CN108426891A - A kind of pin of optical device welding quality detection method and device - Google Patents

Abstract

The invention relates to a method for detecting the soldering quality of optical device pins, comprising the following steps: acquiring image information at the soldering position of the optical device's pins, and performing binary processing on the image information to obtain binary image information; searching for the binary image information The target pixels in the optimized image information are obtained to obtain all the connected regions in the image information composed of the target pixels; the circumscribed rectangles corresponding to each connected region are obtained; the circumscribed rectangles are screened according to the size of the standard soldering pins to obtain the optical device The welding pins correspond to multiple target circumscribed rectangles one by one, respectively calculate the center point coordinates of each target circumscribed rectangle, and calculate the positional relationship between each center point according to the coordinates of each center point; compare the positional relationship with each pin of the optical device Compare the standard positional relationship templates between them, and when the comparison error between the two is within the set error range, it is determined that the pin welding of the optical device is qualified. The detection method provided by the invention has high efficiency and high accuracy.

Description

Method and device for detecting soldering quality of optical device pins

technical field

The invention relates to the technical field of optical device detection, in particular to a method and device for detecting the soldering quality of optical device pins.

Background technique

In the prior art, the pin welding detection of optical devices, especially the pin welding detection of optical transceiver components, is done manually and is in the state of manual or semi-automatic detection. The cost of this link is relatively high, and one-time The detection accuracy rate is low and the detection efficiency is low.

Contents of the invention

The technical problem to be solved by the present invention is to provide a method and device for detecting the soldering quality of optical device pins in view of the above-mentioned deficiencies in the prior art, and use image recognition technology to intelligently select poorly soldered optical devices to reduce the waste of human resources for manual inspection , and improve detection efficiency and accuracy.

The technical solution of the present invention to solve the above-mentioned technical problems is as follows: a method for detecting the soldering quality of optical device pins, comprising the following steps:

Step S1, acquiring image information at the pin welding position of the optical device, and performing binarization processing on the image information to obtain binarized image information;

Step S2, searching for target pixels in the binarized image information, and obtaining all connected regions in the image information composed of the target pixels;

Step S3. Acquiring circumscribed rectangles corresponding to each of the connected regions;

Step S4: Screen the circumscribing rectangles according to the size of the standard soldering pins to obtain a plurality of target circumscribing rectangles corresponding to the soldering pins of the optical device, respectively calculate the center point coordinates of each target circumscribing rectangle, according to The coordinates of each center point calculate the positional relationship between each center point;

Step S5 , comparing the positional relationship with the standard positional relationship template between the pins of the optical device, and judging that the soldering of the pins of the optical device is qualified when the comparison error between the two is within the set error range.

The beneficial effects of the method for detecting the soldering quality of the optical device pins provided by the present invention: the method for detecting the soldering quality of the optical device pins provided by the present invention can automatically complete the scanning and detection of the soldering quality of the optical device pins, and use image recognition technology to perform image information Analyze, intelligently screen out poorly welded optical components, reduce labor costs, and improve detection efficiency and accuracy.

On the basis of above-mentioned technical scheme, the present invention can also be improved as follows:

Further: the step S2 specifically includes:

Step S21, judging one by one whether the pixels in the binarized image information are target pixels, extracting the target pixels adjacent to each other, and merging the target pixels adjacent to each other to obtain the connected region;

Step S22, marking the connected regions.

The beneficial effect of the above further solution is that the connected regions are marked to facilitate rapid identification and extraction of the connected regions.

Further: judging whether the pixel in the binarized image information is a target pixel specifically includes:

Step S211, judging whether the pixel in the binarized image information is the pixel corresponding to the solder joint, if so, go to step S212, otherwise judging that the pixel is not the target pixel;

Step S212, judging whether the left pixel, the upper pixel, and the upper left pixel of the pixel are pixels corresponding to solder joints, and if at least one of the left pixel, upper pixel, and upper left pixel is a pixel corresponding to solder joints, it is determined whether If the pixel is the target pixel, otherwise it is determined that the pixel is not the target pixel.

The beneficial effect of the above further solution is that the target pixels are shrunk through the shrinking operation, so that the connected region composed of the target pixels is shrunk to the upper left corner, so that each connected region is isolated and separated, which is convenient for subsequent analysis and screening.

Further: the step S3 specifically includes:

Step S31, obtaining the uppermost target pixel, the lowermost target pixel, the leftmost target pixel, and the rightmost target pixel in the connected region;

Step S32, make a horizontal straight line L1 through the uppermost target pixel and the lowermost target pixel, respectively make a vertical line L2 through the leftmost target pixel and the rightmost target pixel, the two horizontal straight lines L1 and the two The area surrounded by the vertical line L2 is the circumscribed rectangle.

The beneficial effect of the above further solution is: obtaining the circumscribing rectangle of the connected area is convenient for comparison with standard soldering pins, thereby facilitating effective screening of the circumscribing rectangle.

Further: the positional relationship includes the distance between each of the center points, and the angle between the connecting lines of each of the center points.

The beneficial effect of the above further scheme is: judging whether the position of the solder joint is correct or not based on the positional relationship between the center points, and then judging whether the quality of the solder joint is qualified.

The present invention also provides an optical device pin welding quality inspection device, including a detection dark box for placing optical devices, a first camera and a processor, the first camera is arranged in the detection dark box, and is connected with the processing electrical connection;

The first camera is used to acquire image information at the pin welding position of the optical device;

The processor is used to perform binarization processing on the image information to obtain binarized image information; search for target pixels in the binarized image information, and obtain a pixel composed of the target pixels and located in the image information All connected regions of the connected regions; obtain the circumscribed rectangles corresponding to each of the connected regions; screen the circumscribed rectangles according to the size of the standard soldering pins to obtain a plurality of target circumscribed rectangles corresponding to the soldering pins of the optical device, respectively Calculate the center point coordinates of each of the target circumscribed rectangles, and calculate the positional relationship between each center point according to each of the center point coordinates; compare the positional relationship with the standard positional relationship template between the pins of the optical device Yes, when the comparison error between the two is within the set error range, it is judged that the pin welding of the optical device is qualified.

The beneficial effect of the optical device pin soldering quality detection device provided by the present invention is: the optical device pin soldering quality detection device is based on the optical device pin soldering quality detection method, so the above-mentioned optical device pin soldering quality detection method possesses the beneficial effect , the optical device pin soldering quality inspection device is also available, and will not be repeated here.

On the basis of above-mentioned technical scheme, the present invention can also be improved as follows:

Further: the optical device pin welding quality detection device also includes a feeding assembly, and the feeding assembly includes a base, a slide rail, a motor, a material tray, and a limit sensor;

Both the detection dark box and the slide rail are installed on the base, the slide rail is passed through the detection dark box, and the two ends of the slide rail extend out of the detection dark box; The sliding direction of the slide rail is set on the slide rail, and is used to place optical devices; the limit sensor is installed on the side of the slide rail, and is used to limit the sliding range of the slide rail; the motor and the The sliding rail is connected by transmission and drives the sliding rail to slide; the motor and the limit sensor are both electrically connected to the processor.

The beneficial effect of the above further solution is: adding feeding components, realizing automatic feeding and automatic discharging of optical devices, and further realizing the automation of the whole process of feeding, testing and discharging.

Further: the optical device pin soldering quality inspection device also includes a bracket arranged in the detection dark box for installing the first camera, the bracket is arched, and both ends of the bracket are fixed on the base , and the two ends of the bracket are respectively arranged on both sides of the slide rail, and the first camera is installed on the inner side wall of the bracket.

The beneficial effect of the above further solution is that the bracket straddles the slide rail and does not contact the slide rail, which is beneficial to maintain the stability of the bracket, and at the same time facilitates the camera to take pictures of the optical devices on the slide rail.

Furthermore: the optical device pin soldering quality inspection device further includes a second camera for identifying the identity of the optical device, the second camera is arranged in the detection dark box and is electrically connected to the processor.

The beneficial effect of the above further scheme is: the identification of the optical device is recognized by the second camera, such as a two-dimensional code, a bar code, etc., and the identification result and the detection result are fed back to the user at the same time, which is beneficial to the user for the detection results of each optical device. identify.

Further: there are two first cameras, both of which are installed in the detection dark box, both of the first cameras are electrically connected to the processor, and the two first cameras The cameras are respectively used to take images of pin welding on both sides of the optical device.

The beneficial effect of the above further solution is that: the pin welding images on both sides of the optical device are respectively captured by the two first cameras, and the images are captured simultaneously and recognized and judged at the same time, so that the detection efficiency is higher.

Description of drawings

Fig. 1 is a flow chart of a method for detecting the soldering quality of optical device pins provided by the present invention;

Fig. 2 is a schematic diagram of target pixel judgment of a method for detecting the soldering quality of optical device pins provided by the present invention;

3 is a schematic diagram of obtaining a circumscribed rectangle in a method for detecting the soldering quality of optical device pins provided by the present invention;

Fig. 4 is a schematic diagram of the external structure of an optical device pin soldering quality detection device provided by the present invention;

Fig. 5 is a schematic diagram of the internal structure of an optical device pin soldering quality detection device provided by the present invention.

In the accompanying drawings, the list of parts represented by each label is as follows:

1. Detection black box, 21. First camera, 22. Second camera, 3. Processor, 4. Base, 5. Slide rail, 6. Motor, 7. Material tray, 8. Limit sensor, 9. Bracket, 10. Optical device, L1, horizontal line, L2, vertical line.

Detailed ways

The principles and features of the present invention are described below in conjunction with the accompanying drawings, and the examples given are only used to explain the present invention, and are not intended to limit the scope of the present invention.

The present invention will be described below in conjunction with the accompanying drawings.

An embodiment of the present invention provides a method for detecting the soldering quality of optical device pins, which is hereinafter referred to as the detection method, as shown in FIG. 1 , including the following steps:

Step S1, acquiring image information at the pin welding position of the optical device, and performing binarization processing on the image information to obtain binarized image information;

Step S2, searching for target pixels in the binarized image information, and obtaining all connected regions in the image information composed of the target pixels;

Step S3. Acquiring circumscribed rectangles corresponding to each of the connected regions;

Step S4: Screen the circumscribing rectangles according to the size of the standard soldering pins to obtain a plurality of target circumscribing rectangles corresponding to the soldering pins of the optical device, respectively calculate the center point coordinates of each target circumscribing rectangle, according to The coordinates of each center point calculate the positional relationship between each center point;

Step S5 , comparing the positional relationship with the standard positional relationship template between the pins of the optical device, and judging that the soldering of the pins of the optical device is qualified when the comparison error between the two is within the set error range.

In the detection method provided in this embodiment, first, the image at the welding position of the pin is taken to obtain image information, and the image information is binarized to obtain binarized image information. The binarized image information has fewer pixel types, which is convenient for the processor. identify and process it. Obtaining the connected area of the target pixels can filter out scattered single invalid target pixels. The shapes of the connected regions are different, which is not conducive to its identification and screening. Therefore, the circumscribed rectangle of the connected region is obtained to regularize the connected region, which is convenient for subsequent screening and center point calculation. The circumscribing rectangle is screened by the aspect ratio of the standard soldering pin to obtain the target circumscribing rectangle corresponding to the shape of the soldering pin, and the shape verification of the circumscribing rectangle is realized. Finally, calculate the center point coordinates and positional relationship of each target circumscribing rectangle, verify the positional relationship of each target circumscribing rectangle, that is, verify the welding position of each pin, and finally judge whether the pin welding is qualified according to the verification result of the positional relationship.

Specifically, the standard solder pin is a standard object for shape comparison, and noise is eliminated according to the size of the standard solder pin, such as the aspect ratio of the standard solder pin, to obtain a target circumscribed rectangle. In the detection of the soldering of the optical transceiver component pins, the aspect ratio of 3*3 or 3*4 is usually used to eliminate the circumscribed rectangle of the connection area that does not meet the requirements.

The detection method provided by this embodiment effectively eliminates scattered invalid target pixels, extracts effective features in the binarized image information, and then performs double verification on the features, that is, shape verification and position relationship verification, and finally obtains the detection result. Therefore, the detection method provided by the present invention not only has high detection efficiency, but also has high detection accuracy.

The detection method provided by the present invention adopts image processing and recognition detection technology, can automatically complete the quality detection of optical device pin soldering, eliminates detection errors caused by factors such as artificial fatigue, and the detection efficiency and detection accuracy are far better than Manual inspection.

Preferably, the step S2 specifically includes:

Step S21, judging one by one whether the pixels in the binarized image information are target pixels, extracting the target pixels adjacent to each other, and merging the target pixels adjacent to each other to obtain the connected region;

Step S22, marking the connected regions.

Marking different labels for different connected regions facilitates the identification and extraction of different connected regions, and isolates and separates each connected region through different labels, which facilitates subsequent screening and calculation.

Preferably, judging whether the pixel in the binarized image information is a target pixel specifically includes:

Step S211, judging whether the pixel in the binarized image information is the pixel corresponding to the solder joint, if so, go to step S212, otherwise judging that the pixel is not the target pixel;

Step S212, judging whether the left pixel, the upper pixel, and the upper left pixel of the pixel are pixels corresponding to solder joints, and if at least one of the left pixel, upper pixel, and upper left pixel is a pixel corresponding to solder joints, it is determined whether If the pixel is the target pixel, otherwise it is determined that the pixel is not the target pixel.

For example: the white pixel in the binarized image information is represented by "1", the black pixel is represented by "0", and the pixel corresponding to the solder joint is a white pixel. The judgment of the target pixel in this embodiment is, for the binarized Image information is searched, and when a pixel with a value of "1" is encountered, it is judged whether the value of the left pixel, upper pixel, and upper left pixel of the pixel is "1". When the left pixel, upper pixel, and upper left pixel are Only when at least one value is "1", this pixel can be determined as the target pixel and keep the value of "1".

Combined with Figure 2, this contraction operation can be described by the following recurrence relation:

f(n,l)=h(h(f(n,l-1)+f(n,l)+f(n+1,l)-1)+h(f(n,1))+f (n+1,l-1))

in, f(n,l) represents the pixel at row n and column l, f(n,l-1) is the left pixel of f(n,l), f(n+1,l) is f(n,l) The upper pixel of f(n+1,l-1) is the upper left pixel of f(n,l).

Using the above formula to scan the binarized image information repeatedly, the connected area shrinks to the upper left corner of its boundary.

Preferably, as shown in Figure 3, the step S3 specifically includes:

Step S31, obtaining the uppermost target pixel, the lowermost target pixel, the leftmost target pixel, and the rightmost target pixel in the connected region;

Step S32, make a horizontal straight line L1 through the uppermost target pixel and the lowermost target pixel, respectively make a vertical line L2 through the leftmost target pixel and the rightmost target pixel, the two horizontal straight lines L1 and the two The area surrounded by the vertical line L2 is the circumscribed rectangle.

Obtain the circumscribed rectangle of the connected area. The shape of the rectangular area is easy to describe, calculate, and compare, which is convenient for subsequent screening work, and is also conducive to the subsequent calculation of the center point.

Preferably, the positional relationship includes the distance between each of the center points, and the angle between the connecting lines of each of the center points.

The verification of the positional relationship can ensure that the positions of the soldering points of each pin are accurate and there is no excessive deviation.

The embodiment of the present invention also provides an optical device lead soldering quality detection device, which is hereinafter referred to as the detection device, as shown in FIG. The first camera 21 is arranged in the detection dark box 1 and is electrically connected with the processor 3;

The first camera 21 is used to acquire image information at the pin welding position of the optical device 10;

The processor 3 is used to perform binarization processing on the image information to obtain binarized image information; search for target pixels in the binarized image information, and obtain a pixel located in the image composed of the target pixels All the connected areas in the information; obtain the circumscribed rectangles corresponding to each of the connected areas; filter the circumscribed rectangles according to the size of the standard soldering pins, and obtain a plurality of target circumscribed rectangles corresponding to the soldering pins of the optical device one by one , respectively calculate the center point coordinates of each described target circumscribed rectangle, calculate the positional relationship between each center point according to each described center point coordinate; Described positional relationship and standard positional relationship between each pin of optical device 10 The templates are compared, and when the comparison error between the two is within the set error range, it is determined that the soldering of the pins of the optical device 10 is qualified.

Specifically, the detection obscura 1 provides a stable shooting environment for the first camera 21, improves the shooting quality of images at pin welding positions, and facilitates subsequent image recognition and processing.

The detection device provided by the present invention is based on the above detection method, so the detection device also possesses the beneficial effects of the above detection method, which will not be repeated here.

Preferably, as shown in FIG. 4 , the detection device further includes a feeding assembly, which includes a base 4, a slide rail 5, a motor 6, a material tray 7 and a limit sensor 8;

The detection dark box 1 and the slide rail 5 are installed on the base 4, the slide rail 5 is penetrated in the detection dark box 1, and the two ends of the slide rail 5 extend out of the detection black box 1 The material tray 7 is arranged on the slide rail along the sliding direction of the slide rail 5, and is used to place the optical device 10; the limit sensor 8 is installed on the side of the slide rail 5, and is used to limit the The sliding range of the slide rail 5; the motor 6 is connected to the slide rail 5 in transmission, and drives the slide rail 5 to slide; the motor 6 and the limit sensor 8 are electrically connected to the processor 3 .

In this embodiment, a feeding assembly is added. Specifically, the total length of the slide rail 5 in this embodiment is 700 mm. The slide rail 5 is made of aluminum material, and the surface is anodized. The slide rail 5 is installed on the base 4 through the mounting bracket. The frame is made of aluminum materials, and the base can be sealed with carbon steel to ensure the overall aesthetics of the detection device; the bottom of the base is pasted with rubber software, which is conducive to protecting the detection table. The conveyor belt of slide rail 5 adopts grass green PVC material anti-static anti-skid belt. All sheet metal parts are sprayed with plastic. An emergency stop button can also be set, which is electrically connected to the processor 3 and used to realize the emergency stop of the slide rail 5. The emergency stop button is installed on the base or on the side of the detection workbench to facilitate Quickly press the emergency stop button. The processor 3, the motor 6 and the limit sensor 8 can be arranged and detected in the dark box 1, and the processor 3, the motor 6 and the limit sensor 8 of the detection dark box 1 play a protective role.

After the feeding component is added, the detection device only needs to arrange assembly workers to discharge and unload the material, and the rest of the work can be automatically completed by the detection device. Put it neatly on the material tray 7, then place the material tray 7 on the slide rail 5, turn on the power of the testing equipment and press the start button to start. The slide rail 5 automatically sends the material tray 7 to the detection black box 1, and when passing through the first camera 21, image capture, processing, detection and recognition are automatically performed. After the detection is completed, the slide rail 5 sends the material tray 7 out of the detection black box 1, and feedbacks the detection result in time. The assembler takes out the tested optical devices from the material tray 7, screens the optical devices according to the detection results, and places the next group of optical devices.

The feeding component realizes the automatic feeding and discharging of the optical device, which makes the feeding, testing and discharging of the optical device realize the automation of the whole process, reduces labor costs, and improves the feeding and discharging speed and detection speed.

Preferably, as shown in Figure 5, the detection device also includes a bracket 9 arranged in the detection dark box 1 for installing the first camera 21, the bracket 9 is arched, and the two ends of the bracket 9 are It is fixed on the base 4 , and the two ends of the bracket 9 are respectively arranged on both sides of the slide rail 5 , and the first camera 21 is installed on the inner side wall of the bracket 9 .

The bracket 9 provides a stable support for the camera, so that the first camera 21 will not shake when shooting, and the shooting effect is better, which is convenient for subsequent image recognition and processing.

Preferably, as shown in FIG. 5 , the detection device further includes a second camera 22 for identifying the identity of the optical device 10, the second camera 22 is arranged in the detection dark box 1, and is electrically connected to the processor 3 connect.

Paste an identification label on the optical device 10, the identification table label can be a two-dimensional code, a bar code, etc., scan the identification label through the second camera 22, and synchronously feed back the detection result of the optical device and the identification information to the detection It is convenient for the identification of the detection result of the optical device 10 and the screening of the optical device.

Preferably, as shown in FIG. 5 , there are two first cameras 21, both of which are arranged in the detection dark box 1, and both of the first cameras 21 are compatible with the processing The device 3 is electrically connected, and the two first cameras 21 are respectively used to capture pin welding images on both sides of the optical device 10 .

Two first cameras 21 are used to simultaneously capture pin welding images on both sides of the optical device 10, and the processor 3 simultaneously performs identification processing, which is beneficial to speed up identification and detection.

Specifically, two cameras 21 may be installed on both ends of the bracket 9 respectively, and the two first cameras 21 are both installed on the side of the bracket 9 facing the slide rail 5 . The second camera 22 is installed on the top of the bracket 9 , and is also installed on the side of the bracket 9 facing the slide rail 5 . The installation of the two first cameras 21 and the second camera 22 is realized by the bracket 9, the mechanical structure is simplified, the simultaneous shooting of the two first cameras 21 and the second camera 22 is realized, and the synchronous processing of the processor 3 improves the detection efficiency .

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection of the present invention. within range.

Claims (10)

1. The method for detecting the welding quality of the optical device pin is characterized by comprising the following steps of:

s1, acquiring image information at the pin welding position of the optical device, and performing binarization processing on the image information to obtain binarized image information;

step S2, searching target pixels in the binarized image information, and acquiring all connected regions which are formed by the target pixels and are positioned in the image corresponding to the image information;

step S3, acquiring a circumscribed rectangle corresponding to each connected region;

s4, screening the circumscribed rectangles according to the size of a standard welding pin to obtain a plurality of target circumscribed rectangles corresponding to the welding pin of the optical device one by one, respectively calculating the center point coordinates of each target circumscribed rectangle, and calculating the position relation between the center points according to each center point coordinate;

and step S5, comparing the position relation with a standard position relation template among the pins of the optical device, and judging that the pins of the optical device are welded qualified when the comparison error of the position relation and the standard position relation template is within a set error range.

2. The method for detecting the soldering quality of the optical device pin according to claim 1, wherein the step S2 specifically includes:

step S21, judging whether the pixels in the binarized image information are target pixels one by one, extracting the target pixels adjacent to each other, and combining the target pixels adjacent to each other to obtain the connected region;

and step S22, marking the connected region.

3. The method for detecting the welding quality of the optical device pin according to claim 2, wherein the step of judging whether the pixel in the binarized image information is a target pixel specifically comprises the steps of:

step S211, judging whether the pixel in the binarized image information is a pixel corresponding to a welding spot, if so, turning to step S212, otherwise, judging that the pixel is not a target pixel;

step S212, determining whether the left pixel, the upper pixel, and the upper left pixel of the pixel are pixels corresponding to the welding point, if at least one of the left pixel, the upper pixel, and the upper left pixel is a pixel corresponding to the welding point, determining that the pixel is the target pixel, otherwise determining that the pixel is not the target pixel.

4. The method for detecting the soldering quality of the optical device pin according to claim 1, wherein the step S3 specifically includes:

step S31, acquiring the uppermost target pixel, the lowermost target pixel, the leftmost target pixel and the rightmost target pixel in the connected region;

step S32, a horizontal straight line L1 is respectively drawn by the uppermost target pixel and the lowermost target pixel, a vertical perpendicular line L2 is respectively drawn by the leftmost target pixel and the rightmost target pixel, and an area surrounded by the two horizontal straight lines L1 and the two vertical perpendicular lines L2 is the circumscribed rectangle.

5. The method for detecting the soldering quality of an optical device pin according to any one of claims 1 to 4, wherein the positional relationship includes a distance between the central points and an angle between connecting lines of the central points.

6. The device for detecting the welding quality of the pins of the optical device is characterized by comprising a detection camera bellows (1) for placing the optical device (10), a first camera (21) and a processor (3), wherein the first camera (21) is arranged in the detection camera bellows (1) and is electrically connected with the processor (3);

the first camera (21) is used for acquiring image information at a pin welding position of the optical device (10);

the processor (3) is used for carrying out binarization processing on the image information to obtain binarized image information; searching target pixels in the binarized image information, and acquiring all connected regions which are formed by the target pixels and are located in the image information; acquiring a circumscribed rectangle corresponding to each connected region; screening the circumscribed rectangles according to the size of a standard welding pin to obtain a plurality of target circumscribed rectangles which are in one-to-one correspondence with the welding pin of the optical device, respectively calculating the coordinates of the central points of the target circumscribed rectangles, and calculating the position relation between the central points according to the coordinates of the central points; and comparing the position relation with a standard position relation template among the pins of the optical device (10), and judging that the pins of the optical device (10) are welded qualified when the comparison error of the position relation and the standard position relation template is within a set error range.

7. The device for detecting the welding quality of the pins of the optical device according to claim 6, further comprising a feeding assembly, wherein the feeding assembly comprises a base (4), a sliding rail (5), a motor (6), a material tray (7) and a limit sensor (8);

the detection camera bellows (1) and the slide rail (5) are both arranged on the base (4), the slide rail (5) penetrates through the detection camera bellows (1), and two ends of the slide rail (5) extend out of the detection camera bellows (1); the material tray (7) is arranged on the slide rail along the sliding direction of the slide rail (5) and is used for placing an optical device (10); the limiting sensor (8) is arranged on the side surface of the sliding rail (5) and is used for limiting the sliding range of the sliding rail (5); the motor (6) is in transmission connection with the sliding rail (5) and drives the sliding rail (5) to slide; the motor (6) and the limit sensor (8) are electrically connected with the processor (3).

8. The device for detecting the pin soldering quality of the optical device according to claim 7, further comprising a bracket (9) disposed in the detection camera box (1) and used for mounting the first camera (21), wherein the bracket (9) is arched, two ends of the bracket (9) are fixed on the base (4), two ends of the bracket (9) are disposed on two sides of the sliding rail (5), and the first camera (21) is mounted on an inner side wall of the bracket (9).

9. The device for detecting the welding quality of the pins of the optical devices as claimed in claim 6, further comprising a second camera (22) for identifying the identity of the optical devices (10), wherein the second camera (22) is disposed in the detection camera chamber (1) and electrically connected to the processor (3).

10. The device for detecting the pin soldering quality of an optical device according to any one of claims 6 to 9, wherein there are two first cameras (21), two first cameras (21) are disposed in the dark box (1), two first cameras (21) are electrically connected to the processor (3), and the two first cameras (21) are respectively used for capturing pin soldering images of two sides of the optical device (10).