CN108426891A - A kind of pin of optical device welding quality detection method and device - Google Patents
A kind of pin of optical device welding quality detection method and device Download PDFInfo
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Abstract
The present invention relates to a kind of pin of optical device welding quality detection methods, include the following steps：The image information at the pin welding position of optical device is obtained, and binary conversion treatment is carried out to image information and obtains binary image information；The object pixel in binary image information is searched for, all connected regions being located in image information being made of object pixel are obtained；Obtain the corresponding boundary rectangle of each connected region；Boundary rectangle is screened according to the size of standard welding pin, it obtains and the welding pin of optical device multiple target boundary rectangles correspondingly, the center point coordinate for calculating separately each target boundary rectangle calculates the position relationship between each central point according to each center point coordinate；Normal place relationship templates between position relationship and each pin of optical device are compared, when setting within error range, the pin of judgement optical device welds qualification to the comparison error of the two.Detection method provided by the invention is efficient, accuracy rate is high.
Description
Technical Field
The invention relates to the technical field of optical device detection, in particular to a method and a device for detecting the welding quality of an optical device pin.
Background
In the prior art, pin welding detection of an optical device, especially pin welding detection of an optical transceiver module, is manually completed and is in a manual or semi-automatic detection state, the cost of the link is high, the accuracy of one-time detection is low, and the detection efficiency is low.
Disclosure of Invention
The invention aims to solve the technical problem of the prior art, and provides a method and a device for detecting the welding quality of a pin of an optical device.
The technical scheme for solving the technical problems is as follows: a method for detecting the welding quality of an optical device pin comprises the following steps:
s1, acquiring image information at the pin welding position of the optical device, and performing binarization processing on the image information to obtain binarized image information;
step S2, searching target pixels in the binarized image information, and acquiring all connected regions which are formed by the target pixels and are located in the image information;
step S3, acquiring a circumscribed rectangle corresponding to each connected region;
s4, screening the circumscribed rectangles according to the size of a standard welding pin to obtain a plurality of target circumscribed rectangles corresponding to the welding pin of the optical device one by one, respectively calculating the center point coordinates of each target circumscribed rectangle, and calculating the position relation between the center points according to each center point coordinate;
and step S5, comparing the position relation with a standard position relation template among the pins of the optical device, and judging that the pins of the optical device are welded qualified when the comparison error of the position relation and the standard position relation template is within a set error range.
The method for detecting the welding quality of the optical device pin has the beneficial effects that: the method for detecting the welding quality of the pins of the optical device can automatically complete scanning and detection of the welding quality of the pins of the optical device, analyze image information by using an image recognition technology, intelligently screen out the optical device with poor welding, reduce labor cost and improve detection efficiency and accuracy.
On the basis of the technical scheme, the invention can be further improved as follows:
further: the step S2 specifically includes:
step S21, judging whether the pixels in the binarized image information are target pixels one by one, extracting the target pixels adjacent to each other, and combining the target pixels adjacent to each other to obtain the connected region;
and step S22, marking the connected region.
The beneficial effects of the further scheme are as follows: and the connected region is marked, so that the connected region can be identified and extracted quickly.
Further: judging whether the pixel in the binarized image information is a target pixel specifically comprises:
step S211, judging whether the pixel in the binarized image information is a pixel corresponding to a welding spot, if so, turning to step S212, otherwise, judging that the pixel is not a target pixel;
step S212, determining whether the left pixel, the upper pixel, and the upper left pixel of the pixel are pixels corresponding to the welding point, if at least one of the left pixel, the upper pixel, and the upper left pixel is a pixel corresponding to the welding point, determining that the pixel is the target pixel, otherwise determining that the pixel is not the target pixel.
The beneficial effects of the further scheme are as follows: and shrinking the target pixels through shrinking operation, so that the connected regions formed by the target pixels are shrunk to the upper left corner, and each connected region is isolated and separated, thereby facilitating subsequent analysis and screening.
Further: the step S3 specifically includes:
step S31, acquiring the uppermost target pixel, the lowermost target pixel, the leftmost target pixel and the rightmost target pixel in the connected region;
step S32, a horizontal straight line L1 is respectively drawn by the uppermost target pixel and the lowermost target pixel, a vertical perpendicular line L2 is respectively drawn by the leftmost target pixel and the rightmost target pixel, and an area surrounded by the two horizontal straight lines L1 and the two vertical perpendicular lines L2 is the circumscribed rectangle.
The beneficial effects of the further scheme are as follows: the external rectangle of the communicated region is obtained, comparison with the standard welding pins is facilitated, and effective screening of the external rectangle is facilitated.
Further: the position relationship comprises the distance between the central points and the included angle between the connecting lines of the central points.
The beneficial effects of the further scheme are as follows: and judging whether the position of the welding spot is correct or not according to the position relation between the central points, and further judging whether the quality of the welding spot is qualified or not.
The invention also provides a device for detecting the welding quality of the pins of the optical device, which comprises a detection camera box for placing the optical device, a first camera and a processor, wherein the first camera is arranged in the detection camera box and is electrically connected with the processor;
the first camera is used for acquiring image information at a pin welding position of the optical device;
the processor is used for carrying out binarization processing on the image information to obtain binarized image information; searching target pixels in the binarized image information, and acquiring all connected regions which are formed by the target pixels and are located in the image information; acquiring a circumscribed rectangle corresponding to each connected region; screening the circumscribed rectangles according to the size of a standard welding pin to obtain a plurality of target circumscribed rectangles which are in one-to-one correspondence with the welding pin of the optical device, respectively calculating the coordinates of the central points of the target circumscribed rectangles, and calculating the position relation between the central points according to the coordinates of the central points; and comparing the position relation with a standard position relation template among the pins of the optical device, and judging that the pins of the optical device are welded qualified when the comparison error of the position relation and the standard position relation template is within a set error range.
The device for detecting the welding quality of the pins of the optical device has the advantages that: the optical device pin welding quality detection device is based on an optical device pin welding quality detection method, so that the optical device pin welding quality detection method has the beneficial effects that the optical device pin welding quality detection device also has, and the details are not repeated herein.
On the basis of the technical scheme, the invention can be further improved as follows:
further: the optical device pin welding quality detection device also comprises a feeding assembly, wherein the feeding assembly comprises a base, a slide rail, a motor, a material disc and a limiting sensor;
the detection camera bellows and the slide rail are both arranged on the base, the slide rail penetrates through the detection camera bellows, and two ends of the slide rail extend out of the detection camera bellows; the material disc is arranged on the slide rail along the sliding direction of the slide rail and is used for placing an optical device; the limiting sensor is arranged on the side surface of the sliding rail and used for limiting the sliding range of the sliding rail; the motor is in transmission connection with the slide rail and drives the slide rail to slide; the motor and the limit sensor are electrically connected with the processor.
The beneficial effects of the further scheme are as follows: and a feeding component is added to realize automatic feeding and automatic discharging of the optical device, so that the automation of the whole process of feeding, detecting and discharging is realized.
Further: the detection device for the welding quality of the pins of the optical device further comprises a support, wherein the support is arranged in the detection camera box and used for installing the first camera, the support is arched, the two ends of the support are fixed on the base, the two ends of the support are respectively arranged on the two sides of the sliding rail, and the first camera is arranged on the inner side wall of the support.
The beneficial effects of the further scheme are as follows: the support is striden and is stood on the slide rail, does not contact with the slide rail, is favorable to keeping the stability of support, makes things convenient for the camera to shoot the optical device on the slide rail simultaneously.
Further: the detection device for the welding quality of the pins of the optical devices further comprises a second camera for identifying the identity of the optical devices, and the second camera is arranged in the detection camera bellows and is electrically connected with the processor.
The beneficial effects of the further scheme are as follows: the second camera is used for identifying the identity of the optical device, such as a two-dimensional code, a bar code and the like, and the identity identification result and the detection result are simultaneously fed back to the user, so that the user can conveniently identify the detection result of each optical device.
Further: the first cameras are two and are arranged in the detection camera bellows, the first cameras are electrically connected with the processor, and the first cameras are respectively used for shooting pin welding images on two sides of the optical device.
The beneficial effects of the further scheme are as follows: the two first cameras are used for shooting the pin welding images on the two sides of the optical device respectively, and meanwhile shooting and identifying are carried out, so that the detection efficiency is higher.
Drawings
FIG. 1 is a flow chart of a method for detecting the soldering quality of an optical device pin according to the present invention;
FIG. 2 is a schematic diagram of a target pixel determination of a method for detecting a soldering quality of a pin of an optical device according to the present invention;
FIG. 3 is a schematic diagram of an external rectangle obtained by the method for detecting the welding quality of the optical device pin according to the present invention;
FIG. 4 is a schematic diagram of an external structure of an optical device pin welding quality detection apparatus provided in the present invention;
fig. 5 is a schematic view of an internal structure of the device for detecting the soldering quality of the optical device pin according to the present invention.
In the drawings, the components represented by the respective reference numerals are listed below:
1. the device comprises a detection camera bellows, a first camera 21, a second camera 22, a processor 3, a base 4, a base 5, a slide rail 6, a motor 7, a material tray 8, a limit sensor 9, a support 10, an optical device, L1, a horizontal straight line, L2 and a vertical line.
Detailed Description
The principles and features of this invention are described below in conjunction with the following drawings, which are set forth by way of illustration only and are not intended to limit the scope of the invention.
The present invention will be described with reference to the accompanying drawings.
The embodiment of the invention provides a method for detecting the welding quality of a pin of an optical device, which is hereinafter referred to as a detection method for short, and as shown in figure 1, the method comprises the following steps:
s1, acquiring image information at the pin welding position of the optical device, and performing binarization processing on the image information to obtain binarized image information;
step S2, searching target pixels in the binarized image information, and acquiring all connected regions which are formed by the target pixels and are located in the image information;
step S3, acquiring a circumscribed rectangle corresponding to each connected region;
s4, screening the circumscribed rectangles according to the size of a standard welding pin to obtain a plurality of target circumscribed rectangles corresponding to the welding pin of the optical device one by one, respectively calculating the center point coordinates of each target circumscribed rectangle, and calculating the position relation between the center points according to each center point coordinate;
and step S5, comparing the position relation with a standard position relation template among the pins of the optical device, and judging that the pins of the optical device are welded qualified when the comparison error of the position relation and the standard position relation template is within a set error range.
The detection method provided by the embodiment includes the steps of firstly shooting an image at a pin welding position to obtain image information, and conducting binarization processing on the image information to obtain binarization image information, wherein the pixel types of the binarization image information are few, so that a processor can conveniently identify and process the binarization image information. And acquiring the connected region of the target pixel, and screening scattered single invalid target pixels. The shape diverse of connected region is unfavorable for discerning it and screening, consequently acquires connected region's external rectangle, and is regular connected region, subsequent screening and central point of being convenient for calculate. And screening the external rectangle through the length-width ratio of the standard welding pin to obtain a target external rectangle corresponding to the shape of the welding pin, so as to realize the shape verification of the external rectangle. And finally, calculating the coordinates and the position relation of the central point of each target circumscribed rectangle, verifying the position relation of each target circumscribed rectangle, namely verifying the welding position of each pin, and finally judging whether the pin is welded qualified according to the verification result of the position relation.
Specifically, the standard soldering pins are standard objects for shape comparison, and noise is removed according to the size of the standard soldering pins, for example, the aspect ratio of the standard soldering pins, so as to obtain a target circumscribed rectangle. In the detection of the pin welding of the optical transceiver integrated component, the external rectangle of the communicating region which is not qualified is usually removed by adopting the length-width ratio of 3 x 3 or 3 x 4.
The detection method provided by the embodiment effectively eliminates scattered invalid target pixels, extracts effective features in the binarized image information, and further performs double verification, namely shape verification and position relation verification, on the features to finally obtain a detection result. Therefore, the detection method provided by the invention not only has high detection efficiency, but also has high detection accuracy.
The detection method provided by the invention adopts image processing and recognition detection technology, can automatically complete the quality detection of the welding of the pins of the optical device, eliminates detection errors caused by factors such as artificial fatigue and the like, and has detection efficiency and detection accuracy which are far better than those of artificial detection.
Preferably, the step S2 specifically includes:
step S21, judging whether the pixels in the binarized image information are target pixels one by one, extracting the target pixels adjacent to each other, and combining the target pixels adjacent to each other to obtain the connected region;
and step S22, marking the connected region.
Different labels are marked on different communication areas, so that the identification and extraction of the different communication areas are facilitated, and each communication area is isolated and separated through the different labels, so that the subsequent screening and calculation work is facilitated.
Preferably, the determining whether the pixel in the binarized image information is the target pixel specifically includes:
step S211, judging whether the pixel in the binarized image information is a pixel corresponding to a welding spot, if so, turning to step S212, otherwise, judging that the pixel is not a target pixel;
step S212, determining whether the left pixel, the upper pixel, and the upper left pixel of the pixel are pixels corresponding to the welding point, if at least one of the left pixel, the upper pixel, and the upper left pixel is a pixel corresponding to the welding point, determining that the pixel is the target pixel, otherwise determining that the pixel is not the target pixel.
For example, the following steps are carried out: the white pixel in the binarized image information is represented by "1", the black pixel is represented by "0", the pixel corresponding to the welding point is the white pixel, the target pixel is judged by the embodiment, the binarized image information is searched, when the pixel with the value of "1" is encountered, whether the values of the left pixel, the upper pixel and the upper left pixel of the pixel are "1" or not is judged, and when at least one of the left pixel, the upper pixel and the upper left pixel is "1", the pixel can be judged as the target pixel and is kept as the value of "1".
In conjunction with fig. 2, this puncturing operation can be described by the following recursive relationship:
f(n,l)＝h(h(f(n,l-1)+f(n,l)+f(n+1,l)-1)+h(f(n,1))+f(n+1,l-1))
wherein,f (n, l) denotes the pixel of the ith row and ith column, f (n, l-1) is the left pixel of f (n, l), f (n +1, l) is the upper pixel of f (n, l), and f (n +1, l-1) is the upper left pixel of f (n, l).
And repeatedly scanning the binary image information by using the formula so that the connected region is contracted to the upper left corner of the boundary.
Preferably, as shown in fig. 3, the step S3 specifically includes:
step S31, acquiring the uppermost target pixel, the lowermost target pixel, the leftmost target pixel and the rightmost target pixel in the connected region;
step S32, a horizontal straight line L1 is respectively drawn by the uppermost target pixel and the lowermost target pixel, a vertical perpendicular line L2 is respectively drawn by the leftmost target pixel and the rightmost target pixel, and an area surrounded by the two horizontal straight lines L1 and the two vertical perpendicular lines L2 is the circumscribed rectangle.
The external rectangle of the communicated region is obtained, and the shape of the rectangular region is easy to describe, calculate and compare, so that the subsequent screening work is facilitated, and meanwhile, the calculation work of the subsequent central point is facilitated.
Preferably, the position relationship includes a distance between the central points and an included angle between connecting lines of the central points.
The position of each pin welding point can be ensured to be accurate and correct through the verification of the position relation, and excessive deviation is avoided.
The embodiment of the invention also provides a device for detecting the welding quality of the pins of the optical device, which is hereinafter referred to as a detection device for short, and as shown in fig. 4, the device comprises a detection camera 1 for placing the optical device 10, a first camera 21 and a processor 3, wherein the first camera 21 is arranged in the detection camera 1 and is electrically connected with the processor 3;
the first camera 21 is used for acquiring image information at a pin welding position of the optical device 10;
the processor 3 is used for performing binarization processing on the image information to obtain binarized image information; searching target pixels in the binarized image information, and acquiring all connected regions which are formed by the target pixels and are located in the image information; acquiring a circumscribed rectangle corresponding to each connected region; screening the circumscribed rectangles according to the size of a standard welding pin to obtain a plurality of target circumscribed rectangles which are in one-to-one correspondence with the welding pin of the optical device, respectively calculating the coordinates of the central points of the target circumscribed rectangles, and calculating the position relation between the central points according to the coordinates of the central points; and comparing the position relation with a standard position relation template between the pins of the optical device 10, and judging that the pins of the optical device 10 are welded qualified when the comparison error of the position relation and the standard position relation template is within a set error range.
Specifically, the detection camera bellows 1 provides a stable shooting environment for the first camera 21, so that the shooting quality of images at the pin welding positions is improved, and subsequent image identification and processing are facilitated.
The detection device provided by the invention is based on the detection method, so that the detection device has the same beneficial effects of the detection method, and the description is omitted here.
Preferably, as shown in fig. 4, the detection device further comprises a feeding assembly, wherein the feeding assembly comprises a base 4, a slide rail 5, a motor 6, a material tray 7 and a limit sensor 8;
the detection camera bellows 1 and the slide rail 5 are both arranged on the base 4, the slide rail 5 is arranged in the detection camera bellows 1 in a penetrating manner, and two ends of the slide rail 5 extend out of the detection camera bellows 1; the material tray 7 is arranged on the slide rail along the sliding direction of the slide rail 5 and is used for placing the optical device 10; the limit sensor 8 is mounted on the side surface of the slide rail 5 and used for limiting the sliding range of the slide rail 5; the motor 6 is in transmission connection with the slide rail 5 and drives the slide rail 5 to slide; the motor 6 and the limit sensor 8 are electrically connected with the processor 3.
In the embodiment, a feeding assembly is added, specifically, in the embodiment, the total length of the sliding rail 5 is 700mm, the sliding rail 5 is made of aluminum material, the surface is anodized, the sliding rail 5 is installed on the base 4 through an installation frame, the installation frame is formed by splicing the aluminum material, and the base can be made of a carbon steel sealing plate so as to ensure the integral aesthetic property of the detection device; rubber software is pasted on the bottom surface of the base, so that the detection table top is protected. The conveyer belt of slide rail 5 adopts the antistatic antiskid belt of grass green PVC material. And (5) performing plastic spraying treatment on all sheet metal parts. Still can set up emergency stop button, emergency stop button is connected with treater 3 electricity to realize the emergency stop of slide rail 5, install emergency stop button on the base or the side of testing workbench, conveniently press emergency stop button when emergency appears in the equipment fast. Treater 3, motor 6 and spacing sensor 8 all can set up and detect camera bellows 1 in, detect camera bellows 1 treater 3, motor 6 and spacing sensor 8 and play the guard action.
After the feeding assembly is added, the detection device only needs to arrange an assembly worker to discharge materials and unload materials, all the other work can be automatically completed by the detection device, and the operation flow of the detection device is as follows: an assembler respectively puts a group of welded optical devices on the material tray 7 in the same direction, then places the material tray 7 on the slide rail 5, switches on a power supply of the detection equipment and presses a start button to start. The slide rail 5 automatically sends the material tray 7 to the detection camera 1, and image shooting, processing and detection recognition are automatically carried out when the material tray passes through the first camera 21. After the detection is finished, the slide rail 5 sends the material tray 7 out of the detection camera bellows 1, and the detection result is fed back in time. And the assembly worker takes out the detected optical devices from the material tray 7, screens the optical devices according to the detection result, and places the next group of optical devices.
The automatic feeding and automatic discharging of the optical device are realized by the feeding assembly, so that the automation of the whole process of feeding, detecting and discharging of the optical device is realized, the labor cost is reduced, and the feeding and discharging speed and the detecting speed are improved.
Preferably, as shown in fig. 5, the detection device further includes a support 9 disposed in the detection camera 1 and used for mounting the first camera 21, the support 9 is arched, two ends of the support 9 are fixed on the base 4, two ends of the support 9 are respectively disposed on two sides of the sliding rail 5, and the first camera 21 is mounted on an inner side wall of the support 9.
The support 9 provides a stable support for the camera, so that the first camera 21 cannot shake during shooting, the shooting effect is better, and subsequent image recognition and processing are facilitated.
Preferably, as shown in fig. 5, the detection apparatus further includes a second camera 22 for identifying the identity of the optical device 10, and the second camera 22 is disposed in the detection camera 1 and electrically connected to the processor 3.
The optical device 10 is attached with an identification label, the identification table label can be a two-dimensional code, a bar code and the like, the identification label is scanned through the second camera 22, and the detection result and the identification information of the optical device are synchronously fed back to a detector, so that the detection result of the optical device 10 can be conveniently identified and the optical device can be conveniently screened.
Preferably, as shown in fig. 5, there are two first cameras 21, two first cameras 21 are disposed in the detection dark box 1, two first cameras 21 are electrically connected to the processor 3, and the two first cameras 21 are respectively used for capturing pin welding images on two sides of the optical device 10.
The two first cameras 21 are used for shooting the pin welding images on the two sides of the optical device 10 at the same time, and the processor 3 performs identification processing at the same time, so that the speed of identification and detection is increased.
Specifically, two cameras 21 may be respectively mounted at two ends of the bracket 9, and two first cameras 21 are both mounted at one side of the bracket 9 facing the slide rail 5. The second camera 22 is mounted on the top end of the bracket 9 and is also mounted on the side of the bracket 9 facing the slide rail 5. The installation of the two first cameras 21 and the second camera 22 is realized through the support 9, the mechanical structure is simplified, the simultaneous shooting of the two first cameras 21 and the second camera 22 is realized, the synchronous processing of the processor 3 is realized, and the detection efficiency is improved.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (10)
1. The method for detecting the welding quality of the optical device pin is characterized by comprising the following steps of:
s1, acquiring image information at the pin welding position of the optical device, and performing binarization processing on the image information to obtain binarized image information;
step S2, searching target pixels in the binarized image information, and acquiring all connected regions which are formed by the target pixels and are positioned in the image corresponding to the image information;
step S3, acquiring a circumscribed rectangle corresponding to each connected region;
s4, screening the circumscribed rectangles according to the size of a standard welding pin to obtain a plurality of target circumscribed rectangles corresponding to the welding pin of the optical device one by one, respectively calculating the center point coordinates of each target circumscribed rectangle, and calculating the position relation between the center points according to each center point coordinate;
and step S5, comparing the position relation with a standard position relation template among the pins of the optical device, and judging that the pins of the optical device are welded qualified when the comparison error of the position relation and the standard position relation template is within a set error range.
2. The method for detecting the soldering quality of the optical device pin according to claim 1, wherein the step S2 specifically includes:
step S21, judging whether the pixels in the binarized image information are target pixels one by one, extracting the target pixels adjacent to each other, and combining the target pixels adjacent to each other to obtain the connected region;
and step S22, marking the connected region.
3. The method for detecting the welding quality of the optical device pin according to claim 2, wherein the step of judging whether the pixel in the binarized image information is a target pixel specifically comprises the steps of:
step S211, judging whether the pixel in the binarized image information is a pixel corresponding to a welding spot, if so, turning to step S212, otherwise, judging that the pixel is not a target pixel;
step S212, determining whether the left pixel, the upper pixel, and the upper left pixel of the pixel are pixels corresponding to the welding point, if at least one of the left pixel, the upper pixel, and the upper left pixel is a pixel corresponding to the welding point, determining that the pixel is the target pixel, otherwise determining that the pixel is not the target pixel.
4. The method for detecting the soldering quality of the optical device pin according to claim 1, wherein the step S3 specifically includes:
step S31, acquiring the uppermost target pixel, the lowermost target pixel, the leftmost target pixel and the rightmost target pixel in the connected region;
step S32, a horizontal straight line L1 is respectively drawn by the uppermost target pixel and the lowermost target pixel, a vertical perpendicular line L2 is respectively drawn by the leftmost target pixel and the rightmost target pixel, and an area surrounded by the two horizontal straight lines L1 and the two vertical perpendicular lines L2 is the circumscribed rectangle.
5. The method for detecting the soldering quality of an optical device pin according to any one of claims 1 to 4, wherein the positional relationship includes a distance between the central points and an angle between connecting lines of the central points.
6. The device for detecting the welding quality of the pins of the optical device is characterized by comprising a detection camera bellows (1) for placing the optical device (10), a first camera (21) and a processor (3), wherein the first camera (21) is arranged in the detection camera bellows (1) and is electrically connected with the processor (3);
the first camera (21) is used for acquiring image information at a pin welding position of the optical device (10);
the processor (3) is used for carrying out binarization processing on the image information to obtain binarized image information; searching target pixels in the binarized image information, and acquiring all connected regions which are formed by the target pixels and are located in the image information; acquiring a circumscribed rectangle corresponding to each connected region; screening the circumscribed rectangles according to the size of a standard welding pin to obtain a plurality of target circumscribed rectangles which are in one-to-one correspondence with the welding pin of the optical device, respectively calculating the coordinates of the central points of the target circumscribed rectangles, and calculating the position relation between the central points according to the coordinates of the central points; and comparing the position relation with a standard position relation template among the pins of the optical device (10), and judging that the pins of the optical device (10) are welded qualified when the comparison error of the position relation and the standard position relation template is within a set error range.
7. The device for detecting the welding quality of the pins of the optical device according to claim 6, further comprising a feeding assembly, wherein the feeding assembly comprises a base (4), a sliding rail (5), a motor (6), a material tray (7) and a limit sensor (8);
the detection camera bellows (1) and the slide rail (5) are both arranged on the base (4), the slide rail (5) penetrates through the detection camera bellows (1), and two ends of the slide rail (5) extend out of the detection camera bellows (1); the material tray (7) is arranged on the slide rail along the sliding direction of the slide rail (5) and is used for placing an optical device (10); the limiting sensor (8) is arranged on the side surface of the sliding rail (5) and is used for limiting the sliding range of the sliding rail (5); the motor (6) is in transmission connection with the sliding rail (5) and drives the sliding rail (5) to slide; the motor (6) and the limit sensor (8) are electrically connected with the processor (3).
8. The device for detecting the pin soldering quality of the optical device according to claim 7, further comprising a bracket (9) disposed in the detection camera box (1) and used for mounting the first camera (21), wherein the bracket (9) is arched, two ends of the bracket (9) are fixed on the base (4), two ends of the bracket (9) are disposed on two sides of the sliding rail (5), and the first camera (21) is mounted on an inner side wall of the bracket (9).
9. The device for detecting the welding quality of the pins of the optical devices as claimed in claim 6, further comprising a second camera (22) for identifying the identity of the optical devices (10), wherein the second camera (22) is disposed in the detection camera chamber (1) and electrically connected to the processor (3).
10. The device for detecting the pin soldering quality of an optical device according to any one of claims 6 to 9, wherein there are two first cameras (21), two first cameras (21) are disposed in the dark box (1), two first cameras (21) are electrically connected to the processor (3), and the two first cameras (21) are respectively used for capturing pin soldering images of two sides of the optical device (10).
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109839385A (en) * | 2019-03-04 | 2019-06-04 | 佛山市南海区广工大数控装备协同创新研究院 | A kind of adaptive pcb board defective vision detection and localization and categorizing system |
| CN111054660A (en) * | 2019-12-27 | 2020-04-24 | 绍兴中科通信设备有限公司 | Detection device of optical device TO press-connection machine in 100G optical module and control method thereof |
| CN111185406A (en) * | 2019-09-03 | 2020-05-22 | 北京瑞诚联众科技有限公司 | Image-based welding spot detection method |
| CN114993964A (en) * | 2022-05-31 | 2022-09-02 | 苏州浪潮智能科技有限公司 | Component bottom pin welding detection method |
| CN116309568A (en) * | 2023-05-18 | 2023-06-23 | 深圳恒邦新创科技有限公司 | Chip soldering leg welding quality detection method and system |
| CN117274246A (en) * | 2023-11-17 | 2023-12-22 | 深圳市大族封测科技股份有限公司 | Bonding pad identification method, computer equipment and storage medium |
| CN117630041A (en) * | 2023-12-06 | 2024-03-01 | 江苏科睿坦电子科技有限公司 | RFID chip welding quality detection method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04309299A (en) * | 1991-04-08 | 1992-10-30 | Nippon Avionics Co Ltd | Method and apparatus for collecting positioning information of electronic component |
| JPH08285785A (en) * | 1995-04-14 | 1996-11-01 | Seiwa Denki Kk | Soldering inspection apparatus |
| KR101377032B1 (en) * | 2013-04-11 | 2014-03-25 | 이춘식 | Apparatus for eccentricity inspecting of base plate using flexible printed circuit board |
| CN103745475A (en) * | 2014-01-22 | 2014-04-23 | 哈尔滨工业大学 | Detection and positioning method used for spherical pin element |
| CN103761534A (en) * | 2014-01-22 | 2014-04-30 | 哈尔滨工业大学 | Method for detecting vision localization of QFP element |
| CN205175664U (en) * | 2015-11-26 | 2016-04-20 | 上海维锐智能科技有限公司 | Photoelectric detection system of LED charactron |
-
2018
- 2018-05-07 CN CN201810427468.7A patent/CN108426891A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04309299A (en) * | 1991-04-08 | 1992-10-30 | Nippon Avionics Co Ltd | Method and apparatus for collecting positioning information of electronic component |
| JPH08285785A (en) * | 1995-04-14 | 1996-11-01 | Seiwa Denki Kk | Soldering inspection apparatus |
| KR101377032B1 (en) * | 2013-04-11 | 2014-03-25 | 이춘식 | Apparatus for eccentricity inspecting of base plate using flexible printed circuit board |
| CN103745475A (en) * | 2014-01-22 | 2014-04-23 | 哈尔滨工业大学 | Detection and positioning method used for spherical pin element |
| CN103761534A (en) * | 2014-01-22 | 2014-04-30 | 哈尔滨工业大学 | Method for detecting vision localization of QFP element |
| CN205175664U (en) * | 2015-11-26 | 2016-04-20 | 上海维锐智能科技有限公司 | Photoelectric detection system of LED charactron |
Non-Patent Citations (1)
| Title |
|---|
| 刘禾: "《数字图像处理及应用》", 31 January 2006, 中国电力出版社, pages: 150 - 151 * |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109839385A (en) * | 2019-03-04 | 2019-06-04 | 佛山市南海区广工大数控装备协同创新研究院 | A kind of adaptive pcb board defective vision detection and localization and categorizing system |
| CN111185406A (en) * | 2019-09-03 | 2020-05-22 | 北京瑞诚联众科技有限公司 | Image-based welding spot detection method |
| CN111054660A (en) * | 2019-12-27 | 2020-04-24 | 绍兴中科通信设备有限公司 | Detection device of optical device TO press-connection machine in 100G optical module and control method thereof |
| CN111054660B (en) * | 2019-12-27 | 2024-02-23 | 绍兴中科通信设备有限公司 | Detection device of optical device TO crimping machine in 100G optical module and control method thereof |
| CN114993964A (en) * | 2022-05-31 | 2022-09-02 | 苏州浪潮智能科技有限公司 | Component bottom pin welding detection method |
| CN114993964B (en) * | 2022-05-31 | 2024-01-12 | 苏州浪潮智能科技有限公司 | Welding detection method for pins at bottom of component |
| CN116309568A (en) * | 2023-05-18 | 2023-06-23 | 深圳恒邦新创科技有限公司 | Chip soldering leg welding quality detection method and system |
| CN117274246A (en) * | 2023-11-17 | 2023-12-22 | 深圳市大族封测科技股份有限公司 | Bonding pad identification method, computer equipment and storage medium |
| CN117274246B (en) * | 2023-11-17 | 2024-02-20 | 深圳市大族封测科技股份有限公司 | Bonding pad identification method, computer equipment and storage medium |
| CN117630041A (en) * | 2023-12-06 | 2024-03-01 | 江苏科睿坦电子科技有限公司 | RFID chip welding quality detection method |
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