CN108391042A - A kind of camera image converting system of Vacuum Package image sensor chip - Google Patents
A kind of camera image converting system of Vacuum Package image sensor chip Download PDFInfo
- Publication number
- CN108391042A CN108391042A CN201810491435.9A CN201810491435A CN108391042A CN 108391042 A CN108391042 A CN 108391042A CN 201810491435 A CN201810491435 A CN 201810491435A CN 108391042 A CN108391042 A CN 108391042A
- Authority
- CN
- China
- Prior art keywords
- seal
- sealing
- sensor chip
- vacuum
- sealing ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
The invention discloses a kind of camera image converting systems of Vacuum Package image sensor chip, a kind of camera image converting system of Vacuum Package image sensor chip of its drip irrigation device, including shell, the image conversion module being arranged in shell, the power module being powered to image conversion module and the data processing module that the signal of image conversion module is handled, the shell offers sealing cavity, and vacuum-degree monitoring module is provided in the sealing cavity；Terminal control module is provided on the outside of the sealing cavity, the vacuum monitoring modular is connected with terminal control module.Vacuum degree in sealing cavity can be monitored in real time, vacuum degree signal is sent in real time, more can learn accurately and that timely the vacuum degree in sealing cavity changes.
Description
Technical field
The present invention relates to camera vacuum processing techniques, more specifically, it relates to a kind of Vacuum Package imaging sensor core
The camera image converting system of piece.
Background technology
Camera is a kind of equipment for forming image using optical imaging concept and using negative writing image, and subject is anti-
After the light of injection is focused by the shutter of photographic film (taking the photograph scenery mirror) and control light exposure, sense of the subject in camera bellows
Sub-image is formed in luminescent material.
The imaging sensor that existing camera uses is respectively SMOS imaging sensors and ccd image converter, both
It is to carry out opto-electronic conversion using light sensitive diode (photodiode), converts the image into numerical data, and its main difference is
The mode of numerical data transmission is different.
It, can be easily by peripheral circuit since cmos sensor uses the most common CMOS technology of general semiconductor circuit
(such as AGC, CDS, Timing generator or DSP) is integrated into sensor chip, therefore can save peripheral chip
Cost;In addition to this, since CCD transmits data by the way of charge transfer, as long as cannot wherein be run there are one pixel,
It can cause the data of an entire row that cannot transmit, therefore the yield rate for controlling ccd sensor is more difficult than cmos sensor many, because
This, the cost of ccd sensor can be higher than cmos sensor.
When carrying out image conversion using cmos sensor or ccd image converter, when the working time is longer, chip temperature
Degree increases, and will produce heat, so as to cause thermal noise, generates interference to image forming, therefore is needed in use to CMOS
Sensor or ccd image converter freeze, and thermal noise phenomenon is reduced by way of refrigeration；Due in cmos sensor
Either there are vapor around ccd image converter in order to reduce the air around cmos sensor or ccd image converter
Content usually will be set as vacuum state in objective lens, to prevent steam present in air etc. from condensing on objective lenses,
Influence imaging.
It can be visually noticeable after only being condensed due to the steam in air, when the vacuum degree in objective lens is relatively low
When, air is entered in objective lens, as long as will not condense droplet on objective lenses, user is difficult to learn objective lens
Interior vacuum degree already changes.However these enter the air in objective lens, steam included etc. can equally influence object
The precision and clarity of lens head.
Invention content
In view of the deficiencies of the prior art, the present invention intends to provide a kind of Vacuum Package image sensor chip
Camera image converting system, the vacuum degree in sealing cavity can be monitored in real time, vacuum degree signal is sent in real time,
More it can learn accurately and that timely the vacuum degree in sealing cavity changes.
To achieve the above object, the present invention provides following technical solutions：
A kind of camera image converting system of Vacuum Package image sensor chip, including shell, the image being arranged in shell
Conversion module, the power module being powered to image conversion module and the number that the signal of image conversion module is handled
According to processing module, the shell offers sealing cavity, and vacuum-degree monitoring module is provided in the sealing cavity；Described
It is provided with terminal control module on the outside of sealing cavity, the vacuum monitoring modular is connected with terminal control module.
By using above-mentioned technical proposal, when in use, camera lens can be by optical signal transfer to sensor chip, sensor
Chip converts optical signalling to electric signal, is transferred to data processing module, meanwhile, by electric power source pair of module sensor chip into
Row power supply.Image conversion module is vacuum-treated by the sealing cavity of setting, it is more clear to be imaged when in use.Together
When, the real-time monitoring to vacuum degree in sealing cavity is realized by the vacuum monitoring modular being arranged in sealing cavity, by vacuum
Degree signal is sent in real time, more can learn accurately and that timely the vacuum degree in sealing cavity changes.
The sealing cavity side offers the first seal, the second seal is offered in the other side, described first
It is sealed and installed with seal glass at seal, pcb board is sealed and installed at second installing port；Described image conversion module and
Vacuum-degree monitoring module is connect on the inside of sealing cavity with pcb board, the power module, terminal control module and data processing mould
Block on the outside of sealing cavity with pcb board by connecting；The vacuum exhaust pipe being connected to sealing cavity is provided on the shell.
Preferably, in the shell and being located on the inner wall of sealing cavity integrally formed with step；In the step upper cover
Equipped with the first sealing ring, the seal glass is folded between step and the first sealing ring.
Seal glass is fixed by the step and sealing ring of setting by using above-mentioned technical proposal, optics letter
It number is transmitted by seal glass.
Preferably, offering the first seal groove on the step, the first sealing ring is provided in first seal groove；
First sealing ring offers the second seal groove close to the side of step, and the second sealing is provided in second seal groove
Circle, the seal glass are folded between the first sealing ring and the second sealing ring.
By using above-mentioned technical proposal, by the first sealing ring of setting and it is arranged in the second seal groove second close
Seal carries out grip seal in the both sides of seal glass to seal glass, and when vacuumizing, sealing effect is preferable.
Preferably, second seal groove is being formed with rib by paracentral side, the width of the rib is less than institute
The thickness of the first sealing ring is stated, the diameter of the seal glass is less than the diameter of the second seal groove and the diameter more than rib；Institute
The first sealing ring is stated to be bolted on step.
By using above-mentioned technical proposal, pass through the rib of setting so that it is close that the position of seal glass is limited in second
In sealing groove, keep its relatively stable, meanwhile, the first sealing ring is detachably secured on step by using bolt, so as to
It is more convenient that it is dismantled, is replaced.
Preferably, the side in the sealing cavity and close to the second seal is integrally formed with mounting ring；Described image
Conversion module is mounted on mounting ring close to the side of the first seal, and it is close close to second that the pcb board is sealingly mounted at mounting ring
The side of sealing.
By using above-mentioned technical proposal, by being sealed fixation, pcb board at the second seal of pcb board pair of setting
In sealing, the circuit element of both sides can be both electrically connected, meanwhile, it is arranged by the multilayered structure of pcb board so that
The connection jaws of both sides are not connected between each other, so that the vacuum sealing in sealing cavity is better.
Preferably, being equipped with the second sealing ring on the shell and positioned at the mounting ring upper cover, the pcb board seals sandwiched
Between the second sealing ring and mounting ring.
By using above-mentioned technical proposal, clamping is fixed to pcb board by the second sealing ring and mounting ring of setting.
Preferably, the mounting ring is offering third seal groove, the third sealing close to the side of the second sealing ring
Third sealing ring is provided in slot, the pcb board is crimped on third sealing ring.
Third is installed in seal groove by opening up third seal groove in mounting ring by using above-mentioned technical proposal
Sealing ring, so that pcb board is sealed processing to sealing cavity.
Preferably, offering blind hole in the mounting ring and on the outside of third seal groove；On second sealing ring and pcb board
Location hole is offered, is threaded in blind hole across location hole by the bolt of setting.
By using above-mentioned technical proposal, it is fixed by the second sealing ring of bolt pair so that pcb board is detachably fixed
Between the second sealing ring and mounting ring.
It is being sensed preferably, described image conversion module includes the sensor chip being mounted in mounting ring and setting
Semiconductor chilling plate between device chip and mounting ring.
By using above-mentioned technical proposal, reception conversion is carried out to optical signalling by the sensor chip of setting, is being passed
In sensor chip operation engineering, heat is will produce, to generate thermal noise, by the semiconductor chilling plate of setting to sensor core
Piece freezes, to more effectively reduce thermal noise.
In conclusion the invention has the advantages that：
1, when in use, camera lens can convert optical signal transfer to sensor chip, sensor chip to optical signalling to electricity
Signal is transferred to data processing module, meanwhile, it is powered by electric power source pair of module sensor chip.Pass through the sealing of setting
Cavity is vacuum-treated image conversion module, and it is more clear to be imaged when in use.Meanwhile by being arranged in sealing cavity
Vacuum monitoring modular realize real-time monitoring to vacuum degree in sealing cavity, vacuum degree signal can be sent in real time, can
It is more accurate and timely learn the variation of the vacuum degree in sealing cavity；
2, by the first sealing ring of setting and the second sealing ring being arranged in the second seal groove, in the both sides pair of seal glass
Seal glass carries out grip seal；
3, by being sealed fixation at the second seal of the pcb board pair of setting, pcb board, both can be to both sides in sealing
Circuit element is electrically connected, meanwhile, it is arranged by the multilayered structure of pcb board so that the connection jaws of both sides are between each other not
Connection, so that the vacuum sealing in sealing cavity is better.
Description of the drawings
Fig. 1 is a kind of exploded perspective view of the camera image converting system of Vacuum Package image sensor chip；
Fig. 2 is a kind of sectional view of image conversion module in camera image converting system of Vacuum Package image sensor chip；
Fig. 3 is prominent vacuum-degree monitoring module work in a kind of camera image converting system of Vacuum Package image sensor chip
Flow chart；
Fig. 4 is a kind of explosion signal of image conversion module in camera image converting system of Vacuum Package image sensor chip
Figure；
Fig. 5 is a kind of structural schematic diagram of the camera image converting system middle casing of Vacuum Package image sensor chip；
Fig. 6 is a kind of signal of prominent first sealing ring in camera image converting system of Vacuum Package image sensor chip
Figure；
Fig. 7 is a kind of exploded perspective view of prominent pcb board in camera image converting system of Vacuum Package image sensor chip；
Fig. 8 is a kind of structural schematic diagram of the camera image converting system middle casing of Vacuum Package image sensor chip.
Reference numeral：1, shell；11, sealing cavity；111, the first seal；112, the second seal；12, glass is sealed
Glass；13, step；131, the first seal groove；132, the first sealing ring；14, the first sealing ring；141, the second seal groove；142,
Two sealing rings；143, rib；15, mounting ring；151, third seal groove；152, blind hole；153, third sealing ring；16, pcb board；
17, the second sealing ring；171, location hole；18, vacuum exhaust pipe；2, image conversion module；21, sensor chip；22, sensor
Circuit board；23, semiconductor chilling plate；3, power module；4, data processing module；5, vacuum-degree monitoring module；6, terminal control
Module；7, shell；8, signal receiving module.
Specific implementation mode
Below in conjunction with attached drawing, invention is further described in detail, wherein the identical reference numeral of identical parts
It indicates.It should be noted that word "front", "rear" used in the following description, "left", "right", "up" and "down", " bottom surface " and
" top surface " refers to that the direction in attached drawing, word "inner" and "outside" are referred respectively to towards or away from geometric center of specific component
Direction.
A kind of camera image converting system of Vacuum Package image sensor chip, in conjunction with shown in Fig. 1 and Fig. 2, including shell
Body 1, the image conversion module 2 being arranged in shell 1, the power module 3 being powered to image conversion module 2 and to image
The data processing module 4 that the signal of conversion module 2 is handled, wherein when in use, converted on shell 1 and close to image
2 side of module is equipped with camera lens, right by image conversion module 2 by camera lens by optical signal transfer to image conversion module 2
Optical signalling is handled, and then converts optical signalling to electric signal, is then passed to data processing module 4 and is handled,
In use, data processing module 4, image conversion module 2 etc. are powered by power module 3.
As shown in Figure 1, it is further, shell 7 is installed in shell 1 and close to 112 side of the second seal, passes through shell
7 are located at power module 3,4 outside of data processing module, to be protected to the two.
In conjunction with shown in Fig. 2 and Fig. 3, shell 1 is cylinder, and sealing cavity 11, image modulus of conversion are offered in 1 inside of shell
Block 2 is mounted in sealing cavity 11, and sealing cavity 11 is vacuum structure.
In conjunction with shown in Fig. 3 and Fig. 4, further, vacuum-degree monitoring module 5 is provided in sealing cavity 11；It is sealing
The outside of cavity 11 is provided with terminal control module 6, and the connection type of vacuum monitoring modular 5 and terminal control module 6 can be indigo plant
The connection of tooth signal, wireless network connection or telecommunications connection etc..
By the vacuum-degree monitoring module 5 being arranged in sealing cavity 11, the vacuum structure in sealing cavity 11 is carried out
Monitoring in real time, meanwhile, outside is provided with signal receiving module 8, the vacuum degree signal for being sent out to terminal control module 6 is real
When receive, can be more accurate and timely learn the variation of the vacuum degree in sealing cavity 11；When the vacuum degree in sealing cavity
When dropping to influence imaging, it can timely replace, repair.
In conjunction with shown in Fig. 2 and Fig. 4, wherein form two openings, respectively the first seal at the both ends of sealing cavity 11
111 and second seal 112, wherein optical signalling is transmitted by the first seal 111, the second seal 112 is used for and power supply
Module 3（See Fig. 1）, data processing module 4（See Fig. 1）It is electrically connected.
Wherein, image conversion module 2 includes sensor chip 21 and setting in sensor chip 21 and close to second close
Seal the semiconductor chilling plate 23 of 112 sides, wherein sensor chip 21 can be that SMOS imaging sensors and ccd image turn
Parallel operation, wherein sensor chip 21 and vacuum monitoring modular 5 are fixedly mounted on sensor circuit board 22, semiconductor chilling plate
23 pairs of sensor circuit boards 22 carry out cooling down.
In use, semiconductor chilling plate 23 carries out in process of refrigerastion sensor chip 21, when in sealing cavity
11 memories will produce thermal convection current in case of air, in imaging process, will produce larger impact to imaging effect, therefore will be close
Envelope cavity 11 is set as vacuum structure, so that without air around sensor chip 21, so that sensor chip 21
Imaging effect is more preferable.
In conjunction with shown in Fig. 4 and Fig. 5, carried out by the seal glass 12 of setting close to one end of the first seal 111 it is close
Envelope, to so that optical signalling can be transmitted to through seal glass 12 on sensor chip 21.
In conjunction with shown in Fig. 4 and Fig. 6, radially it is integrally formed in 1 cavity of shell and close to one end of the first seal 111
There is step 13, the first seal groove 131 is offered on step 13, by the way that the first sealing ring is arranged in the first seal groove 131
132 so that seal glass 12 can be crimped on the first sealing ring 132, and at the same time, being provided with can be crimped on seal glass 12
The first sealing ring 14, meanwhile, offer the second seal groove 141 close to the side of seal glass 12 in the first sealing ring 14,
The second sealing ring 142 is provided in second seal groove 141, to when being crimped to seal glass 12 so that seal glass
12 are between the first sealing ring 132 and the second sealing ring 142, meanwhile, pass through in 131 deep side of the first seal groove
The first sealing ring 14 is fixed on step 13 using bolt, so that seal glass 12 can keep impaction state, to
Realize sealing state.
Further, the second seal groove 141 is being formed with rib 143 by paracentral side, and the width of rib 143 is small
In the thickness of the first sealing ring 14, and the diameter of seal glass 12 is less than the diameter of the second seal groove 141 and more than rib 143
Diameter, in fixing seal glass 12 so that seal glass 12 can be connected in the second seal groove 141, radial to close
Envelope glass 12 is limited, to which when the first sealing ring 14 is fixed, seal glass 12 is relatively stable.
In conjunction with shown in Fig. 7 and Fig. 8, wherein the side in sealing cavity 11 and close to the second seal 112 is integrally formed
There is mounting ring 15, wherein image conversion module 2 is arranged in side of the mounting ring 15 far from the second seal 112, in mounting ring 15
Upper and close to the second seal 112 side is sealed and installed with pcb board 16, wherein by pcb board 16 to the second seal 112
Side is sealed fixation, meanwhile, sensor chip 21 and semiconductor chilling plate 23 are electrically connected with pcb board 16, and pcb board 16 exists
Side far from sensor chip 21 and power module 3（In conjunction with Fig. 1）, data processing module 4 be electrically connected, to realize number
On the basis of transmitting function, better vacuum sealing is carried out.
Wherein, third seal groove 151 is offered in side of the mounting ring 15 far from sensor chip 21, in third seal groove
It is provided with third sealing ring 153 in 151, pcb board 16 is connected on third sealing ring 153, meanwhile, it is crimped on pcb board 16
Second sealing ring 17 makes to crimp between pcb board 16 and third sealing ring 153 more closely, to make by the second sealing ring 17
Obtain the sealing effect of pcb board 16 more.
Further, blind hole 152 is offered in mounting ring 15 and in 151 deep side of third seal groove,
The location hole 171 coordinated with blind hole 152 is offered on second sealing ring 17 and pcb board 16, to successively by the bolt of setting
Low temperature endoporus rear thread on the second sealing ring 17 and pcb board 16 is connected in blind hole 152, to realize to pcb board 16
Fixation.
It should be noted that pcb board 16 is set as multi-layer PCB board 16, both sides respectively with sensor chip 21, power module
3 and the interface that is electrically connected of data processing module 4 be not interconnected, preferably sealing cavity can be sealed.
Meanwhile in order to be vacuumized to sealing cavity 11, the vacuum being connected to sealing cavity 11 is provided on shell 1
Seal glass 12, pcb board 16 are carried out installation fixation by exhaust tube 18 first when in use, then right by vacuum exhaust pipe 18
Sealing cavity 11 is vacuumized.
This specific embodiment is only explanation of the invention, is not limitation of the present invention, people in the art
Member can as needed make the present embodiment the modification of not creative contribution after reading this specification, but as long as at this
It is all protected by Patent Law in the right of invention.
Claims (10)
1. a kind of camera image converting system of Vacuum Package image sensor chip, including shell（1）, it is arranged in shell（1）
Interior image conversion module（2）, to image conversion module（2）The power module being powered（3）And to image conversion module
（2）The data processing module that is handled of signal（4）, it is characterised in that：
The shell（1）Offer sealing cavity（11）, in the sealing cavity（11）Inside it is provided with vacuum-degree monitoring module
（5）；
In the sealing cavity（11）Outside is provided with terminal control module（6）, the vacuum monitoring modular（5）And terminal control
Module（6）Connection.
2. the camera image converting system of Vacuum Package image sensor chip according to claim 1, it is characterized in that：
The sealing cavity（11）Side offers the first seal（111）, the second seal is offered in the other side（112）,
In first seal（111）Place is sealed and installed with seal glass（12）, second seal（112）Place is sealed and installed with
Pcb board（16）；
Described image conversion module（2）With vacuum-degree monitoring module（5）In sealing cavity（11）Inside and pcb board（16）Connection,
The power module（3）, terminal control module（6）And data processing module（4）By sealing cavity（11）Outside and pcb board（16）
Connection；
The shell（1）On be provided with and sealing cavity（11）The vacuum exhaust pipe of connection（18）.
3. the camera image converting system of Vacuum Package image sensor chip according to claim 2, it is characterized in that：
The shell（1）It is interior and be located at sealing cavity（11）Inner wall on integrally formed with step（13）；
In the step（13）Upper cover is equipped with the first sealing ring（14）, the seal glass（12）It is folded in step（13）With first
Sealing ring（14）Between.
4. the camera image converting system of Vacuum Package image sensor chip according to claim 3, it is characterized in that：
The step（13）On offer the first seal groove（131）, in first seal groove（131）Inside it is provided with the first sealing
Circle（132）；
First sealing ring（14）Close to step（13）Side offer the second seal groove（141）, second seal
（112）Inside it is provided with the second sealing ring（142）, the seal glass（12）It is folded in the first sealing ring（132）With the second sealing
Circle（142）Between.
5. the camera image converting system of Vacuum Package image sensor chip according to claim 4, it is characterized in that：
Second seal groove（141）It is being formed with rib by paracentral side（143）, the rib（143）Width it is small
In first sealing ring（14）Thickness, the seal glass（12）Diameter be less than the second seal groove（141）Diameter and
More than rib（143）Diameter；
First sealing ring（14）It is bolted on step（13）On.
6. the camera image converting system of Vacuum Package image sensor chip according to claim 2, it is characterized in that：
The sealing cavity（11）Interior and close second seal（112）Side integrally formed with mounting ring（15）；
Described image conversion module（2）Mounted on mounting ring（15）Close to the first seal（111）Side, the pcb board
（16）It is sealingly mounted at mounting ring（15）Close to the second seal（112）Side.
7. the camera image converting system of Vacuum Package image sensor chip according to claim 6, it is characterized in that：
The shell（1）Above and it is located at the mounting ring（15）Upper cover is equipped with the second sealing ring（17）, the pcb board（16）Sealing
It is folded in the second sealing ring（17）And mounting ring（15）Between.
8. the camera image converting system of Vacuum Package image sensor chip according to claim 6, it is characterized in that：
The mounting ring（15）Close to the second sealing ring（17）Side offer third seal groove（151）, the third is close
Sealing groove（151）Inside it is provided with third sealing ring（153）, the pcb board（16）It is crimped on third sealing ring（153）On.
9. the camera image converting system of Vacuum Package image sensor chip according to claim 8, it is characterized in that：
The mounting ring（15）Above and in third seal groove（151）Outside offer blind hole（152）；
Second sealing ring（17）And pcb board（16）On offer location hole（171）, location hole is passed through by the bolt of setting
（171）It is threaded in blind hole（152）On.
10. the camera image converting system of Vacuum Package image sensor chip according to claim 1, it is characterized in that：
Described image conversion module（2）Including being mounted on mounting ring（15）On sensor chip（21）And setting is sensing
Device chip（21）And mounting ring（15）Between semiconductor chilling plate（23）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810491435.9A CN108391042B (en) | 2018-05-21 | 2018-05-21 | Camera image conversion system of vacuum packaging image sensor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810491435.9A CN108391042B (en) | 2018-05-21 | 2018-05-21 | Camera image conversion system of vacuum packaging image sensor chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108391042A true CN108391042A (en) | 2018-08-10 |
| CN108391042B CN108391042B (en) | 2023-09-19 |
Family
ID=63071070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810491435.9A Active CN108391042B (en) | 2018-05-21 | 2018-05-21 | Camera image conversion system of vacuum packaging image sensor chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108391042B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110536052A (en) * | 2019-07-05 | 2019-12-03 | 上海一功文化传播有限公司 | It is a kind of can self-timer photography photographic device |
| CN110620869A (en) * | 2019-10-29 | 2019-12-27 | 维沃移动通信有限公司 | Camera module and electronic equipment |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060097335A1 (en) * | 2004-11-08 | 2006-05-11 | Deok-Hoon Kim | Electronic package for image sensor, and the packaging method thereof |
| CN202353667U (en) * | 2011-12-15 | 2012-07-25 | 中国石油天然气股份有限公司 | Underground camera |
| CN103090586A (en) * | 2013-01-17 | 2013-05-08 | 贾磊 | Air cooling heat dissipation thermoelectric cooler (TEC) electric refrigeration charge coupled device (CCD) Dewar |
| CN103226057A (en) * | 2013-03-27 | 2013-07-31 | 同济大学 | Multifunctional high-efficiency laser damage test device and method in vacuum environment |
| CN204089956U (en) * | 2014-06-03 | 2015-01-07 | 广东欧珀移动通信有限公司 | There is camera module and the mobile phone of refrigerating function |
| CN104580843A (en) * | 2013-10-21 | 2015-04-29 | 维信科技（新加坡）有限公司 | Si-CCD camera and method for quickly obtaining silicon wafer photoluminescence images |
| CN105203554A (en) * | 2015-10-22 | 2015-12-30 | 夏烬楚 | Vacuum multilayer graphene stain detection device |
| CN205534635U (en) * | 2016-04-01 | 2016-08-31 | 北京中科同志科技股份有限公司 | A sealing device that is used for vacuum eutectic stove |
-
2018
- 2018-05-21 CN CN201810491435.9A patent/CN108391042B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060097335A1 (en) * | 2004-11-08 | 2006-05-11 | Deok-Hoon Kim | Electronic package for image sensor, and the packaging method thereof |
| CN202353667U (en) * | 2011-12-15 | 2012-07-25 | 中国石油天然气股份有限公司 | Underground camera |
| CN103090586A (en) * | 2013-01-17 | 2013-05-08 | 贾磊 | Air cooling heat dissipation thermoelectric cooler (TEC) electric refrigeration charge coupled device (CCD) Dewar |
| CN103226057A (en) * | 2013-03-27 | 2013-07-31 | 同济大学 | Multifunctional high-efficiency laser damage test device and method in vacuum environment |
| CN104580843A (en) * | 2013-10-21 | 2015-04-29 | 维信科技（新加坡）有限公司 | Si-CCD camera and method for quickly obtaining silicon wafer photoluminescence images |
| CN204089956U (en) * | 2014-06-03 | 2015-01-07 | 广东欧珀移动通信有限公司 | There is camera module and the mobile phone of refrigerating function |
| CN105203554A (en) * | 2015-10-22 | 2015-12-30 | 夏烬楚 | Vacuum multilayer graphene stain detection device |
| CN205534635U (en) * | 2016-04-01 | 2016-08-31 | 北京中科同志科技股份有限公司 | A sealing device that is used for vacuum eutectic stove |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110536052A (en) * | 2019-07-05 | 2019-12-03 | 上海一功文化传播有限公司 | It is a kind of can self-timer photography photographic device |
| CN110620869A (en) * | 2019-10-29 | 2019-12-27 | 维沃移动通信有限公司 | Camera module and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108391042B (en) | 2023-09-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8316555B2 (en) | Non-contact data transfer from moving systems | |
| CN101208945A (en) | Imaging apparatus and method of manufacturing the same | |
| CN101676790B (en) | Camera body and imaging device equipped with same | |
| CN108391042A (en) | A kind of camera image converting system of Vacuum Package image sensor chip | |
| JP2006345233A (en) | Imaging device and digital camera | |
| EP3499868A1 (en) | Compact infrared camera for automotive safety and driving systems | |
| ATE410887T1 (en) | INFRARED (IR) SENSOR WITH CONTROLLABLE SENSITIVITY | |
| WO2009022458A1 (en) | Imaging device and camera | |
| CN108303182A (en) | A kind of infrared imaging temperature monitoring system | |
| CN110119012A (en) | Solar heat protection projection arrangement out of focus | |
| CN208401974U (en) | A kind of camera image converting system of Vacuum Package image sensor chip | |
| US7491935B2 (en) | Thermally-directed optical processing | |
| CN201845780U (en) | Water cooled CCD (charge-coupled device) image sensor | |
| CN109031646B (en) | A kind of very view Infrared Industrial endoscope and its view finding method | |
| CN210578839U (en) | Camera of vacuum packaging image sensor chip | |
| CN109246371A (en) | A kind of hot spot capture systems and method | |
| CN207704131U (en) | Equipment is taken aim in a kind of sight of hand-held short-wave infrared | |
| CN113284916A (en) | Packaging structure of cmos image sensor chip | |
| CN202033203U (en) | Four-wheel position indicator | |
| CN105898121A (en) | Intelligent camera device | |
| CN213069438U (en) | Linear array scanning lens for industrial camera | |
| CN205812170U (en) | A kind of low-light (level) web camera | |
| CN213516038U (en) | Card formula thermal imager with temperature compensation function | |
| KR102194729B1 (en) | Thermal-infrared temperature measurement apparatus for monitoring photovoltaic solar panel and measurement method thereof | |
| CN219046524U (en) | Infrared light filling camera module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |