CN108366495A - A kind of technique for improving the offset of IC bridge locations and falling off - Google Patents
A kind of technique for improving the offset of IC bridge locations and falling off Download PDFInfo
- Publication number
- CN108366495A CN108366495A CN201711306992.0A CN201711306992A CN108366495A CN 108366495 A CN108366495 A CN 108366495A CN 201711306992 A CN201711306992 A CN 201711306992A CN 108366495 A CN108366495 A CN 108366495A
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- Prior art keywords
- bridge
- offset
- bridge locations
- falling
- improving
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0736—Methods for applying liquids, e.g. spraying
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/111—Preheating, e.g. before soldering
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The present invention relates to PCB manufacture crafts fields, provide a kind of technique that improvement IC bridge locations are deviated and fallen off, the defect that IC small distances, the offset of IC bridge locations and IC bridge locations fall off in overcoming existing welding resistance to produce.Include the following steps：(1) welding resistance pre-treatment specifically includes pickling, nog plate, sandblasting, blots, dries up, drying；(2) it prints, wherein printing ink reducer adds：30ml/KG, 43T oblique pull net, even plug band print, white wire mark brush；(3) pre-baked；(4) contraposition exposure, using semi-automatic exposure machine；(5) develop, developed using potassium carbonate；(6) QC full inspections specifically use 40 times of mirror full inspections；(7) it bakes afterwards, first bakes low temperature, then 155 DEG C/80min of roasting high temperature；(8) Physical Experiment is tested, and specific slice confirms ink lateral erosion.The volatilization time that the present invention can extend printing ink solvent promotes guarantor's bridge ability；Increase energy and energy uniformity, the adhesive force of IC bridge locations can be promoted.
Description
Technical field
The present invention relates to PCB manufacture crafts fields, and in particular to a kind of technique for improving the offset of IC bridge locations and falling off.
Background technology
PCB (printed Circuit Board) Chinese name printed circuit board, also known as printed wiring board, is important
Electronic unit is the supporter of electronic component, is the carrier of electronic component electric appliance connection.Electronic equipment uses printed board
Afterwards, due to the consistency of similar printed board, so as to avoid the mistake of artificial wiring, and can realize electronic component automatic insertion or
Attachment automatic tin solderings is detected automatically, ensure that the quality and stability of electronic equipment.Improving labor productivity reduces
Cost, and it is easy to repair.With the high speed development of the high-accuracy electronic product of high-performance.Electronic product is to printed board product requirement
To the highly reliable multiple stratifications high-speed transfers of high density high-precision fine pore thin wire thin spaces, the development of light weight thin type.So
Requirement for the IC drift rates and reliability of PCB is increasingly stringenter.Manufacture difficulty is higher and higher.To ensure the firm of IC welding
Property and electric property are unaffected.Equipment and substrate harmomegathus cause contraposition accuracy offset can be in 1.25mil or so.As IC is small
The position of spacing 7mil, IC bridge locations need to ensure the spacing of 1mil or more with the both sides IC, be opened to improve the not upper IC increasings of deviation welding resistance
Window reduces welding resistance IC bridge locations to 2.5mil to 2.25mil, to brought in production process IC be easy to fall off IC in deviations because
Element, in the case of not changing mode of printing for guaranteed efficiency, (white net even fills in band print) welding resistance development will ensure that ink can rush in hole
Totally, ensure that IC bridge locations are not fallen off again, need improves welding resistance IC in equipment and technique protects bridge ability.Therefore in production process
Middle promotion product, quality are the targets that industry is pursued jointly.
Invention content
The problem to be solved in the present invention is that IC small distances in overcoming existing welding resistance to produce, the offset of IC bridge locations and IC bridge locations fall off
Defect.A kind of improvement IC bridge locations offset and the technique that falls off of IC bridge locations are provided.
In order to solve the above technical problems, the present invention provides following technology improvement plans：
Present invention improvement welding resistance production IC bridge locations offset and the technique for falling bridge include the following steps：
(1) welding resistance pre-treatment specifically includes pickling, nog plate, sandblasting, blots, dries up, drying；
(2) it prints, printing ink reducer addition：30ml/KG, 43T oblique pull net, even plug band print, white wire mark brush；
(3) pre-baked；
(4) contraposition exposure, using semi-automatic exposure machine；
(5) develop, using potassium carbonate；
(6) QC full inspections, specific 40 times of mirror full inspections；
(7) it bakes afterwards, first bakes low temperature, then high temperature bakes 155 DEG C/80min；
(8) Physical Experiment is tested, and specific slice confirms ink lateral erosion；
It is baked after high temperature and does physical testing, slice confirms ink lateral erosion.Lateral erosion more bigger it is easier fall bridge, IC bridges when surface treatment
There is the risk to fall off more greatly in position.The smaller guarantor's bridge ability of lateral erosion is stronger.
It further illustrates, the welding resistance produces IC small distances.The problem of IC bridge locations deviate and IC bridge locations fall off.
It further illustrates, the step (3) is existing to require that pre-baked (73 DEG C of tunnel oven/8 sections/every section 408 seconds, adds up to 54
Minute) this technology requires pre-baked in pre-baked (73 DEG C of tunnel oven/8 sections/every section 468 seconds adds up to 62 minutes) this technology to increase by 8 points
The volatilization time that clock can extend printing ink solvent promotes guarantor's bridge ability.
It further illustrates, the existing requirement of step (4) designs IC spacing 7mil, the wide 4mil of bridge, and open a window 1.5mil, exposure
Energy：10 ± 1 grades, energy uniformity：75%.This technology requires IC spacing 7mil, the wide 2.5mil of bridge, windowing 2.25mil. exposures
Energy：11 ± 1 grades, energy uniformity：87%.Increasing windowing makes up equipment and substrate harmomegathus (1.25mil) to 2.25mil makes resistance
Weldering IC, which deviates inevitable negative factor, leads to pad in deviation.Ensure parameter upper limit, increases energy and energy
Uniformity can promote the adhesive force of IC bridge locations.
It further illustrates, the step (5)
1. concentration of potassium carbonate of developing：12±2g/L
2. development temperature：30±2℃
3. development point：65 ± 5%
4. developer pressure：Upper pressure .2.5 ± 0.5kg/cm2, push .2.5 ± 0.5kg/cm2
5. washing pressure：1.5±0.2kg/cm2
6. drying temperature：50±5℃
Visualization way and bleed type：The faces IC are unified to develop downward.It is existing to require the sprayed spray of nozzle for cylindricality, it is convenient for
Ink in hole is rinsed, but surface ink and IC bridge locations are impacted greatly, be easy bridge and increases ink side, erosion reduces solder mask
Adhesive force.Nozzle is respectively fan-shaped, cylindricality cross arrangement.Water column can be reduced, IC bridge locations are caused to the impact of IC bridge locations and ink
It falls off, and can guarantee that ink rinses in hole.
The reached advantageous effect of the present invention is：
It is pre-baked in (73 DEG C of continuous tunnel furnace oven/8 sections/every section 468 seconds 62 minutes total) this technology 1. pre-baked to increase by 8 minutes,
The volatilization time that printing ink solvent can be extended promotes guarantor's bridge ability.
Keep IC offsets inevitably negative 2. increasing windowing and making up equipment and substrate harmomegathus (1.25mil) to 2.25mil
Factor leads to pad in deviation.Increase energy and energy uniformity, the adhesive force of IC bridge locations can be promoted.
3. the visualization way and bleed type：The faces IC are unified to develop downward, and the lower nozzle that develops presses water column, respectively fans
Shape, cylindricality cross arrangement；Nozzle half uses spray for sector structure Spray mouths, the other half spray uses column construction Spray mouths, shows
Shadow nozzle presses water column shape.Respectively fan-shaped, cylindricality cross arrangement production.
Description of the drawings
Fig. 1 is prior art engineering design IC spacing figure (7mil) in the present invention；
Fig. 2 is prior art engineering design IC windowing figures (1.5mil) in the present invention；
Fig. 3 is the prior art wide figure of engineering design IC bridges (4mil) in the present invention；
Fig. 4 is 40 times of mirror design sketch of the prior art in the present invention；
Fig. 5 is 100 times of mirror design sketch of the prior art in the present invention；
Fig. 6 is prior art ink lateral erosion slice map in the present invention；
Fig. 7 is engineering design IC spacing figure of the embodiment of the present invention (7mil)；
Fig. 8 is engineering design of embodiment of the present invention IC windowing figures (2.25mil)；
Fig. 9 is the wide figure of engineering design IC bridges of the embodiment of the present invention (2.5mil)；
Figure 10 is 40 times of mirror design sketch of the embodiment of the present invention；
Figure 11 is 100 times of mirror design sketch of art of the embodiment of the present invention；
Figure 12 is art ink lateral erosion slice map of the embodiment of the present invention.
Specific implementation mode
Below in conjunction with the embodiment of the present invention, technical scheme of the present invention is clearly and completely described, it is clear that institute
The embodiment of description is only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention,
Every other embodiment obtained by those of ordinary skill in the art without making creative efforts, belongs to this hair
The range of bright protection.
Clear, complete description, certainly, described embodiment are carried out to the technical solution in patent of invention example below
The only a part of embodiment of the present invention, instead of all the embodiments.Based on embodiment in the present invention, ordinary skill
Personnel do not make the every other embodiment obtained under the premise of creative work, belong to the scope of the present invention.
Referring to attached drawing 7-12,
(1) welding resistance pre-treatment speed:2.5m/min, pickling concentration:3.8%, wear scar width:15mm, drying temperature:91℃
Blasting pressure:Upper pressure：Pressure under 2.0KG/C ㎡：1.8KG/C ㎡ (pickling, sandblasting, is blotted, dried up, drying nog plate)
(2) frictioning hardness is printed：75 degree, scraper angle：35 degree (printing ink reducer adds：30ml/KG, 43T oblique pull net,
Lian Sai band prints, white wire mark brush)
(3) pre-baked (73 DEG C of continuous tunnel furnace oven/8 sections/every section 468 seconds adds up to 62 minutes)
(4) contraposition exposure (semi-automatic exposure machine) IC spacing 7mil, the wide 2.5mil of bridge, open a window 2.25mil, exposure energy：
11 ± 1 grades, vacuum pressure -450mmHg energy uniformities：87%
(5) development (potassium carbonate) development concentration of potassium carbonate：12 ± 2g/L, development temperature：30 ± 2 DEG C, develop point：65±
5%, developer pressure：Upper pressure .2.5 ± 0.5kg/cm2, push .2.5 ± 0.5kg/cm2Wash pressure：1.5±0.2kg/cm2It dries
Dry temperature：50±5℃.Visualization way and bleed type：The faces IC are unified to develop downward.By water column, respectively, fan-shaped cylindricalitys are handed over
Fork arrangement.Nozzle half, spray are the Spray mouths of sector, and half spray is cylindrical Spray mouths, and developing nozzle presses water column shape, fan
Shape cylindricality cross arrangements produce.
(6) QC full inspections (40 times of mirror full inspections) fall off problem without IC in deviation and welding resistance IC bridge locations.
(7) it bakes afterwards and (first bakes low temperature：70 DEG C/30min90 DEG C/30min120 DEG C/20min bakes high temperature again：155℃/80min)
(8) physical testing (slice confirms ink lateral erosion) ink lateral erosion is in 11um-17um
QC is confirmed with 40 times of mirror full inspections after development, and IC and welding resistance IC bridge locations fall off problem in no deviation.It bakes afterwards and does physics survey
Trial cut piece confirms ink lateral erosion 11um-17um.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
Understanding without departing from the principles and spirit of the present invention can carry out these embodiments a variety of variations, modification, replace
And modification, the scope of the present invention is defined by the appended.
Claims (5)
1. a kind of technique for improving the offset of IC bridge locations and falling off, which is characterized in that include the following steps：
(1) welding resistance pre-treatment specifically includes pickling, nog plate, sandblasting, blots, dries up, drying；
(2) it prints, wherein printing ink reducer adds：30ml/KG, 43T oblique pull net, even plug band print, white wire mark brush；
(3) pre-baked；
(4) contraposition exposure, using semi-automatic exposure machine；
(5) develop, developed using potassium carbonate；
(6) QC full inspections specifically use 40 times of mirror full inspections；
(7) it bakes afterwards, first bakes low temperature, then 155 DEG C/80min of roasting high temperature；
(8) Physical Experiment is tested, and specific slice confirms ink lateral erosion.
2. the technique according to claim 1 for improving the offset of IC bridge locations and falling off, it is characterised in that：The step (3) is pre-
Roasted journey, 73 DEG C of tunnel oven/8 sections/every section 468 seconds add up to 62 minutes.
3. the technique according to claim 1 for improving the offset of IC bridge locations and falling off, it is characterised in that：The step (4) is wanted
Ask IC spacing 7mil, the wide 2.5mil of bridge, windowing 2.25mil, exposure energy：11 ± 1 grades, energy uniformity：87%.
4. the technique according to claim 1 for improving the offset of IC bridge locations and falling off, it is characterised in that：The step (5)：
(1) development concentration of potassium carbonate：12±2g/L；
(2) development temperature：30±2℃；
(3) develop point：65 ± 5%；
(4) developer pressure：Upper pressure .2.5 ± 0.5kg/cm2, push .2.5 ± 0.5kg/cm2；
(5) pressure is washed：1.5±0.2kg/cm2；
(6) drying temperature：50±5℃.
5. the technique according to claim 1 for improving the offset of IC bridge locations and falling off, it is characterised in that：The visualization way and
Bleed type：The faces IC are unified to develop downward, and the lower nozzle that develops presses water column shape, respectively fan-shaped, cylindricality cross arrangement；That is nozzle
Half uses spray for sector structure Spray mouths, the other half spray uses column construction Spray mouths.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711306992.0A CN108366495A (en) | 2017-12-11 | 2017-12-11 | A kind of technique for improving the offset of IC bridge locations and falling off |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711306992.0A CN108366495A (en) | 2017-12-11 | 2017-12-11 | A kind of technique for improving the offset of IC bridge locations and falling off |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108366495A true CN108366495A (en) | 2018-08-03 |
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ID=63009918
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711306992.0A Pending CN108366495A (en) | 2017-12-11 | 2017-12-11 | A kind of technique for improving the offset of IC bridge locations and falling off |
Country Status (1)
| Country | Link |
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| CN (1) | CN108366495A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102917549A (en) * | 2011-08-02 | 2013-02-06 | 深南电路有限公司 | Circuit board soldermask bridge processing method |
| CN105163507A (en) * | 2015-08-11 | 2015-12-16 | 深圳崇达多层线路板有限公司 | Method for improving carbon oil yield |
| CN105228363A (en) * | 2015-08-28 | 2016-01-06 | 江门崇达电路技术有限公司 | A kind of manufacture method of solder mask |
| CN107027245A (en) * | 2017-05-02 | 2017-08-08 | 江门崇达电路技术有限公司 | A kind of preparation method of welding resistance bridge |
-
2017
- 2017-12-11 CN CN201711306992.0A patent/CN108366495A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102917549A (en) * | 2011-08-02 | 2013-02-06 | 深南电路有限公司 | Circuit board soldermask bridge processing method |
| CN105163507A (en) * | 2015-08-11 | 2015-12-16 | 深圳崇达多层线路板有限公司 | Method for improving carbon oil yield |
| CN105228363A (en) * | 2015-08-28 | 2016-01-06 | 江门崇达电路技术有限公司 | A kind of manufacture method of solder mask |
| CN107027245A (en) * | 2017-05-02 | 2017-08-08 | 江门崇达电路技术有限公司 | A kind of preparation method of welding resistance bridge |
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Application publication date: 20180803 |