CN108388062A - Laser projection module, depth camera and electronic device - Google Patents
Laser projection module, depth camera and electronic device Download PDFInfo
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- CN108388062A CN108388062A CN201810161926.7A CN201810161926A CN108388062A CN 108388062 A CN108388062 A CN 108388062A CN 201810161926 A CN201810161926 A CN 201810161926A CN 108388062 A CN108388062 A CN 108388062A
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- laser
- projection module
- circuit board
- light source
- laser projection
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B15/00—Special procedures for taking photographs; Apparatus therefor
- G03B15/02—Illuminating scene
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N2021/9511—Optical elements other than lenses, e.g. mirrors
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Abstract
The invention discloses a kind of laser projection modules.Laser projection module includes light source, collimating element, diffraction optical element and laser distribution probe assembly.Light source is for emitting laser.Collimating element is used for collimation laser.Diffraction optical element is for the laser after diffraction collimating element collimation to form laser pattern.Laser distribution probe assembly is arranged in the luminous light path of light source.Laser distribution probe assembly is used to convert the optical signal that light source emits to electric signal output to judge whether collimating element and/or diffraction optical element rupture.In this way, laser projection module can be not turned on when detecting rupture, to avoid to user body or eyes generate harm.In addition, the invention also discloses a kind of depth camera and electronic devices.
Description
Technical field
The present invention relates to technical field of imaging, more particularly to a kind of laser projection module, depth camera and electronic device.
Background technology
Structure light video camera head emits laser using light source, to assist infrared camera to obtain structure light image.Positive reason
Under condition, the laser of light source transmitting, will not be to people by optical system (such as collimating element, diffraction optical element) energy attenuation afterwards
Body damages.However, optical system is usually made of glass or other frangible components, once situations such as dropping is encountered, light
System ruptures, and laser will be emitted directly, irradiate the body or eyes of user, cause serious safety problem.
Invention content
A kind of laser projection module of embodiment of the present invention offer, depth camera and electronic device.
The laser projection module of embodiment of the present invention includes light source, collimating element, diffraction optical element and laser distribution
Probe assembly.The light source is for emitting laser；The collimating element is for collimating the laser；The diffraction optical element is used
Laser after the collimating element collimation described in diffraction is to form laser pattern；The laser distribution probe assembly is arranged in the light
In the luminous light path in source, the laser distribution probe assembly is used to convert the optical signal that the light source emits to electric signal output
To judge whether the collimating element and/or the diffraction optical element rupture.
The depth camera of embodiment of the present invention includes that laser projection module, the image described in any of the above-described embodiment are adopted
Storage and processor.Described image collector be used to acquire projected from the laser projection module into object space it is described sharp
Light pattern.The processor connect with laser distribution probe assembly and is used to handle the laser pattern to obtain depth map
Picture obtains the electric signal, judges whether the electric signal is in preset range and is not in the electric signal described
The collimating element and/or diffraction optical element rupture are determined when in preset range.
The electronic device of embodiment of the present invention includes the depth camera described in shell and any of the above-described embodiment, described
Depth camera setting is exposed to obtain the depth image on the housing and from the shell.
Laser projection module, depth camera and the electronic device of embodiment of the present invention, by the way that laser is distributed detection group
Part is arranged in the luminous light path of light source, converts the optical signal that light source emits to electric signal, to judge collimating element and/
Or whether diffraction optical element ruptures.In this way, can detect that whether laser projection module is intact, and detecting laser projection mould
It when group rupture, may be selected to be not turned on laser projection module, after rupturing to avoid laser projection module, laser projection module projects
Laser energy it is excessively high, body or eyes to user, which are led to the problem of, to be endangered, and the safety that uses of user is promoted.
The additional aspect and advantage of embodiment of the present invention will be set forth in part in the description, partly will be from following
Become apparent in description, or practice through the invention is recognized.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention can be from the description in conjunction with following accompanying drawings to embodiment
It will be apparent and be readily appreciated that, wherein：
Fig. 1 to Fig. 4 is the structural schematic diagram of the laser projection module of certain embodiments of the present invention；
Fig. 5 is the structural schematic diagram of the edge-emitting laser of certain embodiments of the present invention；
Fig. 6 to Figure 20 is the part-structure schematic diagram of the laser projection module of certain embodiments of the present invention；
Figure 21 is the structural schematic diagram of the depth camera of certain embodiments of the present invention；
Figure 22 is the floor map of the electronic device of certain embodiments of the present invention.
Specific implementation mode
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein identical
Or similar label indicates same or similar element or element with the same or similar functions from beginning to end.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and is only used for explaining embodiments of the present invention, and should not be understood as to this hair
The limitation of bright embodiment.
In the description of embodiments of the present invention, it is to be understood that term "center", " longitudinal direction ", " transverse direction ", " length
Degree ", " width ", " thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner",
The orientation or positional relationship of the instructions such as "outside", " clockwise ", " counterclockwise " is to be based on the orientation or positional relationship shown in the drawings, only
It is embodiments of the present invention and simplified description for ease of description, does not indicate or imply the indicated device or element is necessary
With specific orientation, with specific azimuth configuration and operation, therefore should not be understood as the limitation to embodiments of the present invention.
In addition, term " first ", " second " are used for description purposes only, it is not understood to indicate or imply relative importance or implicit
Indicate the quantity of indicated technical characteristic." first " is defined as a result, the feature of " second " can be expressed or impliedly wrap
Include one or more feature.In the description of embodiments of the present invention, the meaning of " plurality " is two or two
More than, unless otherwise specifically defined.
In the description of embodiments of the present invention, it should be noted that unless otherwise clearly defined and limited, term
" installation ", " connection ", " connection " shall be understood in a broad sense, for example, it may be fixedly connected, may be a detachable connection or one
Connect to body；It can be mechanical connection, can also be to be electrically connected or can mutually communicate；Can be directly connected to, can also lead to
It crosses intermediary to be indirectly connected with, can be the interaction relationship of the connection or two elements inside two elements.For ability
For the those of ordinary skill in domain, it can understand that above-mentioned term in embodiments of the present invention specific contains as the case may be
Justice.
Following disclosure provides many different embodiments or example is used for realizing embodiments of the present invention not
Same structure.In order to simplify the disclosure of embodiments of the present invention, hereinafter the component of specific examples and setting are described.When
So, they are merely examples, and is not intended to limit the present invention.In addition, embodiments of the present invention can be in different examples
Repeat reference numerals and/or reference letter in son, this repetition are for purposes of simplicity and clarity, itself not indicate to be begged for
By the relationship between various embodiments and/or setting.In addition, the various specific techniques that embodiments of the present invention provide
With the example of material, but make those of ordinary skill in the art may realize that the application of other techniques and/or other materials
With.
Referring to Fig. 1, the laser projection module 220 of embodiment of the present invention includes light source 220a, collimating element 223, swashs
Light distribution probe assembly 224 and diffraction optical element 225.Light source 220a is for emitting laser.Collimating element 223 is sharp for collimating
Light.Diffraction optical element 225 is for the laser after the collimation of diffraction collimating element 223 to form laser pattern.Laser distribution detection
Component 224 is arranged in the luminous light path of light source 220a.The light that laser distribution probe assembly 224 is used to emit light source 220a is believed
Number electric signal output is converted into judge whether collimating element 223 and/or diffraction optical element 225 rupture.
The laser projection module 220 of embodiment of the present invention is arranged by the way that laser is distributed probe assembly 224 in light source
In the luminous light path of 220a, convert the light source 220a optical signals emitted to electric signal, to judge collimating element 223 and/
Or whether diffraction optical element 225 ruptures.In this way, can detect that whether laser projection module 220 is intact, and detecting laser
It when projecting the rupture of module 220, may be selected to be not turned on laser projection module 220, after being ruptured to avoid laser projection module 220, swash
The energy for the laser that light projection module 220 projects is excessively high, and the body or eyes to user, which are led to the problem of, to be endangered, and promotes user
The safety used.
In addition, since laser distribution probe assembly 224 is arranged in the luminous light path of light source 220a, laser is distributed detection group
Part 224 can directly receive the laser of light source 220a transmittings, therefore laser distribution probe assembly 224 can be according to electric signal
Relatively accurately judge whether collimating element 223 and/or diffraction optical element 225 rupture.
Specifically, light source 220a transmittings are for detecting collimating element 223 and/or whether diffraction optical element 225 ruptures
Optical signal, wherein the intensity of the optical signal can be less than the intensity of the optical signal emitted when light source 220a normal works, to reduce
Safety in energy consumption and raising detection process.Laser distribution probe assembly 224 converts the optical signal received to telecommunications again
Number (current or voltage etc.) output.When collimating element 223 and diffraction optical element 225 are in serviceable condition, light source 220a hairs
The laser penetrated is larger by energy attenuation after collimating element 223 and/or diffraction optical element 225, and laser is distributed probe assembly 224
The optical signal received is weaker, and the electric signal to get is also weaker.And work as collimating element 223 and/or diffraction optical element
When 225 rupture, the laser of light source 220a transmittings will directly emit from rupture location, and energy attenuation is smaller, laser distribution
The optical signal that probe assembly 224 receives is stronger, and the electric signal to get is also stronger.Therefore, it can be distributed according to laser
The electric signal that probe assembly 224 is got in real time and laser point under 225 non-state of rupture of collimating element 223 and diffraction optical element
Size of the difference between the electric signal that cloth probe assembly 224 is got judges collimating element 223 and/or diffraction optical element
Whether 225 rupture.It is further possible to according to laser under 225 non-state of rupture of collimating element 223 and diffraction optical element point
The electric signal that cloth probe assembly 224 is got determines a preset range [Emin, Emax], when laser is distributed probe assembly 224
When the electric signal got in real time is not in the preset range, determine that collimating element 223 and/or diffraction optical element 225 are broken
It splits.
Further, when the electric signal that laser distribution probe assembly 224 is got in real time is more than Emax, when laser is distributed
The electric signal that probe assembly 224 is got in real time be in range (Emax, E1] when, it may be determined that collimating element 223 rupture；When sharp
The electric signal that light distribution probe assembly 224 is got in real time be in range (E1, E2] when, it may be determined that diffraction optical element 225
Rupture；When the electric signal that laser distribution probe assembly 224 is got in real time is in range (E2 ,+∞), it may be determined that collimation member
Part 223 and diffraction optical element 225 rupture, wherein E2 ＞ E1 ＞ Emax.Certainly, above-mentioned for further determining that collimation member
The mode that part 223 and/or diffraction optical element 225 rupture is only to schematically illustrate, and laser is distributed the electricity that probe assembly 224 obtains
Signal can also be only used for primarily determining at least one presence rupture in collimating element 223 and diffraction optical element 225, and exist
Selection is not turned on laser projection module 220 when rupture.
In some embodiments, laser distribution probe assembly 224 includes conducting element 2242 and is arranged in conducting element
Photodetector 2244 on 2242.The setting of conducting element 2242 is shining in light path.Specifically, photodetector 2244 can be with
For photodiode (Photo-Diode, PD), the optical signal that photodetector 2244 can emit light source 220a is converted into electricity
Signal (current or voltage etc.), and electric signal is conducted to conducting element 2242, conducting element 2242 passes through the line transmission electricity
Signal, such as it is transmitted to the processor 228 (please referring to Figure 21) of depth camera 200, so that processor 228 can be according to the electricity
Signal determines that collimating element 223 and/or diffraction optical element 225 rupture.
Please refer to Fig.1 to Fig.4, in some embodiments, conducting element 2242 be light transmission (light transmission can refer to light transmission
Rate is greater than or equal to 80%, similarly hereinafter) sheets of conductive membrane structure.The sheets of conductive membrane structure of light transmission can be reduced or avoided sharp
The influence to laser when in the luminous light path of light source 220a is arranged in light distribution probe assembly 224.
Specifically, conducting element 2242 includes opposite conductive plane of incidence 2242b and conductive exit facet 2242a.Conduction enters
It is by the side of close to sources 220a to penetrate face 2242b.
Photodetector 2244 may be provided on conductive plane of incidence 2242b or be arranged on conductive exit facet 2242a or
Person is arranged in the inside of conducting element 2242.
In some embodiments, the quantity of photodetector 2244 is one, in this way, light detection can be reduced or avoided
Influence (such as avoid shelter from laser) of the element 2244 to laser.In some embodiments, photodetector 2244 is arranged
In the central area of conducting element 2242, such photodetector 2244 can be with the strong of the zero order beam of accurately measure laser
Degree, and can weaken or shelter from zero order beam, avoid zero order beam from damaging human body.
In some embodiments, the quantity of photodetector 2244 is multiple, and the interval of multiple photodetectors 2244 is set
It sets on conducting element 2242.Specifically, photodetector 2244 can be in matrix distribution on conducting element 2242, Huo Zhecheng
Straight line is distributed on conducting element 2242；Or it is diminishingly distributed to marginal density by the center of light-guide device 2242
On conducting element 2242, this is not restricted.
When the quantity of photodetector 2244 is multiple, multiple photodetectors 2244 are respectively used to multiple and different positions
The multiple optical signals received set are converted into multiple electric signals and conduct to conducting element 2242, and conducting element 2242 again will be more
A electric signal can be judged by line transmission to processor 228, processor 228 according to the average value between multiple electric signals
Whether collimating element 223 and/or diffraction optical element 225 rupture.Similarly, whether processor 228 is for judging the average value
It is not in preset range, collimating element 223 and/or diffraction optical element is determined when the average value is not in preset range
225 ruptures.In this way, the result that detection collimating element 223 and/or diffraction optical element 225 rupture is more accurate.In addition, due to
The quantity of photodetector 2244 is multiple, when one of photodetector 2244 damages, other photodetectors
2244 can work normally, and realize the function that detection collimating element 223 and/or diffraction optical element 225 rupture.Therefore, it compares
For a photodetector 2244 only is arranged, the laser projection module 220 of embodiment of the present invention detects collimating element 223
And/or the reliability higher that diffraction optical element 225 ruptures.
It should be noted that when stating photodetector 2244 in design, photodetector 2244 can be minimized
Size, to which influence of the photodetector 2244 to laser be reduced or avoided.
It in some embodiments, can be with if above-mentioned photodetector 2244 blocks or reduce the laser of position
The region that 2244 position of photodetector is corresponded in laser pattern is handled as bad point, such as according to laser pattern
Other normal regions in addition to bad point work normally or obtained using other normal region interpolation of laser pattern in addition to bad point
Obtain the corresponding regime values in bad point position.
In some embodiments, laser distribution probe assembly 224 is located at collimating element 223 and diffraction optical element 225
Between；And/or laser distribution probe assembly 224 is located at the side of the separate collimating element 223 of diffraction optical element 225.Namely
It is to say, the quantity that laser is distributed probe assembly 224 can be one, and a laser distribution probe assembly 224 is located at collimating element
(as shown in Figure 1 to Figure 3) or the separate collimating element positioned at diffraction optical element 225 between 223 and diffraction optical element 225
223 side (as shown in Figure 4).The quantity that laser is distributed probe assembly 224 can be two, one of laser distribution detection
For component 224 between collimating element 223 and diffraction optical element 225, another laser distribution probe assembly 224 is located at diffraction
The side of the separate collimating element 223 of optical element 225.
It please refers to Fig.1 to Fig.3, a laser distribution probe assembly 224 is located at collimating element 223 and diffraction optical element
Between 225, when collimating element 223 and diffraction optical element 225 are in serviceable condition, the laser of light source 220a transmittings passes through standard
Energy attenuation is larger after straight element 223, and the optical signal that laser distribution probe assembly 224 receives is weaker, the electricity to get
Signal is also weaker.And when collimating element 223 ruptures, the laser of light source 220a transmittings will directly be launched from rupture location
Come, energy attenuation is smaller, and the optical signal that laser distribution probe assembly 224 receives is stronger, and the electric signal to get also is got over
By force；When diffraction optical element 225 ruptures, the laser of light source 220a transmittings reflects at rupture location, and by laser point
Cloth probe assembly 224 receives, and the electric signal to get is also stronger.When the rupture of collimating element 223 and diffraction optical element
When 225 rupture, the laser of light source 220a transmittings will directly emit from the rupture location of collimating element 223, energy attenuation
Smaller, in addition, laser can also reflect at the rupture location of diffraction optical element 225, laser distribution probe assembly 224 connects
The optical signal received is stronger, and the electric signal to get is also stronger.Thus, it is possible to judge collimating element 223 and/or diffraction light
Learn whether element 225 ruptures.
Referring to Fig. 4, a laser distribution probe assembly 224 is located at the separate collimating element 223 of diffraction optical element 225
Side, similarly may determine that whether collimating element 223 and/or diffraction optical element 225 rupture, be no longer developed in details.
When one of laser be distributed probe assembly 224 between collimating element 223 and diffraction optical element 225, separately
When the side for the separate collimating element 223 that one laser distribution probe assembly 224 is located at diffraction optical element 225, two laser
Projected position of the probe assembly 224 on light source 220a is distributed to mutually stagger.When any of which laser is distributed probe assembly 224
When detecting that collimating element 223 and/or diffraction optical element 225 rupture, it may be selected to be not turned on laser projection module 220, with true
It ensures safety.In addition, when any of which laser distribution probe assembly 224 damages, another laser is distributed probe assembly 224
It can also work normally, realize the function that detection collimating element 223 and/or diffraction optical element 225 rupture.
In some embodiments, light source 220a includes vertical cavity surface emitting laser (Vertical Cavity
Surface Emitting Laser, VCSEL).
Referring to Fig. 1, in some embodiments, light source 220a includes edge-emitting laser (edge-emitting
Laser, EEL) 221.Edge-emitting laser 221 includes light-emitting surface 2211, and light-emitting surface 2211 is towards collimating element 223.The present invention
The laser projection module 220 of embodiment emits laser, one side edge-emitting laser 221 using edge-emitting laser 221
It is smaller compared with the temperature drift of VCSEL array, on the other hand, since edge-emitting laser 221 is single-point light emitting structure, it is not necessarily to array of designs
Structure makes simply, and the cost of light source of laser projection module 220 is relatively low.
Further, the light-emitting surface 2211 of edge-emitting laser 221 is towards collimating element 223 and diffraction optical element 225,
Therefore the laser that edge-emitting laser 221 emits enters after being directly transmitted to collimating element 223 in diffraction optical element 225,
Prism for reflection laser need not be additionally set, prism is avoided to reduce the efficiency of laser.
Referring to Fig. 5, in some embodiments, edge-emitting laser 221 refers to light-emitting surface 2211 perpendicular to substrate
2226 laser.Edge-emitting laser 221 be, for example, Fabry-Perot type laser (fabry perot laser, FP) or
Distributed feedback laser (Distributed Feedback Laser, DFB) 222.In embodiments of the present invention, edge emitting
Laser 221 is distributed feedback laser 222.
In some embodiments, light-emitting surface 2211 is vertical with the collimation optical axis 2232 of collimating element 223.In this way, being convenient for
In the laser light incident to collimating element 223 that edge-emitting laser 221 emits.
Specifically, when light-emitting surface 2211 is vertical with the collimation optical axis 2232 of collimating element 223, edge-emitting laser 221
The central ray of the laser of transmitting is parallel with the collimation optical axis 2232 of collimating element 223, and such collimating element 223 is easy to implement right
It is burnt, enabling accurately to project the laser that edge-emitting laser 221 emits on diffraction optical element 225.
In some embodiments, collimation optical axis 2232 passes through the center of light-emitting surface 2211.In this way, 223 energy of collimating element
The enough laser emitted edge-emitting laser 221 realizes preferable collimating effect.
Specifically, when the laser emitted in edge-emitting laser 221 is directly transmitted in collimating element 223, optical axis is collimated
2232 pass through the center of light-emitting surface 2211, and the laser light incident that edge-emitting laser 221 emits can be made to collimating element 223,
It so can steadily export the laser after collimation.
In some embodiments, collimation optical axis 2232 is parallel with the diffraction optical axis 2252 of diffraction optical element 225, into one
Step ground, collimates optical axis 2232 and diffraction optical axis 2252 overlaps, and across the center of light-emitting surface 2211.In this way, edge-emitting laser
The laser of 221 transmittings can realize preferable collimating effect and diffracting effect.
Fig. 6 to Figure 15 is please referred to, in some embodiments, laser projection module 220 further includes fixed component 227, Gu
Component 227 is determined for fixing edge-emitting laser 221.In this way, edge-emitting laser 221 can be consolidated using fixed component 227
It is fixed live, to prevent edge-emitting laser 221 from falling, the accident such as displacement or shaking.
Specifically, incorporated by reference to Fig. 5, edge-emitting laser 221 is generally in elongate strip structure.Such as distributed feedback laser
222 include top electrode 2221, top covering 2222, active layer 2223, optical grating construction 2224, under-clad layer 2225, substrate 2226 and under
Electrode 2227.Wherein, top covering 2222 can be formed by P-type semiconductor monomer (such as GaAS, InAs, InSb etc.), under-clad layer
2225 can be formed by N-type semiconductor monomer (such as GaAS, InAs, InSb etc.), shape between top covering 2222 and under-clad layer 2225
At P-N junction, optical grating construction 2224 is, for example, Bragg grating (bragg grating).By in top electrode 2221 and lower electrode
2227 add forward bias, and a large amount of holes in top covering 2222, a large amount of free electrons in under-clad layer 2225 are in active layer
2223 generations are compound, and since compound tense electronics is from conduction band transitions to valence band, extra energy just emits in the form of light, from
And form laser.
The laser of distributed feedback laser 222 obtains the increasing of power by the feedback of optical grating construction 2224 when propagating
Benefit.The power for improving distributed feedback laser 222 needs to swash by increasing Injection Current and/or increasing distributed feedback
The length of light device 222, since increase Injection Current can make the power consumption of distributed feedback laser 222 increase and generate heat
Therefore serious problem in order to ensure that distributed feedback laser 222 can work normally, needs increase distributed feedback to swash
The length of light device 222 causes distributed feedback laser 222 generally in elongate strip structure.
When the light-emitting surface 2211 of edge-emitting laser 221 is towards collimating element 223, edge-emitting laser 221 is in vertical
Place, since edge-emitting laser 221 is in elongate strip structure, edge-emitting laser 221 be susceptible to fall, displacement or shaking etc.
It is unexpected, it is therefore desirable to be fixed edge-emitting laser 221 using fixed component 227.
Referring to Fig. 6, in some embodiments, laser projection module 220 includes circuit board assemblies 229, Bian Fa
Penetrate the company that laser 221 further includes the mounting surface 2214 and connection light-emitting surface 2211 and mounting surface 2214 opposite with light-emitting surface 2211
Junction 2215, fixed component 227 are sealing 2271, and sealing 2271 is arranged between mounting surface 2214 and circuit board assemblies 229.Such as
Edge-emitting laser 221, can be rapidly bonded on circuit board assemblies 229 by this using sealing 2271.
Also referring to Fig. 6, Fig. 7 to Fig. 9, in some embodiments, sealing 2271 can also be provided at circuit board assemblies
Between 229 and joint face 2215, the joint face 2215 of edge-emitting laser 221 can be fixed, to edge-emitting laser 221
It is less likely to occur to shake, and then avoids the problem that edge-emitting laser 221 shakes and influences laser pattern.
Referring to Fig. 7, in some embodiments, the quantity of joint face 2215 is multiple, and the setting of sealing 2271 exists
Between any one joint face 2215 and circuit board assemblies 229.Since sealing 2271 is positioned only at a joint face 2215 and electricity
Between road board group part 229, on the one hand, the simple for process of edge-emitting laser 221 is bonded, so as to rapidly swash edge emitting
Light device 221 is fixed on circuit board assemblies 229；On the other hand the sealing needed for bonding edge-emitting laser 221 can be reduced
2271 amount can so reduce the manufacturing cost of laser projection module 220.
It should be noted that when sealing 2271 is arranged between any one joint face 2215 and circuit board assemblies 229, envelope
The joint face 2215 can be completely covered in glue 2271 or part covers the joint face 2215.
In some embodiments, edge-emitting laser 221 be in rectangular shape, multiple joint faces 2215 for example including：
First joint face 2216, the second joint face 2217, third joint face 2218 and the 4th joint face 2219.Sealing 2271 is arranged in office
Anticipate between a joint face 2215 and circuit board assemblies 229, it can be understood as, the setting of sealing 2271 the first joint face 2216 with
Between circuit board 229 or sealing 2271 is arranged between the second joint face 2217 and circuit board 229 or the setting of sealing 2271 exists
Between third joint face 2218 and circuit board 229 or sealing 2271 is arranged between the 4th joint face 2219 and circuit board 229,
It is not specifically limited herein.
Referring to Fig. 7, in one embodiment, sealing 2271 is arranged between the 4th joint face 2219 and circuit board 229.
Referring to Fig. 8, in some embodiments, the quantity of joint face 2215 is multiple, and the setting of sealing 2271 exists
Between at least two joint faces 2215 and circuit board assemblies 229.In this way, the installation that can improve edge-emitting laser 221 is stablized
Property.Since sealing 2271 is arranged between at least two joint faces 2215 and circuit board assemblies 229, edge emitting can be improved
The mounting stability of laser 221, reduce edge-emitting laser 221 and occur falling, displacement, shaking etc. it is unexpected.It needs to illustrate
It is that when sealing 2271 is arranged between at least two joint faces 2215 and circuit board assemblies 229, sealing 2271 can be completely covered
Any one joint face 2215 or part cover any one joint face 2215.
In some embodiments, sealing 2271 is arranged between at least two joint faces 2215 and circuit board assemblies 229,
It is to be understood that sealing 2271 is arranged between the first joint face 2216 and circuit board assemblies 229 and is arranged in the second joint face
Between 2217 and circuit board assemblies 229；Or sealing 2271 is arranged between the first joint face 2216 and circuit board assemblies 229 and sets
It sets between third joint face 2218 and circuit board assemblies 229；Or sealing 2271 is arranged in the first joint face 2216 and circuit board
Between component 229 and it is arranged between the 4th joint face 2219 and circuit board assemblies 229；Or the setting of sealing 2271 is in the second connection
Between face 2217 and circuit board assemblies 229 and it is arranged between third joint face 2218 and circuit board assemblies 229；Or sealing 2271
It is arranged between the second joint face 2217 and circuit board assemblies 229 and setting is in the 4th joint face 2219 and circuit board assemblies 229
Between；Or sealing 2271 is arranged between third joint face 2218 and circuit board assemblies 229 and is arranged in the 4th joint face 2219
Between circuit board assemblies 229；Or sealing 2271 is arranged between the first joint face 2216 and circuit board assemblies 229, setting exists
Between second joint face 2217 and circuit board assemblies 229 and it is arranged between third joint face 2218 and circuit board assemblies 229；Or
Sealing 2271 is arranged between the first joint face 2216 and circuit board assemblies 229, is arranged in the second joint face 2217 and circuit board
Between component 229 and it is arranged between the 4th joint face 2219 and circuit board assemblies 229；Or the setting of sealing 2271 is in the first connection
Between face 2216 and circuit board assemblies 229, it is arranged between third joint face 2218 and circuit board assemblies 229 and is arranged the 4th
Between joint face 2219 and circuit board assemblies 229；Or the setting of sealing 2271 the second joint face 2217 and circuit board assemblies 229 it
Between, be arranged between third joint face 2218 and circuit board assemblies 229 and be arranged in the 4th joint face 2219 and circuit board assemblies
Between 229；Or sealing 2271 is arranged between the first joint face 2216 and circuit board assemblies 229, is arranged in the second joint face
Between 2217 and circuit board assemblies 229, it is arranged between third joint face 2218 and circuit board assemblies 229 and is arranged in the 4th company
Between junction 2219 and circuit board assemblies 229.
Wherein, any one joint face 2215 can be completely covered in sealing 2271 or part covers any one joint face
2215, it is arranged between the first joint face 2216 and circuit board assemblies 229 with sealing 2271 and is arranged in the second joint face 2217
For between circuit board assemblies 229, it can be understood as, sealing 2271 is completely covered the first joint face 2216 and is completely covered the
Two joint faces 2217；Or the second joint face 2217 of the first joint face 2216 and part covering is completely covered in sealing 2271；Or sealing
2271 parts cover the first joint face 2216 and the second joint face 2217 are completely covered；Or the first connection of 2271 part of sealing covering
The second joint face 2217 of face 2216 and part covering.
Please continue to refer to Fig. 8, in one embodiment, sealing 2271 is arranged in third joint face 2218 and circuit board assemblies
Between 229 and between the 4th joint face 2219 and circuit board assemblies 229.
Referring to Fig. 9, in some embodiments, the quantity of joint face 2215 is multiple, and institute is wrapped up in sealing 2271
There is joint face 2215.In this way, the stability of edge-emitting laser 221 can be improved to a greater degree, it is further reduced edge emitting
Falling occurs in laser 221, displacement, shaking etc. are unexpected.It should be noted that all joint faces 2215 are wrapped up in sealing 2271, it can
To be interpreted as, all joint faces 2215 are completely covered in sealing 2271.
Please continue to refer to Fig. 9, in one embodiment, all joint faces 2215 are wrapped up in sealing 2271, it can be understood as, envelope
The first joint face 2216, the second joint face 2217, third joint face 2218 and the 4th joint face 2219 is completely covered in glue 2271.
Referring to Fig. 10, in some embodiments, light-emitting surface 2211 is including luminous zone 2212 and is located at luminous zone 2212
The non-light-emitting area 2213 of both sides, sealing 2271 are arranged on non-light-emitting area 2213.In this way, edge emitting can be improved yet further
The stability of laser 221.
It specifically, can be with mainly by 2223 region emergent ray of active layer when being shone due to edge-emitting laser 221
The active layer 2223 and its peripheral region of edge-emitting laser 221 are regarded as luminous zone 2212, other non-luminous regions are regarded
Make non-light-emitting area 2213, it, can be in the non-of light-emitting surface 2211 in order to yet further improve the stability of edge-emitting laser 221
Sealing 2271 is also provided on luminous zone 2213.It should be noted that sealing 2271 is arranged when on non-light-emitting area 2213, sealing
2271 are completely covered non-light-emitting area 2213 or part covering non-light-emitting area 2213.
Referring to Fig. 10, in one embodiment, luminous zone 2212 and non-light-emitting area 2213 are as shown, sealing 2271 is complete
All standing non-light-emitting area 2213.In some embodiments, sealing 2271 can also be arranged on luminous zone 2212, and setting is being sent out
The light transmittance of sealing 2271 in light area 2212 is more than 85%, in this way, sealing 2271 can fix edge-emitting laser 221,
The normal work that can also be avoided sheltering from laser and influence laser projection module 220.
1 to Figure 14 is please referred to Fig.1, in some embodiments, the quantity of joint face 2215 is one, and sealing 2271 is arranged
Between joint face 2215 and circuit board assemblies 229.A part for joint face 2215 is wrapped up in sealing 2271.In this way, can simplify
The technique in bonding connection face 2215 reduces the manufacturing cost of laser projection module 220.
It is appreciated that due to a part for 2271 package joint faces 2215 of sealing, it is bonded edge-emitting laser 221
It is simple for process, so as to which rapidly edge-emitting laser 221 is fixed on circuit board assemblies 229.In addition, sealing 2271
The part for only wrapping up joint face 2215 can also reduce the quantity of the sealing 2271 needed for bonding edge-emitting laser 221, such as
This can reduce the manufacturing cost of laser projection module 220.
It should be noted that when a part for joint face 2215 is wrapped up in sealing 2271, sealing 2271, which can be arranged, to be connected
Can also be the short transverse in edge-emitting laser 221 on the region of the close mounting surface 2214 in face 2215, sealing 2271 connects
Mounting surface 2214 and light-emitting surface 2211 are connect, and in the circumferential direction of edge-emitting laser 221, the joint face of 2271 covering part of sealing
2215 (as shown in figure 13).
2 are please referred to Fig.1, in one embodiment, edge-emitting laser 221 is cylindrical, and the quantity of joint face 2215 is
One, sealing 2271 can be arranged in joint face 2215 on the region of mounting surface 2214.
3 are please referred to Fig.1, in another embodiment, edge-emitting laser 221 is cylindrical, the quantity of joint face 2215
It is one, in the short transverse of edge-emitting laser 221, sealing 2271 connects mounting surface 2214 and light-emitting surface 2211, and on side
On the circumferencial direction of emitting laser 221, the joint face 2215 of 2271 covering part of sealing.
4 are please referred to Fig.1, in some embodiments, the quantity of joint face 2215 is one, and the setting of sealing 2271 is connecting
Between face 2215 and circuit board assemblies 229.Entire joint face 2215 is wrapped up in sealing 2271.In this way, edge emitting laser can be improved
The stability of device 221.It is appreciated that entire joint face 2215 is wrapped up in sealing 2271, the steady of edge-emitting laser 221 can be improved
It is qualitative, reduce edge-emitting laser 221 and occur falling, displacement, shaking etc. it is unexpected.
In some embodiments, the quantity of joint face 2215 only there are one when, sealing 2271 can also be arranged non-
On luminous zone 2213, it is not specifically limited herein.
Please refer to Fig.1 5, in some embodiments, the setting of sealing 2271 mounting surface 2214 and circuit board assemblies 229 it
Between and be arranged between joint face 2215 and circuit board assemblies 229, wherein sealing 2271 be arranged in joint face 2215 and circuit board
The case where being any one of the above embodiment between component 229.In this way, the steady of edge-emitting laser 221 can be improved
It is qualitative.
In some embodiments, sealing 2271 is heat-conducting glue.In this way, the heat conductivility opposite side of heat-conducting glue can be utilized to send out
Laser 221 is penetrated to radiate.Specifically, edge-emitting laser 221 will produce more heat during the work time, especially exist
In the case of increasing operating current in order to ensure the operating power of edge-emitting laser 221, the power consumption of edge-emitting laser 221
Increase and occur serious problem of generating heat, heat conduction may be used in the sealing 2271 for being accordingly used in fixed edge-emitting laser 221
Glue, in this way, using the heat conductivility of heat-conducting glue, it can be by the heat derives of edge-emitting laser 221, to be embodied as edge emitting
The effect that laser 221 radiates, and then avoid edge-emitting laser 221 operation irregularity or damage etc. are asked due to heat largely accumulates
Topic.
6 are please referred to Fig.1, in some embodiments, laser projection module 220 includes circuit board assemblies 229, fixed component
227 be the fixed frame 2272 being arranged on circuit board assemblies 229, and edge-emitting laser 221 is housed in fixed frame 2272 and holds
It is loaded on circuit board assemblies 229.In this way, edge-emitting laser 221 can be fixed using fixed frame 2272.
Specifically, edge-emitting laser 221 can be partly housed in fixed frame 2272, such as edge-emitting laser
The part-structure of 221 mounting surface 2214 and the close mounting surface 2214 of joint face 2215 is housed in fixed frame 2272, to
The material needed for fixed frame 2272 can be reduced, and then reduces the manufacturing cost of laser projection module 220.Edge-emitting laser
221 can also fully be housed in fixed frame 2272, i.e., the mounting surface 2214 of edge-emitting laser 221 and joint face 2215 are complete
It is housed in fixed frame 2272 entirely, can so improve the stability of edge-emitting laser 221.In addition, in order to avoid fixed frame
2272 shelter from laser and influence the normal work of laser projection module 220, the upper surface 2272a and light-emitting surface of fixed frame 2272
2211 is concordant, i.e. the upper surface 2272a of fixed frame 2272 is in light-emitting surface 2211 in same plane.
Certainly, when edge-emitting laser 221 is fully housed in fixed frame 2272, the upper surface of fixed frame 2272
2272a can also be higher than light-emitting surface 2211, and the upper surface 2272a of fixed frame 2272 does not influence the normal propagation of laser.At one
In embodiment, the upper surface 2272a of fixed frame 2272 is slightly above light-emitting surface 2211, and the upper surface 2272a of fixed frame 2272
Extend to light-emitting surface 2211, extends to the non-light-emitting area 2213 of light-emitting surface 2211, can so be slided to avoid edge-emitting laser 221
Go out.At this point, the bottom of fixed frame 2272 can default (being through-hole among fixed frame 2272), when installation, edge-emitting laser
221 can be stretched into the bottom of self-retaining frame 2272 until being contradicted with upper surface 2272a.
7 to Figure 19 are please referred to Fig.1, in some embodiments, laser projection module 220 includes circuit board assemblies 229, Gu
It includes at least two flexible supporting frames 2273 being arranged on circuit board assemblies 229, at least two supporting racks 2273 to determine component 227
Receiving space 2278 is collectively formed, receiving space 2278 accommodates edge-emitting laser 221, and at least two supporting racks 2273 are for branch
Prop up edge-emitting laser 221.In this way, edge-emitting laser 221 can be fixed using flexible supporting frames 2273.
Specifically, in fixed edge-emitting laser 221, it can first apply external force and make supporting rack 2273 towards far from receiving
The direction in space 2278 is pushed aside, and then edge-emitting laser 221 is put into receiving space 2278, then supporting rack 2273 is loose
It opens, due to the elastic reaction of supporting rack 2273, each supporting rack 2273 generates the compressing towards 221 center of edge-emitting laser
Edge-emitting laser 221 is fixed on circuit board assemblies 229 by power, the resultant force generated between multiple supporting racks 2273.
Referring to Figure 17 and Figure 18, in one embodiment, at least two supporting racks 2273 can refer to first
Support 2274, the second supporting rack 2275, third supporting rack 2276 and the 4th supporting rack 2277, four supporting racks 2273 are opposite two-by-two
Setting, specifically, the first supporting rack 2274 is oppositely arranged with third supporting rack 2276, the second supporting rack 2275 and the 4th supporting rack
2277 are oppositely arranged, in this way, the first supporting rack 2274, the second supporting rack 2275, third supporting rack 2276 and the 4th supporting rack
2277 resultant forces being collectively formed can support edge-emitting laser 221.
In some embodiments, the material of fixed component 227 is Heat Conduction Material.In this way, Heat Conduction Material can be utilized
Heat conductivility radiates to edge-emitting laser 221.
Specifically, edge-emitting laser 221 will produce more heat during the work time, especially in order to ensure sending out on side
The operating power of laser 221 is penetrated in the case of increasing operating current, the power consumption of edge-emitting laser 221 increases and occurs
It generates heat serious problem, therefore Heat Conduction Material may be used in fixed component 227, in this way, using the heat conductivility of Heat Conduction Material, it can
By the heat derives of edge-emitting laser 221, to be embodied as the effect of the heat dissipation of edge-emitting laser 221, and then to avoid side
Emitting laser 221 due to heat largely accumulates operation irregularity or damage the problems such as.Wherein, Heat Conduction Material can be ceramic material
Material, or metal material (being, for example, aluminium, gold, copper, silver etc.).In this way, ceramic material, metal material etc. can be made full use of
The good feature of Heat Conduction Material thermal conductivity, radiates to edge-emitting laser 221.
Referring to Fig. 1, in some embodiments, circuit board assemblies 229 are including substrate 2296 and are carried on substrate
Circuit board 2292 on 2296, circuit board 2292 offer via 2294, and edge-emitting laser 221 is carried on substrate 2296 simultaneously
It is housed in via 2294.In this way, substrate 2296 can be utilized to support circuit board 2292, and can be by circuit board 2292
On open up via 2294 to reduce the thickness of laser projection module 220.
In some embodiments, circuit board 2292 for example can be printed circuit board (PCB), flexible PCB (FPC),
Any one in Rigid Flex.
Please continue to refer to Fig. 1, in some embodiments, substrate 2296 offers heat emission hole 2298.In this way, edge emitting swashs
Light device 221 can be radiated by heat emission hole 2298.
Specifically, heat emission hole 2298 can be the blind hole being opened on substrate 2296 close to 221 side of edge-emitting laser
Or through-hole.The shape of heat emission hole 2298 can be circle, rectangle etc..Further, the quantity of heat emission hole 2298 can be one
A, position corresponding with edge-emitting laser 221 opens up heat emission hole 2298 on substrate 2296.The quantity of heat emission hole 2298 also may be used
Think multiple, multiple heat emission holes 2298 can be with a matrix type arranged on substrate 2296, can also be swashed close to edge emitting
The position of light device 221 is densely arranged.
In some embodiments, substrate 2296 is made from a material that be thermally conductive.In this way, substrate 2296 can be used not only for carrying electricity
Road plate 2292, and can also radiate to edge-emitting laser 221, improve the service life of laser projection module 220.Its
In, Heat Conduction Material can be ceramic material, or metal material (being, for example, aluminium, gold, copper, silver etc.).In this way, can be abundant
Using the good feature of the Heat Conduction Materials such as ceramic material, metal material thermal conductivity, radiate to edge-emitting laser 221.
In some embodiments, the material of substrate 2296 may be plastics, for example be polyethylene terephthalate
Ester (Polyethylene Glycol Terephthalate, PET), polymethyl methacrylate (Polymethyl
Methacrylate, PMMA), makrolon (Polycarbonate, PC), in polyimides (Polyimide, PI) at least
It is a kind of.In this way, 2296 weight of substrate is small and has enough support strengths.
In certain embodiments, heat emission hole 2298 fills Heat Conduction Material, Heat Conduction Material and the substrate 2296 of heat emission hole 2298
Heat Conduction Material it is different.In this way, can in the case that substrate 2296 manufacturing cost it is lower, improve substrate 2296 heat dissipation effect
Fruit.
Specifically, Heat Conduction Material (such as heat-conducting silicone grease or metal material etc.) may be used in heat emission hole 2298 to be filled out
It is filled with enhancing heat-conducting effect.When the material of substrate 2296 is ceramics and offers heat emission hole 2298 as above, heat emission hole 2298
Middle filling heat-conducting silicone grease or metal material (such as silver, copper, gold etc.) are to radiate.In this way, compared to the pottery of substrate 2296
For ceramic material, the heat conductive silica gel or metal material of heat emission hole 2298 can improve the heat conductivility of substrate 2296.Work as substrate
When 2296 material is metal material and offers heat emission hole 2298 as above, filling heat conductivility is than the gold in heat emission hole 2298
Belong to the better metal of thermal conductivity of material.For example, when the material of substrate 2296 is aluminium, copper is injected in heat emission hole 2298, then
For example, when the material of substrate 2296 is copper, gold is injected in heat emission hole 2298.In this way, compared to substrate 2296 completely by leading
For hot property is relatively low and lower-cost metal material is made, heat conductivility is better, and complete compared to substrate 2296
For being made entirely of excellent thermal conductivity and the higher metal material of cost, cost is lower.When the material of substrate 2296 is modeling
When expecting and offering heat emission hole 2298 as above, filling heat-conductive silicone grease or metal material in heat emission hole 2298, substrate at this time
2296 one side are played a supporting role, and on the other hand play cooling effect, and compared to substrate 2296 completely by Heat Conduction Material
For (metal material or ceramic material) is made, quality is lighter.
Referring to Fig. 2, in some embodiments, circuit board assemblies 229 can only include circuit board 2292, edge emitting laser
Device 221 is arranged on circuit board 2292.In this way, reducing the thickness of laser projection module 220.In some embodiments, electric
Fluted 2299 can be opened up on road plate 2292, the setting of edge-emitting laser 221 connects in groove 2299 and by fixed component 227
It connects, in this way, further decreasing the thickness of laser projection module 220.
9 and Figure 20 are please referred to Fig.1, in some embodiments, circuit board assemblies 229 are including substrate 2296 and are carried on base
Circuit board 2292 on plate 2296, circuit board 2292 offer via 2294, and edge-emitting laser 221 is carried on substrate 2296
And be housed in via 2294, the inner wall of via 2294 is contacted with the joint face 2215 of edge-emitting laser 221.In this way, can be with
Edge-emitting laser 221 is fixed using via 2294.
Specifically, the size and shape of the inner wall of via 2294 can be with the joint face 2215 of edge-emitting laser 221
Size and shape is consistent, when to be arranged edge-emitting laser 221 in via 2294, the inner wall and edge emitting of via 2294
Edge-emitting laser 221 can be fixed on circuit board assemblies 229 by the frictional force between the joint face 2215 of laser 221,
At this point, the fixed component 227 of any one of the above embodiment can be default, the via 2294 of circuit board assemblies 229 in other words
It may be regarded as fixed component 227.
It certainly, can also be with any one of the above embodiment when fixing edge-emitting laser 221 by via 2294
Fixed component 227 is combined, such as in one embodiment, and edge-emitting laser 221 is arranged after via 2294, envelope is passed through
Glue 2271 connects mounting surface 2214 with circuit board assemblies 229 and connect the inner wall of joint face 2215 and via 2294.
It please refers to Fig.1 and Fig. 2, in some embodiments, the laser projection module 220 of embodiment of the present invention can also wrap
Barrel assembly 226 is included, barrel assembly 226 is arranged on circuit board assemblies 229 and collectively constitutes host cavity with circuit board assemblies 229
2262.Barrel assembly 226 includes lens barrel 2264 and protective cover 2266.Lens barrel 2264 includes roof 2264a and prolongs from roof 2264a
The peripheral wall 2264b for the annular stretched, peripheral wall 2264b are arranged on circuit board assemblies 229, and roof 2264a is offered and host cavity
The light hole 2264c of 2262 connections.Protective cover 2266 is arranged on roof 2264a.Protective cover 2266 includes offering light extraction to lead to
The baffle 2266b of the hole 2266a and annular sidewall 2266c extended from baffle 2266b.Diffraction optical element 225 is carried on roof
2264a is upper and is housed in protective cover 2266.The opposite both sides of diffraction optical element 225 respectively with protective cover 2266 and roof
2264a is contradicted, and baffle 2266b includes the resistance surface 2268 close to light hole 2264c, diffraction optical element 225 and resistance surface
2268 contradict.
Specifically, diffraction optical element 225 includes opposite the diffraction plane of incidence 2254 and diffraction exit facet 2256.Diffraction light
It learns element 225 to be carried on roof 2264a, the surface of the close light hole 2264c of diffraction exit facet 2256 and baffle 2266b
(resistance surface 2268) contradicts, and the diffraction plane of incidence 2254 is contradicted with roof 2264a.Light hole 2264c is aligned with host cavity 2262, is gone out
Light through-hole 2266a is aligned with light hole 2264c.Roof 2264a, side wall 2266c and baffle 2266b and diffraction optical element 225
It contradicts, to prevent diffraction optical element 225 from falling off out of protective cover 2266 along light direction.In some embodiments, it protects
Shield 2266 is pasted onto by glue 2269 on roof 2264a.
Please continue to refer to Fig. 1 and Fig. 2, in some embodiments, collimating element 223 is including optical section 2234 and around light
The mounting portion 2236 that the department of the Chinese Academy of Sciences 2234 is arranged, collimating element 223 include positioned at the collimated incident face of 223 opposite both sides of collimating element
2238 with collimation exit facet 2239, the curved surfaces that optical section 2234 is located at 223 opposite both sides of collimating element including two, mounting portion
2236 contradict with peripheral wall 2264b.
When assembling above-mentioned laser projection module 220, along light path from the bottom end of the peripheral wall 2264b of barrel assembly 226
Collimating element 223 is put into host cavity 2262 successively and installs the circuit board assemblies 229 of edge-emitting laser 221.Bian Fa
Penetrating laser 221 can first be mounted on circuit board assemblies 229, then will be equipped with the circuit board of edge-emitting laser 221 again
Component 229 is combined with barrel assembly 226 together.Diffraction optical element 225 is carried on roof 2264a against the direction of light path
On, then protective cover 2266 is mounted on roof 2264a, to make diffraction optical element 225 be housed in protective cover 2266.
In this way, laser projection module 220 is installed simply.In other embodiments, first the reversing of diffraction optical element 225 can also be set
It sets in protective cover 2266, then diffraction optical element 225 and protective cover 2266 is installed along on roof 2264a again.This
When, diffraction exit facet 2256 and the resistance surface 2268 of diffraction optical element 225 contradict, the diffraction plane of incidence 2254 and roof 2264a
It contradicts and opposite with the collimation exit facet 2239 of optical section 2234, collimated incident face 2238 and the edge emitting laser of optical section 2234
Device 221 is opposite.In this way, the installation of laser projection module 220 is simpler.
Figure 21 is please referred to, the depth camera 200 of embodiment of the present invention includes the laser of any one of the above embodiment
Project module 220, image acquisition device 240 and processor 228.Image acquisition device 240 for acquire from laser projection module 220 to
The laser pattern projected in object space.Processor 228 respectively with laser distribution probe assembly 224, laser projection module 220,
And image acquisition device 240 connects, processor 228 is for handling laser pattern to obtain depth image, obtain laser distribution detection
The electric signal of component 224 judges whether electric signal is true in preset range and when electric signal is not in preset range
Determine collimating element 223 and/or diffraction optical element 225 ruptures.
Laser pattern is handled to obtain depth image, is specifically as follows, processor 228 is calculated using image matching algorithm
The deviation value of each pixel each pixel corresponding with reference pattern, is further obtained further according to the deviation value in laser pattern
Obtain the depth image of laser pattern.Wherein, image matching algorithm can be digital picture correlation (Digital Image
Correlation, DIC) algorithm.It is of course also possible to use other image matching algorithms replace DIC algorithms.
In some embodiments, image acquisition device 240 can be infrared camera.
In some embodiments, processor 228 can also be applied to the laser projection module 220 of embodiment of the present invention
In, the laser projection module 220 of embodiment of the present invention includes processor 228 in other words.
Figure 22 is please referred to, the electronic device 1000 of embodiment of the present invention includes that shell 100 and any one of the above are implemented
The depth camera 200 of mode, depth camera 200 are mounted on shell 100 and are exposed from shell 100 to obtain laser pattern.
The depth camera 200 and electronic device 1000 of embodiment of the present invention are emitted sharp using edge-emitting laser 221
Light, one side edge-emitting laser 221 are smaller compared with the temperature drift of VCSEL array, on the other hand, since edge-emitting laser 221 is
Single-point light emitting structure is not necessarily to array of designs structure, makes simply, the cost of light source of laser projection module 220 is relatively low.
In some embodiments, electronic device 1000 includes mobile phone, tablet computer, laptop, Intelligent bracelet, intelligence
Energy wrist-watch, intelligent helmet, intelligent glasses etc..
In the description of this specification, reference term " embodiment ", " some embodiments ", " schematically implementation
The description of mode ", " example ", " specific example " or " some examples " etc. means the tool described in conjunction with the embodiment or example
Body characteristics, structure, material or feature are contained at least one embodiment or example of the present invention.In the present specification,
Schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, the specific features of description, knot
Structure, material or feature can be combined in any suitable manner in any one or more embodiments or example.
Any process described otherwise above or method description are construed as in flow chart or herein, and expression includes
It is one or more for realizing specific logical function or process the step of executable instruction code module, segment or portion
Point, and the range of the preferred embodiment of the present invention includes other realization, wherein can not press shown or discuss suitable
Sequence, include according to involved function by it is basic simultaneously in the way of or in the opposite order, to execute function, this should be of the invention
Embodiment person of ordinary skill in the field understood.
Expression or logic and/or step described otherwise above herein in flow charts, for example, being considered use
In the order list for the executable instruction for realizing logic function, may be embodied in any computer-readable medium, for
Instruction execution system, device or equipment (system of such as computer based system including processing module or other can be from instruction
Execute system, device or equipment instruction fetch and the system that executes instruction) use, or combine these instruction execution systems, device or
Equipment and use.For the purpose of this specification, " computer-readable medium " can be it is any can include, store, communicating, propagating or
Transmission program uses for instruction execution system, device or equipment or in conjunction with these instruction execution systems, device or equipment
Device.The more specific example (non-exhaustive list) of computer-readable medium includes following：With one or more wiring
Electrical connection section (IPM current foldback circuits), portable computer diskette box (magnetic device), random access memory (RAM) are read-only to deposit
Reservoir (ROM), erasable edit read-only storage (EPROM or flash memory), fiber device and portable optic disk are only
Read memory (CDROM).In addition, computer-readable medium can even is that the paper that can print described program on it or other conjunctions
Suitable medium, because can be for example by carrying out optical scanner to paper or other media, then into edlin, interpretation or when necessary
It is handled with other suitable methods electronically to obtain described program, is then stored in computer storage.
It should be appreciated that each section of embodiments of the present invention can be with hardware, software, firmware or combination thereof come real
It is existing.In the above-described embodiment, multiple steps or method can use storage in memory and by suitable instruction execution system
The software or firmware of execution is realized.For example, if realized with hardware, in another embodiment, ability can be used
Any one of following technology or their combination well known to domain are realized：With for realizing logic function to data-signal
The discrete logic of logic gates, the application-specific integrated circuit with suitable combinational logic gate circuit, programmable gate array
(PGA), field programmable gate array (FPGA) etc..
Those skilled in the art are appreciated that realize all or part of step that above-described embodiment method carries
Suddenly it is that relevant hardware can be instructed to complete by program, the program can be stored in a kind of computer-readable storage medium
In matter, which includes the steps that one or a combination set of embodiment of the method when being executed.
In addition, each functional unit in various embodiments of the present invention can be integrated in a processing module, also may be used
To be that each unit physically exists alone, can also two or more units be integrated in a module.It is above-mentioned integrated
The form that hardware had both may be used in module is realized, can also be realized in the form of software function module.The integrated module
If being realized in the form of software function module and when sold or used as an independent product, a calculating can also be stored in
In machine read/write memory medium.
Storage medium mentioned above can be read-only memory, disk or CD etc..
Although embodiments of the present invention have been shown and described above, it is to be understood that the above embodiment is
Illustratively, it is not considered as limiting the invention, those skilled in the art within the scope of the invention can be right
The above embodiment is changed, changes, replacing and modification.
Claims (17)
1. a kind of laser projection module, which is characterized in that the laser projection module includes：
Light source, the light source is for emitting laser；
Collimating element, the collimating element is for collimating the laser；
Diffraction optical element, the diffraction optical element is for the laser after collimating element collimation described in diffraction to form laser figure
Case；With
Laser is distributed probe assembly, and the laser distribution probe assembly is arranged in the luminous light path of the light source, the laser
Distribution probe assembly be used to convert the optical signal that the light source emits to electric signal output with judge the collimating element and/or
Whether the diffraction optical element ruptures.
2. laser projection module according to claim 1, which is characterized in that the laser distribution probe assembly includes conduction
Element and the photodetector being arranged on the conducting element, the conducting element are arranged in the luminous light path.
3. laser projection module according to claim 2, which is characterized in that the conducting element is the sheets of conductive of light transmission
Membrane structure.
4. laser projection module according to claim 2, which is characterized in that the quantity of the photodetector be it is multiple,
Multiple photodetectors are arranged at intervals on the conducting element.
5. laser projection module according to claim 1, which is characterized in that the laser distribution probe assembly is located at described
Between collimating element and the diffraction optical element；And/or the laser distribution probe assembly is located at the diffraction optical element
Far from the collimating element side.
6. laser projection module according to claim 1, which is characterized in that the light source includes vertical cavity surface-emitting laser
Device.
7. laser projection module according to claim 1, which is characterized in that the light source includes edge-emitting laser.
8. laser projection module according to claim 7, which is characterized in that the light source is distributed feedback laser.
9. laser projection module according to claim 7 or 8, which is characterized in that the light source includes light-emitting surface, the hair
Smooth surface is towards the collimating element.
10. laser projection module according to claim 9, which is characterized in that the laser projection module further includes fixing
Component, the fixed component is for fixing the light source.
11. laser projection module according to claim 10, which is characterized in that the laser projection module includes circuit board
Component, the light source further include the connection of the mounting surface and the connection light-emitting surface and the mounting surface opposite with the light-emitting surface
Face, the fixed component are sealing, and the sealing is arranged between the mounting surface and the circuit board assemblies.
12. laser projection module according to claim 10, which is characterized in that the laser projection module includes circuit board
Component, the light source further include the connection of the mounting surface and the connection light-emitting surface and the mounting surface opposite with the light-emitting surface
Face, the fixed component are sealing, and the sealing is arranged between the circuit board assemblies and the joint face.
13. laser projection module according to claim 10, which is characterized in that the laser projection module includes circuit board
Component, the fixed component are the fixed frame being arranged on the circuit board assemblies, and the light source is housed in the fixed frame
And it is carried on the circuit board assemblies.
14. laser projection module according to claim 10, which is characterized in that the laser projection module includes circuit board
Component, the fixed component includes at least two flexible supporting frames being arranged on the circuit board assemblies, described at least two
Receiving space is collectively formed in supporting rack, and the receiving space is for accommodating the light source, and at least two support frames as described above are for branch
Support said light source.
15. laser projection module according to claim 9, which is characterized in that the laser projection module further includes circuit
Board group part, the circuit board assemblies include the circuit board of substrate and carrying on the substrate, and the circuit board offers via,
The light source loading on the substrate and is housed in the via, and the circuit board assemblies are for fixing the light source, institute
The inner wall for stating via is contacted with the joint face of the light source.
16. a kind of depth camera, which is characterized in that the depth camera includes：
Laser projection module described in claim 1-15 any one；
Image acquisition device, described image collector is for described in acquiring and being projected into object space from the laser projection module
Laser pattern；With
The processor being connect with laser distribution probe assembly, the processor is for handling the laser pattern to obtain depth
Degree image obtains the electric signal, judges whether the electric signal is not in preset range and in the electric signal
The collimating element and/or diffraction optical element rupture are determined when in the preset range.
17. a kind of electronic device, which is characterized in that the electronic device includes：
Shell；With
Depth camera described in claim 16, depth camera setting expose on the housing and from the shell with
Obtain the depth image.
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| CN201810161926.7A CN108388062A (en) | 2018-02-27 | 2018-02-27 | Laser projection module, depth camera and electronic device |
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| WO2020038060A1 (en) * | 2018-08-22 | 2020-02-27 | Oppo广东移动通信有限公司 | Laser projection module and control method therefor, and image acquisition device and electronic apparatus |
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