CN108426891A - A kind of pin of optical device welding quality detection method and device - Google Patents
A kind of pin of optical device welding quality detection method and device Download PDFInfo
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Abstract
The present invention relates to a kind of pin of optical device welding quality detection methods, include the following steps：The image information at the pin welding position of optical device is obtained, and binary conversion treatment is carried out to image information and obtains binary image information；The object pixel in binary image information is searched for, all connected regions being located in image information being made of object pixel are obtained；Obtain the corresponding boundary rectangle of each connected region；Boundary rectangle is screened according to the size of standard welding pin, it obtains and the welding pin of optical device multiple target boundary rectangles correspondingly, the center point coordinate for calculating separately each target boundary rectangle calculates the position relationship between each central point according to each center point coordinate；Normal place relationship templates between position relationship and each pin of optical device are compared, when setting within error range, the pin of judgement optical device welds qualification to the comparison error of the two.Detection method provided by the invention is efficient, accuracy rate is high.
Description
Technical field
The present invention relates to optical device detection technique field more particularly to a kind of pin of optical device welding quality detection method and
Device.
Background technology
In the prior art, the pin welding detection of optical device, the pin welding detection of especially light transmit-receive integrated component is all
It is to be completed by artificial, in artificial or semi-automatic detecting state, the cost of this link accounts for relatively high and primary
Detection accuracy is relatively low, and detection efficiency is low.
Invention content
The technical problem to be solved by the present invention is to solve the above shortcomings of the prior art and to provide a kind of welderings of pin of optical device
Quality determining method and device are connect, the optical device of bad welding is intelligently selected using image recognition technology, to reduce artificial detection
Waste of human resource, and improve detection efficiency and accuracy.
The technical solution that the present invention solves above-mentioned technical problem is as follows：A kind of pin of optical device welding quality detection method,
Include the following steps：
Step S1, the image information at the pin welding position of optical device is obtained, and two-value is carried out to described image information
Change handles to obtain binary image information；
Step S2, the object pixel in the binary image information is searched for, what acquisition was made of the object pixel
All connected regions in described image information；
Step S3, the corresponding boundary rectangle of each connected region is obtained；
Step S4, the boundary rectangle is screened according to the size of standard welding pin, obtains the weldering with optical device
Pin multiple target boundary rectangles correspondingly are connect, the center point coordinate of each target boundary rectangle is calculated separately, according to
Each center point coordinate calculates the position relationship between each central point；
Step S5, the normal place relationship templates between the position relationship and each pin of optical device are compared, when
It is qualified that the comparison error of the two pin of judgement optical device when setting within error range welds.
The advantageous effect of pin of optical device welding quality detection method provided by the invention：Optical device provided by the invention draws
Foot welding quality detection method can automatically complete the scanning and detection of pin of optical device welding quality, utilize image recognition
Technology analyzes image information, intelligently screens out the optical device of failure welding, reduces human cost, improve detection efficiency and
Accuracy rate.
Based on the above technical solution, the present invention can also be improved as follows：
Further：The step S2 is specifically included：
Step S21, judge whether the pixel in the binary image information is object pixel, and extraction adjoins each other one by one
The object pixel, and merge the object pixel to adjoin each other to obtain the connected region；
Step S22, the connected region is marked.
The advantageous effect of above-mentioned further scheme is：Connected region is marked, convenient for connected region it is quick identify,
Extraction.
Further：Judge whether the pixel in the binary image information is that object pixel specifically includes：
Step S211, judge whether the pixel in the binary image information is the corresponding pixel of solder joint, if it is
S212 is gone to step, it is object pixel otherwise to judge the pixel not；
Step S212, judge whether the leftmost pixel, topmost pixel and upper left pixel of the pixel are that solder joint corresponds to
Pixel, if at least one in the leftmost pixel, topmost pixel and upper left pixel be the corresponding pixel of solder joint if
Judge that the pixel is object pixel, it is object pixel otherwise to judge the pixel not.
The advantageous effect of above-mentioned further scheme is：Object pixel is shunk by shrinking operation so that have target
The connected region of pixel composition is contracted to the upper left corner so that isolates and detaches between each connected region, is convenient for subsequent analysis
And screening.
Further：The step S3 is specifically included：
Step S31, obtain object pixel in the connected region positioned at the top, bottom object pixel, most left
The object pixel on side and the object pixel of rightmost；
Step S32, horizontal linear L1 is done by the object pixel of the top and the object pixel of bottom respectively, passed through
The object pixel of leftmost object pixel and rightmost is vertical vertical line L2, two horizontal linear L1 and two respectively
Vertical vertical line L2 area defined described in item is the boundary rectangle.
The advantageous effect of above-mentioned further scheme is：The boundary rectangle of connected region is obtained, is convenient for and standard welding pin
It is compared, and then convenient for the Effective selection to boundary rectangle.
Further：The position relationship includes the line of the distance between each described central point and each central point
Between angle.
The advantageous effect of above-mentioned further scheme is：Judge bond pad locations whether just by the position relationship between central point
Really, and then judge whether quality of welding spot is qualified.
Include dark for placing the detection of optical device the present invention also provides a kind of pin of optical device Welding quality test device
Case, the first camera and processor, first camera are set in the detection camera bellows, and are electrically connected with the processor
It connects；
First camera is used to obtain the image information at the pin welding position of optical device；
The processor is used to carry out binary conversion treatment to described image information to obtain binary image information；Described in search
Object pixel in binary image information obtains and is located at owning in described image information by what the object pixel was formed
Connected region；Obtain the corresponding boundary rectangle of each connected region；According to the size of standard welding pin to the external square
Shape is screened, obtain with the welding pin of optical device multiple target boundary rectangles correspondingly, calculate separately each mesh
The center point coordinate for marking boundary rectangle, the position relationship between each central point is calculated according to each center point coordinate；By institute
The normal place relationship templates stated between position relationship and each pin of optical device are compared, when the comparison error of the two is being set
Judge that the pin welding of optical device is qualified when within error range.
The advantageous effect of pin of optical device Welding quality test device provided by the invention is：Pin of optical device welding quality
Detection device is based on pin of optical device welding quality detection method, therefore above-mentioned pin of optical device welding quality detection method is had
Standby advantageous effect, pin of optical device Welding quality test device are likewise supplied with, and details are not described herein.
Based on the above technical solution, the present invention can also be improved as follows：
Further：Pin of optical device Welding quality test device further includes feeding material component, the feeding material component include pedestal,
Sliding rail, motor, material disc and limit sensors；
The detection camera bellows and sliding rail are mounted on the pedestal, and the sliding rail is arranged in the detection camera bellows,
And the both ends of the sliding rail are stretched out outside the detection camera bellows；The material disc is set to the cunning along the glide direction of the sliding rail
On rail, and for placing optical device；The limit sensors are installed on the side of the sliding rail, and for limiting the sliding rail
Sliding scale；The motor is sequentially connected with the sliding rail, and the sliding rail is driven to slide；The motor and the limit pass
Sensor is electrically connected with the processor.
The advantageous effect of above-mentioned further scheme is：Increase feeding material component, realizes the automatic feed of optical device and automatic
Discharging, and then realize charging, detection and the automation of discharging overall process.
Further：Pin of optical device Welding quality test device further includes being set in the detection camera bellows for installing institute
The holder of the first camera is stated, the holder is arch, and the both ends of the holder are both secured on the pedestal, and the holder
Both ends be respectively arranged at the both sides of the sliding rail, first camera is installed on the madial wall of the holder.
The advantageous effect of above-mentioned further scheme is：Holder is not contacted across standing on sliding rail with sliding rail, is conducive to keep branch
The stability of frame, while camera being facilitated to shoot the optical device on sliding rail.
Further：Pin of optical device Welding quality test device further includes the second of optical device identity for identification taking the photograph
As head, the second camera is set in the detection camera bellows, and is electrically connected with the processor.
The advantageous effect of above-mentioned further scheme is：The identity of optical device, such as two are identified by second camera
Code, bar code etc. are tieed up, identification result and testing result are fed back into user simultaneously, are conducive to inspection of the user to each optical device
Result is surveyed to be recognized.
Further：First camera is two, and two first cameras may be contained in the detection camera bellows,
Two first cameras are electrically connected with the processor, and two first cameras are respectively used to shooting optical device
The pin welding image of both sides.
The advantageous effect of above-mentioned further scheme is：Shoot the pin of optical device both sides respectively by two the first cameras
Welding image is shot simultaneously, while identifying judgement so that detection efficiency higher.
Description of the drawings
Fig. 1 is a kind of flow chart of pin of optical device welding quality detection method provided by the invention；
Fig. 2 is the signal that a kind of object pixel of pin of optical device welding quality detection method provided by the invention judges
Figure；
Fig. 3 is a kind of signal of the acquisition boundary rectangle of pin of optical device welding quality detection method provided by the invention
Figure；
Fig. 4 is a kind of external structure schematic diagram of pin of optical device Welding quality test device provided by the invention；
Fig. 5 is a kind of internal structure schematic diagram of pin of optical device Welding quality test device provided by the invention.
In attached drawing, parts list represented by the reference numerals are as follows：
1, camera bellows is detected, the 21, first camera, 22, second camera, 3, processor, 4, pedestal, 5, sliding rail, 6, motor,
7, material disc, 8, limit sensors, 9, holder, 10, optical device, L1, horizontal linear, L2, vertical vertical line,.
Specific implementation mode
The principle and features of the present invention will be described below with reference to the accompanying drawings, and the given examples are served only to explain the present invention, and
It is non-to be used to limit the scope of the present invention.
Below in conjunction with the accompanying drawings, the present invention will be described.
The embodiment of the present invention provides a kind of pin of optical device welding quality detection method, hereinafter referred to as detection method, such as Fig. 1
It is shown, include the following steps：
Step S1, the image information at the pin welding position of optical device is obtained, and two-value is carried out to described image information
Change handles to obtain binary image information；
Step S2, the object pixel in the binary image information is searched for, what acquisition was made of the object pixel
All connected regions in described image information；
Step S3, the corresponding boundary rectangle of each connected region is obtained；
Step S4, the boundary rectangle is screened according to the size of standard welding pin, obtains the weldering with optical device
Pin multiple target boundary rectangles correspondingly are connect, the center point coordinate of each target boundary rectangle is calculated separately, according to
Each center point coordinate calculates the position relationship between each central point；
Step S5, the normal place relationship templates between the position relationship and each pin of optical device are compared, when
It is qualified that the comparison error of the two pin of judgement optical device when setting within error range welds.
Detection method provided in this embodiment shoots the image at pin welding position, obtains image information, first to figure
Binary image information is obtained as information carries out binary conversion treatment, the pixel type of binary image information is few, is convenient for processor
It is identified and is handled.The connected region for obtaining object pixel, can screen out the single invalid object pixel being scattered.Even
The shape in logical region is different, is unfavorable for that it is identified and screens, therefore obtains the boundary rectangle of connected region, to even
Logical region progress is regular, is calculated convenient for subsequent screening and central point.It is screened by the length-width ratio of standard welding pin external
Rectangle obtains target boundary rectangle corresponding with welding pin shape, realizes the shape verification of boundary rectangle.Finally calculate each mesh
The center point coordinate and position relationship for marking boundary rectangle, verify the position relationship of each target boundary rectangle, i.e., to each
The welding position of a pin is verified, and finally judges whether pin welding is qualified according to the verification result of position relationship.
Specifically, standard welding pin is to carry out the standard object of shape comparison, according to the size of standard welding pin, example
Such as the length-width ratio of standard welding pin, cancelling noise obtains target boundary rectangle.In the inspection of light transmit-receive integrated package pin welding
In survey, the length-width ratio of generally use 3*3 or 3*4 reject the boundary rectangle of undesirable connected region.
Detection method provided in this embodiment effectively obviates the invalid targets pixel being scattered, and extracts binary image
Effective feature in information, and then double verification, i.e. shape verification and position relationship verification are carried out to feature, it finally obtains
Testing result.Thus not only detection efficiency is high for detection method provided by the invention, but also Detection accuracy is high.
Detection method provided by the invention can be automatically performed optical device using image procossing and recognition detection technology
The quality testing of pin welding is obviated due to detection error caused by the factors such as artificial fatigue, and detection efficiency and detection are accurate
Rate is all much better than artificial detection.
Preferably, the step S2 is specifically included：
Step S21, judge whether the pixel in the binary image information is object pixel, and extraction adjoins each other one by one
The object pixel, and merge the object pixel to adjoin each other to obtain the connected region；
Step S22, the connected region is marked.
The label different to different connected component labelings is convenient for the identification and extraction of different connected regions, passes through difference
Label, it is each connected region is isolated and detach, be convenient for subsequent screening and evaluation work.
Preferably, judge whether the pixel in the binary image information is that object pixel specifically includes：
Step S211, judge whether the pixel in the binary image information is the corresponding pixel of solder joint, if it is
S212 is gone to step, it is object pixel otherwise to judge the pixel not；
Step S212, judge whether the leftmost pixel, topmost pixel and upper left pixel of the pixel are that solder joint corresponds to
Pixel, if at least one in the leftmost pixel, topmost pixel and upper left pixel be the corresponding pixel of solder joint if
Judge that the pixel is object pixel, it is object pixel otherwise to judge the pixel not.
It illustrates：White pixel in binary image information is indicated with " 1 ", black picture element is indicated with " 0 ", solder joint
Corresponding pixel is white pixel, and the present embodiment is to scan for binary image information for the judgement of object pixel, is met
When to the pixel that value is " 1 ", judge the leftmost pixel of the pixel, topmost pixel and upper left pixel value whether be
" 1 ", when at least one value is " 1 " in leftmost pixel, topmost pixel and upper left pixel, this pixel can just be determined as
Object pixel, and remain " 1 " value.
In conjunction with Fig. 2, this contraction operation can be described with recurrence relation once：
F (n, l)=h (h (f (n, l-1)+f (n, l)+f (n+1, l) -1)+h (f (n, 1))+f (n+1, l-1))
Wherein,F (n, l) indicates that the pixel of line n l row, f (n, l-1) are the left side of f (n, l)
Pixel, f (n+1, l) are the topmost pixel of f (n, l), and f (n+1, l-1) is the upper left pixel of f (n, l).
Binary image information is repeatedly scanned with using above formula so that connected region is contracted to the upper left on its boundary
Angle.
Preferably, as shown in figure 3, the step S3 is specifically included：
Step S31, obtain object pixel in the connected region positioned at the top, bottom object pixel, most left
The object pixel on side and the object pixel of rightmost；
Step S32, horizontal linear L1 is done by the object pixel of the top and the object pixel of bottom respectively, passed through
The object pixel of leftmost object pixel and rightmost is vertical vertical line L2, two horizontal linear L1 and two respectively
Vertical vertical line L2 area defined described in item is the boundary rectangle.
The boundary rectangle of connected region is obtained, the shape in the region of rectangle is easy to be described, calculate and compare, be convenient for
Subsequent screening operation, while being conducive to the evaluation work of subsequent central point.
Preferably, the position relationship includes the line of the distance between each described central point and each central point
Between angle.
It can ensure that the position of each pin pad is precisely errorless by the verification of position relationship, without excessive deviation.
The embodiment of the present invention also provides a kind of pin of optical device Welding quality test device, hereinafter referred to as detection device, such as
Include for placing the detection camera bellows 1 of optical device 10, the first camera 21 and processor 3, first camera shooting shown in Fig. 4
First 21 are set in the detection camera bellows 1, and are electrically connected with the processor 3；
First camera 21 is used to obtain the image information at the pin welding position of optical device 10；
The processor 3 is used to carry out binary conversion treatment to described image information to obtain binary image information；Search institute
The object pixel in binary image information is stated, the institute being located in described image information being made of the object pixel is obtained
There is connected region；Obtain the corresponding boundary rectangle of each connected region；According to the size of standard welding pin to described external
Rectangle is screened, obtain with the welding pin of optical device multiple target boundary rectangles correspondingly, calculate separately each described
The center point coordinate of target boundary rectangle calculates the position relationship between each central point according to each center point coordinate；It will
Normal place relationship templates between the position relationship and 10 each pin of optical device are compared, when the comparison error of the two exists
The pin welding of judgement optical device 10 is qualified when setting within error range.
Specifically, detection camera bellows 1 is that the first camera 21 provides stable shooting environmental, improves figure at pin welding position
The shooting quality of picture is convenient for subsequent image recognition and processing.
Detection device provided by the invention is based on above-mentioned detection method, therefore the beneficial effect that above-mentioned detection method has
Fruit, detection device are likewise supplied with, and details are not described herein.
Preferably, as shown in figure 4, detection device further includes feeding material component, the feeding material component include pedestal 4, sliding rail 5,
Motor 6, material disc 7 and limit sensors 8；
The detection camera bellows 1 and sliding rail 5 are mounted on the pedestal 4, and the sliding rail 5 is arranged in the detection camera bellows
In 1, and the both ends of the sliding rail 5 are stretched out outside the detection camera bellows 1；The material disc 7 is arranged along the glide direction of the sliding rail 5
In on the sliding rail, and for placing optical device 10；The limit sensors 8 are installed on the side of the sliding rail 5, and for limiting
Make the sliding scale of the sliding rail 5；The motor 6 is sequentially connected with the sliding rail 5, and the sliding rail 5 is driven to slide；The electricity
Machine 6 and the limit sensors 8 are electrically connected with the processor 3.
Embodiment adds feeding material components, and specifically, the total length of sliding rail 5 is 700mm in the present embodiment, and sliding rail 5 is adopted
With aluminum material, surface anodization processing, sliding rail 5 is mounted on by mounting bracket on pedestal 4, and mounting bracket is spelled using aluminum material
It connects, carbon steel sealing plate can be used in pedestal, to ensure the aesthetics of detection device entirety；It is soft that rubber is pasted in the bottom surface of pedestal
Part is conducive to protect detection platform.The conveyer belt of sliding rail 5 uses grass green PVC material antistatic creeper band.To all metal plates
Part carries out plastic-spraying processing.Scram button can be also set, and scram button is electrically connected with processor 3, and for realizing the urgency of sliding rail 5
Stop, scram button is mounted on the base or is detected the side of workbench, it is convenient quick when under equipment is in an emergency
Press scram button.Processor 3, motor 6 and limit sensors 8 can be arranged and detect in camera bellows 1, and detection camera bellows 1 is handled
Device 3, motor 6 and limit sensors 8 play a protective role.
After increasing feeding material component, detection device only needs to arrange for assembler and carries out blowing and discharging, remaining work is equal
It can be automatically performed by detection device, the operating process of detection device is as follows：Assembly crewman is respectively by one group of soldered light device
Part is equidirectional to be neatly placed on material disc 7, and then material disc 7 is placed on sliding rail 5, is connected detection device power supply and is pressed
Start button starts.Material disc 7 is sent to detection camera bellows 1 by sliding rail 5 automatically, by carrying out image bat when the first camera 21 automatically
Take the photograph, handle and detect identification.After completing detection, material disc 7 is sent out detection camera bellows 1 by sliding rail 5, and timely feedbacks detection knot
Fruit.Assembler takes out the optical device detected from material disc 7, and Screening Treatment is carried out according to testing result sun adjuster part,
And put next group of optical device.
Feeding material component realizes automatic feed and the self-emptying of optical device so that the charging of optical device, detection and
The automation of overall process is realized in discharging, reduces human cost, improves charging discharging speed and detection speed.
Preferably, as shown in figure 5, detection device further includes being set in the detection camera bellows 1 for installing described first
The holder 9 of camera 21, the holder 9 are arch, and the both ends of the holder 9 are both secured on the pedestal 4, and the holder
9 both ends are respectively arranged at the both sides of the sliding rail 5, and first camera 21 is installed on the madial wall of the holder 9.
Holder 9 provides a stable support for camera so that the first camera 21 will not shake when shooting, and shoot
Effect is more preferable, is convenient for subsequent image recognition and processing.
Preferably, as shown in figure 5, detection device further includes the second camera of 10 identity of optical device for identification
22, the second camera 22 is set in the detection camera bellows 1, and is electrically connected with the processor 3.
Identification tag is sticked on optical device 10, identification table label can be Quick Response Code, bar code etc., pass through
Second camera 22 is scanned identification tag, by the testing result of optical device and identity identification information synchronous feedback
To inspector, convenient for the identification of the testing result of optical device 10 and the screening of optical device.
Preferably, as shown in figure 5, first camera 21 is two, two first cameras 21 may be contained within
In the detection camera bellows 1, two first cameras 21 are electrically connected with the processor 3, and two first camera shootings
First 21 are respectively used to the pin welding image of 10 both sides of shooting optical device.
Shoot the pin welding image of 10 both sides of optical device simultaneously using two the first cameras 21, processor 3 simultaneously into
Row identifying processing is conducive to accelerate identification and detection speed.
Specifically, two cameras 21 can be respectively arranged in the both ends of holder 9, two the first cameras 21 are respectively mounted
In holder 9 towards the side of sliding rail 5.Second camera 22 is installed on the top of holder 9, and is equally installed on holder 9 towards cunning
The side of rail 5.The installation that two first cameras 21 and second camera 22 are realized by holder 9, simplifies mechanical structure, real
It is shot while existing two the first cameras 21 and second camera 22, the synchronization process of processor 3 improves detection efficiency.
The foregoing is merely presently preferred embodiments of the present invention, is not intended to limit the invention, it is all the present invention spirit and
Within principle, any modification, equivalent replacement, improvement and so on should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of pin of optical device welding quality detection method, which is characterized in that include the following steps：
Step S1, the image information at the pin welding position of optical device is obtained, and described image information is carried out at binaryzation
Reason, obtains binary image information；
Step S2, the object pixel in the binary image information is searched for, acquisition is located at by what the object pixel was formed
All connected regions in the corresponding image of described image information；
Step S3, the corresponding boundary rectangle of each connected region is obtained；
Step S4, the boundary rectangle is screened according to the size of standard welding pin, obtains the welding with optical device and draws
Foot multiple target boundary rectangles correspondingly, calculate separately the center point coordinate of each target boundary rectangle, according to each
The center point coordinate calculates the position relationship between each central point；
Step S5, the normal place relationship templates between the position relationship and each pin of optical device are compared, work as the two
Comparison error when setting within error range the pin of judgement optical device weld it is qualified.
2. pin of optical device welding quality detection method according to claim 1, which is characterized in that the step S2 is specifically wrapped
It includes：
Step S21, judge whether the pixel in the binary image information is object pixel, extracts the institute to adjoin each other one by one
Object pixel is stated, and merges the object pixel to adjoin each other to obtain the connected region；
Step S22, the connected region is marked.
3. pin of optical device welding quality detection method according to claim 2, which is characterized in that judge the binary picture
As whether the pixel in information is that object pixel specifically includes：
Step S211, judge whether the pixel in the binary image information is the corresponding pixel of solder joint, if it is turns to walk
Rapid S212, it is object pixel otherwise to judge the pixel not；
Step S212, judge whether the leftmost pixel, topmost pixel and upper left pixel of the pixel are the corresponding picture of solder joint
Element judges if at least one in the leftmost pixel, topmost pixel and upper left pixel is the corresponding pixel of solder joint
The pixel is object pixel, and it is object pixel otherwise to judge the pixel not.
4. pin of optical device welding quality detection method according to claim 1, which is characterized in that the step S3 is specifically wrapped
It includes：
Step S31, obtain object pixel in the connected region positioned at the top, bottom object pixel, leftmost
The object pixel of object pixel and rightmost；
Step S32, horizontal linear L1 is done by the object pixel of the top and the object pixel of bottom respectively, by most left
The object pixel on side and the object pixel of rightmost do vertical vertical line L2, two horizontal linear L1 and two institutes respectively
It is the boundary rectangle to state vertical vertical line L2 area defined.
5. according to any pin of optical device welding quality detection methods of claim 1-4, which is characterized in that close the position
System includes the angle between the line of the distance between each described central point and each central point.
6. a kind of pin of optical device Welding quality test device, which is characterized in that the detection including being used to place optical device (10)
Camera bellows (1), the first camera (21) and processor (3), first camera (21) are set to the detection camera bellows (1)
It is interior, and be electrically connected with the processor (3)；
First camera (21) is used to obtain the image information at the pin welding position of optical device (10)；
The processor (3) is used to carry out binary conversion treatment to described image information to obtain binary image information；Described in search
Object pixel in binary image information obtains and is located at owning in described image information by what the object pixel was formed
Connected region；Obtain the corresponding boundary rectangle of each connected region；According to the size of standard welding pin to the external square
Shape is screened, obtain with the welding pin of optical device multiple target boundary rectangles correspondingly, calculate separately each mesh
The center point coordinate for marking boundary rectangle, the position relationship between each central point is calculated according to each center point coordinate；By institute
The normal place relationship templates stated between position relationship and optical device (10) each pin are compared, when the comparison error of the two exists
The pin welding of judgement optical device (10) is qualified when setting within error range.
7. pin of optical device Welding quality test device according to claim 6, which is characterized in that further include feeding material component,
The feeding material component includes pedestal (4), sliding rail (5), motor (6), material disc (7) and limit sensors (8)；
The detection camera bellows (1) and sliding rail (5) are mounted on the pedestal (4), and the sliding rail (5) is arranged in the detection
In camera bellows (1), and the detection camera bellows (1) is stretched out outside in the both ends of the sliding rail (5)；The material disc (7) is along the sliding rail (5)
Glide direction be set on the sliding rail, and for placing optical device (10)；The limit sensors (8) are installed on the cunning
The side of rail (5), and the sliding scale for limiting the sliding rail (5)；The motor (6) is sequentially connected with the sliding rail (5),
And the sliding rail (5) is driven to slide；The motor (6) and the limit sensors (8) are electrically connected with the processor (3)
It connects.
8. pin of optical device Welding quality test device according to claim 7, which is characterized in that further include be set to it is described
Holder (9) in detection camera bellows (1) for installing first camera (21), the holder (9) are arch, the holder
(9) both ends are both secured on the pedestal (4), and the both ends of the holder (9) are respectively arranged at the two of the sliding rail (5)
Side, first camera (21) are installed on the madial wall of the holder (9).
9. pin of optical device Welding quality test device according to claim 6, which is characterized in that further include light for identification
The second camera (22) of device (10) identity, the second camera (22) are set in the detection camera bellows (1), and
It is electrically connected with the processor (3).
10. according to any pin of optical device Welding quality test devices of claim 6-9, which is characterized in that described first
Camera (21) is two, and two first cameras (21) may be contained in the detection camera bellows (1), two described first
Camera (21) is electrically connected with the processor (3), and two first cameras (21) are respectively used to shooting optical device
(10) the pin welding image of both sides.
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| CN201810427468.7A CN108426891A (en) | 2018-05-07 | 2018-05-07 | A kind of pin of optical device welding quality detection method and device |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109839385A (en) * | 2019-03-04 | 2019-06-04 | 佛山市南海区广工大数控装备协同创新研究院 | A kind of adaptive pcb board defective vision detection and localization and categorizing system |
| CN111054660A (en) * | 2019-12-27 | 2020-04-24 | 绍兴中科通信设备有限公司 | Detection device of optical device TO press-connection machine in 100G optical module and control method thereof |
| CN111185406A (en) * | 2019-09-03 | 2020-05-22 | 北京瑞诚联众科技有限公司 | Image-based welding spot detection method |
| CN114993964A (en) * | 2022-05-31 | 2022-09-02 | 苏州浪潮智能科技有限公司 | Component bottom pin welding detection method |
| CN116309568A (en) * | 2023-05-18 | 2023-06-23 | 深圳恒邦新创科技有限公司 | Chip soldering leg welding quality detection method and system |
| CN117274246A (en) * | 2023-11-17 | 2023-12-22 | 深圳市大族封测科技股份有限公司 | Bonding pad identification method, computer equipment and storage medium |
| CN117630041A (en) * | 2023-12-06 | 2024-03-01 | 江苏科睿坦电子科技有限公司 | RFID chip welding quality detection method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04309299A (en) * | 1991-04-08 | 1992-10-30 | Nippon Avionics Co Ltd | Method and apparatus for collecting positioning information of electronic component |
| JPH08285785A (en) * | 1995-04-14 | 1996-11-01 | Seiwa Denki Kk | Soldering inspection apparatus |
| KR101377032B1 (en) * | 2013-04-11 | 2014-03-25 | 이춘식 | Apparatus for eccentricity inspecting of base plate using flexible printed circuit board |
| CN103745475A (en) * | 2014-01-22 | 2014-04-23 | 哈尔滨工业大学 | Detection and positioning method used for spherical pin element |
| CN103761534A (en) * | 2014-01-22 | 2014-04-30 | 哈尔滨工业大学 | Method for detecting vision localization of QFP element |
| CN205175664U (en) * | 2015-11-26 | 2016-04-20 | 上海维锐智能科技有限公司 | Photoelectric detection system of LED charactron |
-
2018
- 2018-05-07 CN CN201810427468.7A patent/CN108426891A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04309299A (en) * | 1991-04-08 | 1992-10-30 | Nippon Avionics Co Ltd | Method and apparatus for collecting positioning information of electronic component |
| JPH08285785A (en) * | 1995-04-14 | 1996-11-01 | Seiwa Denki Kk | Soldering inspection apparatus |
| KR101377032B1 (en) * | 2013-04-11 | 2014-03-25 | 이춘식 | Apparatus for eccentricity inspecting of base plate using flexible printed circuit board |
| CN103745475A (en) * | 2014-01-22 | 2014-04-23 | 哈尔滨工业大学 | Detection and positioning method used for spherical pin element |
| CN103761534A (en) * | 2014-01-22 | 2014-04-30 | 哈尔滨工业大学 | Method for detecting vision localization of QFP element |
| CN205175664U (en) * | 2015-11-26 | 2016-04-20 | 上海维锐智能科技有限公司 | Photoelectric detection system of LED charactron |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109839385A (en) * | 2019-03-04 | 2019-06-04 | 佛山市南海区广工大数控装备协同创新研究院 | A kind of adaptive pcb board defective vision detection and localization and categorizing system |
| CN111185406A (en) * | 2019-09-03 | 2020-05-22 | 北京瑞诚联众科技有限公司 | Image-based welding spot detection method |
| CN111054660A (en) * | 2019-12-27 | 2020-04-24 | 绍兴中科通信设备有限公司 | Detection device of optical device TO press-connection machine in 100G optical module and control method thereof |
| CN111054660B (en) * | 2019-12-27 | 2024-02-23 | 绍兴中科通信设备有限公司 | Detection device of optical device TO crimping machine in 100G optical module and control method thereof |
| CN114993964A (en) * | 2022-05-31 | 2022-09-02 | 苏州浪潮智能科技有限公司 | Component bottom pin welding detection method |
| CN114993964B (en) * | 2022-05-31 | 2024-01-12 | 苏州浪潮智能科技有限公司 | Welding detection method for pins at bottom of component |
| CN116309568A (en) * | 2023-05-18 | 2023-06-23 | 深圳恒邦新创科技有限公司 | Chip soldering leg welding quality detection method and system |
| CN117274246A (en) * | 2023-11-17 | 2023-12-22 | 深圳市大族封测科技股份有限公司 | Bonding pad identification method, computer equipment and storage medium |
| CN117274246B (en) * | 2023-11-17 | 2024-02-20 | 深圳市大族封测科技股份有限公司 | Bonding pad identification method, computer equipment and storage medium |
| CN117630041A (en) * | 2023-12-06 | 2024-03-01 | 江苏科睿坦电子科技有限公司 | RFID chip welding quality detection method |
| CN117630041B (en) * | 2023-12-06 | 2024-05-10 | 江苏科睿坦电子科技有限公司 | RFID chip welding quality detection method |
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