CN108376024A - Cloud computer mainboard with heat sinking function - Google Patents
Cloud computer mainboard with heat sinking function Download PDFInfo
- Publication number
- CN108376024A CN108376024A CN201810328671.9A CN201810328671A CN108376024A CN 108376024 A CN108376024 A CN 108376024A CN 201810328671 A CN201810328671 A CN 201810328671A CN 108376024 A CN108376024 A CN 108376024A
- Authority
- CN
- China
- Prior art keywords
- fixedly connected
- condenser pipe
- mainboard
- water pump
- copper sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/184—Mounting of motherboards
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Apparatus For Making Beverages (AREA)
Abstract
The invention discloses the cloud computer mainboards with heat sinking function, including mainboard ontology, the bottom of the mainboard ontology is fixedly connected with radiating copper sheet, the both sides of the radiating copper sheet bottom have been fixedly connected with ventilation duct, the both sides of the ventilation tube cavity have been fixedly connected with holder, it is fixedly connected with motor between two holders, the output end of the motor is fixedly connected with flabellum, the bottom of the radiating copper sheet and it is provided with condenser pipe before two ventilation ducts, rear end on the left of the condenser pipe is communicated with hose, the one end of the hose far from condenser pipe is communicated with water pump, it is communicated with connector on the right side of the water pump.The present invention is used cooperatively by mainboard ontology, radiating copper sheet, ventilation duct, motor, flabellum, condenser pipe, hose, water pump, support plate and graphene cooling fin, it can preferably radiate to mainboard, it preferably ensure that the effect of heat dissipation, and then preferably ensure that the efficiency of cloud computing.
Description
Technical field
The present invention relates to field of computer technology, specially the cloud computer mainboard with heat sinking function.
Background technology
Cloud computer is to use the Distributed architecture entirely different with personal computer and supercomputer, by means of
The virtualization technology of cloud computing, one has powerful calculating ability made of the computing resource fusion by multiple advantage of lower cost
Computer, it can efficiently support the multiclass application demands such as big data processing, high-throughput and high-security information service, calculate
Ability and storage capacity can dynamic retractility and infinite expanding, traditional cloud computer mainboard is typically all to be dissipated by fan
Then heat derives are ensured the heat dissipation performance of computer, but this radiating mode increasingly cannot by heat by heat conducting pipe
Heat inside cloud computer mainboard is radiated, the effect of heat dissipation is affected, and then affects the operation effect of cloud computer
Rate.
Invention content
The purpose of the present invention is to provide the cloud computer mainboards with heat sinking function, have the advantages of good heat dissipation effect,
It is typically all to be radiated by fan to solve traditional cloud computer mainboard, is then protected heat derives by heat conducting pipe
The heat dissipation performance of computer is demonstrate,proved, but this radiating mode cannot increasingly dissipate the heat inside cloud computer mainboard
Heat, the problem of affecting the effect of heat dissipation, and then affect cloud computer operation efficiency.
To achieve the above object, the present invention provides the following technical solutions：Cloud computer mainboard with heat sinking function, including
The bottom of mainboard ontology, the mainboard ontology is fixedly connected with radiating copper sheet, and the both sides of the radiating copper sheet bottom are fixed to be connected
It is connected to ventilation duct, the both sides of the ventilation tube cavity have been fixedly connected with holder, have been fixedly connected with motor between two holders, institute
The output end for stating motor is fixedly connected with flabellum, the bottom of the radiating copper sheet and is provided with condensation before two ventilation ducts
It manages, the rear end on the left of the condenser pipe is communicated with hose, and the one end of the hose far from condenser pipe is communicated with water pump, the water pump
Right side be communicated with connector, the bottom of the water pump is fixedly connected with support plate, and left side and the ventilation duct of the support plate are fixed
It connects, the front end on the right side of the condenser pipe is connected to by hose with peripheral hardware cooling cylinder.
Preferably, graphene cooling fin is provided at the top of the mainboard ontology, the both sides of the mainboard body bottom portion are equal
It is fixedly connected with mounting bracket.
Preferably, the bottom of the ventilation duct has been bolted to connection Air Filter, the bottom of the heat dissipation copper coin and
It is provided with radiating fin between condenser pipe gap.
Preferably, snubber block is fixedly connected on the left of the water pump, the left side of the snubber block is fixed with ventilation duct to be connected
It connects.
Compared with prior art, beneficial effects of the present invention are as follows：
1, the present invention passes through mainboard ontology, radiating copper sheet, ventilation duct, motor, flabellum, condenser pipe, hose, water pump, support
Being used cooperatively for plate and graphene cooling fin, can preferably radiate to mainboard, preferably ensure that the effect of heat dissipation, into
And it preferably ensure that the efficiency of cloud computing.
2, the present invention can preferably be dissipated a small amount of heat of mainboard bodies top by the way that graphene cooling fin is arranged
Heat preferably ensure that heat dissipation effect, by the way that mounting bracket is arranged, can preferably install mainboard, preferably ensure
The convenience of installation can prevent dust from entering the inner cavity of ventilation duct, preferably ensure that motor by the way that Air Filter is arranged
Heat between condenser pipe can preferably be radiated, preferably be ensure that scattered by the way that radiating fin is arranged by service life
Thermal effect can slow down the vibrations generated when pump working, preferably ensure that water pump uses the longevity by the way that snubber block is arranged
Life.
Description of the drawings
Fig. 1 is schematic structural view of the invention；
Fig. 2 is condenser pipe of the present invention and hose overlooking the connection structure.
In figure：1 mainboard ontology, 2 radiating copper sheets, 3 ventilation ducts, 4 holders, 5 motors, 6 flabellums, 7 condenser pipes, 8 hoses, 9 water
Pump, 10 connectors, 11 support plates, 12 graphene cooling fins, 13 mounting brackets, 14 Air Filters, 15 radiating fins, 16 snubber blocks.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
- 2 are please referred to Fig.1, the cloud computer mainboard with heat sinking function, including mainboard ontology 1, the top of mainboard ontology 1
It is provided with graphene cooling fin 12, it, can be preferably by a small amount of heat at 1 top of mainboard ontology by the way that graphene cooling fin 12 is arranged
Amount radiates, and preferably ensure that heat dissipation effect, the both sides of 1 bottom of mainboard ontology have been fixedly connected with mounting bracket 13, have passed through
Mounting bracket 13 is set, preferably mainboard can be installed, preferably ensure that the convenience of installation, mainboard ontology 1
Bottom is fixedly connected with radiating copper sheet 2, and the both sides of 2 bottom of radiating copper sheet have been fixedly connected with ventilation duct 3,3 inner cavity of ventilation duct
Both sides have been fixedly connected with holder 4, and motor 5 is fixedly connected between two holders 4, and the output end of motor 5 is fixedly connected with fan
Leaf 6, the bottom of radiating copper sheet 2 and is provided with condenser pipe 7 before two ventilation ducts 3, and the bottom of ventilation duct 3 is solid by bolt
Surely it is connected with Air Filter 14, by the way that Air Filter 14 is arranged, can prevent dust from entering the inner cavity of ventilation duct 3, preferably ensure that
The service life of motor 5, radiate copper coin 2 bottom and be provided with radiating fin 15 between 7 gap of condenser pipe, pass through setting
Radiating fin 15 can preferably radiate the heat between condenser pipe 7, preferably ensure that heat dissipation effect, condenser pipe 7
The rear end in left side is communicated with hose 8, and the one end of hose 8 far from condenser pipe 7 is communicated with water pump 9, and the right side of water pump 9 is communicated with connector
10, the bottom of water pump 9 is fixedly connected with support plate 11, and the left side of water pump 9 is fixedly connected with snubber block 16, the left side of snubber block 16
It is fixedly connected with ventilation duct 3, by the way that snubber block 16 is arranged, the vibrations generated when water pump 9 works can be slowed down, preferably ensure that
The left side of the service life of water pump 9, support plate 11 is fixedly connected with ventilation duct 3, the front end on the right side of condenser pipe 7 by hose 8 with
Peripheral hardware cooling cylinder is connected to, and passes through mainboard ontology 1, radiating copper sheet 2, ventilation duct 3, motor 5, flabellum 6, condenser pipe 7, hose 8, water pump
9, support plate 11 and graphene cooling fin 12 are used cooperatively, and can preferably be radiated, preferably be ensure that scattered to mainboard
The effect of heat, and then preferably ensure that the efficiency of cloud computing.
In use, the heat that mainboard ontology 1 generates is adsorbed by radiating copper sheet 2, flabellum 6 is driven by motor 5
Rotation generates air-flow and heat radiates, and is extracted the condensate liquid in peripheral hardware cooling cylinder by water pump, will by hose 8
The heat on 2 surface of radiating copper sheet is taken away in the inner cavity flowing that condensate liquid is delivered to condenser pipe 7, and then completes the heat dissipation of mainboard.
In summary：The cloud computer mainboard with heat sinking function, passes through mainboard ontology 1, radiating copper sheet 2, ventilation duct
3, the cooperation of motor 5, flabellum 6, condenser pipe 7, hose 8, water pump 9, support plate 11 and graphene cooling fin 12 solves traditional
Cloud computer mainboard is typically all to be radiated by fan, and heat derives are then ensured the heat dissipation of computer by heat conducting pipe
Performance, but this radiating mode cannot increasingly radiate the heat inside cloud computer mainboard, affect scattered
The effect of heat, and then the problem of affect cloud computer operation efficiency.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
Understanding without departing from the principles and spirit of the present invention can carry out these embodiments a variety of variations, modification, replace
And modification, the scope of the present invention is defined by the appended.
Claims (4)
1. the cloud computer mainboard with heat sinking function, including mainboard ontology (1), it is characterised in that：The mainboard ontology (1)
Bottom is fixedly connected with radiating copper sheet (2), and the both sides of radiating copper sheet (2) bottom have been fixedly connected with ventilation duct (3), described
The both sides of ventilation duct (3) inner cavity have been fixedly connected with holder (4), and motor (5) is fixedly connected between two holders (4), described
The output end of motor (5) is fixedly connected with flabellum (6), the bottom of the radiating copper sheet (2) and before two ventilation ducts (3)
It is provided with condenser pipe (7), the rear end on the left of the condenser pipe (7) is communicated with hose (8), and the hose (8) is far from condenser pipe (7)
One end be communicated with water pump (9), connector (10) is communicated on the right side of the water pump (9), the bottom of the water pump (9) is fixedly connected
There are support plate (11), the left side of the support plate (11) to be fixedly connected with ventilation duct (3), the front end on the right side of the condenser pipe (7)
It is connected to peripheral hardware cooling cylinder by hose (8).
2. the cloud computer mainboard according to claim 1 with heat sinking function, it is characterised in that：The mainboard ontology
(1) graphene cooling fin (12) is provided at the top of, the both sides of mainboard ontology (1) bottom have been fixedly connected with mounting bracket
(13)。
3. the cloud computer mainboard according to claim 1 with heat sinking function, it is characterised in that：The ventilation duct (3)
Bottom be bolted to connection Air Filter (14), the bottom of the heat dissipation copper coin (2) and positioned at condenser pipe (7) gap it
Between be provided with radiating fin (15).
4. the cloud computer mainboard according to claim 1 with heat sinking function, it is characterised in that：The water pump (9)
Left side is fixedly connected with snubber block (16), and the left side of the snubber block (16) is fixedly connected with ventilation duct (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810328671.9A CN108376024A (en) | 2018-04-13 | 2018-04-13 | Cloud computer mainboard with heat sinking function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810328671.9A CN108376024A (en) | 2018-04-13 | 2018-04-13 | Cloud computer mainboard with heat sinking function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108376024A true CN108376024A (en) | 2018-08-07 |
Family
ID=63032245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810328671.9A Withdrawn CN108376024A (en) | 2018-04-13 | 2018-04-13 | Cloud computer mainboard with heat sinking function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108376024A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109814682A (en) * | 2019-01-30 | 2019-05-28 | 合肥陆通智能科技有限公司 | A kind of all direction multifunctional protection mainboard |
-
2018
- 2018-04-13 CN CN201810328671.9A patent/CN108376024A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109814682A (en) * | 2019-01-30 | 2019-05-28 | 合肥陆通智能科技有限公司 | A kind of all direction multifunctional protection mainboard |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8437129B2 (en) | Server cabinet | |
| CN101902895A (en) | Cooling system | |
| CN208063383U (en) | A kind of sound equipment of good heat dissipation effect | |
| CN108376024A (en) | Cloud computer mainboard with heat sinking function | |
| CN108089686A (en) | A kind of computer CPU radiator fan convenient for deashing | |
| CN208044525U (en) | Cloud computer mainboard with heat sinking function | |
| CN212623957U (en) | High-performance node server for enterprise | |
| CN209471407U (en) | Desktop computer with water-cooling heat radiating device | |
| CN211149383U (en) | Heat dissipation machine case for cloud computer host | |
| CN201167089Y (en) | CPU radiating device | |
| TW201120625A (en) | A dual fan heat dissipation device | |
| CN209514541U (en) | A kind of Cloud Server heat radiation rack for computer internet | |
| CN202171765U (en) | Computer host with air purifier | |
| CN107656600A (en) | A kind of regenerative apparatus for computer CPU radiating | |
| CN203909703U (en) | Computer radiating case | |
| CN201993600U (en) | Easy-radiating industrial personal computer | |
| CN103901988B (en) | A kind of vehicle-mounted ruggedized computers of 1U | |
| CN109634382A (en) | Desktop computer with water-cooling heat radiating device | |
| CN207637093U (en) | A kind of server radiating system | |
| CN202189298U (en) | Terminal device | |
| CN215642578U (en) | Liquid cooling and air cooling combined server cooling device | |
| CN208044516U (en) | A kind of computer CPU radiator fan convenient for deashing | |
| CN118349093A (en) | Uniform radiator | |
| CN219695694U (en) | Server with heat radiation structure | |
| CN211979570U (en) | Smart city is with high heat dissipation storage device of cloud computing host computer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180807 |