CN108407119B - Monocrystalline silicon rod processing device - Google Patents
Monocrystalline silicon rod processing device Download PDFInfo
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- CN108407119B CN108407119B CN201810453697.6A CN201810453697A CN108407119B CN 108407119 B CN108407119 B CN 108407119B CN 201810453697 A CN201810453697 A CN 201810453697A CN 108407119 B CN108407119 B CN 108407119B
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- monocrystalline silicon
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- 229910021421 monocrystalline silicon Inorganic materials 0.000 title claims abstract description 153
- 238000012545 processing Methods 0.000 title claims abstract description 55
- 230000007246 mechanism Effects 0.000 claims abstract description 245
- 238000005520 cutting process Methods 0.000 claims abstract description 97
- 239000000463 material Substances 0.000 claims abstract description 60
- 230000001939 inductive effect Effects 0.000 claims abstract description 30
- 238000001514 detection method Methods 0.000 claims abstract description 13
- 239000013078 crystal Substances 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims abstract description 9
- 230000008569 process Effects 0.000 claims abstract description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 86
- 238000005507 spraying Methods 0.000 claims description 45
- 210000000078 claw Anatomy 0.000 claims description 34
- 229910003460 diamond Inorganic materials 0.000 claims description 33
- 239000010432 diamond Substances 0.000 claims description 33
- 230000000670 limiting effect Effects 0.000 claims description 27
- 230000000903 blocking effect Effects 0.000 claims description 20
- 239000003638 chemical reducing agent Substances 0.000 claims description 16
- 238000004804 winding Methods 0.000 claims description 15
- 238000003860 storage Methods 0.000 claims description 12
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000000926 separation method Methods 0.000 claims description 2
- 230000005540 biological transmission Effects 0.000 description 16
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 10
- 238000010586 diagram Methods 0.000 description 10
- 229910052710 silicon Inorganic materials 0.000 description 10
- 239000010703 silicon Substances 0.000 description 10
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- 241001391944 Commicarpus scandens Species 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
Abstract
The invention relates to a monocrystalline silicon rod processing device which comprises a workbench, a feeding mechanism, a tool setting and material moving mechanism and a wire saw cutting operation mechanism, wherein the tool setting and material moving mechanism comprises a sucker, a material moving mechanism and a detection mechanism, the detection mechanism comprises a connecting seat, a round nut, a sliding pin shaft, a reset spring, an inductive switch and an inductive plate, the connecting seat is in threaded connection with a material moving frame, the round nut is sleeved outside the connecting seat, one end of the sliding pin shaft is connected with the reset spring, the other end of the sliding pin shaft is connected with the inductive plate, the inductive switch is fixed on the connecting seat, the inductive end of the inductive switch is flush with the side wall of the connecting seat, the inductive plate is flush with the sucker surface after the monocrystalline silicon rod is sucked, and the wire saw cutting operation mechanism is used for processing monocrystalline silicon crystals. The feeding process of the device is simpler, the conveying speed of the monocrystalline silicon rod is high, the processing efficiency is high, the accuracy of locating the monocrystalline silicon rod and the origin is ensured through the additionally arranged detection mechanism, so that the cutting length error of the monocrystalline silicon rod is reduced, and the processing precision of the monocrystalline silicon rod is ensured.
Description
Technical Field
The invention relates to the technical field of cutting of hard and brittle materials, in particular to a monocrystalline silicon rod processing device.
Background
In chinese patent literature, publication No. CN107443601a, it discloses a single crystal bar cuts cutting equipment, and it includes the frame, can slide the single crystal bar material feeding unit of operation on the chassis, installs the cutting frame on the chassis, installs the coping saw cutting mechanism in the cutting frame, can slide single crystal bar support top device, get feeding robot and skip on the chassis, its main points lie in: on the supporting roller assembly fixed base, clamping jaws of two movable clamping units are located above the supporting rollers, the clamping units can penetrate through the space below the cutting machine frame, the wire saw cutting mechanism is single-section cutting, the servo motor drives the speed reducer to drive the gear and the rack to be meshed to achieve movement of the bar floating supporting device, and the material taking robot is located on the side face of the bar floating supporting device. The device has the following disadvantages:
(1) The monocrystalline silicon rod is self-centering clamped by the clamping jaws of the two groups of movable clamping units, and the following steps must be repeated every time a cutting action is performed: the clamping unit loosens the monocrystalline silicon rod and places on the roller assembly, moves the clamping unit to the appointed position, clamps the monocrystalline silicon rod again and breaks away from the roller assembly, drives the monocrystalline silicon rod again to the appointed cutting position, tedious operation can greatly reduce the work efficiency of equipment, and the reduction output does not disclose how to carry out the school sword in this equipment in addition to guarantee the cutting accuracy of monocrystalline silicon rod, and traditional cutting school sword is through manual observation or the mode of acting as go-between location, school sword inefficiency, and cutting accuracy is low, leads to the fact great influence to the machining accuracy of monocrystalline silicon rod easily.
(2) The clamping force for supporting the monocrystalline bar is provided by the cylinder of the bar floating supporting device, the cylinder needs to keep the ejection position unchanged until cutting is completed after ejection, and the clamping force is influenced by unstable air source pressure, leakage pressure loss of an air supply pipeline and gravity change of the monocrystalline silicon bar after cutting, so that displacement of the monocrystalline bar can be caused, and the cutting quality is influenced.
(3) The existing spraying device for carrying out cold cutting and chip cleaning on the annular diamond wire saw is arranged at the edge of a cutting window of a cutting operation mechanism, is far away from a monocrystalline silicon rod when cutting is started, and cold cutting water is impacted to splash around the monocrystalline silicon rod in the rear direction, so that the working environment is not beneficial to environmental protection.
Disclosure of Invention
Therefore, it is necessary to provide a single crystal silicon rod processing device to solve the problems of complicated feeding, low efficiency, large single crystal silicon rod cutting length error and low processing precision in the working process of the existing single crystal silicon rod processing device.
In order to achieve the above object, the inventors provide a single crystal silicon rod processing apparatus comprising a workbench, a feeding mechanism, a tool setting and moving mechanism and a wire saw cutting operation mechanism;
the top surface of the workbench is provided with a plurality of roller mechanisms which are axially arranged along the workbench;
The feeding mechanism comprises a clamping mechanism and a conveying mechanism, wherein the clamping mechanism is used for clamping the monocrystalline silicon rod, the conveying mechanism comprises a conveying frame and a first driving mechanism, the clamping mechanism is fixed on the conveying frame, and the first driving mechanism is used for driving the conveying frame to axially move along the workbench;
the tool setting and material moving mechanism comprises a sucker, a material moving mechanism and a detection mechanism, wherein the material moving mechanism comprises a material moving frame and a second driving mechanism, the second driving mechanism is used for driving the material moving frame to axially move along a workbench, the sucker is fixed on the material moving frame and is used for being attached to one end face of a monocrystalline silicon rod, the detection mechanism comprises a connecting seat, a round nut, a sliding pin shaft, a reset spring, an inductive switch and an inductive plate, the connecting seat is in threaded connection with the material moving frame, the round nut is sleeved outside the connecting seat, a containing hole is formed in the connecting seat, the reset spring is located in the containing hole, one end of the sliding pin shaft is connected with the reset spring, the other end of the sliding pin shaft is connected with the inductive plate, the inductive switch is fixed on the connecting seat, the inductive end of the inductive switch is flush with the side wall of the connecting seat, and the inductive plate is flush with the suction plate face after the monocrystalline silicon rod is tightly sucked;
The wire saw cutting operation mechanism comprises a frame, a wire saw cutting unit and a lifting mechanism, wherein the wire saw cutting unit is located above the workbench and is fixed with the frame through the lifting mechanism, and the lifting mechanism drives the wire saw cutting unit to process monocrystalline silicon crystals.
As a preferable structure of the invention, the connecting seat comprises a fixed seat and a sliding seat, the fixed seat is in threaded connection with the material moving frame, the sliding seat is in sliding sleeve joint with the fixed seat, the fixed seat and the sliding seat are internally provided with containing holes, the sliding seat is communicated with the fixed seat, the reset spring is positioned in the containing hole of the fixed seat, one end of the sliding pin is connected with the reset spring, the other end of the sliding pin is connected with the sensing plate, and the sensing switch is fixed on the sliding seat.
As an optimized structure of the tool setting and material moving mechanism, the tool setting and material moving mechanism further comprises a clamping workpiece, the clamping workpiece is fixed on a material moving frame, the clamping workpiece is respectively positioned at two sides of a sucker, the clamping workpiece comprises a clamping seat, a first cylinder and a second cylinder, a cylinder body of the first cylinder is fixed on the side wall of the clamping seat, a telescopic rod of the first cylinder penetrates through the clamping seat, a jacking block is fixed at one end of the telescopic rod penetrating through the clamping seat, a circular telescopic shield is sleeved outside the telescopic rod between the jacking block and the side wall of the clamping seat, a cylinder body of the second cylinder is fixed on the side wall of the clamping seat, the telescopic rod of the second cylinder is telescopic to abut against or separate from the telescopic rod of the first cylinder, and the telescopic rods of the first cylinder of the clamping workpiece positioned at two sides of the sucker are all arranged towards the sucker.
As a preferable structure of the invention, the clamping mechanism comprises a first claw seat, a second claw seat, claws and a telescopic piece, wherein the first claw seat and the second claw seat are of arc structures, one end of the first claw seat is hinged with one end of the telescopic piece, the other end of the first claw seat is fixedly provided with the claws, one end of the second claw seat is hinged with the other end of the telescopic piece, the other end of the second claw seat is fixedly provided with the claws, the first claw seat and the second claw seat are connected with the conveying frame through supporting columns, and the first claw seat and the second claw seat can rotate around the connecting positions of the supporting columns.
As a preferable structure of the invention, the roller mechanism comprises a U-shaped roller support frame, a connecting rod and rollers, wherein the U-shaped roller support frame is fixedly connected with the top surface of the workbench, the rollers are fixed in U-shaped grooves of the roller support frame through the connecting rod, the rollers can rotate around the connecting rod, a plurality of roller mechanisms are axially arranged into two groups along the top surface of the workbench, the two groups of roller mechanisms are symmetrically arranged on the top surface of the workbench, and an included angle formed by extension lines of central lines of the rollers in the two groups of roller mechanisms is 30-60 degrees.
As an optimal structure of the invention, the top surface of the workbench is also provided with a plurality of clamping workpieces, the clamping workpieces are axially arranged into two groups along the top surface of the workbench, and the two groups of clamping workpieces are collinear with the two groups of roller mechanisms.
As an optimized structure of the invention, the wire saw cutting operation mechanism is a gantry type annular diamond wire saw cutting mechanism, the gantry type annular diamond wire saw cutting mechanism comprises a portal frame, an annular diamond wire saw cutting unit and a lifting mechanism, the annular diamond wire saw cutting unit comprises a gear train mounting panel, a guide wheel assembly and an annular diamond wire saw, the annular diamond wire saw is arranged in a guide wheel wire groove of the guide wheel assembly, the lifting mechanism comprises a lifting motor, a lifting speed reducer, a lifting screw and a lifting nut, the lifting motor is arranged on a cross beam of the portal frame, the lifting motor is connected with the lifting screw through the lifting speed reducer, the lifting motor is used for driving the lifting screw to rotate, the lifting nut is sleeved on the lifting screw, and the gear train mounting panel is fixed with the lifting nut.
As a preferable structure of the invention, the processing device further comprises a movable spraying mechanism, the movable spraying mechanism comprises a moving mechanism and a spraying mechanism, the spraying mechanism comprises a water storage tank, a water supply pipe, a water spraying tank, a limiting side plate and a water retaining brush, the water storage tank is provided with a water inlet hole, the water supply pipe is communicated with the water storage tank and the water spraying tank, a bottom plate of the water spraying tank is provided with a plurality of water spraying holes, both front side surfaces and both rear side surfaces of the water spraying tank are respectively provided with a limiting side plate, the bottom end of each limiting side plate is provided with an arc notch, and both left side surfaces and right side surfaces of the water spraying tank are respectively provided with the water retaining brush.
As a preferable structure of the invention, the processing device further comprises a telescopic water retaining mechanism, the telescopic water retaining mechanism comprises a winding mechanism and a water retaining curtain sheet, one end of the water retaining curtain sheet is fixed with the workbench, and the other end of the water retaining curtain sheet is wound in the winding mechanism.
As an optimal structure of the invention, the processing device further comprises a manual slice taking tool, the manual slice taking tool comprises a magnetic gauge stand, a universal support arm and a slice sucker, one end of the universal support arm is connected with the magnetic gauge stand, the other end of the universal support arm is connected with the slice sucker, the manual slice taking tool is positioned on a workbench, and the slice sucker is used for the end face of a monocrystalline silicon rod to be sliced.
Compared with the prior art, the technical scheme has the following advantages: according to the monocrystalline silicon rod processing device, firstly, the monocrystalline silicon rod is clamped and fixed through the clamping mechanism, then the monocrystalline silicon rod to be processed is conveyed to the cutter setting and material moving mechanism through the conveying mechanism, the clamping mechanism releases the monocrystalline silicon rod, then only one end face of the monocrystalline silicon rod is required to be sucked by the sucker, the monocrystalline silicon rod is dragged to a designated cutting position through the material moving mechanism, after the first cutting work is finished, the cutter setting and material moving mechanism is repeatedly used to drag the monocrystalline silicon rod, so that the feeding can be finished, the feeding process is simpler, the conveying speed of the monocrystalline silicon rod is high, and the processing efficiency is high; in addition, when the sucker completely absorbs the end face of the monocrystalline silicon rod, the cutting origin of the monocrystalline silicon rod is determined, and the accuracy of locating the monocrystalline silicon rod and the origin is ensured through the additionally arranged detection mechanism, so that the cutting length error of the monocrystalline silicon rod is reduced, and the machining precision of the monocrystalline silicon rod is ensured.
Drawings
FIG. 1 is a schematic diagram showing an oblique view of an apparatus for processing a silicon single crystal rod according to an embodiment of the present invention;
FIG. 2 is a schematic diagram showing a structure of a feed mechanism of a single crystal silicon rod processing apparatus according to an embodiment of the present invention in a perspective view;
FIG. 3 is a schematic diagram showing a perspective view of an embodiment of a tool setting and shifting mechanism of the single crystal silicon rod processing apparatus according to the present invention;
FIG. 4 is a schematic diagram showing an oblique view of one embodiment of a clamping workpiece of the apparatus for processing a silicon single crystal rod according to the present invention;
FIG. 5 is a schematic diagram showing a structure of a detecting mechanism of a single crystal silicon rod processing apparatus according to an embodiment of the present invention;
FIG. 6 is a schematic cross-sectional view of an embodiment of a detecting mechanism of a single crystal silicon rod processing apparatus of the present invention;
FIG. 7 is a schematic side view of a working table of a single crystal silicon rod processing apparatus according to an embodiment of the present invention;
FIG. 8 is a schematic view showing a front view of an embodiment of a wire saw cutting operation mechanism of the single crystal silicon rod processing apparatus of the present invention;
FIG. 9 is a schematic view showing a rear view of an embodiment of a wire saw cutting operation mechanism of the single crystal silicon rod processing apparatus of the present invention;
FIG. 10 is a schematic diagram showing an oblique view of an embodiment of a roller mechanism of a single crystal silicon rod processing apparatus according to the present invention;
FIG. 11 is a schematic diagram showing a structure of a movable shower mechanism of a single crystal silicon rod processing apparatus according to an embodiment of the present invention in a perspective view;
FIG. 12 is a schematic diagram showing a perspective view of an embodiment of a telescopic water blocking mechanism of a single crystal silicon rod processing apparatus according to the present invention;
FIG. 13 is a schematic diagram showing an oblique view of an embodiment of a manual wafer-taking tool of the single crystal silicon rod processing apparatus of the present invention;
FIG. 14 is a schematic view showing a structure of a single crystal silicon rod processing apparatus according to another embodiment of the present invention;
FIG. 15 is a schematic diagram showing a structure of a feed mechanism of a single crystal silicon rod processing apparatus according to another embodiment of the present invention in a perspective view;
FIG. 16 is a schematic perspective view of another embodiment of a tool setting and shifting mechanism of the single crystal silicon rod processing apparatus of the present invention.
Reference numerals illustrate:
1. a work table; 11. a boss;
2. a feeding mechanism;
211. a first jaw seat; 212. a second jaw seat; 213. a claw; 214. a telescoping member; 215. a support column; 216. a support plate;
221. a carriage; 222. a first driving mechanism; 2221. a servo motor; 2222. a transmission gear; 2223. a drive rack; 2224. a speed reducer; 2225. a linear guide rail; 2226. a slide block;
3. a tool setting and material moving mechanism;
31. a suction cup;
321. a material moving frame; 322. a second driving mechanism;
33. a detection mechanism; 331. a fixing seat; 332. a sliding seat; 333. a round nut; 334. sliding pin shafts; 335. a return spring; 336. an inductive switch; 337. an induction plate;
34. Clamping a workpiece; 341. clamping base; 342. a first cylinder; 343. a second cylinder; 344. a tightening block; 345. a circular telescopic shield;
4. a wire saw cutting operation mechanism;
41. a portal frame;
42. an annular diamond wire saw cutting unit; 421. a wheel train mounting panel; 422. a guide wheel assembly; 423. an annular diamond wire saw;
431. lifting the motor; 432. lifting a speed reducer; 433. lifting the screw; 434. lifting the nut; 435. lifting the guide rail; 436. lifting the sliding block;
5. a roller mechanism; 51. u-shaped roller support frames; 52. a connecting rod; 53. a roller;
6. a single crystal silicon rod;
7. a movable spraying mechanism;
71. a moving mechanism;
721. a water storage tank; 722. a water supply pipe; 723. a water spray tank; 724. a limit side plate; 725. a water retaining brush;
73. a mounting bracket;
8. a telescopic water retaining mechanism; 81. a winding mechanism; 82. a water blocking curtain sheet;
9. manually taking a piece tool; 91. a magnetic gauge stand; 92. a universal support arm; 93. and a slice sucker.
Detailed Description
In order to describe the technical content, constructional features, achieved objects and effects of the technical solution in detail, the following description is made in connection with the specific embodiments in conjunction with the accompanying drawings.
Referring to fig. 1 to 16, the invention provides a single crystal silicon rod processing device, which comprises a workbench 1, a feeding mechanism 2, a tool setting and moving mechanism 3 and a wire saw cutting running mechanism 4;
The workbench 1 is used as a bearing structure of a single crystal silicon rod 6 to be processed, and the movement and the processing of the single crystal silicon rod 6 are completed on the workbench 1. Specifically, a plurality of roller mechanisms 5 are disposed on the top surface of the workbench 1, and the plurality of roller mechanisms 5 are axially arranged along the workbench 1. The roller mechanism 5 is directly contacted with the monocrystalline silicon rod 6, and the monocrystalline silicon rod 6 slides along the roller surface in the roller mechanism 5, so that the monocrystalline silicon rod 6 moves more smoothly.
As shown in fig. 2, the feeding mechanism 2 serves as one of the feeding mechanisms of the present apparatus, and the single crystal silicon rod 6 placed on the table 1 is first conveyed by the feeding mechanism 2 to the next unit to approach a designated processing position. Specifically, the feeding mechanism 2 comprises a clamping mechanism and a conveying mechanism, the clamping mechanism is used for clamping the monocrystalline silicon rod 6, the conveying mechanism comprises a conveying frame 221 and a first driving mechanism 222, the clamping mechanism is fixed on the conveying frame 221, and the first driving mechanism 222 is used for driving the conveying frame 221 to axially move along the workbench 1. The conveying frame 221 is used as a mounting frame of a clamping mechanism, and the first driving mechanism 222 drives the conveying frame 221 to move so as to drive the clamping mechanism for clamping the monocrystalline silicon rod 6 to move, thereby achieving the effect of moving the monocrystalline silicon rod 6 to be processed.
As shown in fig. 3, the tool setting and moving mechanism 3 serves as a further feeding mechanism of the device, which not only plays a role in moving the monocrystalline silicon rod 6 to a designated processing position, but also plays a role in tool setting and calibrating, so that the accuracy of the processing origin of the monocrystalline silicon rod 6 is ensured, and the processing precision of the monocrystalline silicon rod is ensured. Specifically, tool setting moves material mechanism 3 includes sucking disc 31, moves material mechanism and detection mechanism 33, move material mechanism and include moving work or material rest 321 and second actuating mechanism 322, second actuating mechanism 322 is used for driving and moves work or material rest 321 along workstation 1 axial motion, sucking disc 31 is fixed on moving work or material rest 321, and sucking disc 31 is used for pasting and inhales on the terminal surface of monocrystalline silicon stick 6, detection mechanism 33 includes connecting seat, round nut, slip round pin axle 334, reset spring 335, inductive switch 336 and sensing plate 337, threaded connection between connecting seat and the work or material rest 321, round nut cover is located outside the connecting seat, has seted up the holding hole on the connecting seat, reset spring 335 is arranged in the holding hole, reset spring 335 is connected to slip round pin axle 334 one end, and inductive plate 337 is connected to the other end, inductive switch 336 is fixed on the connecting seat, and inductive end of inductive switch 336 flushes with the lateral wall of connecting seat, inductive plate 337 flushes with sucking disc 31 after inhaling monocrystalline silicon stick 6. In the device, the feeding mechanism 2 firstly conveys the monocrystalline silicon rod 6 forwards until the front end face of the monocrystalline silicon rod 6 is attached to the sucker 31, at the moment, the clamping mechanism releases the monocrystalline silicon rod 6, the feeding mechanism 2 returns to the initial position until the next cutting operation is participated in when the next monocrystalline silicon rod 6 is clamped, at the moment, the position of the sucker 31 which completely sucks the front end face of the monocrystalline silicon rod 6 is used as the origin of the cutting length, the monocrystalline silicon rod 6 sucked on the sucker 31 is driven to move forwards through the movement of the material moving mechanism, when the material moving mechanism moves to the designated position, the cutting operation is started, and in the cutter setting displacement mechanism, the cutting length of the monocrystalline silicon rod 6 is completely accurate because the origin of the cutting length is determined, and the determination of the cutting length is more efficient by adopting the structure, so that the processing efficiency of the whole device is provided. Please refer to fig. 5 and 6. In order to further improve the cutting length precision of the monocrystalline silicon rod 6, the detecting mechanism 33 is further arranged in the tool setting and material moving mechanism 3 so as to ensure the accuracy of the length origin of the cutting gauge, specifically, in the detecting mechanism 33, the sensing plate 337 is flush with the surface of the sucker 31 after the sucker 31 sucks the monocrystalline silicon rod 6, when the sucker 31 does not suck the monocrystalline silicon rod 6, the sensing plate 337 should be in front of the sucker 31, the monocrystalline silicon rod 6 first impacts the sensing plate 337, the sensing plate 337 moves backwards, when the front end surface of the monocrystalline silicon rod 6 impacts the sucker 31 and is completely sucked by the sucker 31, the sensing plate 337 is flush with the surface of the sucker 31, at the moment, the sensing plate 337 contacts the contact type sensing switch 336 backwards, the sensing switch 336 is lightened so as to ensure the accuracy of positioning of the monocrystalline silicon rod 6 and the origin, thereby reducing the cutting length error of the monocrystalline silicon rod 6, ensuring the processing precision thereof, and after the monocrystalline silicon rod 6 is separated from the sucker 31, under the action of the reset spring 335, the sensing plate 337 returns to the initial state so as to perform the next calibration work. When the inductive switch 336 is on and the suction cup 31 does not drive the monocrystalline silicon rod 6 to move, or the monocrystalline silicon rod 6 is dragged by the suction cup 31, the inductive switch 336 does not react, which indicates that the monocrystalline silicon rod 6 and the origin are positioned to have errors, then the cutting length fixing precision is reduced, at the moment, the position of the connecting seat is adjusted, the depth of the connecting screw lock into the material moving frame 321 is adjusted to adjust the position of the induction plate 337, the suction cup 31 surface after the monocrystalline silicon rod 6 is sucked is flush with the induction plate 337, the accuracy of the cutting length origin of the monocrystalline silicon rod 6 is determined, and after the position of the induction plate 337 is adjusted by the rotating connecting seat, the round nut sleeved outside the connecting seat is used for locking. Preferably, the suction cup 31 is circular, and the center of the suction cup 31 arranged on the material moving frame 321 corresponds to the center of the monocrystalline silicon rod 6.
The wire saw cutting operation mechanism 4 is used as a component for specifically executing a cutting function of the device, and executes a slicing or cutting function on the single crystal silicon rod 6 to be processed. Specifically, the wire saw cutting operation mechanism 4 comprises a frame, a wire saw cutting unit and a lifting mechanism, wherein the wire saw cutting unit is located above the workbench 1 and is fixed with the frame through the lifting mechanism, and the lifting mechanism drives the wire saw cutting unit to process monocrystalline silicon crystals.
Referring to fig. 5 and 6, as a preferred embodiment of the present invention, the connecting seat includes a fixed seat 331 and a sliding seat 332, the fixed seat 331 is in threaded connection with the material moving frame 321, the sliding seat 332 is in sliding connection with the fixed seat 331, the fixed seat 331 and the sliding seat 332 are provided with accommodating holes, the sliding seat 332 is communicated with the fixed seat 331, the return spring 335 is located in the accommodating hole of the fixed seat 331, one end of the sliding pin 334 is connected with the return spring 335, the other end is connected with the sensing plate 337, and the sensing switch 336 is fixed on the sliding seat 332. The fixed seat 331 is used as a direct connection structure between the detection mechanism 33 and the material moving frame 321, and the purpose of dividing the connection seat into the fixed seat 331 and the sliding seat 332 is as follows: when an error exists in the length origin of the cutting gauge, the front and back positions of the sensing plate 337 need to be adjusted, that is, the depth of the screw lock into the material moving rack 321 on the fixing seat 331 is adjusted, because of the sliding connection adopted between the sliding seat 332 and the fixing seat 331, when the fixing seat 331 rotates to adjust the locking depth, the position of the sliding seat 332 in the radial direction is unchanged, and then the relative position of the sensing switch 336 fixed on the sliding seat 332 and the sensing plate 337 is unchanged, so that the normal detection work of the sensing switch 336 is prevented from being influenced. In a specific embodiment, the connection between the sliding pin 334 and the return spring 335 may be that one end of the sliding pin 334 directly abuts against one end of the return spring 335, or the sliding pin 334 stretches into the internal rotation cavity of the return spring 335, and a limiting protrusion provided on the sliding pin 334 abuts against one end of the return spring 335. Preferably, the sensing plate 337 is made of plastic material, which is that the sensing plate 337 affects the quality of the single crystal silicon rod 6, because the silicon crystal is in direct contact with the ferrous material, which is most likely to have magnetic permeability, resulting in complicating the magnetic field fringe effect of the silicon wafer, thereby affecting the quality of the silicon crystal block after dicing.
Referring to fig. 3 and 4, as a preferred embodiment of the present invention, the tool setting and moving mechanism 3 further includes a clamping workpiece 34, the clamping workpiece 34 is fixed on the moving frame 321, the clamping workpiece 34 is respectively located at two sides of the suction cup 31, the clamping workpiece 34 includes a clamping seat 341, a first cylinder 342 and a second cylinder 343, a cylinder body of the first cylinder 342 is fixed on a side wall of the clamping seat 341, a telescopic rod of the first cylinder 342 penetrates through the clamping seat 341, a tightening block 344 is fixed at one end of the telescopic rod penetrating through the clamping seat 341, a circular telescopic shield 345 is sleeved outside the telescopic rod between the tightening block 344 and the side wall of the clamping seat 341, a cylinder body of the second cylinder 343 is fixed on the side wall of the clamping seat 341, the telescopic rod of the second cylinder 343 is in telescopic abutment or separation with the telescopic rod of the first cylinder 342, and the telescopic rods of the first cylinder 342 located at two sides of the suction cup 31 are all arranged towards the suction cup 31. The clamping workpiece 34 is used for clamping and fixing the monocrystalline silicon rod 6 when the monocrystalline silicon rod 6 is cut, specifically, the telescopic rod of the first cylinder 342 stretches to drive the jacking block 344 to lean against the monocrystalline silicon rod 6, then the telescopic rod of the second cylinder 343 stretches to press the telescopic cylinder of the first cylinder 342, the clamping workpiece 34 on two sides of the sucker 31 clamps the monocrystalline silicon rod 6, and stability of the monocrystalline silicon rod 6 during cutting is guaranteed. Preferably, the included angle formed by two telescopic rods for clamping the workpiece 34 on two sides of the suction disc 31 is 60-100 degrees. Preferably, the center of the through hole of the clamping seat 341 for installing the telescopic rod of the first cylinder 342 is deviated from the center of the clamping seat 341 and is located at the far end of the installation surface of the second cylinder 343, the telescopic rod of the second cylinder 343 is perpendicular to the telescopic rod of the first cylinder 342, the installation position of the second cylinder 343 is close to the ejection end, and the structure enables the pressure applied to the telescopic rod of the first cylinder 342 by the second cylinder 343 to be larger and the friction force to be more stable. With the clamping workpiece 34 with the structure, the second cylinder 343 of the clamping workpiece 34 can be converted into larger friction force on the telescopic rod of the first cylinder 342 with smaller ejection pressure, so that the shaking of the monocrystalline silicon rod 6 in the cutting process caused by unstable air source pressure of the cylinder can be greatly reduced, and the occurrence of edge breakage or wave surface can be further caused, so that the cutting quality of the monocrystalline silicon rod 6 can be ensured; after the monocrystalline silicon rod 6 is cut off, the retracted jacking block for clamping the workpiece, the monocrystalline silicon rod 6 falls on the roller mechanism 5, and the sucker 31 on the automatic tool setting and material moving mechanism 3 drives the monocrystalline silicon rod 6 to move to a discharging area, so that the degree of automation is high, and the processing quality is high.
In the embodiment shown in fig. 2 and 3, the first driving mechanism 222 and the second driving mechanism 322 each include a servo motor 2221, a transmission gear 2222, and a transmission rack 2223, the transmission rack 2223 is disposed on a side wall of the table 1, and the transmission gear 2222 is meshed with the transmission rack 2223. In the first driving mechanism 222, an output shaft of the servo motor 2221 penetrates through the conveying frame 221 and is connected with the transmission gear 2222, the servo motor 2221 is started, the output shaft of the servo motor 2221 drives the transmission gear 2222 meshed with the output shaft to rotate, and the transmission gear 2222 drives the conveying frame 221 to perform linear motion along the transmission rack 2223. In the second driving mechanism 322, an output shaft of the servo motor 2221 penetrates through the material moving rack 321 and is connected with the transmission gear 2222, the servo motor 2221 is started, the output shaft of the servo motor 2221 drives the transmission gear 2222 meshed with the servo motor 2221 to rotate, and the transmission gear 2222 rotates to drive the material moving rack 321 to perform linear motion along the transmission rack 2223. Preferably, a speed reducer 2224 is further disposed between the servo motor 2221 and the transmission gear 2222, and the speed reducer 2224 is configured to reduce the high rotation speed output by the servo motor 2221 and then output the reduced high rotation speed through the output shaft. By adopting the driving mechanism, the structure is ingenious, the manufacturing is simpler, the driving mechanism is wholly arranged on the side edge of the workbench 1, and the maintenance is convenient. Preferably, the first driving mechanism 222 and the second driving mechanism 322 are disposed on two sides of the table 1, respectively. Preferably, the workbench 1 is further provided with a linear guide rail 2225, and the material moving frame 321 and the conveying frame 221 adapted to the linear guide rail 2226 are provided to ensure that the material moving frame 321 and the conveying frame 221 move more stably. Referring to fig. 14 and 16, in some other embodiments, the driving mechanism adopts a ball screw transmission, the workbench 1 is in a groove structure, two sides of the workbench 1 are provided with through grooves for the conveying frame 221 and the material moving frame 321 to pass through and move, preferably, the driving mechanism comprises a moving guide rail, a sliding block 2226, a screw nut, a ball screw, a servo motor 2221 and a speed reducer 2224, the servo motor 2221 is connected with the speed reducer 2224, an output shaft of the speed reducer 2224 is connected with the ball screw, the screw nut is sleeved on the ball screw and is fixed with the mounting frame, the sliding block 2226 is arranged below the mounting frame, the linear guide rail 2225 is axially arranged along the workbench 1, and the sliding block 2226 can slide along the linear guide rail 2225. In particular, the mounting frame may be a carriage 221 or a material moving frame 321, i.e. the driving mechanism may be used for both the feeding mechanism 2 and the tool setting and material moving mechanism 3.
Referring to fig. 2, as a preferred embodiment of the present invention, the clamping mechanism includes a first jaw seat 211, a second jaw seat 212, a jaw 213 and a telescopic member 214, wherein the first jaw seat 211 and the second jaw seat 212 are both in an arc structure, one end of the first jaw seat 211 is hinged with one end of the telescopic member 214, the other end of the first jaw seat 211 is fixed with the jaw 213, one end of the second jaw seat 212 is hinged with the other end of the telescopic member 214, the other end of the second jaw seat 212 is fixed with the jaw 213, the first jaw seat 211 and the second jaw seat 212 are both connected with the conveying frame 221 through a supporting column 215, and the first jaw seat 211 and the second jaw seat 212 can rotate around the joint with the supporting column 215. In this embodiment, the extension of the telescopic member 214 drives the first jaw seat 211 and the second jaw seat 212 fixed on the conveying frame 221 to rotate inwards around the supporting column 215, the first jaw 213 and the second jaw 213 are close to each other to shrink the clamping cavity of the clamping mechanism, and meanwhile, the jaw 213 fixed at the opening end of the jaw 213 seat is shrunk, so that the clamping mechanism can clamp the monocrystalline silicon rod 6 on the workbench 1, and when the telescopic member 214 is shrunk, the first jaw seat and the second jaw seat 212 are separated from each other to release the monocrystalline silicon rod 6, so that the clamping mechanism is very simple and convenient to clamp and fix the monocrystalline silicon rod 6. Preferably, the telescopic member 214 may be an electric cylinder, a hydraulic cylinder or a linear motor. Preferably, a soft pad is further arranged on the contact surface of the claw 213 and the monocrystalline silicon rod 6, and the soft pad is made of polyurethane material. Preferably, the clamping mechanism further comprises a supporting plate 216, two ends of the supporting plate 216 are hinged and fixed with the side walls of the first jaw seat 211 and the second jaw seat 212 respectively, and the supporting plate 216 is used for improving structural rigidity and firmness of the whole clamping mechanism. Referring to fig. 14 and 15, in some other embodiments, the clamping mechanism includes a clamping frame, a telescopic cylinder and a limiting clamping plate, the clamping frame is in a "u" structure, the limiting clamping plate is pivotally hinged on two side walls of the clamping frame, one end of the telescopic cylinder is fixed on the clamping frame, and the other end of the telescopic cylinder is fixed with the bottom end of the limiting clamping plate. The expansion rod of the expansion device cylinder stretches to drive the limiting clamping plates on the two sides to retract downwards, and the limiting clamping plates are matched with the jacking cylinder on the clamping frame to clamp the monocrystalline silicon rod 6.
Referring to the drawings, as a preferred embodiment of the present invention, the roller mechanism 5 includes a U-shaped roller support frame 51, a connecting rod 52 and a roller 53, wherein the U-shaped roller support frame 51 is fixedly connected with the top surface of the table 1, the roller 53 is fixed in a U-shaped groove of the roller support frame via the connecting rod 52, the roller 53 can rotate around the connecting rod, the plurality of roller mechanisms 5 are axially arranged in two groups along the top surface of the table 1, the two groups of roller mechanisms 5 are symmetrically arranged on the top surface of the table 1, and an included angle formed by extension lines of center lines of the rollers 53 in the two groups of roller mechanisms 5 is 30-60 °. The roller on the surface of the workbench 1 is set to be of the structure, the roller 53 is installed relatively simply, a roller installation hole is not required to be formed in the workbench 1, the complex installation process is omitted, the roller 53 is worn, only the roller support frame where the worn roller 53 is arranged is required to be detached for replacement, the replacement is simple and cost is reduced, the roller is installed by adopting the roller support frame, the inclined angle of the roller support frame is only required to be controlled, and the included angle formed by the extension line of the central line of the roller is controlled conveniently, namely the clamping angle of the monocrystalline silicon rod when the monocrystalline silicon rod rolls on the roller mechanism. Preferably, the included angle formed by the extension lines of the central lines of the rollers in the two sets of roller mechanisms 5 is 30-60 degrees, and the rollers are arranged at the included angle, so that the movement of the single crystal silicon rod is more stable when the single crystal silicon rod is fed and cut on the rollers.
Referring to fig. 1, 8 and 9, as a preferred embodiment of the present invention, the wire saw cutting operation mechanism 4 is a gantry type annular diamond wire saw cutting mechanism, the gantry type annular diamond wire saw cutting mechanism includes a gantry 41, an annular diamond wire saw cutting unit 42 and a lifting mechanism, the annular diamond wire saw cutting unit 42 includes a gear train mounting panel 421, a guide wheel assembly 422 and an annular diamond wire saw 423, the annular diamond wire saw 423 is disposed in a guide wheel slot of the guide wheel assembly 422, the lifting mechanism includes a lifting motor 431, a lifting speed reducer 432, a lifting screw 433 and a lifting nut 434, the lifting motor 431 is disposed on a beam of the gantry 41, the lifting motor 431 is connected with the lifting screw 433 through the lifting speed reducer 432, the lifting motor 431 is used for driving the lifting screw 433 to rotate, the lifting nut 434 is sleeved on the lifting screw 433, and the gear train mounting panel 421 is fixed with the lifting nut 434. Preferably, the processing device further comprises a boss 11, the boss 11 is arranged at two sides of the workbench 1, and the frame is fixed on the boss 11. Specifically, the portal frame 41 includes two left and right columns and a beam connected to the top ends of the columns, the lifting motor 431 and the lifting speed reducer 432 are fixed on the beam, the wheel train mounting panel 421 of the annular diamond wire saw cutting unit 42 is fixed with the lifting nut 434, and the lifting screw 433 rotates to drive the lifting nut 434 to rise or fall. The lifting motor 431 is used for providing lifting driving force for the lifting mechanism. Preferably, the upright post is further provided with a lifting guide rail 435, and the wheel train mounting panel 421 is fixed with a lifting slider 436 adapted thereto. The lifting speed reducer 432 is used for reducing the high rotation speed output by the output shaft of the lifting motor 431 so as to slow down the lifting or descending speed of the cutting unit. The lifting screw 433 is engaged with the lifting nut 434 to convert the rotation of the lifting screw 433 into the lifting movement of the lifting nut 434. In certain other embodiments, the wiresaw cutting operation mechanism 4 may also be a wire-wound diamond wiresaw cutting mechanism.
In the embodiment shown in fig. 11, the processing apparatus further includes a mobile spraying mechanism 7, the mobile spraying mechanism 7 includes a moving mechanism 71 and a spraying mechanism, the spraying mechanism includes a water storage tank 721, a water supply pipe 722 and a water spraying tank 723, a water inlet is formed on the water storage tank 721, the water supply pipe 722 is communicated with the water storage tank 721 and the water spraying tank 723, and a plurality of water spraying holes are formed on a bottom plate of the water spraying tank 723. The movable spraying mechanism 7 can spray water in a water-cooling manner along with the cutting work of the wire saw cutting operation mechanism 4. External cooling water firstly flows into the water storage tank 721 through the water inlet hole on the water storage tank 721, then is conveyed to the water spraying tank 723 through the water conveying pipe 722, and then is sprayed into the saw kerf of the monocrystalline silicon rod 6 through a plurality of water spraying holes formed in the water spraying tank 723, so that the cutting surfaces of the diamond annular wire saw and the monocrystalline silicon rod 6 are cooled, and meanwhile cutting powder can be wetted, and the working environment is prevented from being polluted by the powder. The moving mechanism 71 has the function of lifting or lowering the water spraying tank 723 up and down and following the cutting operation mechanism so as to prevent the wire saw cutting operation mechanism 4 from interfering with the operation of the spraying mechanism. Preferably, the moving mechanism 71 may be an air cylinder, a hydraulic cylinder, or a linear motor. Preferably, the water supply pipe 722 is a steel pipe, and the number of the water supply pipes 722 is two. Preferably, the movable spraying mechanism 7 further comprises a mounting bracket 73, the mounting bracket 73 is arranged on the side surface of the beam of the portal frame 41, and the movable mechanism 71 is fixed on the mounting bracket 73.
Referring to fig. 11, as a preferred embodiment of the present invention, the spraying mechanism further includes a limiting side plate 724 and a water blocking brush 725, wherein the front and rear sides of the water spraying tank 723 are respectively provided with a limiting side plate 724, the diamond wire saw is located between the front and rear limiting side plates 724, the bottom end of the limiting side plate 724 is provided with an arc notch, and the left and right sides of the water spraying tank 723 are respectively provided with the water blocking brush 725. The limiting side plates 724 can prevent the cooling liquid sprayed out of the water spraying holes from being sprayed to other positions to cause the waste of spraying water, on the other hand, the limiting side plates 724 are further provided with arc-shaped notches matched with the shapes of the monocrystalline silicon rods 6, under the drive of the moving mechanism 71, the two limiting side plates 724 are just attached to the side surfaces of the monocrystalline silicon rods 6, at the moment, the annular diamond wire saw 423 just penetrates through the two limiting side plates 724, the annular diamond wire saw 423 cuts the monocrystalline silicon rods 6, the limiting side plates 724 reduce the possibility of edge breakage of the cuts due to the stress release of the monocrystalline silicon rods 6 when cutting, the spraying liquid limiting side plates 724 are limited, and can only be sprayed from the cuts of the monocrystalline silicon rods 6 and punched out from the two side surfaces, so that the service life of the annular diamond wire saw 423 is effectively prolonged, the cutting quality is ensured, and splashing of the spraying water is reduced. In addition, in the actual working process, the annular diamond wire saw 423 passes through the position of the water blocking brush 725, so that the water blocking brush 725 is cut into a wire saw running channel in the use process. Preferably, the limiting side plate 724 is made of nylon, which can prevent the surface of the silicon crystal material from being scratched, and does not affect the quality of the monocrystalline silicon rod 6.
Referring to fig. 1 and 14, as a preferred embodiment of the present invention, a plurality of clamping workpieces 34 are further disposed on the top surface of the table 1, and the clamping workpieces 34 are axially arranged in two groups along the top surface of the table 1, and the two groups of clamping workpieces 34 are collinear with the two groups of roller mechanisms 5. In this embodiment, the clamping workpiece 34 is used as one of the clamping and fixing devices for the monocrystalline silicon rod 6, the pushing block 344 of the clamping workpiece 34 pushes up the monocrystalline silicon rod 6, the two assembly clamping workpieces form a V-shaped corner clamping surface, and the monocrystalline silicon rod can be firmly fixed under the action of self gravity and friction force of the pushing block, so that edge breakage of the monocrystalline silicon rod in the processing process is prevented. When the monocrystalline silicon rod needs to be moved, the clamping workpiece is retracted, so that the monocrystalline silicon rod falls onto the roller mechanism, and the movement of the monocrystalline silicon rod can be conveniently realized. In the preferred embodiment, the clamping workpiece can be matched with other clamping mechanisms to fix the monocrystalline silicon rod, for example, the limiting baffle of the spraying mechanism is pressed down, so that a good limiting effect can be achieved on the monocrystalline silicon rod 6, and the clamping workpiece 34 on the top surface of the workbench 1 can be matched with the clamping workpiece 34 on the tool setting limiting mechanism to limit and fix the monocrystalline silicon rod 6 to be processed. Preferably, the workbench 1 is further provided with a yielding groove, and the yielding groove can be used for the annular diamond wire saw 423 to pass through so as to cut the monocrystalline silicon rod 6 better. In practice, the relief groove may be formed by a gap between two U-shaped roller support frames 51. Preferably, the number of the clamping workpieces 34 arranged on the top surface of the workbench 1 is at least 4, and the clamping workpieces 34 are symmetrically arranged on two sides of the yielding groove of the workbench 1 respectively, so that the limiting of the annular diamond wire saw 423 on the monocrystalline silicon rod 6 is more stable when the annular diamond wire saw 423 cuts the monocrystalline silicon rod 6.
Referring to fig. 12, as a preferred embodiment of the present invention, the processing device further includes a telescopic water blocking mechanism 8, the telescopic water blocking mechanism 8 includes a winding mechanism 81 and a water blocking curtain 82, one end of the water blocking curtain 82 is fixed to the workbench 1, and the other end of the water blocking curtain 82 is wound in the winding mechanism 81. The telescopic water blocking mechanism 8 is used for preventing splashing of spray cooling water and affecting the use environment of an operator. Specifically, the winding mechanism 81 is arranged on the cutting frame of the wire saw cutting operation mechanism 4, such as the bottom end of the wheel train mounting panel 421 of the annular diamond wire saw cutting unit 42, the winding mechanism 81 can move up and down along with the wheel train mounting panel 421, the water retaining curtain sheet 82 can wind in real time in the winding mechanism 81, and further shielding and guiding the splashing spray liquid can be achieved, so that the pollution of the splashing spray liquid to the environment is reduced. Preferably, the two sides of the top surface of the workbench 1 are provided with liquid collecting tanks. Specifically, the winding mechanism 81 includes a winding box and a rotating shaft, and one end of the water blocking curtain 82 is fixed on the rotating shaft. In other embodiments, the telescopic water blocking mechanism 8 is similar to the structure of the winding ruler, the winding mechanism 81 comprises a winding box body and a compression spring, and the water blocking curtain 82 is wound outside the compression spring.
Referring to fig. 13, as a preferred embodiment of the present invention, the processing apparatus further includes a manual slice taking tool 9, where the manual slice taking tool 9 includes a magnetic gauge stand 91, a universal support arm 92, and a slice suction cup 93, one end of the universal support arm 92 is connected to the magnetic gauge stand 91, the other end of the universal support arm 92 is connected to the slice suction cup 93, the manual slice taking tool 9 is located on the workbench 1, and the slice suction cup 93 is used for end faces of the monocrystalline silicon rods 6 to be sliced. When the slicing operation of the monocrystalline silicon rod 6 is carried out, the sucking disc 31 is adsorbed on the end face of the silicon rod to be sliced, the magnetic gauge stand 91 is adsorbed on the workbench 1, and then the magnetic universal support arm 92 is locked, so that the clamping of the silicon wafer to be sliced is completed, and after slicing is finished, the silicon wafer can be dismounted by slightly stirring one corner of the sucking disc 31. When the monocrystalline silicon rod 6 is cut off, the manual slice taking tool 9 can be placed in an area which does not affect the cutting off of the monocrystalline silicon rod 6 or the manual slice taking tool 9 can be directly taken off. The manual sheet taking work is simple in structure and extremely convenient to operate, and the problem that the silicon wafer is easy to break is completely solved. Preferably, the slice suction cup 93 is a vacuum source free suction cup 31.
It should be noted that, although the foregoing embodiments have been described herein, the scope of the present invention is not limited thereby. Therefore, based on the innovative concepts of the present invention, alterations and modifications to the embodiments described herein, or equivalent structures or equivalent flow transformations made by the present description and drawings, apply the above technical solution, directly or indirectly, to other relevant technical fields, all of which are included in the scope of the invention.
Claims (10)
1. The monocrystalline silicon rod processing device is characterized by comprising a workbench, a feeding mechanism, a tool setting and moving mechanism and a wire saw cutting operation mechanism;
the top surface of the workbench is provided with a plurality of roller mechanisms which are axially arranged along the workbench;
the feeding mechanism comprises a clamping mechanism and a conveying mechanism, wherein the clamping mechanism is used for clamping the monocrystalline silicon rod, the conveying mechanism comprises a conveying frame and a first driving mechanism, the clamping mechanism is fixed on the conveying frame, and the first driving mechanism is used for driving the conveying frame to axially move along the workbench;
the tool setting and material moving mechanism comprises a sucker, a material moving mechanism and a detection mechanism, wherein the material moving mechanism comprises a material moving frame and a second driving mechanism, the second driving mechanism is used for driving the material moving frame to axially move along a workbench, the sucker is fixed on the material moving frame and is used for being attached to one end face of a monocrystalline silicon rod, the detection mechanism comprises a connecting seat, a round nut, a sliding pin shaft, a reset spring, an inductive switch and an inductive plate, the connecting seat is in threaded connection with the material moving frame, the round nut is sleeved outside the connecting seat, a containing hole is formed in the connecting seat, the reset spring is located in the containing hole, one end of the sliding pin shaft is connected with the reset spring, the other end of the sliding pin shaft is connected with the inductive plate, the inductive switch is fixed on the connecting seat, the inductive end of the inductive switch is flush with the side wall of the connecting seat, and the inductive plate is flush with the suction plate face after the monocrystalline silicon rod is tightly sucked;
The wire saw cutting operation mechanism comprises a frame, a wire saw cutting unit and a lifting mechanism, wherein the wire saw cutting unit is located above the workbench and is fixed with the frame through the lifting mechanism, and the lifting mechanism drives the wire saw cutting unit to process monocrystalline silicon crystals.
2. The monocrystalline silicon rod processing device according to claim 1, wherein the connecting seat comprises a fixed seat and a sliding seat, the fixed seat is in threaded connection with the material moving frame, the sliding seat is in sliding sleeve connection with the fixed seat, containing holes are formed in the fixed seat and the sliding seat, the sliding seat is communicated with the fixed seat, the reset spring is located in the containing hole of the fixed seat, one end of the sliding pin is connected with the reset spring, the other end of the sliding pin is connected with the sensing plate, and the sensing switch is fixed on the sliding seat.
3. The monocrystalline silicon rod processing device according to claim 2, wherein the tool setting and material moving mechanism further comprises a clamping workpiece, the clamping workpiece is fixed on a material moving frame, the clamping workpiece is respectively located at two sides of the sucker, the clamping workpiece comprises a clamping seat, a first cylinder and a second cylinder, a cylinder body of the first cylinder is fixed on the side wall of the clamping seat, a telescopic rod of the first cylinder penetrates through the clamping seat, a tightening block is fixed at one end of the telescopic rod penetrating through the clamping seat, a circular telescopic shield is sleeved outside the telescopic rod between the tightening block and the side wall of the clamping seat, a cylinder body of the second cylinder is fixed on the side wall of the clamping seat, telescopic rods of the first cylinder of the second cylinder are in telescopic connection with or separation with telescopic rods of the first cylinder, and telescopic rods of the first cylinder of the clamping workpiece located at two sides of the sucker are all arranged towards the sucker.
4. The single crystal silicon rod processing device according to claim 1, wherein the clamping mechanism comprises a first claw seat, a second claw seat, claws and a telescopic piece, the first claw seat and the second claw seat are of arc structures, one end of the first claw seat is hinged with one end of the telescopic piece, the other end of the first claw seat is fixed with the claws, one end of the second claw seat is hinged with the other end of the telescopic piece, the other end of the second claw seat is fixed with the claws, the first claw seat and the second claw seat are connected with the conveying frame through supporting columns, and the first claw seat and the second claw seat can rotate around the joint of the first claw seat and the second claw seat with the supporting columns.
5. The single crystal silicon rod processing apparatus according to claim 1, wherein the roller mechanism comprises a U-shaped roller support frame, a connecting rod and rollers, the U-shaped roller support frame is fixedly connected with the top surface of the table, the rollers are fixed in the U-shaped groove of the roller support frame via the connecting rod, the rollers can rotate around the connecting rod, the plurality of roller mechanisms are axially arranged into two groups along the top surface of the table, the two groups of roller mechanisms are symmetrically arranged on the top surface of the table, and an included angle formed by extension lines of central lines of the rollers in the two groups of roller mechanisms is 30-60 °.
6. The apparatus of claim 5, wherein a plurality of clamping workpieces are further provided on the top surface of the table, the plurality of clamping workpieces are axially aligned in two sets along the top surface of the table, and the two sets of clamping workpieces are collinear with the two sets of roller mechanisms.
7. The monocrystalline silicon rod processing device of claim 1, wherein the wire saw cutting operation mechanism is a gantry type annular diamond wire saw cutting mechanism, the gantry type annular diamond wire saw cutting mechanism comprises a portal frame, an annular diamond wire saw cutting unit and a lifting mechanism, the annular diamond wire saw cutting unit comprises a gear train mounting panel, a guide wheel assembly and an annular diamond wire saw, the annular diamond wire saw is arranged in a guide wheel wire groove of the guide wheel assembly, the lifting mechanism comprises a lifting motor, a lifting speed reducer, a lifting screw and a lifting nut, the lifting motor is arranged on a cross beam of the portal frame, the lifting motor is connected with the lifting screw through the lifting speed reducer, the lifting motor is used for driving the lifting screw to rotate, the lifting nut is sleeved on the lifting screw, and the gear train mounting panel is fixed with the lifting nut.
8. The monocrystalline silicon rod processing device according to claim 1 or 7, further comprising a movable spraying mechanism, wherein the movable spraying mechanism comprises a moving mechanism and a spraying mechanism, the spraying mechanism comprises a water storage tank, a water supply pipe, a water spraying tank, a limiting side plate and a water retaining brush, the water storage tank is provided with a water inlet hole, the water supply pipe is communicated with the water storage tank and the water spraying tank, a bottom plate of the water spraying tank is provided with a plurality of water spraying holes, both front side surfaces and both rear side surfaces of the water spraying tank are respectively provided with a limiting side plate, the bottom end of each limiting side plate is provided with an arc notch, and both left side surfaces and right side surfaces of the water spraying tank are respectively provided with the water retaining brush.
9. The monocrystalline silicon rod processing device of claim 1, further comprising a telescopic water blocking mechanism, wherein the telescopic water blocking mechanism comprises a winding mechanism and a water blocking curtain, one end of the water blocking curtain is fixed with the workbench, and the other end of the water blocking curtain is wound in the winding mechanism.
10. The single crystal silicon rod processing device according to claim 1, further comprising a manual slice taking tool, wherein the manual slice taking tool comprises a magnetic gauge stand, a universal support arm and a slice sucker, one end of the universal support arm is connected with the magnetic gauge stand, the other end of the universal support arm is connected with the slice sucker, the manual slice taking tool is located on a workbench, and the slice sucker is used for the end face of a single crystal silicon rod to be sliced.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108407119B (en) * | 2018-05-14 | 2023-12-15 | 福州天瑞线锯科技有限公司 | Monocrystalline silicon rod processing device |
| CN109175723B (en) * | 2018-08-27 | 2020-07-31 | 扬中市惠丰包装有限公司 | Plastic pipe cutting equipment with limiting mechanism |
| CN109176198A (en) * | 2018-10-17 | 2019-01-11 | 江苏英锐半导体有限公司 | A kind of monocrystalline silicon rod milling side processing unit for wafer flow production |
| CN109397568B (en) * | 2018-11-16 | 2024-03-29 | 福州天瑞线锯科技有限公司 | Monocrystalline silicon rod squaring clamping device |
| CN109465977B (en) * | 2018-12-26 | 2024-03-29 | 福州天瑞线锯科技有限公司 | Monocrystalline silicon rod clamping device |
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