CN108405271A - A kind of LED display point glue equipment - Google Patents
A kind of LED display point glue equipment Download PDFInfo
- Publication number
- CN108405271A CN108405271A CN201810610172.9A CN201810610172A CN108405271A CN 108405271 A CN108405271 A CN 108405271A CN 201810610172 A CN201810610172 A CN 201810610172A CN 108405271 A CN108405271 A CN 108405271A
- Authority
- CN
- China
- Prior art keywords
- glue
- receiving cavity
- packing element
- heating mechanism
- dripping head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003292 glue Substances 0.000 title claims abstract description 122
- 238000012856 packing Methods 0.000 claims abstract description 37
- 238000010438 heat treatment Methods 0.000 claims abstract description 34
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 21
- 238000000151 deposition Methods 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 description 6
- 238000007759 kiss coating Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011324 bead Substances 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- -1 i.e. Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/001—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work incorporating means for heating or cooling the liquid or other fluent material
Landscapes
- Electroluminescent Light Sources (AREA)
- Led Device Packages (AREA)
- Coating Apparatus (AREA)
Abstract
The invention discloses a kind of LED display point glue equipments, including pedestal, pressure exerting arrangement, packing element, Glue dripping head and heating mechanism；The Glue dripping head includes receiving cavity and the Jiao Zui that is connected to the receiving cavity, and the receiving cavity and the packing element are installed on the pedestal；The packing element is connected by a sebific duct with the receiving cavity of the Glue dripping head, the pressure exerting arrangement is connected by a tracheae with the packing element, to press to depositing in the glue in the packing element so that the glue in the packing element is squeezed to the receiving cavity, and is squeezed out from the Jiao Zui；Wherein, the heating mechanism is mounted in the receiving cavity, the glue in the receiving cavity is heated to target temperature, by the above-mentioned means, the temperature of glue can be improved, to improve the mobility of glue.
Description
Technical field
The present invention relates to LED display technical fields, more particularly to a kind of LED display point glue equipment.
Background technology
LED display mainly by a large amount of LED light installation on circuit boards, then by circuit board driving LED light shine from
And realize display.In process of production, will after LED light installation on circuit boards, need to the edge of LED light carry out dispensing with
So that LED light is fixed on circuit boards.In order to avoid glue is directly put to influence the illumination effect of LED light in LED light,
Dispensing process is typically that dispensing is carried out between LED lamp bead, i.e., glue spots between LED light, then utilizes the flowing of glue
Property flow to the edge of LED light, to realize the fixation of LED light and circuit board.
In existing dispenser, usually first glue is stored into packing element, then squeezes to Jiao Zui and exports from packing element, so
It is influenced afterwards by dispensing speed, glue usually requires to wait for the regular hour that can just be squeezed out in packing element, and from packing element
It is also required to take some time to Jiao Zui, to which when glue is extruded from Jiao Zuizhong, the temperature of glue can decrease, and lead
It causes glue a degree of solidification occur, reduces the mobility of glue, be easy to cause dispensing process and occur drawing the feelings such as glue, kiss-coating
Condition influences dispensing effect, and since the mobility of glue is deteriorated, also results in glue and be difficult to flow to the edge of LED light, no
Conducive to the fixation of LED light.
Invention content
The invention mainly solves the technical problem of providing a kind of LED display point glue equipments, can improve the temperature of glue
Degree the problems such as reducing drawing glue, the kiss-coating of dispensing process, is conducive to improve the secured of LED light to improve the mobility of glue
Property..
The embodiment of the present invention provide a kind of LED display point glue equipment, including pedestal, pressure exerting arrangement, packing element, Glue dripping head with
And heating mechanism；
The Glue dripping head includes receiving cavity and the Jiao Zui that is connected to the receiving cavity, the receiving cavity and the glue
Cylinder is installed on the pedestal；
The packing element is connected by a sebific duct with the receiving cavity of the Glue dripping head, the pressure exerting arrangement by a tracheae and
The packing element connection, to press to depositing in the glue in the packing element so that the glue in the packing element is squeezed to institute
Receiving cavity is stated, and is squeezed out from the Jiao Zui；
Wherein, the heating mechanism is mounted in the receiving cavity, and the glue in the receiving cavity is heated to
Target temperature.
Wherein, the target temperature is 50 °.
Wherein, the heating mechanism is greater than or equal to target temperature in the temperature for detecting the glue in the receiving cavity
When, stop heating, when the temperature for detecting the glue in the receiving cavity is less than target temperature, is heated.
Wherein, the heating mechanism is arranged in the interior bottom of the receiving cavity.
Wherein, further include light source and camera；
The light source and the camera are installed on the pedestal, and the camera lens of the camera is towards the Glue dripping head
The direction at place is taken pictures with the circuit board to LED display, the light source be located at the camera lens and the Glue dripping head it
Between.
Wherein, the packing element is located at the side of the pedestal, and the camera and the light source are located at the phase of the pedestal
To the other side.
Wherein, the packing element is located at the side of Glue dripping head moving direction.
Wherein, further include the range sensor being connect with host computer, the range sensor is arranged on the Jiao Zui, uses
In obtaining the distance between Jiao Zui and circuit board, the host computer is directed away from electricity in the distance less than threshold value time control glue mouth
It moves in the direction of road plate.
Wherein, the heating mechanism is infrared heating mechanism or electromagnetic heating mechanism.
In the LED display point glue equipment of the present invention, by the way that heating mechanism is arranged in the receiving cavity of Glue dripping head, with right
Glue in receiving cavity is heated, and so as to improve the temperature of glue, to improve the mobility of glue, reduces dispensing
The problems such as drawing glue of process, kiss-coating, is conducive to the fastness for improving LED light.
Description of the drawings
Fig. 1 is a structural schematic diagram of LED display point glue equipment provided in an embodiment of the present invention；
Fig. 2 is the right view of point glue equipment shown in FIG. 1；
Fig. 3 is the left view of point glue equipment shown in FIG. 1；
Fig. 4 is that point glue equipment provided in an embodiment of the present invention carries out schematic diagram for dispensing glue to LED display；
Fig. 5 is another structural schematic diagram of LED display point glue equipment provided in an embodiment of the present invention.
Specific implementation mode
Below in conjunction with the attached drawing in the embodiment of the present application, technical solutions in the embodiments of the present application carries out clear, complete
Site preparation describes.Obviously, described embodiments are only a part of embodiments of the present application, instead of all the embodiments.It is based on
Embodiment in the application, the every other implementation that those skilled in the art are obtained without creative efforts
Example, shall fall in the protection scope of this application.
Refering to fig. 1 to Fig. 3, in LED display point glue equipment of the present invention, including pedestal 10, pressure exerting arrangement 11, packing element 12,
Glue dripping head 13 and heating mechanism 14.
Wherein, Glue dripping head 13 includes receiving cavity 131 and glue mouth 132, and gold may be used in receiving cavity 131 and nozzle 132
Belong to material to be made.As shown, receiving cavity 131 is mounted on one end of pedestal 10, glue mouth 132 is connected to receiving cavity 131.
Packing element 12 is mounted in a side of pedestal 10, and position is higher than the position of receiving cavity 131 for storing glue.
Packing element 12 is connected to by sebific duct 121 with receiving cavity 131.
Pressure exerting arrangement 11 such as can be air pressure mechanism in the form of piston, be connected by tracheae 111 and packing element 12.Pressure exerting arrangement
11 to the glue in packing element 12 for applying air pressure, so that the glue in packing element 12 is under pressure, is squeezed from packing element 12
It is depressed into a receiving cavity 131, and is squeezed out from glue mouth 132, to realize the plastic emitting of point glue equipment.
Wherein, in the present embodiment, heating mechanism 14 is mounted in receiving cavity 131, for the glue in receiving cavity 131
Water carries out being heated to target temperature, is heated as a result, to the glue in receiving cavity 131 by heating mechanism 14, Ke Yiti
The temperature of high glue, and then improve the mobility of glue so that mobility bigger when glue is squeezed out from glue mouth 132, it can
It reduces dispensing process and phenomena such as drawing glue, kiss-coating occurs.
Wherein, pedestal 10 is, for example, mechanical arm, is connect with host computer, by the movement of PC control mechanical arm, thus
Packing element 12 and Glue dripping head 13 is driven to move.
It, can be with after LED light 40 is mounted on circuit board 41 as shown in figure 4, in the production process of LED display
Dispensing is carried out using gap of the point glue equipment of the embodiment of the present invention between LED light 40, LED light 40 is preferably fixed on
On circuit board 41.Wherein, by the way that heating mechanism 14 is arranged in receiving cavity 131, with to the glue that will squeeze glue discharging mouth 132
It is heated, the mobility of glue can be improved, to enable to glue to be easier to flow when glue spots are between LED light 40
To the edge of LED light 40, LED light 40 and circuit board 41 are fixed, are conducive to the fastness for improving LED light 40, wherein
Fig. 1 and shown in Fig. 4 42 is glue layer.
Wherein, target temperature such as can be 50 ° or 55 °, 60 ° etc., can specifically be set according to the property of glue
It is fixed.Wherein, it is provided with temperature sensor in heating mechanism 14, the temperature for detecting glue, when detecting in receiving cavity 131
The temperature of glue when being greater than or equal to target temperature, heating mechanism 14 stops heating, avoids glue temperature excessively high, when detecting
When the temperature of glue is less than target temperature, is heated, avoid glue temperature too low and lack mobility.
Certainly, can also be the heating mechanism when detecting that the temperature of glue is less than 40 ° in some other embodiment
14 are heated, and when detecting that the temperature of glue is higher than 50 °, heating mechanism 14 stops heating, and the temperature of glue is ensured with this
In 40 to 50 ° of range.
Wherein, heating mechanism 14 can be such as infrared heating mechanism or electromagnetic heating mechanism, not limit this.
Wherein, in order to more accurately obtain the temperature of glue, as shown in Figure 1, heating mechanism 14 can be arranged in accommodating chamber
The interior bottom of body 131.Certainly, heating mechanism 14 can also be arranged on the madial wall of receiving cavity 131, or can pass through
Connecting rope is suspended on the middle part of receiving cavity 131.
Further, with continued reference to Fig. 1, point glue equipment further includes light source 15 and camera 16.Light source 15 and camera 16
It is installed on pedestal 10.Wherein, packing element 12 is located on the side of pedestal 10, and light source 15 and camera 16 are then located at pedestal 10
The other side opposite with packing element 12 on.Wherein, packing element 12 can be the side positioned at 13 moving direction of Glue dripping head, such as to scheme
Based on view shown in 1, the Glue dripping head 13 of point glue equipment is moved from left to right to carry out dispensing, the i.e. mobile side of Glue dripping head 13
To for the right, packing element 12 is arranged on the right of pedestal 10, and light source 15 and camera 16 are then arranged on the left side of pedestal 10.
Wherein, the camera lens 161 of camera 16 is towards the direction where Glue dripping head 13, in dispensing to circuit board 41 into
Row is taken pictures, to which host computer obtains the photo captured by camera 16, to go out (the marks of the mark on circuit board 41 according to photo array
Note) point, which is start reference coordinate for dispensing glue.Light source 15 is between camera lens 161 and Glue dripping head 13, when needs pass through
When camera 16 takes pictures to position circuit board 41, light source 15 is opened to irradiate circuit board 41, in the light of light source 15
Under irradiation, camera 16 can obtain clearer mark points photo, the accuracy of mark point locations can be improved, to improve
The accuracy of dispensing position.
Refering to Fig. 5, in another embodiment of point glue equipment of the present invention, point glue equipment can also include further that distance passes
Sensor 17.Range sensor 17 is connect with host computer, is arranged on glue mouth 131, for obtain glue mouth 131 and circuit board 41 it
Between distance.Host computer is less than the direction movement that threshold value time control glue mouth 131 is directed away from circuit board 41 in the distance.
During dispensing, when the distance between glue mouth 131 and circuit board 41 are smaller, it is possible to glue mouth 131 can be caused
Touch circuit board 41 either LED light 40 in order to avoid glue mouth 131 touches circuit board or LED light and scratch circuit board or
LED light, and also to avoid glue mouth 131 from damaging, by the way that a threshold value is arranged, when detecting between glue mouth 131 and circuit board 41
Distance be less than when changing threshold value, then control glue mouth 131 and move up, that is, the direction movement of circuit board 41 is directed away from, to increase
The distance between glue mouth 131 and circuit board 41.
Mode the above is only the implementation of the present invention is not intended to limit the scope of the invention, every to utilize this
Equivalent structure or equivalent flow shift made by description of the invention and accompanying drawing content, it is relevant to be applied directly or indirectly in other
Technical field is included within the scope of the present invention.
Claims (9)
1. a kind of LED display point glue equipment, which is characterized in that including pedestal, pressure exerting arrangement, packing element, Glue dripping head and heating
Mechanism；
The Glue dripping head includes receiving cavity and the Jiao Zui that is connected to the receiving cavity, and the receiving cavity and the packing element are equal
On the pedestal；
The packing element is connected by a sebific duct with the receiving cavity of the Glue dripping head, and the pressure exerting arrangement passes through a tracheae and described
Packing element connects, to press to depositing in the glue in the packing element so that the glue in the packing element is squeezed to the appearance
It receives cavity, and is squeezed out from the Jiao Zui；
Wherein, the heating mechanism is mounted in the receiving cavity, and the glue in the receiving cavity is heated to target
Temperature.
2. the apparatus according to claim 1, which is characterized in that the target temperature is 50 °.
3. the apparatus according to claim 1, which is characterized in that the heating mechanism is detecting in the receiving cavity
When the temperature of glue is greater than or equal to target temperature, stop heating, it is low in the temperature for detecting the glue in the receiving cavity
When target temperature, heated.
4. the apparatus according to claim 1, which is characterized in that the heating mechanism is arranged at the interior bottom of the receiving cavity
Portion.
5. the apparatus according to claim 1, which is characterized in that further include light source and camera；
The light source and the camera are installed on the pedestal, where the camera lens towards the Glue dripping head of the camera
Direction, taken pictures with the circuit board to LED display, the light source is between the camera lens and the Glue dripping head.
6. device according to claim 5, which is characterized in that the packing element is located at the side of the pedestal, the camera shooting
Head and the light source are located at the opposite other side of the pedestal.
7. device according to claim 6, which is characterized in that the packing element is located at the side of Glue dripping head moving direction.
8. the apparatus according to claim 1, which is characterized in that further include the range sensor being connect with host computer, it is described
Range sensor is arranged on the Jiao Zui, for obtaining the distance between Jiao Zui and circuit board, the host computer it is described away from
It is moved from the direction for being directed away from circuit board less than threshold value time control glue mouth.
9. the apparatus according to claim 1, which is characterized in that the heating mechanism is infrared heating mechanism or electromagnetic heating
Mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810610172.9A CN108405271A (en) | 2018-06-13 | 2018-06-13 | A kind of LED display point glue equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810610172.9A CN108405271A (en) | 2018-06-13 | 2018-06-13 | A kind of LED display point glue equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108405271A true CN108405271A (en) | 2018-08-17 |
Family
ID=63141709
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810610172.9A Pending CN108405271A (en) | 2018-06-13 | 2018-06-13 | A kind of LED display point glue equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108405271A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109675762A (en) * | 2018-11-09 | 2019-04-26 | 深圳市德彩光电有限公司 | A kind of dispensing method of LED display and the spot gluing equipment of LED display |
| CN111899654A (en) * | 2020-07-20 | 2020-11-06 | 利亚德智慧显示(深圳)有限公司 | Display screen, light-emitting module and manufacturing method thereof |
| TWI716866B (en) * | 2019-05-06 | 2021-01-21 | 萬潤科技股份有限公司 | Liquid chamber module of liquid material extrusion device |
| CN112916304A (en) * | 2021-01-22 | 2021-06-08 | 苏州彩阳电暖科技有限公司 | Automatic glue injection and nail nailing device for electric blanket component and using method thereof |
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| CN208627701U (en) * | 2018-06-13 | 2019-03-22 | 深圳市德彩光电有限公司 | A kind of LED display point glue equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109675762A (en) * | 2018-11-09 | 2019-04-26 | 深圳市德彩光电有限公司 | A kind of dispensing method of LED display and the spot gluing equipment of LED display |
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| TWI716866B (en) * | 2019-05-06 | 2021-01-21 | 萬潤科技股份有限公司 | Liquid chamber module of liquid material extrusion device |
| CN111899654A (en) * | 2020-07-20 | 2020-11-06 | 利亚德智慧显示(深圳)有限公司 | Display screen, light-emitting module and manufacturing method thereof |
| CN112916304A (en) * | 2021-01-22 | 2021-06-08 | 苏州彩阳电暖科技有限公司 | Automatic glue injection and nail nailing device for electric blanket component and using method thereof |
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Address after: 518000 201, No. 13, Huiye Road, Tangjia community, Fenghuang street, Guangming District, Shenzhen City, Guangdong Province Applicant after: Shendecai photoelectric (Shenzhen) Co., Ltd Address before: 518000 Guangdong province Shenzhen Guangming New District Gongming building village community Zhongtai road 18 German color Industrial Park Applicant before: Shenzhen Dicolor Optoelectronics Co., Ltd. |
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Address after: 518000 201, No. 13, Huiye Road, Tangjia community, Fenghuang street, Guangming District, Shenzhen City, Guangdong Province Applicant after: Shendecai Technology (Shenzhen) Co., Ltd Address before: 518000 201, No. 13, Huiye Road, Tangjia community, Fenghuang street, Guangming District, Shenzhen City, Guangdong Province Applicant before: Shendecai photoelectric (Shenzhen) Co.,Ltd. |
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