CN108385078A - Flexible base board and preparation method thereof - Google Patents
Flexible base board and preparation method thereof Download PDFInfo
- Publication number
- CN108385078A CN108385078A CN201810161890.2A CN201810161890A CN108385078A CN 108385078 A CN108385078 A CN 108385078A CN 201810161890 A CN201810161890 A CN 201810161890A CN 108385078 A CN108385078 A CN 108385078A
- Authority
- CN
- China
- Prior art keywords
- base board
- flexible
- flexible substrate
- flexible base
- metal film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/20—Metallic material, boron or silicon on organic substrates
- C23C14/205—Metallic material, boron or silicon on organic substrates by cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
Abstract
The invention discloses a kind of flexible base board and preparation method thereof, which includes：Flexible substrate is wound up on rotating device；Control flexible substrate rotation；By the surface of metal particle deposition to flexible substrate；Metallic forms metal film on flexible substrate surface.Pass through above method; metallic is set to deposit film forming under flexible substrate rolled state; with absorb flexible base board it is open and flat after or when more crimping metal film itself the stress that brings of hardness; protect metal film that phenomenon of rupture does not occur; and formed metal film also because metallic rotating and depositing and thin and thick is uniform, caused by avoiding uneven thickness the phenomenon that flexible substrate warpage.
Description
Technical field
The present invention relates to display technology fields, more particularly to a kind of flexible base board and preparation method thereof.
Background technology
With the continuous development of electronic display technology, flexible display apparatus (flexible TFT-LCD, flexible OLED etc.) is with its matter
Amount is light, and thickness is small, long lifespan, flexible to wait many merits, becomes most potential display technology of new generation.It is now main
The flexible substrate of the flexible base board of stream includes mainly ultra-thin glass, metal class and thin polymer film three categories, wherein using most
More is polymer flexibility substrate, such as PI (polyimides) substrate material, good mechanical property, excellent endurance energy,
Good optical transmittance, can " roll-to-roll " production the features such as, become the preferred material of existing flexible substrate and obtain extensive
Pay attention to.
But flexible base board be bent and be unfolded during, on flexible substrates by metal film etching from metal
Line easily causes entire flexible base board to break down, and this kind probably due to stress cannot be fully absorbed and is broken
Malfunction elimination is difficult, and repair is not easy, and causes the failure rate of flexible base board higher.Moreover, metal film uneven distribution is even, also result in
The phenomenon that flexible substrate warpage.
Invention content
Present invention generally provides a kind of flexible base boards and preparation method thereof, it is intended to solve current flexible base board bending or
When expansion, metallic diaphragm stress can not be fully absorbed and occur fracture and metal film uneven distribution it is even caused by flexible liner
The problem of bottom warpage.
In order to solve the above technical problems, the technical solution adopted by the present invention is：A kind of production method of flexible base board is provided,
The method includes：
Flexible substrate is wound up on rotating device；
Control the flexible substrate rotation；
By metal particle deposition to the surface of the flexible substrate；And
The metallic forms metal film on the flexible substrate surface.
In order to solve the above technical problems, the another technical solution that the present invention uses is：A kind of flexible base board is provided, it is described
Flexible base board is made by the production method of above-mentioned flexible base board.
The beneficial effects of the invention are as follows：By the way that flexible substrate to be wound up on rotating device, make metallic in flexible liner
Film forming is deposited under the rolled state of bottom, what the hardness of metal film itself was brought when absorbing open and flat rear flexible base board or curling answers
Power protects metal film not occur phenomenon of rupture, and metal film also because the rotating and depositing of metallic and thin and thick is uniform, avoid
Caused by uneven thickness the phenomenon that flexible substrate warpage.
Description of the drawings
Fig. 1 is the flow diagram of the production method of flexible base board of the present invention；
Fig. 2 is the operation chart of the production method of flexible base board of the present invention；
Fig. 3 is the structural schematic diagram of flexible base board of the present invention.
Specific implementation mode
Referring to Fig. 1, being the flow diagram of the production method of flexible base board of the present invention.As shown in Figure 1, the present invention is flexible
The production method of substrate includes the following steps：
Step S1：Flexible substrate 2 is wound up on rotating device 1；
Step S2：Flexible substrate 2 is controlled to rotate；
Step S3：By metal particle deposition to the surface of flexible substrate 2；
Step S4：Metallic forms metal film 3 on 2 surface of flexible substrate；
Step S5：By adsorption of the flexible substrate 2 far from metal film 3 in flat substrate；
Step S6：It is coated with, exposes on metal film 3, development；
Step S7：Vacuum suction is released to detach flexible substrate 2 with flat substrate.
Metal film 3 has certain hardness, the process of flexible substrate 2 curling and expansion for flexible substrate 2
In, metal film 3 the phenomenon that fracture may can not occur because of stress by absorption.But after the above coating operation, phase
Than the deposited metal particle directly in flat flexible substrate 2, most clear advantage is that, metal film 3 (being shown in Fig. 3) exists
Deposition work is completed under 2 rolled state of flexible substrate, so the flexible substrate 2 for just having completed plated film takes off from rotating device 1
From rear temporarily in slightly rolled shape state, metal film 3 is slightly smaller than metal film 3 far from flexible close to the surface area of the one side of flexible substrate 2
The surface area of the one side of substrate 2, this small difference in areas complexed metal ductility of itself, it is flat can to absorb flexible substrate 2
The stress that the hardness of itself of metal film 3 is brought when after exhibition or more crimping, protects metal film 3 that phenomenon of rupture does not occur, and
Also because of the rotatable sputtering of metallic, deposition forms the uniform metal film 3 of thin and thick, avoids flexibility caused by uneven thickness
The phenomenon that 2 warpage of substrate.
In addition, the flexible substrate 2 of web-like is provided with certain hardness and thickness after plated film, using the side of vacuum suction
After formula makes flexible substrate 2 is uncoated to be adsorbed on flat substrate on one side, compared to the flexible base board for not using above-mentioned plated film mode, no
It will appear the fold-modified situation of flexible substrate, bring great convenience for subsequent processing procedure；Compared with traditional processing procedure, significantly
Reduce process cumbersome when flexible substrate 2 and glass substrate are removed, also improve that flexible base board removes from glass substrate at
Power.
Referring to Fig. 2, being the operation chart of the production method of flexible base board of the present invention.As shown in Fig. 2, by flexible substrate
2 (flexible substrate for having completed plated film is shown in the figure) are wound up on rotating device 1, and it is in flexuosity to make flexible substrate 2,
And the white space for not being sputtered metallic is made to rotate to the position where metal particle deposition source, so that metallic is splashed to
Film forming is deposited in flexible substrate 2.Wherein, metallic is provided by target 4, and target 4 can be planar targets, can also be curved surface
Target, the gold of planar targets or curved surface target as sputter when flexible substrate 2 rotates to planar targets either curved surface target location
Belong to particle and then deposit to 2 surface of flexible substrate, completes plated film.
Planar targets or curved surface target can move back and forth in a certain range, so that metallic uniformly sputters
To 2 surface of flexible substrate, and either planar targets or curved surface target, it is only necessary to cover a certain range of rotating device 1
, such setting can be simultaneously to the flexible substrate 2 of large area progress coating operation, and the sputtering yield of metallic is high.
It is also contemplated that using hollow tubular target, the hollow parts of tubular target device 1 will be chosen to install is inserted in, keep tubular target complete
The surface of flexible substrate 2 is covered, the sputtering of metallic is disposably completed, so that plating membrane efficiency reaches highest.
In view of daily processing flexibility substrate is related to batch operation more, therefore, multiple flexible substrates 2 can be wound simultaneously
Onto rotating device 1, the sputtering operation of continuous metallic is carried out.And in order to which the later stage is easily isolated multiple flexible substrates 2,
Easy breakpoint 5 is set between two adjacent flexible substrates 2, after the completion of plated film work, flexible substrate 2 is detached one by one.This
The setting of sample is more suitable for planar targets or curved surface target, and flexible substrate 2 can disconnect one by one after plated film, can also from
One end of the flexible substrate 2 of volume starts coating operation, and the flexible substrate 2 for completing plated film is then sent on another spool and carries out
Winding, or be sent to platform lastblock and cover one piece and stack, storage is all convenient in the above operation, also allow for next step
Operation.And if it is tubular target, then need flexible substrate 2 to be nested into the hollow parts of tubular target with rotating device 1.
Such setting is more suitable for one flexible substrate 2 of work sheet.If necessary to process continuous multiple flexible substrates 2, need to make rotation
Device 1 has certain length, and leaves some space region in one end of uncoated continuous flexible substrate 2, is fixed to another
The shaft of one flexible substrate 2 for furling plated film, the shaft need to rotate and drive white space traction continuous
Flexible substrate 2 winds rotating device 1 with certain angle of inclination, the region sputtered into metallic.Meanwhile the cylinder of tubular target
Height also answers adaptability to lengthen, with the sputtering work of more efficient completion metallic.
In the present embodiment, metallic includes at least one of molybdenum, aluminium, copper, tin indium oxide particle.For example, in flexibility
The metal film 3 deposited on substrate 2 can be the sandwich diaphragm of molybdenum-copper-molybdenum, to be etched needed for flexible base board after plated film
Scan line.Copper film can also be deposited in flexible substrate 2, to etch the scan line or signal needed for flexible base board after plated film
Line.Can also depositing indium tin oxide layer on flexible substrates, to etch the shading electrode needed for flexible base board after plated film.Gold
It is different according to the metallic and purposes of its sputtering to belong to film 3, thickness is also different, the range of the thickness of metal film 3 in 300-450nm
It is interior.
In the present embodiment, the material of flexible substrate 2 is one in dimethyl silicone polymer (PDMS) or polyimide (PI)
Kind.
In the present embodiment, metallic can deposit to the surface of flexible substrate 2 by electromagnetism sputtering method.In other implementations
In example, metallic can also deposit to the surface of substrate by other means, as long as can achieve the object of the present invention.
Referring to Fig. 3, being the structural schematic diagram of flexible base board of the present invention.As shown in figure 3, being made by above-mentioned production method
The metal film 3 of flexible base board be located at the surface of flexible substrate 2.Metal film 3 has centainly for flexible substrate 2
Hardness, during the curling of flexible substrate 2 and expansion, what metal film 3 may can not be occurred being broken by absorption because of stress
Phenomenon.But after the above coating operation, compared to splash-proofing sputtering metal particle is most apparent directly in flat flexible substrate 2
Advantage is that metal film 3 completes sputtering work under 2 rolled state of flexible substrate, so just having completed the flexible liner of plated film
Bottom 2 is in temporarily slightly rolled shape state after being detached from from rotating device 1, and metal film 3 is slightly small close to the surface area of the one side of flexible substrate 2
In the surface area of one side of the metal film 3 far from flexible substrate 2, this small difference in areas, can absorb flexible substrate 2 it is open and flat after
Or the stress that the hardness of itself of metal film 3 is brought when more crimping, protect metal film 3 that phenomenon of rupture, Er Qieyin does not occur
For the rotatable sputtering of metallic, the uniform metal film 3 of thin and thick is formd, flexible substrate 2 is stuck up caused by avoiding uneven thickness
Bent phenomenon.
In addition, the flexible substrate 2 of web-like is provided with certain hardness and thickness after plated film, using the side of vacuum suction
After formula makes flexible substrate 2 is uncoated to be adsorbed on flat substrate on one side, compared to the flexible base board for not using above-mentioned plated film mode, no
It will appear 2 fold-modified situation of flexible substrate, bring great convenience for subsequent processing procedure；Compared with traditional processing procedure, greatly
It is big to reduce process cumbersome when flexible base board is removed with glass substrate, also improve that flexible base board removes from glass substrate at
Power.
The production method of flexible base board of the present invention is suitable for OLED display fields and TFT-LCD display fields.
The present invention makes metallic sink in flexible substrate rolled state by the way that flexible substrate to be wound up on rotating device
Product film forming, with absorb flexible base board it is open and flat after or when more crimping metal film itself the stress that brings of hardness, protect metal
Phenomenon of rupture do not occur for film, and the metal film formed also because the rotating and depositing of metallic and thin and thick is uniform, avoid thickness
Caused by degree is uneven the phenomenon that flexible substrate warpage.
Mode the above is only the implementation of the present invention is not intended to limit the scope of the invention, every to utilize this
Equivalent structure or equivalent flow shift made by description of the invention and accompanying drawing content, it is relevant to be applied directly or indirectly in other
Technical field is included within the scope of the present invention.
Claims (10)
1. a kind of production method of flexible base board, which is characterized in that the method includes：
Flexible substrate is wound up on rotating device；
Control the flexible substrate rotation；
By metal particle deposition to the surface of the flexible substrate；And
The metallic forms metal film on the flexible substrate surface.
2. the production method of flexible base board as described in claim 1, which is characterized in that the metallic is in the flexible liner
Bottom surface forms metal film：
By adsorption of the flexible substrate far from the metal film in flat substrate；
It is coated with, exposes on the metal film, development；And
Vacuum suction is released to detach the flexible substrate with the flat substrate.
3. the production method of flexible base board as described in claim 1, which is characterized in that the metallic with planar targets or
Cambered surface target is sedimentary origin.
4. the production method of flexible base board as described in claim 1, which is characterized in that the metal film is at least one layer.
5. the production method of flexible base board as described in claim 1, which is characterized in that the metallic include molybdenum, aluminium,
At least one of copper, tin indium oxide particle.
6. the production method of flexible base board as described in claim 1, which is characterized in that the thickness of the metal film is 300-
450nm。
7. the production method of flexible base board as described in claim 1, which is characterized in that the material of the flexible base board is poly- two
One kind in methylsiloxane or polyimide.
8. the production method of flexible base board as described in claim 1, which is characterized in that be wound up into described soft on rotating device
The quantity of property substrate is at least one, and there are easy breakpoints between two neighboring flexible substrate.
9. the production method of flexible base board as described in claim 1, which is characterized in that the metallic is sputtered by electromagnetism
Method deposits to the surface of the flexible base board.
10. a kind of flexible base board, which is characterized in that the flexible base board passes through such as claim 1-9 any one of them flexibility
The production method of substrate is made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810161890.2A CN108385078A (en) | 2018-02-26 | 2018-02-26 | Flexible base board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810161890.2A CN108385078A (en) | 2018-02-26 | 2018-02-26 | Flexible base board and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108385078A true CN108385078A (en) | 2018-08-10 |
Family
ID=63069317
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810161890.2A Pending CN108385078A (en) | 2018-02-26 | 2018-02-26 | Flexible base board and preparation method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN108385078A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115505929A (en) * | 2022-10-08 | 2022-12-23 | 东莞市钜升金属科技有限公司 | Production process of metal etching thin material |
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| CN102899630A (en) * | 2011-07-29 | 2013-01-30 | 日东电工株式会社 | Method for double-side vacuum film formation and laminate obtained by the method |
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| CN105369196A (en) * | 2009-09-11 | 2016-03-02 | 通用电气公司 | Apparatus and methods to form a patterned coating on an oled substrate |
| CN107611017A (en) * | 2017-09-21 | 2018-01-19 | 天津大学 | A kind of method for improving flexible capacitor capacitance |
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| US5783024A (en) * | 1996-04-12 | 1998-07-21 | Nbs Imaging Systems, Inc. | Apparatus for applying heat bondable lamina to a substrate |
| US20030224151A1 (en) * | 2001-07-05 | 2003-12-04 | Mitchell Chauncey T. | Direct thermal printable pull-aparts |
| CN1444295A (en) * | 2001-12-20 | 2003-09-24 | Lg电子株式会社 | Device and method for mfg. GaN base |
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| US20080202919A1 (en) * | 2007-02-22 | 2008-08-28 | Jeon Geon Han | Apparatus And Method For Manufacturing Stress-Free Flexible Printed Circuit Board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115505929A (en) * | 2022-10-08 | 2022-12-23 | 东莞市钜升金属科技有限公司 | Production process of metal etching thin material |
| CN115505929B (en) * | 2022-10-08 | 2023-12-19 | 东莞市钜升金属科技有限公司 | Production process of metal etching thin material |
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Application publication date: 20180810 |
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