating to be covered in first
The top of space C1 and the second accommodating space C2.The first shell 11 and the second shell 12 be located at it is described in
Entreat the opposite two sides of partition board 14, the lower side of the first shell 11 and the second shell 12 respectively with the lower housing 13
Upper side edge be mutually linked.As shown in Fig. 3, Fig. 4 and Fig. 6, in the present embodiment, the first shell 11 is removably arranged
Correspond to the side of the first accommodating space C1 in casing 10, and after casing 10 is completed, 11 He of the first shell
Space between the central baffle 14 forms the first accommodating space C1.The central baffle 14 corresponds to described first and holds
The one side for emptying a C1 forms multiple disk slots 142, and in the present embodiment, and each disk module 20 is respectively provided with one
Disk bracket 22, respectively for housing a disk 21, each disk bracket 22 is able in being inserted in each disk bracket 22
In the disk slot 142 for entreating partition board 14, and to be able to an accommodating disk module in each disk slot 142
20, so as to being arranged multiple disk modules 20 in the first accommodating space C1.
And as shown in Fig. 3, Fig. 5 and Fig. 6, in the present embodiment, second shell 12 is removably set to the casing
10 correspond to the side of the second accommodating space C2, after casing 10 is completed, the second shell 12 and the center every
Space between plate 14 forms the second accommodating space C2.The central baffle 14 corresponds to the one of the second accommodating space C2
Side forms a mounting plane, with for the circuit board 30 and the radiator fan 40, to be set to the central baffle 14 right
The one side for answering the second accommodating space C2, so as to so that it is accommodating that circuit board 30 and the radiator fan 40 are accommodated in second
In the C2 of space.
There is an at least pyrotoxin 31, and in a radiating fin is arranged on the pyrotoxin 31 in the circuit board 30
32.And multiple attachment devices 33 are additionally provided in the circuit board 30, as shown in Figures 1 and 3, the casing 10 is under
The position of side is provided with an inscription plate 131, the position setting for engraving each attachment device 33 of corresponding circuits substrate 30 on plate 131
There are multiple openings, after the storage device 1 is completed, multiple attachment devices 33 are able to from the inscription plate 131
Multiple openings be exposed to the outside of casing 10.
More particularly, in the embodiment, the circuit board 30 is the mainboard of the storage device 1, the circuit base
Pyrotoxin 31 on plate 30 can be CPU, control the electronic building brick of the easy fever such as chip or memory, and multiple connection dresses
It is respectively network connector, electric connector or for the attachment devices such as USB connector to set 33.
For achieve the purpose that for inside casing 10 disk module 20 and circuit board 30 radiate, under the casing 10
Side is provided at least one first air inlet 15 and at least one second air inlet 16, and an at least first exhaust is arranged in the upside of casing 10
Outlet 17, and in casing 10 18 are exported along a side setting at least second exhaust of the second axial direction D2.
As shown in Figures 2 and 6, first air inlet 15 is set to lower housing 13 close to the first accommodating space C1
Downside, and be connected to the first accommodating space C1.Second air inlet 16 is set to the lower housing 13 close to described
The downside of two accommodating space C2, and it is connected to the second accommodating space C2.And in the embodiment, the bottom surface of the lower housing 13
Also there is a lug boss 132, the height of the bottom surface of the lug boss 132 to be less than first air inlet 15 and second air inlet
Mouthfuls 16 height, and when the casing 10 is positioned in desktop or other planes, desktop can be contacted via lug boss 132
Or holding plane, and make the flat of the first air inlet 15 and the second air inlet 16 and the contacts-side-down of desktop or the casing 10
A spacing is kept between the object of face, so as to making the first air inlet 15 and the second air inlet 16 keep unimpeded.
As shown in Fig. 3, Fig. 6 and Fig. 7, in the embodiment, the first exhaust outlet 17 is set to the second shell 12
Position close to 10 upside of the casing, and the upside of the central baffle 14 forms a upper spacer 141, the upper spacer
141 is generally vertical with the top of central baffle 14, and extends towards the direction of the medial surface of second shell 12, and makes institute
State the upside that upper spacer 141 is shielded in the second accommodating space C2.And the height of the upper spacer 141 is described less than being set to
The height of the first exhaust outlet 17 of the upside of second shell 12, and the top surface of the upper spacer 141 and the top plate 111
A spacing is kept between bottom surface, and to form a gap between the top surface and the bottom surface of the top plate of the upper spacer 141.Institute
It states the gap between upper spacer 141 and top plate 111 and is connected to the first accommodating space C1 and first exhaust outlet 17, therefore
Enable air in the first accommodating space C1 via between upper spacer 141 and top plate 111 gap and the first row
Gas outlet 17 is communicated to the outside of casing 10.
As shown in Fig. 3 and Fig. 9, in the embodiment, radiator fan 40 is integrally fixed at central baffle 14 to be held towards described second
The one side of a C2 is emptied, and is arranged in the second accommodating space C2 and is located at the circuit board 30 on the second axial direction D2
A side.The second exhaust outlet 18 is set to second shell 12 on the second axial direction D2 relative to the radiation air
The side of fan 40, in the present embodiment, the second shell 12 forms the structures of paliform in second exhaust outlet 18, and the
A removable cover 181 is arranged in the opening of two air exits 18, under 18 unused states of second exhaust outlet, the removable cover
Plate 181 can be covered in the opening of second exhaust outlet 18, and casing is entered from second exhaust outlet 18 with to avoid sundries
10 inside.
As shown in Fig. 3, Fig. 5 and Fig. 9, in the embodiment, radiator fan 40 includes a blower-casting 41, the blower-casting
Can accommodate the components such as flabellum and motor inside 41, blower-casting 41 towards the central baffle 41 and relative to the center every
An air inlet notch 42 is respectively set in the both sides of plate 41, and the one side of blower-casting 41 towards second exhaust outlet 18 has one
Air outlet 43.When the radiator fan 40 is assembled in 10 inside of casing, the air outlet 43 is exported towards the second exhaust
18 direction, and the air outlet 43 of the radiator fan 40, the pyrotoxin 31, radiating fin 32 and the second exhaust
Outlet 18 is arranged at 10 inside of the casing close on the position of height, and makes the radiator fan 40, the pyrotoxin
31, radiating fin 32 and second exhaust outlet 18 are jointly along sequential on the second axial direction D2.
As shown in figure 9, when the radiator fan 40 starts, air can be drawn into heat dissipation from the air inlet notch 42
The center of the blade (not shown) of fan 40, then sent out air from the air outlet 43 by the blade of radiator fan 40,
And formed a forced heat radiation air-flow, and the forced heat radiation air-flow can first pass through the circuit board 30, the pyrotoxin 31 and
The radiating fin 32, is then discharged to the outside of casing 10 from second exhaust outlet 18 again, and makes the heat transmission gas
Stream can be reducing the temperature of circuit board 30 and pyrotoxin 31.
As shown in figure 9, to achieve the purpose that the forced heat radiation air-flow for guiding radiator fan 40 to generate, the present invention hold second
The flow path for emptying the forced heat radiation air-flow that a C2 is internally located at the generation of the radiator fan 40 is leaned in the first axis D1
The position of 10 upside of the nearly casing is arranged an at least port plate 121, in the present embodiment, 121 one of the port plate at
Type is set to the medial surface of second shell 12, and is prolonged by the direction level of the medial surface of second shell 12 towards central baffle 14
It stretches.The height of the port plate 121 is located at 18 top of air outlet 43 and second exhaust outlet of the radiator fan 40
Position so that the position of the port plate 121 be located at radiator fan 40 generation forced heat radiation air-flow flowing road
Position of the diameter on the upside of the casing.By the port plate 121, a gas channel can be defined, and described in limitation
The forced heat radiation air-flow that the air outlet 43 of radiator fan 40 is discharged, which does not diffuse into, is located at the stream in the second accommodating space C2
In the space of 121 top of road partition board, forced heat radiation Diffusion of gas stream is avoided so as to reaching, and improve the purpose of heat dissipation effect.
As shown in Fig. 3, Fig. 6 and Fig. 7, to enable the air phase in the first accommodating space C1 and the second accommodating space C2
It mutually circulates, the central baffle 14 is provided with multiple ventilative through holes 19 in the embodiment.More particularly, in the embodiment,
Multiple ventilative through holes 19 are set to the air inlet notch 42 that the radiator fan 40 is corresponded in central baffle 14 including multiple
Multiple first ventilative through holes 191 and multiple be set to set correspond to the more of 121 top of the port plate in central baffle 14
A second ventilative through hole 192.
The storage device 1 of the present invention is configured to operate with a heat loss through convection pattern, or with a forced heat radiation mould
Formula operates.More particularly, storage device 10 of the invention can be in the circuit board 30, or in the first accommodating space
Temperature detecting component is set in C1 and the second accommodating space C2, by detecting the circuit board 30 and the disk module 20
The mode of operation temperature determine to operate using the heat loss through convection pattern or forced heat radiation pattern.
When storage device 1 of the present invention is operated with the heat loss through convection pattern, dissipated by the principle of air thermal convection current
Heat, therefore the radiator fan 40 does not start, and can achieve the purpose that save energy consumption, and it is suitable for storage device 1
In the standby mode, energy saver mode or low-load state and temperature use in the state of being less than a critical-temperature.When the storage fills
It is to generate forced heat radiation air-flow by the radiator fan 40 to radiate when setting 1 and being operated with the forced heat radiation pattern, and energy
Enough there is higher radiating efficiency, therefore be suitable for storage device 1 and the stagnation temperature is higher than with high load condition or operation temperature
It is used in the state of degree.
As shown in FIG. 6 and 7, when the storage device 1 of the present invention is operated with heat loss through convection pattern, the radiator fan 40
Inoperative, the air in the first accommodating space C1 can absorb the temperature of the disk module 20 and due to thermal convection current acts on
The outside of the casing 10 is flow to from first exhaust outlet 17, and the air in the second accommodating space C2 can be inhaled
Receive the temperature of the circuit board 30 and pyrotoxin 31, and due to thermal convection current acts on from multiple first ventilative through holes 191 or
Second ventilative through hole 192 is flow in the first accommodating space C1, then is discharged to via first exhaust outlet 17 described
The outside of casing 10.And the cold air outside the casing 10 because thermal convection current act on respectively from first air inlet 15 and described in
Second air inlet 16 is inhaled into the first accommodating space C1 and the second accommodating space C2, and make described first into
Gas port 15 and second air inlet 16 are respectively formed the air inlet of the first accommodating space C1 and the second accommodating space C2
Channel.
As can be seen from figures 8 and 9, when the storage device 1 is operated with forced heat radiation pattern, the radiator fan 40 starts
To generate the forced heat radiation air-flow, and the forced heat radiation air-flow in the second accommodating space C2 along described second
Axial D2 from second exhaust outlet 18 by being discharged again after the circuit board 30 and pyrotoxin 31 and radiating fin 32
To the outside of the casing 10, and the forced heat radiation air-flow of some can be discharged to from the second air inlet 16 of 10 lower section of casing
The outside of casing 10.
As shown in figure 8, after the radiator fan 40 starts, the air in the first accommodating space C1 is dissipated by described
The effect of 40 blade suction of Hot-air fan, and can be inhaled into from multiple first ventilative through holes 191, the second ventilative through hole 192
Into the second accommodating space C2, and the air outside casing 10 is respectively via first air inlet 15 and described first
Air exit 17 is inhaled into the first accommodating space C1.
Therefore when forced heat radiation pattern operate, radiating airflow is not discharged from first exhaust outlet 17, but changes with the
Two air exits 18 and second air inlet 16 are discharged to the outside of casing 10, and the cold air outside casing 10 is with the
One air exit 17 and the first air inlet 15 pass through radiator fan 40 as the inlet channel into the first accommodating space C1
Suction air is drawn into via the first ventilative through hole 191 or the second ventilative through hole 192 in the second accommodating space C2 again.
The advantageous effect of storage device radiator structure of the present invention, essentially consisting in the storage device 1 can be standby, low negative
It carries or temperature in the state of a critical-temperature by air thermal convection principle less than being radiated, energy consumption is saved to reach
Purpose, and operated with high load condition in storage device 1, and temperature starts radiation air higher than in the state of critical-temperature
Fan 40 changes with forced heat radiation mode operation, therefore achievees the purpose that improve heat dissipation effect.Therefore technology through the invention, can
Suitable radiating mode is selected in load and state of temperature according to storage device 1, and can be by preferentially being added with free convection
Energy-saving design supplemented by wisdom fan, effectively achievees the purpose that power saving.
The present invention the foregoing is merely the present invention preferable possible embodiments, it is non-thus limitation the present invention protection model
It encloses, therefore every equivalence techniques variation done with description of the invention and accompanying drawing content, it is both contained in the protection model of the present invention
In enclosing.
Claims (10)
1. a kind of storage device radiator structure, which is characterized in that including：
One storage device, the storage device have a casing, and be placed in the casing a circuit board, multiple magnetic
Disk module and a radiator fan；
Wherein, the casing has opposite upside and downside, opposite front side and rear side and opposite left side and right side,
The casing can define orthogonal first axis and second axial, and upside and the downside of the casing are located at described
Casing both sides opposite in the first axis, left side and the right side of the casing are located at the casing described second
Opposite both sides in axial direction, the front side of the casing and rear side be located at the casing with the first axis and the second axis
Opposite sides in vertical direction；
The casing includes a central baffle, and the central baffle is between the front side and rear side of the casing, by described
The casing internal is partitioned into one first accommodating space and one second accommodating space by central baffle, and multiple disk modules hold
It is placed in first accommodating space, the circuit board is placed in second accommodating space, and the radiator fan is set
It is placed in second accommodating space and is located at a side of the circuit board in second axial direction；
At least one first air inlet and at least one second air inlet, at least 1 first air inlet are provided on the downside of the casing
Mouth is connected to first accommodating space, and at least 1 second air inlet is connected to second accommodating space；
Multiple ventilative through holes are arranged in the central baffle, with so that first accommodating space and the second accommodating space energy
Enough it is interconnected by multiple ventilative through holes；
One first exhaust of setting exports on the upside of the casing, the first accommodating space described in the first exhaust outlet；It is described
Casing position described second axially with respect to the radiator fan a side be arranged a second exhaust export, the second row
Second accommodating space described in gas outlet；
The storage device is configured to operate with a heat loss through convection pattern and a forced heat radiation pattern, when the storage fills
It sets when being operated with the heat loss through convection pattern, the radiator fan is inoperative, and the air in second accommodating space is via more
A ventilative through hole is passed in first accommodating space, and the first exhaust exports to form first accommodating space
With the passing away of the second accommodating space inner air, and first air inlet and second air inlet are respectively formed
The inlet channel of first accommodating space and second accommodating space；
When the storage device is operated with the forced heat radiation pattern, the radiator fan starts, and generates one and dissipated from described
Hot-air fan exports the forced heat radiation air-flow with second air inlet discharge by the circuit board and in the second exhaust,
And the air in first accommodating space is acted on by the radiator fan and the forced heat radiation air-flow suction, and from
Multiple ventilative through holes enter in second accommodating space, and first exhaust outlet and first air inlet
Form the inlet channel of first accommodating space.
2. storage device radiator structure as described in claim 1, which is characterized in that the casing further includes a lower housing, one
First shell and a second shell, wherein the lower housing is located at the downside of the casing, the first shell and described second
Shell is located at the opposite two sides of the central baffle, and the first shell, the second shell are close to the lower housing
One end respectively with the lower housing be connected, the space between the first shell and the central baffle formed it is described first hold
Between emptying, the space between the second shell and the central baffle forms second accommodating space.
3. storage device radiator structure as claimed in claim 2, which is characterized in that the upside of the first shell forms a top
Plate, the top plate are covered in the upside of first accommodating space and second accommodating space, to form the casing
Upside；The first exhaust outlet is set to position of the second shell on the upside of the casing；The central baffle
Upside forms a upper spacer, and the upper spacer is shielded in the upside of second accommodating space, and the height of the upper spacer is less than
The height of the first exhaust outlet, and keep a spacing between the top surface of the upper spacer and the bottom surface of the top plate and make
One is formed between the top surface of the upper spacer and the bottom surface of the top plate is connected to first accommodating space and the first exhaust
The gap of outlet.
4. storage device radiator structure as described in claim 1, which is characterized in that at least one hair in the circuit board
A radiating fin is arranged on the pyrotoxin in heat source；The pyrotoxin and the radiating fin of the circuit board are arranged in
On the flow path of the forced heat radiation air-flow.
5. storage device radiator structure as claimed in claim 4, which is characterized in that second accommodating space is located at described strong
An at least port plate is arranged in position of the flow path of radiating airflow processed on the upside of the casing, to limit the pressure
Radiating airflow can not be diffused into second accommodating space in the space above the port plate.
6. storage device radiator structure as claimed in claim 5, which is characterized in that multiple ventilative through holes include multiple set
It is placed in the central baffle the first ventilative through hole for corresponding to the radiator fan position and multiple is set to central baffle pair
Answer the second ventilative through hole of the circuit board position.
7. storage device radiator structure as claimed in claim 6, which is characterized in that the radiator fan includes：One fan hub
Body, at least an air inlet notch and an at least exhaust outlet, wherein the exhaust outlet is located at the blower-casting towards described second
The direction of air exit.
8. storage device radiator structure as claimed in claim 7, which is characterized in that the position of multiple first ventilative through holes
The air inlet gap position of the corresponding radiator fan.
9. storage device radiator structure as claimed in claim 2, which is characterized in that first air inlet and described second into
Gas port is respectively arranged at a bottom surface of the lower housing, and the bottom surface of the lower housing also has a lug boss, the lug boss
The height of bottom surface is less than the height of first air inlet and second air inlet, and the casing is made to be positioned over a desktop
Or one on planar object when, the desktop or the planar object can be contacted by the lug boss, and make described the
A spacing is kept between one air inlet and second air inlet and the desktop or the planar object, so as to making described
One air inlet and second air inlet are kept unimpeded.
10. a kind of storage device radiator structure, which is characterized in that including：
One storage device, the storage device has a casing, multiple disk modules and a circuit board, wherein in the casing
Portion is separated by a central baffle as one first accommodating space and one second accommodating space, and the disk module is placed in described
In one accommodating space, the circuit board is placed in second accommodating space；
Multiple first air inlets, multiple first air inlets are set to the downside of the casing and the described first accommodating sky of connection
Between；
Multiple second air inlets, multiple second air inlets are set to the downside of the casing and the described second accommodating sky of connection
Between；
One first exhaust exports, and the first exhaust outlet is set to the upside of the casing, and is connected to the described first accommodating sky
Between；
One second exhaust exports, and the second exhaust outlet is set to a side of the casing and the described second accommodating sky of connection
Between；
Multiple ventilative through holes, multiple ventilative through holes are set in the central baffle, and make first accommodating space
It is interconnected with second accommodating space；
One radiator fan, the radiator fan are set in second accommodating space, and the circuit board is set to described
Position in two accommodating spaces between the radiator fan and second exhaust outlet, the radiator fan is generating
One forced heat radiation air-flow, the forced heat radiation air-flow are discharged by being exported from the second exhaust after the circuit board；
The storage device is configured to operate with a heat loss through convection pattern and a forced heat radiation pattern, when the storage fills
Set when being operated with the heat loss through convection pattern, the radiator fan shuts down, the air in second accommodating space via
Multiple ventilative through holes are passed in first accommodating space, and the first exhaust exports to form the described first accommodating sky
Between and the second accommodating space inner air passing away, and first air inlet and second air inlet distinguish shape
At the inlet channel of first accommodating space and second accommodating space；
When the storage device is operated with the forced heat radiation pattern, the radiator fan starts, and generates one and dissipated from described
The forced heat radiation air-flow that Hot-air fan is discharged by the circuit board and second exhaust outlet and second air inlet, and
Air in first accommodating space is acted on by the radiator fan suction, and is entered from multiple ventilative through holes
In second accommodating space, and first exhaust outlet and first air inlet form first accommodating space
Inlet channel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810449480.8A CN108427492A (en) | 2018-05-11 | 2018-05-11 | Storage device radiator structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810449480.8A CN108427492A (en) | 2018-05-11 | 2018-05-11 | Storage device radiator structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108427492A true CN108427492A (en) | 2018-08-21 |
Family
ID=63162895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810449480.8A Pending CN108427492A (en) | 2018-05-11 | 2018-05-11 | Storage device radiator structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108427492A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2710032Y (en) * | 2004-03-04 | 2005-07-13 | 英志企业股份有限公司 | Structure for preventing electromagnetic wave and imporving internal heat sink of envelope of computer |
| TWM331697U (en) * | 2007-11-13 | 2008-05-01 | Jr Rack Co Ltd | Server cabinet with over temperature monitoring device |
| CN102955541A (en) * | 2011-08-17 | 2013-03-06 | 日立-Lg数据存储韩国公司 | Ventilator of network attached storage system |
| CN207182188U (en) * | 2017-09-12 | 2018-04-03 | 东莞市金河田实业有限公司 | One kind digs ore deposit casing structure |
| CN208172715U (en) * | 2018-05-11 | 2018-11-30 | 环胜电子(深圳)有限公司 | Storage device radiator structure |
-
2018
- 2018-05-11 CN CN201810449480.8A patent/CN108427492A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2710032Y (en) * | 2004-03-04 | 2005-07-13 | 英志企业股份有限公司 | Structure for preventing electromagnetic wave and imporving internal heat sink of envelope of computer |
| TWM331697U (en) * | 2007-11-13 | 2008-05-01 | Jr Rack Co Ltd | Server cabinet with over temperature monitoring device |
| CN102955541A (en) * | 2011-08-17 | 2013-03-06 | 日立-Lg数据存储韩国公司 | Ventilator of network attached storage system |
| CN207182188U (en) * | 2017-09-12 | 2018-04-03 | 东莞市金河田实业有限公司 | One kind digs ore deposit casing structure |
| CN208172715U (en) * | 2018-05-11 | 2018-11-30 | 环胜电子(深圳)有限公司 | Storage device radiator structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101547588B (en) | Cooling device for accommodated printed circuit board in a chassis | |
| CN104238693B (en) | The hot systems of computer | |
| KR100708809B1 (en) | Cooling device using water for computer and control method thereof | |
| JP4377742B2 (en) | Electronic device having a radiator, a cooling device, and a cooling device | |
| US20150062803A1 (en) | Server | |
| CN208172715U (en) | Storage device radiator structure | |
| CN108427492A (en) | Storage device radiator structure | |
| CN216795610U (en) | Heat dissipation casing and have its intelligent device | |
| CN209842550U (en) | Notebook computer radiator | |
| TWM269502U (en) | Heat dissipation module | |
| CN203324916U (en) | Integrated computer | |
| TWI564699B (en) | Heat sink assembly and graphics card module | |
| CN108073251B (en) | Electronic device with fan | |
| CN216429992U (en) | Servo rack heat extraction device | |
| CN217484807U (en) | Computer server and cooling system | |
| CN219590742U (en) | Case (S) | |
| CN216956836U (en) | Computer host with array type radiating fins | |
| CN217386293U (en) | Server | |
| CN216486261U (en) | Software development server heat abstractor | |
| JP2016057997A (en) | Electric communication computing module capable of housing printed circuit board | |
| JP3195481U (en) | Telecommunications computing module capable of accommodating printed circuit boards | |
| CN215345679U (en) | Active heat dissipation module | |
| CN220629916U (en) | Heat radiation structure of electronic module | |
| CN218918062U (en) | High-efficiency heat radiation module and notebook computer | |
| CN212009483U (en) | Computer device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20210415 Address after: 8 / F, innovation building, 1 zhongkeji Road, petrochemical Avenue, Daya Bay, Huizhou, Guangdong 516200 Applicant after: Huanrong Electronics (Huizhou) Co.,Ltd. Address before: 518057 Huansheng electronic Park, high tech Industrial Park, Nanshan District, Shenzhen City, Guangdong Province Applicant before: USI ELECTRONICS (SHENZHEN) Co.,Ltd. |
|
| TA01 | Transfer of patent application right | ||
| CB02 | Change of applicant information |
Address after: No. 369, Xinhe Avenue, Dayawan West District, Huizhou, Guangdong 516000 Applicant after: Huanrong Electronics (Huizhou) Co.,Ltd. Address before: 8 / F, innovation building, 1 zhongkeji Road, petrochemical Avenue, Daya Bay, Huizhou, Guangdong 516200 Applicant before: Huanrong Electronics (Huizhou) Co.,Ltd. |
|
| CB02 | Change of applicant information |