CN208044525U - Cloud computer mainboard with heat sinking function - Google Patents
Cloud computer mainboard with heat sinking function Download PDFInfo
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- CN208044525U CN208044525U CN201820521391.5U CN201820521391U CN208044525U CN 208044525 U CN208044525 U CN 208044525U CN 201820521391 U CN201820521391 U CN 201820521391U CN 208044525 U CN208044525 U CN 208044525U
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- fixedly connected
- condenser pipe
- mainboard
- water pump
- copper sheet
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Abstract
The utility model discloses the cloud computer mainboards with heat sinking function, including mainboard ontology, the bottom of the mainboard ontology is fixedly connected with radiating copper sheet, the both sides of the radiating copper sheet bottom have been fixedly connected with ventilation duct, the both sides of the ventilation tube cavity have been fixedly connected with holder, it is fixedly connected with motor between two holders, the output end of the motor is fixedly connected with flabellum, the bottom of the radiating copper sheet and it is provided with condenser pipe before two ventilation ducts, rear end on the left of the condenser pipe is communicated with hose, the one end of the hose far from condenser pipe is communicated with water pump, it is communicated with connector on the right side of the water pump.The utility model is used cooperatively by mainboard ontology, radiating copper sheet, ventilation duct, motor, flabellum, condenser pipe, hose, water pump, support plate and graphene cooling fin, it can preferably radiate to mainboard, it preferably ensure that the effect of heat dissipation, and then preferably ensure that the efficiency of cloud computing.
Description
Technical field
The utility model is related to field of computer technology, specially the cloud computer mainboard with heat sinking function.
Background technology
Cloud computer is to use the Distributed architecture entirely different with personal computer and supercomputer, by means of
The virtualization technology of cloud computing, one has powerful calculating ability made of the computing resource fusion by multiple advantage of lower cost
Computer, it can efficiently support the multiclass application demands such as big data processing, high-throughput and high-security information service, calculate
Ability and storage capacity can dynamic retractility and infinite expanding, traditional cloud computer mainboard is typically all to be dissipated by fan
Then heat derives are ensured the heat dissipation performance of computer, but this radiating mode increasingly cannot by heat by heat conducting pipe
Heat inside cloud computer mainboard is radiated, the effect of heat dissipation is affected, and then affects the operation effect of cloud computer
Rate.
Utility model content
The purpose of this utility model is to provide the cloud computer mainboards with heat sinking function, have the excellent of good heat dissipation effect
Point, it is typically all to be radiated by fan to solve traditional cloud computer mainboard, then by heat conducting pipe by heat derives,
Ensure the heat dissipation performance of computer, but this radiating mode cannot increasingly carry out the heat inside cloud computer mainboard
Heat dissipation, the problem of affecting the effect of heat dissipation, and then affect cloud computer operation efficiency.
To achieve the above object, the utility model provides the following technical solutions:Cloud computer mainboard with heat sinking function,
Including mainboard ontology, the bottom of the mainboard ontology is fixedly connected with radiating copper sheet, and the both sides of the radiating copper sheet bottom are solid
Surely it is connected with ventilation duct, the both sides of the ventilation tube cavity have been fixedly connected with holder, electricity is fixedly connected between two holders
The output end of machine, the motor is fixedly connected with flabellum, the bottom of the radiating copper sheet and the setting before two ventilation ducts
There are condenser pipe, the rear end on the left of the condenser pipe to be communicated with hose, the one end of the hose far from condenser pipe is communicated with water pump, institute
It states and is communicated with connector on the right side of water pump, the bottom of the water pump is fixedly connected with support plate, the left side of the support plate and ventilation
Pipe is fixedly connected, and the front end on the right side of the condenser pipe is connected to by hose with peripheral hardware cooling cylinder.
Preferably, graphene cooling fin is provided at the top of the mainboard ontology, the both sides of the mainboard body bottom portion are equal
It is fixedly connected with mounting bracket.
Preferably, the bottom of the ventilation duct has been bolted to connection Air Filter, the bottom of the heat dissipation copper coin and
It is provided with radiating fin between condenser pipe gap.
Preferably, snubber block is fixedly connected on the left of the water pump, the left side of the snubber block is fixed with ventilation duct to be connected
It connects.
Compared with prior art, the beneficial effects of the utility model are as follows:
1, the utility model by mainboard ontology, radiating copper sheet, ventilation duct, motor, flabellum, condenser pipe, hose, water pump,
Being used cooperatively for support plate and graphene cooling fin, can preferably radiate to mainboard, preferably ensure that the effect of heat dissipation
Fruit, and then preferably ensure that the efficiency of cloud computing.
2, the utility model by be arranged graphene cooling fin, can preferably by a small amount of heat of mainboard bodies top into
Row heat dissipation, preferably ensure that heat dissipation effect, by the way that mounting bracket is arranged, can preferably install mainboard, preferably
The convenience that ensure that installation can prevent dust from entering the inner cavity of ventilation duct, preferably ensure that electricity by the way that Air Filter is arranged
Heat between condenser pipe can preferably be radiated, preferably be ensured by the way that radiating fin is arranged by the service life of machine
Heat dissipation effect can slow down the vibrations generated when pump working, preferably ensure that the use of water pump by the way that snubber block is arranged
Service life.
Description of the drawings
FIG. 1 is a schematic structural view of the utility model;
Fig. 2 is the utility model condenser pipe and hose overlooking the connection structure.
In figure:1 mainboard ontology, 2 radiating copper sheets, 3 ventilation ducts, 4 holders, 5 motors, 6 flabellums, 7 condenser pipes, 8 hoses, 9 water
Pump, 10 connectors, 11 support plates, 12 graphene cooling fins, 13 mounting brackets, 14 Air Filters, 15 radiating fins, 16 snubber blocks.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
The every other embodiment obtained, shall fall within the protection scope of the present invention.
- 2 are please referred to Fig.1, the cloud computer mainboard with heat sinking function, including mainboard ontology 1, the top of mainboard ontology 1
It is provided with graphene cooling fin 12, it, can be preferably by a small amount of heat at 1 top of mainboard ontology by the way that graphene cooling fin 12 is arranged
Amount radiates, and preferably ensure that heat dissipation effect, the both sides of 1 bottom of mainboard ontology have been fixedly connected with mounting bracket 13, have passed through
Mounting bracket 13 is set, preferably mainboard can be installed, preferably ensure that the convenience of installation, mainboard ontology 1
Bottom is fixedly connected with radiating copper sheet 2, and the both sides of 2 bottom of radiating copper sheet have been fixedly connected with ventilation duct 3,3 inner cavity of ventilation duct
Both sides have been fixedly connected with holder 4, and motor 5 is fixedly connected between two holders 4, and the output end of motor 5 is fixedly connected with fan
Leaf 6, the bottom of radiating copper sheet 2 and is provided with condenser pipe 7 before two ventilation ducts 3, and the bottom of ventilation duct 3 is solid by bolt
Surely it is connected with Air Filter 14, by the way that Air Filter 14 is arranged, can prevent dust from entering the inner cavity of ventilation duct 3, preferably ensure that
The service life of motor 5, radiate copper coin 2 bottom and be provided with radiating fin 15 between 7 gap of condenser pipe, pass through setting
Radiating fin 15 can preferably radiate the heat between condenser pipe 7, preferably ensure that heat dissipation effect, condenser pipe 7
The rear end in left side is communicated with hose 8, and the one end of hose 8 far from condenser pipe 7 is communicated with water pump 9, and the right side of water pump 9 is communicated with connector
10, the bottom of water pump 9 is fixedly connected with support plate 11, and the left side of water pump 9 is fixedly connected with snubber block 16, the left side of snubber block 16
It is fixedly connected with ventilation duct 3, by the way that snubber block 16 is arranged, the vibrations generated when water pump 9 works can be slowed down, preferably ensure that
The left side of the service life of water pump 9, support plate 11 is fixedly connected with ventilation duct 3, the front end on the right side of condenser pipe 7 by hose 8 with
Peripheral hardware cooling cylinder is connected to, and passes through mainboard ontology 1, radiating copper sheet 2, ventilation duct 3, motor 5, flabellum 6, condenser pipe 7, hose 8, water pump
9, support plate 11 and graphene cooling fin 12 are used cooperatively, and can preferably be radiated, preferably be ensure that scattered to mainboard
The effect of heat, and then preferably ensure that the efficiency of cloud computing.
In use, the heat that mainboard ontology 1 generates is adsorbed by radiating copper sheet 2, flabellum 6 is driven by motor 5
Rotation generates air-flow and heat radiates, and is extracted the condensate liquid in peripheral hardware cooling cylinder by water pump, will by hose 8
The heat on 2 surface of radiating copper sheet is taken away in the inner cavity flowing that condensate liquid is delivered to condenser pipe 7, and then completes the heat dissipation of mainboard.
In summary:The cloud computer mainboard with heat sinking function, passes through mainboard ontology 1, radiating copper sheet 2, ventilation duct
3, the cooperation of motor 5, flabellum 6, condenser pipe 7, hose 8, water pump 9, support plate 11 and graphene cooling fin 12 solves traditional
Cloud computer mainboard is typically all to be radiated by fan, and heat derives are then ensured the heat dissipation of computer by heat conducting pipe
Performance, but this radiating mode cannot increasingly radiate the heat inside cloud computer mainboard, affect scattered
The effect of heat, and then the problem of affect cloud computer operation efficiency.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is appreciated that can these embodiments be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (4)
1. the cloud computer mainboard with heat sinking function, including mainboard ontology (1), it is characterised in that:The mainboard ontology (1)
Bottom is fixedly connected with radiating copper sheet (2), and the both sides of radiating copper sheet (2) bottom have been fixedly connected with ventilation duct (3), described
The both sides of ventilation duct (3) inner cavity have been fixedly connected with holder (4), and motor (5) is fixedly connected between two holders (4), described
The output end of motor (5) is fixedly connected with flabellum (6), the bottom of the radiating copper sheet (2) and before two ventilation ducts (3)
It is provided with condenser pipe (7), the rear end on the left of the condenser pipe (7) is communicated with hose (8), and the hose (8) is far from condenser pipe (7)
One end be communicated with water pump (9), connector (10) is communicated on the right side of the water pump (9), the bottom of the water pump (9) is fixedly connected
There are support plate (11), the left side of the support plate (11) to be fixedly connected with ventilation duct (3), the front end on the right side of the condenser pipe (7)
It is connected to peripheral hardware cooling cylinder by hose (8).
2. the cloud computer mainboard according to claim 1 with heat sinking function, it is characterised in that:The mainboard ontology
(1) graphene cooling fin (12) is provided at the top of, the both sides of mainboard ontology (1) bottom have been fixedly connected with mounting bracket
(13)。
3. the cloud computer mainboard according to claim 1 with heat sinking function, it is characterised in that:The ventilation duct (3)
Bottom be bolted to connection Air Filter (14), the bottom of the radiating copper sheet (2) and positioned at condenser pipe (7) gap it
Between be provided with radiating fin (15).
4. the cloud computer mainboard according to claim 1 with heat sinking function, it is characterised in that:The water pump (9)
Left side is fixedly connected with snubber block (16), and the left side of the snubber block (16) is fixedly connected with ventilation duct (3).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201820521391.5U CN208044525U (en) | 2018-04-13 | 2018-04-13 | Cloud computer mainboard with heat sinking function |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201820521391.5U CN208044525U (en) | 2018-04-13 | 2018-04-13 | Cloud computer mainboard with heat sinking function |
Publications (1)
Publication Number | Publication Date |
---|---|
CN208044525U true CN208044525U (en) | 2018-11-02 |
Family
ID=63943874
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201820521391.5U Active CN208044525U (en) | 2018-04-13 | 2018-04-13 | Cloud computer mainboard with heat sinking function |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN208044525U (en) |
-
2018
- 2018-04-13 CN CN201820521391.5U patent/CN208044525U/en active Active
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GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20190925 Address after: 100089 No. 12, No. 3, Yuquan Road, Haidian District, Beijing, 3107 Patentee after: Beijing Infinite Wisdom Technology Co., Ltd. Address before: 450000 Henan Zhengzhou Free Trade Zone, Zhengzhou, Henan (Zheng Dong) 908 window of Yunfeng A block, window of Green Road, Pu Hui Road 80 Patentee before: Zhengzhou sandalle Technology Co., Ltd. |