CN210578839U - Camera of vacuum packaging image sensor chip - Google Patents

Abstract

The utility model relates to a camera of vacuum packaging image sensing chip, which belongs to the technical field of cameras, and comprises a shell, an image conversion module arranged in the shell, a power module for supplying power to the image conversion module, and a data processing module for processing the signal of the image conversion module, wherein the shell is provided with a sealed cavity, and a vacuum degree monitoring module is arranged in the sealed cavity; a terminal control module is arranged on the outer side of the sealed cavity, and the vacuum degree monitoring module is connected with the terminal control module; the vacuum degree monitoring device also comprises a micro vacuum pump for vacuumizing the sealed cavity and a control circuit which is coupled with the vacuum degree monitoring module and drives the micro vacuum pump to work. The vacuum degree monitoring module can monitor the vacuum degree in the sealed cavity in real time, and the control circuit drives the micro vacuum pump to work as the sealed cavity to be vacuumized when the vacuum degree in the sealed cavity is low, so that the vacuum degree of the sealed cavity is maintained.

Description

Camera of vacuum packaging image sensor chip

Technical Field

The utility model relates to a camera especially relates to a camera of vacuum packaging image sensor chip.

Background

The camera is an apparatus for forming an image by using an optical imaging principle and recording the image using a negative film, and light reflected from a subject is focused by a photographic lens (a photographing objective lens) and a shutter for controlling an exposure amount, and then the subject forms a latent image on a photosensitive material in a dark box.

The image sensors used in the existing cameras are respectively an SMOS image sensor and a CCD image converter, both of which use a photodiode (photodiode) to perform photoelectric conversion to convert an image into digital data, and the main difference is that the digital data transmission mode is different.

Since the CMOS sensor uses the most common CMOS process of a general semiconductor circuit, peripheral circuits (such as AGC, CDS, Timing generator, or DSP, etc.) can be easily integrated into a sensor chip, so that the cost of a peripheral chip can be saved; in addition, since the CCD transfers data by charge transfer, if only one pixel is not operated, the data of a whole row cannot be transferred, so that the yield of controlling the CCD sensor is much more difficult than that of the CMOS sensor, and thus the cost of the CCD sensor is higher than that of the CMOS sensor.

When a CMOS sensor or a CCD image converter is used for image conversion, the temperature of a chip rises and heat is generated when the working time is long, so that thermal noise is caused and image forming is interfered, the CMOS sensor or the CCD image converter needs to be refrigerated in the using process, and the thermal noise phenomenon is reduced in a refrigerating mode; since water vapor exists around the CMOS sensor or the CCD image converter, in order to reduce the air content around the CMOS sensor or the CCD image converter, the inside of the objective lens is usually set in a vacuum state to prevent water vapor and the like existing in the air from condensing on the objective lens and affecting the imaging.

The existing Chinese utility model patent with reference to publication number CN208401974U discloses a camera image conversion system of a vacuum packaging image sensor chip, which comprises a shell, an image conversion module arranged in the shell, a power supply module for supplying power to the image conversion module, and a data processing module for processing signals of the image conversion module, wherein the shell is provided with a sealed cavity, and a vacuum degree monitoring module is arranged in the sealed cavity; and a terminal control module is arranged on the outer side of the sealed cavity, and the vacuum degree monitoring module is connected with the terminal control module. The vacuum degree change in the sealed cavity can be known more accurately and timely.

The above prior art has the following disadvantages: the vacuum degree monitoring module can only monitor the vacuum degree of the sealed cavity, and when the vacuum degree in the sealed cavity is insufficient, the camera still needs to be vacuumized again manually.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a camera of vacuum packaging image sensor chip, its advantage lies in that does not need the people to carry out vacuum treatment again to the sealed cavity in the camera when its sealed cavity's vacuum is not enough.

The above utility model discloses an above-mentioned utility model purpose can realize through following technical scheme:

a camera of a vacuum packaging image sensor chip comprises a shell, an image conversion module arranged in the shell, a power supply module for supplying power to the image conversion module, and a data processing module for processing signals of the image conversion module, wherein the shell is provided with a sealed cavity, and a vacuum degree monitoring module is arranged in the sealed cavity; the vacuum degree monitoring module is used for monitoring the vacuum degree of the sealed cavity in real time to output a vacuum degree monitoring signal responding to the vacuum degree in the sealed cavity; the FPGA chip is internally provided with a comparator and a timing unit;

the comparator is coupled with the vacuum degree monitoring module to receive the vacuum degree monitoring signal so as to respond to insufficient vacuum degree in the sealed cavity and output a comparison signal;

the timing unit is coupled with the comparator and used for receiving the comparison signal, resetting the timing in response to the timing of the comparison signal and starting to output a trigger signal; the timing unit resets the timing after timing the set time and stops outputting the trigger signal;

and the micro vacuum pump is used for vacuumizing the sealed cavity and is coupled with the timing unit to receive the trigger signal so as to respond to the trigger signal to work.

Through adopting above-mentioned technical scheme, when using, the camera lens can be with optical signal transmission to sensor chip, and sensor chip turns into the signal of telecommunication with optical signal, transmits to data processing module, simultaneously, supplies power to sensor chip through power module. The image conversion module is subjected to vacuum treatment through the arranged sealed cavity, and imaging is clear when the imaging device is used. Meanwhile, the vacuum degree monitoring module arranged in the sealed cavity is used for realizing real-time monitoring of the vacuum degree in the sealed cavity, and transmitting a vacuum degree signal in real time, so that the change of the vacuum degree in the sealed cavity can be known more accurately and timely; when the vacuum degree in the sealed cavity is insufficient, the comparator outputs a comparison signal, the timer outputs a trigger signal for a certain time, the micro vacuum pump works for a certain time to form the sealed cavity, so that the vacuum degree of the sealed cavity is maintained below a set vacuum degree value, the sealed cavity in the camera does not need to be vacuumized manually when the vacuum degree in the sealed cavity is insufficient, and the vacuum degree in the sealed cavity is maintained in a simple, convenient and high-automation-degree mode.

The utility model discloses further set up to, the timing unit sets up to the counter, the count time interval of counter is fixed and is stored with the count upper limit in the counter, receives as the counter count zero clearing restart count and begin to export comparison signal when the counter when the comparison signal, when the counter stops count and counter stop output after the count of counter (92) reaches the count upper limit trigger signal.

The utility model is further provided with a phase inverter with an input end coupled with the output end of the comparator and a semiconductor refrigeration piece coupled with the output end of the phase inverter, wherein the semiconductor refrigeration piece and the micro vacuum pump do not work simultaneously when the phase inverter works; the inverter is also integrated with the FPGA chip.

The utility model is further provided with a gate connected in series between the counter and the micro vacuum pump, the gate is also coupled with an I2C bus controller, the I2C bus controller is coupled with an upper computer, and the upper computer drives the gate to be communicated with the counter or directly communicated with the I2C bus controller; the gate is also integrated with the FPGA chip.

The utility model is further arranged in that one side of the sealing cavity is provided with a first sealing port, the other side is provided with a second sealing port, sealing glass is arranged at the first sealing port in a sealing way, and a PCB board is arranged at the second mounting port in a sealing way; the image conversion module and the vacuum degree monitoring module are connected with the PCB at the inner side of the sealed cavity, and the power supply module, the terminal control module and the data processing module are connected with the PCB at the outer side of the sealed cavity; a vacuum exhaust pipe communicated with the sealed cavity is arranged on the shell; the vacuum exhaust pipe is communicated and connected with the micro vacuum pump.

Through adopting above-mentioned technical scheme, micro vacuum pump passes through the vacuum exhaust tube and is connected with sealed cavity intercommunication, simple structure, and it is convenient to set up.

The utility model is further arranged that a step is integrally formed in the shell and on the inner wall of the sealed cavity; the step upper cover is provided with a first sealing ring, and the sealing glass is clamped between the step and the first sealing ring; a first sealing groove is formed in the step, and a first sealing ring is arranged in the first sealing groove; a second sealing groove is formed in one side, close to the step, of the first sealing ring, a second sealing ring is arranged in the second sealing groove, and the sealing glass is clamped between the first sealing ring and the second sealing ring; a flange is formed on one side, close to the center, of the second sealing groove, the width of the flange is smaller than the thickness of the first sealing ring, and the diameter of the sealing glass is smaller than that of the second sealing groove and larger than that of the flange; the first sealing ring is fixed on the step through a bolt.

By adopting the technical scheme, the sealing glass is fixed through the steps and the sealing rings, the optical signal is transmitted through the sealing glass and passes through the first sealing ring and the second sealing ring arranged in the second sealing groove, the sealing glass is clamped and sealed on two sides of the sealing glass, and the sealing effect is better when the vacuum pumping is carried out; through the flange that sets up for sealed glass's position is restricted in the second seal groove, makes it comparatively stable, simultaneously, can dismantle first sealing ring through using the bolt and fix on the step, thereby can comparatively conveniently dismantle, change it.

The utility model is further arranged that a mounting ring is integrally formed at one side of the sealing cavity close to the second sealing port; the image conversion module is installed on one side, close to the first sealing opening, of the installation ring, and the PCB is installed on one side, close to the second sealing opening, of the installation ring in a sealing mode.

Through adopting above-mentioned technical scheme, sealed fixed to second sealing port department through the PCB board that sets up, the PCB board when sealed both can carry out electric connection to the circuit element of both sides, simultaneously, sets up through the multilayer structure of PCB board for the wiring mouth of both sides does not communicate each other, thereby makes the vacuum seal effect in the sealed cavity better.

The utility model discloses further set up to, just be located on the casing the collar upper cover is equipped with the second sealing ring, the PCB board seal clamp is established between second sealing ring and collar.

Through adopting above-mentioned technical scheme, fix the centre gripping to the PCB board through the second sealing ring that sets up and collar.

The utility model is further arranged in that a third sealing groove is arranged on one side of the mounting ring close to the second sealing ring, a third sealing ring is arranged in the third sealing groove, and the PCB is pressed on the third sealing ring; a blind hole is formed in the mounting ring and on the outer side of the third sealing groove; the second sealing ring and the PCB are provided with positioning holes, and the second sealing ring and the PCB are connected to the blind holes through the bolts penetrating through the positioning holes in a threaded manner.

By adopting the technical scheme, the third sealing groove is formed in the mounting ring, and the third sealing ring is mounted in the sealing groove, so that the PCB performs sealing treatment on the sealing cavity; the second sealing ring is fixed through the bolt, so that the PCB can be detachably fixed between the second sealing ring and the mounting ring.

To sum up, the utility model discloses a beneficial technological effect does:

1. the camera vacuum degree monitoring device not only can monitor the vacuum degree in the sealed cavity in the camera in real time, but also can automatically vacuumize the sealed cavity when the vacuum degree in the sealed cavity is insufficient, so that the manual vacuumizing process when the vacuum degree in the sealed cavity is insufficient is omitted;

2. the micro vacuum pump can be actively controlled by the upper computer to carry out the vacuumizing process, and the vacuumizing process is different from the vacuumizing mode of automatic detection and control, so that the application is more flexible;

3. the sealing glass is clamped and sealed at two sides of the sealing glass through the arranged first sealing ring and the second sealing ring arranged in the second sealing groove;

4. the PCB board through setting up seals fixedly to second sealing port department, and the PCB board both can carry out electric connection to the circuit element of both sides when sealed, simultaneously, sets up through the multilayer structure of PCB board for the wiring mouth of both sides does not communicate with each other, thereby makes the vacuum seal effect in the sealed cavity better.

Drawings

FIG. 1 is an exploded view of a camera vacuum packaging an image sensor chip;

FIG. 2 is a cross-sectional view of an image conversion module in a camera with a vacuum packaged image sensor chip;

FIG. 3 is a flow chart of the operation of a protruded vacuum monitoring module in a camera for vacuum packaging of an image sensor chip;

FIG. 4 is an exploded view of an image conversion module in a camera with a vacuum packaged image sensor chip;

FIG. 5 is a schematic diagram of a camera housing with a vacuum-packed image sensor chip;

FIG. 6 is a schematic diagram of a first seal ring protruding from a camera for vacuum packaging an image sensor chip;

FIG. 7 is an exploded view of a protruded PCB board in a camera for vacuum packaging an image sensor chip;

FIG. 8 is a schematic diagram of a camera housing with a vacuum packaged image sensor chip;

FIG. 9 is a schematic view of the position of the micro vacuum pump in the housing;

FIG. 10 is a schematic view of the connection structure of the control system of the micro vacuum pump

Fig. 11 is a schematic structural diagram of a control system of the micro vacuum pump.

In the figure, 1, a housing; 11. sealing the cavity; 111. a first sealing port; 112. a second sealing port; 12. sealing glass; 13. a step; 131. a first seal groove; 132. a first seal ring; 14. a first seal ring; 141. a second seal groove; 142. a second seal ring; 143. blocking edges; 15. a mounting ring; 151. a third seal groove; 152. blind holes; 153. a third seal ring; 16. a PCB board; 17. a second seal ring; 171. positioning holes; 18. a vacuum exhaust tube; 181. an external thread; 19. a micro vacuum pump; 191. a vacuum connecting pipe; 192. a threaded sleeve; 2. an image conversion module; 21. a sensor chip; 22. a sensor circuit board; 23. a semiconductor refrigeration sheet; 3. a power supply module; 4. a data processing module; 5. a vacuum degree monitoring module; 6. a terminal control module; 7. a housing; 8. a signal receiving module; 9. an FPGA chip; 91. a comparator; 92. a counter; 93. a gate; 94. an inverter; 101. an upper computer; 102. I2C bus controller.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings.

The present invention will be described in further detail with reference to the drawings, wherein like parts are designated by like reference numerals. It should be noted that as used in the following description, the terms "front," "rear," "left," "right," "upper" and "lower," "bottom" and "top" refer to directions in the drawings, and the terms "inner" and "outer" refer to directions toward and away from, respectively, the geometric center of a particular component.

The utility model provides a camera image conversion system of vacuum packaging image sensor chip, combine fig. 1 and fig. 2 to show, including casing 1, image conversion module 2 of setting in casing 1, power module 3 that supplies power to image conversion module 2 and data processing module 4 that image conversion module 2's signal was handled, wherein, when using, on casing 1 and be close to image conversion module 2 one side and install the camera lens, transmit optical signal for image conversion module 2 through the camera lens, handle optical signal through image conversion module 2, then convert optical signal into the signal of telecommunication, then transmit to data processing module 4 and handle, in the use, power supply data processing module 4, image conversion module 2 etc. through power module 3.

As shown in fig. 1, a casing 7 is further attached to the case 1 on the side close to the second seal port 112, and the power module 3 and the data processing module 4 are covered with the casing 7 to protect them.

Referring to fig. 2 and 3, the housing 1 is cylindrical, a sealed cavity 11 is formed inside the housing 1, the image conversion module 2 is installed in the sealed cavity 11, and the sealed cavity 11 is a vacuum structure.

As shown in fig. 3 and 4, further, a vacuum degree monitoring module 5 is arranged in the sealed cavity 11; the terminal control module 6 is arranged outside the sealed cavity 11, and the connection mode of the vacuum degree monitoring module 5 and the terminal control module 6 can be Bluetooth signal connection, wireless network connection, or telecommunication connection and the like.

The vacuum structure in the sealed cavity 11 is monitored in real time through the vacuum degree monitoring module 5 arranged in the sealed cavity 11, and meanwhile, the signal receiving module 8 is arranged outside and is used for receiving a vacuum degree signal sent by the terminal control module 6 in real time, so that the change of the vacuum degree in the sealed cavity 11 can be known more accurately and timely; the vacuum degree monitoring module 5 is used for monitoring the vacuum degree of the sealed cavity 11 in real time to output a vacuum degree monitoring signal of digital quantity responding to the vacuum degree in the sealed cavity 11, and when the vacuum degree in the sealed cavity 11 is insufficient, namely the vacuum degree is increased, the vacuum degree monitoring signal is correspondingly increased.

Referring to fig. 2 and 4, two openings, namely a first sealing port 111 and a second sealing port 112, are formed at two ends of the sealed cavity 11, wherein the first sealing port 111 transmits optical signals, and the second sealing port 112 is used for electrically connecting with the power module 3 (see fig. 1) and the data processing module 4 (see fig. 1).

The image conversion module 2 includes a sensor chip 21 and a semiconductor cooling plate 23 disposed on the sensor chip 21 and close to one side of the second sealing port 112, wherein the sensor chip 21 may be an SMOS image sensor and a CCD image converter, wherein the sensor chip 21 and the vacuum degree monitoring module 5 are fixedly mounted on the sensor circuit board 22, and the semiconductor cooling plate 23 cools the sensor circuit board 22.

In the use, semiconductor refrigeration piece 23 carries out the refrigeration in-process to sensor chip 21, can produce the heat convection under the condition of air in sealed cavity 11, at the imaging in-process, can produce great influence to the formation of image effect, so set up sealed cavity 11 into vacuum structure to do not have the air around making sensor chip 21, and then make sensor chip 21 imaging better.

As shown in fig. 4 and 5, the end near the first sealing opening 111 is sealed by the sealing glass 12, so that the optical signal can be transmitted to the sensor chip 21 through the sealing glass 12.

As shown in fig. 4 and fig. 6, a step 13 is integrally formed in the cavity of the housing 1 at one end close to the first sealing opening 111 along the radial direction, a first sealing groove 131 is formed on the step 13, the first sealing ring 132 is disposed in the first sealing groove 131, so that the sealing glass 12 can be pressed onto the first sealing ring 132, at the same time, a first sealing ring 14 is disposed, which can be pressed onto the sealing glass 12, a second sealing groove 141 is formed on one side of the first sealing ring 14 close to the sealing glass 12, and a second sealing ring 142 is disposed in the second sealing groove 141, so that the sealing glass 12 is located between the first sealing ring 132 and the second sealing ring 142 when the sealing glass 12 is pressed, and at the same time, the first sealing ring 14 is fixed on the step 13 by using a bolt at one side of the first sealing groove 131 away from the center, so that the sealing glass 12 can maintain a pressed state, thereby achieving a sealed state.

Further, the second sealing groove 141 is formed with a rib 143 on one side near the center, and the width of the rib 143 is smaller than the thickness of the first sealing ring 14, and the diameter of the sealing glass 12 is smaller than the diameter of the second sealing groove 141 and larger than the diameter of the rib 143, so that, when the sealing glass 12 is fixed, the sealing glass 12 can be clamped in the second sealing groove 141, the sealing glass 12 is limited in the radial direction, and when the first sealing ring 14 is fixed, the sealing glass 12 is relatively stable.

Referring to fig. 7 and 8, a mounting ring 15 is integrally formed in the sealed cavity 11 and on a side close to the second sealing opening 112, wherein the image conversion module 2 is disposed on a side of the mounting ring 15 away from the second sealing opening 112, and a PCB 16 is hermetically mounted on the mounting ring 15 and on a side close to the second sealing opening 112, wherein the second sealing opening 112 is hermetically fixed by the PCB 16, and meanwhile, the sensor chip 21 and the semiconductor cooling plate 23 are electrically connected to the PCB 16, and the PCB 16 is electrically connected to the power module 3 (referring to fig. 1) and the data processing module 4 on a side away from the sensor chip 21, so as to perform better vacuum sealing on the basis of realizing the data transmission function.

Wherein, the third seal groove 151 has been seted up to one side of keeping away from sensor chip 21 at collar 15, is provided with third sealing washer 153 in the third seal groove 151, with PCB 16 butt on third sealing washer 153, simultaneously, crimping second sealing ring 17 on PCB 16 makes the crimping between PCB 16 and the third sealing washer 153 comparatively inseparable through second sealing ring 17 to make PCB 16's sealed effect comparatively.

Further, on the collar 15 and in the third seal groove 151 one side of keeping away from the center seted up blind hole 152, seted up on second sealing ring 17 and PCB board 16 with blind hole 152 complex locating hole 171 to, threaded connection is on blind hole 152 after passing the low temperature hole on second sealing ring 17 and the PCB board 16 in proper order through the bolt that sets up, thereby realizes fixing PCB board 16.

It should be noted that the PCB 16 is a multilayer PCB, and two sides of the multilayer PCB are not connected to the electrical connection ports of the sensor chip 21, the power module 3, and the data processing module 4, respectively, so that the sealed cavity can be better sealed.

Meanwhile, in order to evacuate the sealed cavity 11, a vacuum exhaust tube 18 communicating with the sealed cavity 11 is provided on the housing 1.

Referring to fig. 3, 10 and 11, the camera further includes a comparator coupled to the vacuum degree detection module to receive the vacuum degree monitoring signal and output a comparison signal in response to the vacuum degree in the sealed cavity being greater than a vacuum degree set value, a counter coupled to the comparator to receive the comparison signal and start counting in response to the comparison signal and output a trigger signal, and a micro vacuum pump coupled to the counter to receive the trigger signal and operate in response to the trigger signal.

Referring to fig. 1 and 9, the micro vacuum pump 19 and the power module 3 are both disposed in the housing 7, the micro vacuum pump 19 is detachably connected to a vacuum connection pipe 191 penetrating the housing 7, a threaded sleeve 192 is slidably sleeved on an end portion of the vacuum connection pipe 191 located outside the housing 7 in an airtight manner, an external thread 181 in threaded fit with the threaded sleeve 192 is disposed on an end portion of the vacuum exhaust pipe 18 located outside the housing 7, and the threaded sleeve 192 is screwed on the external thread 181 of the vacuum exhaust pipe 18 to achieve airtight connection of the micro vacuum pump 19, the vacuum connection pipe 191 and the vacuum exhaust pipe 18.

It can be understood that a vacuum degree preset signal responding to the vacuum degree critical value is preset in the comparator 91, and when the vacuum degree monitoring module 5 detects that the vacuum degree in the sealed cavity 11 is insufficient, the vacuum degree monitoring signal is greater than the vacuum degree preset signal so that the comparator 91 outputs a high-level comparison signal; when the counter 92 receives the comparison signal, the counter is cleared and starts counting again, and starts to output a high-level trigger signal, and the micro vacuum pump 19 starts to operate after receiving the high-level trigger signal, so as to vacuumize the sealed cavity 11. The counter 92 is internally provided with a counting upper limit, and when the counting of the counter 92 reaches the counting upper limit, the counting is stopped and the counter 92 stops outputting the trigger signal, so that the micro vacuum pump 19 stops working; it will be appreciated that the interval between the digital transitions of the timer is fixed and the time counted to the upper limit of the count is fixed, i.e. the counter 92 performs the function of timing a specified duration. When the vacuum degree in the sealed cavity 11 is insufficient, the micro vacuum pump 19 operates for a period of time to evacuate the sealed cavity 11, and then is turned off.

Further, a gate 93 is connected between the counter 92 and the micro vacuum pump 19 in series, the gate 93 is connected with an I2C bus controller 102 and is connected with an upper computer 101 through the I2C bus controller 102, the gate 93 is used for selecting the counter 92 or the I2C bus controller 102 to be connected with the micro vacuum pump 19 and controlling the micro vacuum pump 19, when the micro vacuum pump 19 is communicated with the counter 92, the micro vacuum pump 19 is controlled by a detection and automatic control loop where a vacuum degree detection module is located, when the micro vacuum pump 19 is communicated with the I2C bus controller 102, the micro vacuum pump 19 can be directly controlled through the upper computer 101, and therefore automatic and manual control modes of the micro vacuum pump 19 are achieved.

It should be noted that the gating control of the gate 93 is connected to the upper computer 101 through the I2C bus controller 102, and is controlled by the upper computer 101 for gating, that is, the upper computer 101 needs to control both the gate 93 and the micro vacuum pump 19 through the I2C bus controller 102, and the two communication protocols are different, so the I2C bus controller 102 needs to be connected to the gate 93 through two lines, one of which is used for being connected to the gate 93 and controlling the gate 93 by the upper computer 101, and the other is used for being communicated with the micro vacuum pump 19 to control the micro vacuum pump 19.

In order to avoid the simultaneous operation of the micro vacuum pump 19 and the semiconductor refrigeration plate 23 in the automatic control loop, an inverter 94 is arranged between the comparator 91 and the semiconductor refrigeration plate 23, the input end of the inverter 94 is coupled to the comparator 91 to receive the comparison signal, and the output end of the inverter 94 is coupled to the semiconductor refrigeration plate 23, when the comparator 91 outputs a high-level comparison signal, the semiconductor refrigeration plate 23 receives a low-level signal to make the semiconductor refrigeration plate 23 not work, otherwise, the semiconductor refrigeration plate 23 works, that is, the micro vacuum pump 19 and the semiconductor refrigeration plate 23 do not work simultaneously in the automatic control loop.

In the conventional camera setting, if the semiconductor cooling plate 23 does not operate, the image conversion module 2 of the camera may not operate normally.

Of course, since the operation of the semiconductor chilling plates 23 is also controlled, and is generally directly controlled by the upper computer 101, when the micro vacuum pump 19 is in a loop directly controlled by the upper computer 101, the automatic control loop is totally disabled, that is, there is a possibility that the micro vacuum pump 19 and the semiconductor chilling plates 23 operate simultaneously in a state where the micro vacuum pump 19 is directly controlled by the upper computer 101.

In this embodiment, the comparator 91, the inverter 94, the counter 92 and the gate 93 all adopt programming devices integrated on the FPGA chip 9, the FPGA chip 9 is adopted to realize circuit functions, the integration degree is high, the internal space of the camera is saved, and the FPGA chip 9 adopts direct graphic logic input, so that the technology is mature, and the realization mode is simple. It needs to point out that FPGA chip 9 is current mature technique, and the mode that adopts FPGA chip 9 to carry out picture and text programming is conventional technological means, and FPGA chip 9 also is current program with the program logic of interior programming, so the utility model discloses do not relate to the improvement to the procedure. It should be noted that the gas pumped out by the micro vacuum pump 19 is generally less and the housing 7 where the micro vacuum pump 19 is located is not sealed, so it is directly exhausted into the housing 7 where the power module 3 is located.

In the specific working process: when the micro vacuum pump (19) is selected by the upper computer (101) to be communicated with the automatic control loop where the vacuum degree detection module is located, the vacuum degree monitoring module (5) detects the vacuum degree in the sealed cavity (11), and when the vacuum degree in the sealed cavity (11) is insufficient, the micro vacuum pump (19) works for a period of time to vacuumize the sealed cavity (11) and then automatically stops, so that the automatic maintenance of the vacuum degree in the sealed cavity (11) is realized; when the micro vacuum pump (19) is selected through the upper computer (101) and is directly communicated with the upper computer (101) through the I2C bus controller (102), the micro vacuum pump (19) can be directly controlled through the upper computer (101).

The process of manually adopting a specific device to vacuumize the sealed cavity (11) when the vacuum degree in the sealed cavity (11) is insufficient is omitted in the process of detecting and controlling the automatic vacuum pumping, the process is simple and convenient, the process of vacuumizing can be directly controlled, the active maintenance of the vacuum degree in the sealed cavity (11) is facilitated, and the control of the vacuum degree in the sealed cavity (11) is relatively flexible.

The sealed cavity and the sealed cavity are only explained for the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications to the present embodiment as needed without inventive contribution after reading the present specification, but all are protected by patent laws within the scope of the claims of the present invention.

Claims (9)

1. A camera of a vacuum packaging image sensor chip comprises a shell (1), an image conversion module (2) arranged in the shell (1), a power supply module (3) for supplying power to the image conversion module (2), and a data processing module (4) for processing signals of the image conversion module (2), wherein a sealed cavity (11) is formed in the shell (1), and a vacuum degree monitoring module (5) is arranged in the sealed cavity (11); the vacuum degree monitoring module (5) is used for monitoring the vacuum degree of the sealed cavity (11) in real time to output a vacuum degree monitoring signal responding to the vacuum degree in the sealed cavity (11); the FPGA chip (9), the FPGA chip (9) is provided with a comparator (91) and a timing unit inside;

a comparator (91) coupled to the vacuum monitoring module (5) to receive the vacuum monitoring signal and output a comparison signal in response to an insufficient vacuum level within the sealed cavity (11);

the timing unit is coupled with the comparator (91) to receive the comparison signal so as to respond to the comparison signal timing zero clearing to restart timing and start to output a trigger signal; the timing unit resets the timing after timing the set time and stops outputting the trigger signal;

and the micro vacuum pump (19) is used for vacuumizing the sealed cavity (11) and is coupled with the timing unit to receive the trigger signal so as to work in response to the trigger signal.

2. The camera of claim 1, wherein the timing unit is configured as a counter (92), the counting time interval of the counter (92) is fixed, an upper counting limit is stored in the counter (92), the counter (92) counts when receiving the comparison signal, the counter (92) resets to restart counting and starts outputting the comparison signal, and the counter (92) stops counting and stops outputting the trigger signal when the counter (92) counts to the upper counting limit.

3. The camera for vacuum packaging the image sensor chip as claimed in claim 1, further comprising an inverter (94) having an input terminal coupled to an output terminal of the comparator (91) and a semiconductor chilling plate (23) coupled to an output terminal of the inverter (94), wherein the semiconductor chilling plate (23) and the micro vacuum pump (19) are not operated simultaneously when the inverter (94) is operated; the inverter (94) is also integrated in the FPGA chip (9).

4. The camera for vacuum packaging the image sensor chip as claimed in claim 2, further comprising a gate (93) connected in series between the counter (92) and the micro vacuum pump (19), wherein the gate (93) is further coupled with an I2C bus controller (102), the I2C bus controller (102) is coupled with an upper computer (101), and the upper computer (101) drives the gate (93) to selectively communicate with the counter (92) or directly communicate with the I2C bus controller (102); the gate (93) is also integrated into the FPGA chip (9).

5. The camera for vacuum packaging the image sensor chip as claimed in claim 1, wherein a terminal control module (6) is arranged outside the sealed cavity (11), and the vacuum degree monitoring module (5) is connected with the terminal control module (6); a first sealing opening (111) is formed in one side of the sealing cavity (11), a second sealing opening (112) is formed in the other side of the sealing cavity, sealing glass (12) is hermetically installed at the first sealing opening (111), and a PCB (16) is hermetically installed at the second sealing opening; the image conversion module (2) and the vacuum degree monitoring module (5) are connected with the PCB (16) at the inner side of the sealed cavity (11), and the power supply module (3), the terminal control module (6) and the data processing module (4) are connected with the PCB (16) at the outer side of the sealed cavity (11); a vacuum exhaust tube (18) communicated with the sealed cavity (11) is arranged on the shell (1); the vacuum pumping pipe (18) is communicated and connected with the micro vacuum pump (19).

6. The camera for vacuum packaging the image sensor chip as claimed in claim 5, wherein a step (13) is integrally formed on the inner wall of the sealed cavity (11) in the shell (1); a first sealing ring (14) is arranged on the step (13) in a covering mode, and the sealing glass (12) is clamped between the step (13) and the first sealing ring (14); a first sealing groove (131) is formed in the step (13), and a first sealing ring (132) is arranged in the first sealing groove (131); a second sealing groove (141) is formed in one side, close to the step (13), of the first sealing ring (14), a second sealing ring (142) is arranged in the second sealing groove (141), and the sealing glass (12) is clamped between the first sealing ring (132) and the second sealing ring (142); a rib (143) is formed on one side of the second sealing groove (141) close to the center, the width of the rib (143) is smaller than the thickness of the first sealing ring (14), and the diameter of the sealing glass (12) is smaller than that of the second sealing groove (141) and larger than that of the rib (143); the first sealing ring (14) is fixed on the step (13) through bolts.

7. The camera for vacuum packaging the image sensor chip as claimed in claim 5, wherein a mounting ring (15) is integrally formed in the sealed cavity (11) on a side close to the second sealing port (112); the image conversion module (2) is arranged on one side, close to the first sealing opening (111), of the mounting ring (15), and the PCB (16) is arranged on one side, close to the second sealing opening (112), of the mounting ring (15) in a sealing mode.

8. The camera for vacuum packaging the image sensor chip as claimed in claim 7, wherein a second sealing ring (17) is covered on the housing (1) and positioned on the mounting ring (15), and the PCB (16) is hermetically clamped between the second sealing ring (17) and the mounting ring (15).

9. The camera for vacuum packaging the image sensor chip as claimed in claim 7, wherein a third sealing groove (151) is formed on one side of the mounting ring (15) close to the second sealing ring (17), a third sealing ring (153) is arranged in the third sealing groove (151), and the PCB (16) is pressed on the third sealing ring (153); a blind hole (152) is formed in the mounting ring (15) and on the outer side of the third sealing groove (151); the second sealing ring (17) and the PCB (16) are provided with positioning holes (171), and bolts penetrate through the positioning holes (171) to be connected to the blind holes (152) in a threaded mode.

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