CN108381003A - Die bonder automatic feed mechanism and solder stick automatic feeding - Google Patents
Die bonder automatic feed mechanism and solder stick automatic feeding Download PDFInfo
- Publication number
- CN108381003A CN108381003A CN201810442045.2A CN201810442045A CN108381003A CN 108381003 A CN108381003 A CN 108381003A CN 201810442045 A CN201810442045 A CN 201810442045A CN 108381003 A CN108381003 A CN 108381003A
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- CN
- China
- Prior art keywords
- driven roller
- solder stick
- active roll
- feed mechanism
- transfer passage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/063—Solder feeding devices for wire feeding
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Die Bonding (AREA)
Abstract
The present invention picks technical field suitable for High Speed Welding, provides a kind of die bonder automatic feed mechanism, including driving device, for according to control command, providing rotary driving force；Conveying mechanism, it include the active roll being sequentially connected with the driving device, and the driven roller being arranged side by side with the active roll, the active roll and/or driven roller be equipped with allow material by transfer passage, the force-applied direction movement to closer or far from the active roll of the driven roller.The present invention also correspondingly provides a kind of solder stick automatic feeding including said chip bonding machine automatic feed mechanism.Whereby, the present invention effectively can accurately adjust the amount of movement of material, to ensure accuracy of the post-order process to material requirement, reduce processing cost, improve efficiency.
Description
Technical field
It picks technical field more particularly to a kind of die bonder automatic feed mechanism and weldering the present invention relates to High Speed Welding
Tin silk automatic feeding.
Background technology
In the actual production process, it is a kind of a kind of welding medium being commonly used to carry out welding using solder stick, cooperation
Electric iron or other heating devices can melt solder stick, the processes such as welding to carry out electronic component.Existing rank
Section, using solder stick as in the component welding process of solder, the supply of solder is to be manually fed, and the dosage of solder is mainly by operation
Person determines with the experience of itself, never dedicated tool, the control for materials in welding process.Meeting in welding process
It is excessive often to there is stacked solder, influences weld appearance；It is very little even to there is solder, rosin joint and other issues occurs, causes not
Necessary loss.Also there are the device that soldering-wire dosage is precisely controlled, documents (application number in the prior art
CN201620363345.8 a kind of solder stick materials precise control device is disclosed in), the operation principle of the device is as follows：Device
Main body is connect with drive component hand wheel component or electric machine assembly, forms solder stick materials precise control device.By solder stick one end
It is sent into guide-track groove by the direction of rotation of rotary components, rotary components rotation is driven by drive component hand wheel component or electric machine assembly
Turn, rotary components are in rotary course, and solder stick is in the guide groove of guide rail, by the extruding of gear piece and guide rail, in solder stick
While one side surface leaves impression, solder stick will not be broken, the part between each two impression, for solder needed for welding every time
Dosage, realization accurately control.
Wherein the thickness of gear piece and the guide-track groove of guide rail be it is complete be used cooperatively, depending on the solder stick of different size；
And the space width of gear piece is designed then according to different welding demands by calculating, and ensures the various differences for meeting different solder sticks
Welding demand.Since in actual production process, solder stick specification type is more, scolding tin dosage is different, so guide rail and gear piece
Standing replaceable module can be used as to exist.
In the documents, extruding conveying is carried out to solder stick using gear piece, the gap between gear piece and guide-track groove is not
It is easy to adjust.Conference is crossed in gap keeps solder stick displacement distance inaccurate, and gap is too small, and gear piece is excessive to the extruding force of solder stick,
It is be easy to cause the fracture of solder stick, influences welding effect of the solder stick to workpiece, is needed simultaneously for the solder stick of different thicknesses
Gear piece to be replaced, to ensure welding effect, it is therefore desirable to the gear piece for having different space widths increases cost, and
Working efficiency is reduced in replacement process.
In summary, the existing technology has inconveniences and defects in actual use, so it is necessary to be improved.
Invention content
For above-mentioned defect, the purpose of the present invention is to provide a kind of die bonder automatic feed mechanisms, can
The amount of movement for effectively accurately adjusting material reduces processing cost, carries to ensure accuracy of the post-order process to material requirement
High efficiency.
The present invention also aims to provide a kind of solder stick automatic feeding, the use of solder stick can be effectively controlled
Amount improves welding efficiency and welding quality to reduce processing cost.
To achieve the goals above, the present invention provides a kind of die bonder automatic feed mechanism, including driving device,
For according to control command, providing rotary driving force；
Conveying mechanism includes the active roll being sequentially connected with the driving device, and side by side with the active roll
The driven roller being arranged, the active roll and/or driven roller be equipped with allow material by transfer passage, the driven roller
The force-applied direction movement to closer or far from the active roll.
Die bonder automatic feed mechanism according to the present invention further includes a tension being connect with the driven roller
Device, for being provided to the close pulling force of active roll for the driven roller.
Die bonder automatic feed mechanism according to the present invention, the tension device include：
Fixing piece is equipped with a fixed structure；
Driven roller swing arm, one end are rotatably connected the driven roller, and the other end is rotatably connected in the fixation
Part, and the fixing piece is divided into the both sides of the driven roller swing arm with driven roller；
Locating part is set to the centre position of the driven roller swing arm；
Elastic component, both ends are separately connected the fixed structure and locating part.
Die bonder automatic feed mechanism according to the present invention, the driving device turn according in control command
Speed, stroke and time parameter operation.
Die bonder automatic feed mechanism according to the present invention, the driving device include driving motor and shaft coupling
Device, the active roll are sequentially connected by shaft coupling and the driving motor.
The present invention also correspondingly provides a kind of solder stick including said chip bonding machine automatic feed mechanism and send automatically
Expect that device, the transfer passage are solder stick transfer passage.
Solder stick automatic feeding according to the present invention, the transfer passage are set to the active roll including described
And/or the mutually matched delivery chute of driven roller, the conveying groove depth are less than solder stick radius.
Solder stick automatic feeding according to the present invention, the delivery chute is interior to be equipped with equally distributed anti-skid chequer.
Solder stick automatic feeding according to the present invention further includes the material guide structure being set to above the transfer passage,
The material guide structure has the material path that a receiving solder stick passes through.
Solder stick automatic feeding according to the present invention, the transfer passage lower section is equipped with and the transfer passage and mistake
Expect feed tube of the hole in same vertical line.
The present invention provides a kind of die bonder automatic feed mechanisms, including driving device and conveying mechanism.Driving
Device is used to, according to control command, provide rotary driving force, conveying mechanism then directly transports material.Specifically, conveying mechanism packet
Include the active roll being sequentially connected with driving device, and the driven roller being arranged side by side with active roll, active roll and/or
Driven roller be equipped with allow material by transfer passage, the movement of material is gripped using active roll and driven roller,
Ensure that it can effectively be conveyed along the direction to be conveyed.The driven roller is force-applied to closer or far from the active
The direction of roller is moved, and ensures that driven roller can grip the material of different thicknesses, improves use scope, is reduced and is made
Cost.Beneficial effects of the present invention：By the rotation of active roll and driven roller, the pinch to solder stick can be realized
Transport ensures the amount of movement of solder stick in the welding process, ensures welding quality and welding effect, realizes precisely welding, improves
Welding efficiency.
Description of the drawings
Fig. 1 is the structural schematic diagram of the present invention；
Fig. 2 is the sectional view of the present invention；
Fig. 3 is another structural schematic diagram of the present invention；
Fig. 4 is the partial structural diagram of Fig. 3；
11- driving motors in the figure, 12- shaft couplings, 21- active rolls, the driven rollers of 22-, 23- transfer passages, 31-
Fixing piece, 311- fixed structures, the driven roller swing arms of 32-, 33- locating parts, 34- elastic components, 41- solder sticks, 42- solder sticks are solid
Centering spindle, 43- spacing rings, 5- feed tubes, 6- risers, 7- material guide structures.
Specific implementation mode
In order to make the purpose , technical scheme and advantage of the present invention be clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated, it should be understood that and the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
Referring to Fig. 1~4, the present invention provides a kind of die bonder automatic feed mechanism, including driving device 10 and
Conveying mechanism 20, wherein：
Driving device 10 is used to, according to control command, provide rotary driving force.In concrete application, driving device 10 can lead to
Motor 11 of overdriving is realized, background control system is connected, to be transported according to rotating speed, stroke and the time parameter in control command
Row.To ensure that stablizing for power exports, in one embodiment of the invention, a shaft coupling 12 is arranged in driving device 10, passes through shaft coupling
Device 12 is connect with the conveying mechanism 20 of rear class.
Conveying mechanism 20 includes the active roll 21 being sequentially connected with the driving device, and side by side with active roll 21
The driven roller 22 being arranged, active roll 21 and/or driven roller 22 be equipped with allow material by transfer passage 23, utilize actively
Roller 21 and driven roller 22 grip the movement of material, and it is effectively defeated to ensure that it can be carried out along the direction to be conveyed
It send.Transfer passage 23 can be the gap reserved between driving wheel and driven wheel, can also be active roll 21 and/or driven voller
The accommodating space with friction-driven structure being arranged on wheel 22.To realize that the spatial scalability of transfer passage 23, the present invention will
Driven roller 22 is set as the force-applied direction movement to closer or far from the active roll 21, ensures that driven roller 22 can
The material of different thicknesses is gripped, use scope is improved, reduces cost of manufacture.
It, can for the active force in relatively free squeezed state for realizing between above-mentioned driven roller 22 and active roll 21
Connect with driven roller 22 by the way that elastic mechanism is arranged, for example, by elastic tensioning part stretch the tension driven roller 22 or
Person, which compresses, pushes against the driven roller 22.
The die bonder automatic feed mechanism of the present invention can to strip, band-like and other opposite regular shapes,
And the relatively soft material of material carries out control conveying, it, can be with same as a result of program control and above-mentioned mechanical structure
Structure is directed to the material with different-thickness or different-diameter and is conveyed, and machine is adjusted without the change because of parameter of materials
Tool structure, greatly improves working efficiency, has higher practical value.
The above-mentioned elastic mechanism of the preferred present invention uses tension device connect with driven roller 22, for described in being from
Dynamic roller 22 is provided to the close pulling force of active roll 21, and the position of driven roller 22 is controlled and limited using tension device
It is fixed, it can be fitted closely with active roll 21, ensure to pinch the fixed of material, material is enable precisely to move.
In one embodiment of this invention, in conjunction with Fig. 4, tension device includes：
Fixing piece 31 is equipped with a fixed structure 311.The fixed structure 311 can be a connection piece shown in Fig. 4,
In order to be connect with elastic component 34.The fixed structure 311, which can also be, is set to fixing piece 31 structure of itself, for example fixed connects
Hole is connect, so that the respective end of elastic component 34 is directly connected on fixing piece 31.
Driven roller swing arm 32, one end are rotatably connected the driven roller 22, and the other end is rotatably connected in described
Fixing piece 31, and the fixing piece 31 and driven roller 22 are divided into the both sides of the driven roller swing arm 32, convenient for from
The position of dynamic roller 22 is moved, and can realize movement, is facilitated the interspersed of solder stick 41, is improved working efficiency；
Locating part 33 is set to the centre position of the driven roller swing arm 32, angle, torque to swing arm, to driven roller
22 position is limited, and can be realized and be fitted closely with active roll 21, convenient for material position is fixed；
Elastic component 34, both ends are separately connected the fixed structure 311 and locating part 33, using elastic component 34 to driven roller
22 provide pulling force, enable it and active roll 21 is closed is bonded, and ensure to pinch the fixed of material.
Further, inventive drive means are run according to rotating speed, stroke and the time parameter in control command, are passed through
The rotary speed of driving motor 11 is adjusted in rotating speed, to ensure the accurate movement of solder stick 41, while using stroke and
Time parameter is monitored the amount of movement of solder stick 41, ensures the stability of solder stick 41 during the work time.
The present invention also provides a kind of solder stick automatic feedings including said chip bonding machine automatic feed mechanism.
The device is used for the accurate conveying of solder stick, to ensure the convenience of subsequent welding procedure.
Corresponding, the channel between active roll and/or driven roller is solder stick transfer passage.To ensure solder stick
Stablize and transmit, in one embodiment of the invention, transfer passage 23 is set to the active roll 21 and/or driven voller including described
The mutually matched delivery chute of wheel 22, the conveying groove depth are less than 41 radius of solder stick, ensure delivery chute to 41 energy of solder stick
It is enough to realize fixed gripping, so that solder stick 41 is realized movement with the rotation of active roll 21 and driven roller 22, is convenient for butt welding
41 displacement distance of tin silk is precisely controlled, and improves welding quality and welding efficiency.
Embodiment one：
Interspersed installation is carried out to solder stick 41 first, needs to move tension device, using tension device to driven roller 22
Position be defined, enable it that limit is fixed for the solder stick 41 of different thicknesses with active roll 22, ensure to weld
The accurate transport of tin silk 41.Tension device includes fixing piece 31, driven roller swing arm 32, locating part 33 and elastic component 34, described
Fixing piece 31 is equipped with a fixed structure 311；Driven 32 one end of roller swing arm is rotatably connected the driven roller 22, the other end
It is rotatably connected in the fixing piece 31, and the fixing piece 31 is divided into the driven roller swing arm 32 with driven roller 22
Both sides, by deep groove ball bearing connection fixture 31, locating part 33 is set to the driven roller for the driven roller swing arm 32
The centre position of swing arm 32；34 both ends of elastic component are separately connected the fixed structure 311 and locating part 33, move driven roller pendulum
Arm 32 makes it that driven roller 22 be driven to be realized along the 32 axis place of connecing of driven roller swing arm and rotates.Transfer passage 23 is that solder stick 41 is defeated
Channel 23 is sent, which further includes the material guide structure 7 of 23 top of transfer passage, which has one to accommodate solder stick 41
The material path passed through, 23 lower section of transfer passage are equipped with the feed tube with the transfer passage 23 and material path in same vertical line
5, solder stick 41 is installed on the top of the material guide structure 7 by a riser 6, and passes through solder stick fixed central spindle 42 and spacing ring
The position of 43 pairs of solder sticks 41 is fixed.Solder stick 41 enters feed tube 5 through transfer passage 23 and material path, then reversed rotation
Turn driven roller swing arm 32, make it that driven roller 22 be driven to reset, realization is fitted closely to solder stick 41 with active roll 21
Gripping.Equally distributed anti-skid chequer is equipped in delivery chute, can enhance solder stick 41 and active roll 21 and driven roller 22 it
Between frictional force, can realize the accurate transport to solder stick 41, while can adapt to the solder stick 41 of different thicknesses, protect
Demonstrate,prove the accurate transport of solder stick 41.Using driving device to the powered rotation of conveying mechanism, driving device includes driving electricity
Machine 11 and shaft coupling 12, the active roll 21 are sequentially connected by shaft coupling 12 and the driving motor 11, active roll 21
It is operated under the drive of driving motor 11, with the closed realization of driven roller 22 being bonded to the folder of solder stick 41 in operation process
It send, can realize and move along the direction of rotation of active roll 21, ensure the transport to solder stick 41, it can be to workpiece
Precisely welded.
Embodiment two：
Interspersed installation is carried out to solder stick 41 first, needs to move tension device.Tension device include fixing piece 31 and from
Dynamic roller swing arm 32, driven 32 axis of roller swing arm connect driven roller 22, and the fixing piece 31 is fixedly connected with driven roller pendulum
Arm 32, and compression spring is installed between riser 6.The fixing piece 31 connects 12 shell of shaft coupling by bearing, is needing
When being moved to tension device, need to only move fixing piece 31 can drive driven roller swing arm 32 to realize rotation, by solder stick
After 41 installations, fixing piece 31 is unclamped, fixing piece 31 realizes reset under the action of compression spring, ensures driven roller 22 and active
Fitting closely between roller 21, to ensure the pinch to solder stick 41.The device further includes leading for 23 top of transfer passage
Expect structure 7, which has the material path that passes through of receiving solder stick 41,23 lower section of transfer passage be equipped with it is described defeated
The feed tube 5 of channel 23 and material path in same vertical line, solder stick 41 is sent to be installed on the material guide structure by a riser 6
7 top, solder stick 41 enter feed tube 5 through transfer passage 23 and material path, then reversely rotate driven roller swing arm 32, make
It drives driven roller 22 to reset, and the gripping realized to solder stick 41 is fitted closely with active roll 21.It can also be by drive roll
Transfer passage 23 on wheel 21 and driven roller 22 changes anti-skid chequer into, is provided on the whole in active roll 21 and driven roller 22
Equally distributed anti-skid chequer makes it grip solder stick 41.Using driving device to the powered rotation of conveying mechanism,
Driving device includes driving motor 11 and shaft coupling 12, and the active roll 21 is passed by shaft coupling 12 and the driving motor 11
Dynamic connection, active roll 21 operate under the drive of driving motor 11, in operation process with the closed driven roller 22 being bonded
It realizes the pinch to solder stick 41, can realize and move along the direction of rotation of active roll 21, ensure to solder stick 41
Transport, can precisely weld workpiece.
In conclusion the present invention provides a kind of die bonder automatic feed mechanism, including driving device, it is used for root
According to control command, rotary driving force is provided；Conveying mechanism includes the active roll being sequentially connected with the driving device, and
The driven roller being arranged side by side with the active roll, the active roll and/or driven roller be equipped with allow material by it is defeated
Channel is sent, the movement of material is gripped using active roll and driven roller, ensures that it can be along the direction to be conveyed
Effectively conveyed.The force-applied direction movement to closer or far from the active roll of the driven roller, ensures driven voller
Wheel can grip the material of different thicknesses, improve use scope, reduce cost of manufacture.Beneficial effects of the present invention：It is logical
The rotation of active roll and driven roller is crossed, the pinch transport to solder stick can be realized, ensure that solder stick was welding
Amount of movement in journey ensures welding quality and welding effect, realizes precisely welding, improves welding efficiency.
Certainly, the present invention can also have other various embodiments, without deviating from the spirit and substance of the present invention, ripe
It knows those skilled in the art and makes various corresponding change and deformations, but these corresponding changes and change in accordance with the present invention
Shape should all belong to the protection domain of appended claims of the invention.
Claims (10)
1. a kind of die bonder automatic feed mechanism, which is characterized in that including
Driving device, for according to control command, providing rotary driving force；
Conveying mechanism includes the active roll being sequentially connected with the driving device, and is arranged side by side with the active roll
Driven roller, the active roll and/or driven roller be equipped with allow material by transfer passage, the driven roller can be by
Power is moved to the direction closer or far from the active roll.
2. die bonder automatic feed mechanism according to claim 1, which is characterized in that further include one with it is described from
The tension device of dynamic roller connection, for being provided to the close pulling force of active roll for the driven roller.
3. die bonder automatic feed mechanism according to claim 2, which is characterized in that the tension device packet
It includes：
Fixing piece is equipped with a fixed structure；
Driven roller swing arm, one end are rotatably connected the driven roller, and the other end is rotatably connected in the fixing piece, and
And the fixing piece is divided into the both sides of the driven roller swing arm with driven roller；
Locating part is set to the centre position of the driven roller swing arm；
Elastic component, both ends are separately connected the fixed structure and locating part.
4. die bonder automatic feed mechanism according to claim 1, which is characterized in that the driving device according to
Rotating speed, stroke in control command and time parameter operation.
5. die bonder automatic feed mechanism according to claim 1, which is characterized in that the driving device includes
Driving motor and shaft coupling, the active roll are sequentially connected by shaft coupling and the driving motor.
6. a kind of includes that the solder stick of the die bonder automatic feed mechanism as described in any one of Claims 1 to 5 is sent automatically
Expect device, which is characterized in that the transfer passage is solder stick transfer passage.
7. solder stick automatic feeding according to claim 6, which is characterized in that the transfer passage includes described sets
It is placed in the mutually matched delivery chute of the active roll and/or driven roller, the conveying groove depth is less than solder stick radius.
8. solder stick automatic feeding according to claim 7, which is characterized in that be equipped in the delivery chute and uniformly divide
The anti-skid chequer of cloth.
9. solder stick automatic feeding according to claim 6, which is characterized in that further include being set to the transfer passage
The material guide structure of top, the material guide structure have the material path that a receiving solder stick passes through.
10. solder stick automatic feeding according to claim 6, which is characterized in that be equipped with below the transfer passage
With the feed tube of the transfer passage and material path in same vertical line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810442045.2A CN108381003A (en) | 2018-05-10 | 2018-05-10 | Die bonder automatic feed mechanism and solder stick automatic feeding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810442045.2A CN108381003A (en) | 2018-05-10 | 2018-05-10 | Die bonder automatic feed mechanism and solder stick automatic feeding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108381003A true CN108381003A (en) | 2018-08-10 |
Family
ID=63070447
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810442045.2A Withdrawn CN108381003A (en) | 2018-05-10 | 2018-05-10 | Die bonder automatic feed mechanism and solder stick automatic feeding |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108381003A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109332843A (en) * | 2018-11-23 | 2019-02-15 | 何毅 | A kind of auxiliary electric iron push welding wire device |
-
2018
- 2018-05-10 CN CN201810442045.2A patent/CN108381003A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109332843A (en) * | 2018-11-23 | 2019-02-15 | 何毅 | A kind of auxiliary electric iron push welding wire device |
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| PB01 | Publication | ||
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| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180810 |
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| WW01 | Invention patent application withdrawn after publication |