CN108364882A - Obtain the method that the wafer crystalline substance back of the body scratches source - Google Patents
Obtain the method that the wafer crystalline substance back of the body scratches source Download PDFInfo
- Publication number
- CN108364882A CN108364882A CN201810157691.4A CN201810157691A CN108364882A CN 108364882 A CN108364882 A CN 108364882A CN 201810157691 A CN201810157691 A CN 201810157691A CN 108364882 A CN108364882 A CN 108364882A
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- wafer
- crystalline substance
- manipulator
- scratch
- source
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
The present invention provides a kind of methods that the acquisition wafer crystalline substance back of the body scratches source, including the manipulator for producing board is grouped according to the size of cross-sectional width；Wafer crystalline substance is carried on the back and carries out particle detections, to judge whether the wafer crystalline substance back of the body scratches；When the wafer crystalline substance back of the body scratches, the shortest distance between scratch and the wafer center of circle is obtained；The group of the manipulator of the scratch wafer crystalline substance back of the body is judged according to the shortest distance between the scratch and the wafer center of circle.It can quickly and accurately judge whether the wafer crystalline substance back of the body scratches using the method for particle detections, improve the efficiency of detection, avoid the uncertainty of Manual Visual Inspection, the manipulator for producing board is grouped, when wafer crystalline substance, which is carried on the back, to be scratched, can quickly determine the group for the manipulator for scratching the wafer crystalline substance back of the body, to timely and effectively find out the production board of generation problem, the generation of bulk defective products is avoided, and reduces manpower expenditure, effectively raises the yield and quality of product.
Description
Technical field
The present invention relates to field of semiconductor manufacture more particularly to a kind of methods for obtaining the wafer crystalline substance back of the body and scratching source.
Background technology
As integrated circuit device size constantly reduces, the complexity of technical process is continuously improved, and defects detection becomes whole
An essential link in a production process.
In the manufacturing process of existing wafer, the scratch of the wafer crystalline substance back of the body is very serious defect, but wafer crystalline substance is carried on the back
The detection for scratching defect also rests on stage of Manual Visual Inspection at present, accuracy that Manual Visual Inspection scratches the wafer crystalline substance back of the body and tight
Severe degree is different according to testing staff, it is serious different to scratch and detection light bright-dark degree is different and it is very big to distinguish, so for
There are many uncertain factors for the judgement that the crystalline substance back of the body scratches, and can not accurately judge whether the wafer crystalline substance back of the body scratches.Also, currently without
A kind of method that can quickly determine the wafer crystalline substance back of the body and scratch source, can not find out of order board, lead to defective products in time
Outflow, reduces the yield and production capacity of product.
Invention content
The purpose of the present invention is to provide it is a kind of acquisition wafer crystalline substance the back of the body scratch source method, with solve in the prior art without
Method finds failure board in time, and defective products is led to problems such as to flow out.
In order to achieve the above object, the present invention provides a kind of method that the acquisition wafer crystalline substance back of the body scratches source, the acquisitions
Wafer crystalline substance carries on the back the method for scratching source：
The manipulator for producing board is grouped according to the size of cross-sectional width；
Using different groups of other manipulator grasping silicon wafers, in the process of grasping, the manipulator holds the wafer crystalline substance back of the body；
The wafer crystalline substance is carried on the back and carries out particle detections, to judge whether the wafer crystalline substance back of the body scratches；
When the wafer crystalline substance back of the body scratches, the shortest distance between scratch and the wafer center of circle is obtained；According to institute
The shortest distance between scratch and the wafer center of circle is stated to judge to scratch the group of the manipulator of the wafer crystalline substance back of the body.
Optionally, by the manipulator for producing board according to the size of cross-sectional width be grouped including：
The manipulator for producing board is grouped according to the size of cross-sectional width；
The manipulator of every group of production board is classified according to grasp mode.
Optionally, the manipulator axial symmetry.
Optionally, in the process of grasping, the symmetry axis of the manipulator is directed at the diametric(al) of the wafer.
Optionally, by the manipulator for producing board according to the size of cross-sectional width be grouped including：
It is A groups when the half of the cross-sectional width of the manipulator is in the first range；When cutting for the manipulator
It is B groups when the half of face width is in the second range；When the manipulator cross-sectional width half in third model
It is C groups when enclosing interior.
Optionally, when the shortest distance between the scratch and the wafer center of circle is in the first range, scratch comes
Source is the manipulator of A groups；When the shortest distance between the scratch and the wafer center of circle is in the second range, scratch comes
Source is the manipulator of B groups；When the shortest distance between the scratch and the wafer center of circle is within the scope of third, scratch comes
Source is the manipulator of C groups.
Optionally, described first ranging from 0 millimeter -50 millimeters, described second ranging from 50 millimeters -100 millimeters, described
Three ranging from 100 millimeters -150 millimeters.
Optionally, the manipulator of every group of production board is carried out classification according to grasp mode includes：
It is the first kind when the grasp mode of the manipulator is that monolithic captures；When the grasp mode of the manipulator is
It is the second class when multi-disc captures；It is third class when the grasp mode of the manipulator is to capture by the gross.
Optionally, when the single-wafer crystalline substance back of the body scratches, the source of scratch is the manipulator of the first kind；When continuous multi-disc
When the wafer crystalline substance back of the body scratches, the source of scratch is the manipulator of the second class；When the wafer crystalline substance back of the body scratches by the gross, scratch
Source be third class manipulator.
Optionally, the wafer number that the manipulator of multi-disc crawl captures every time is 5-10；The manipulator captured by the gross
The wafer number captured every time is 20-30.
Optionally, judged to scratch the wafer crystalline substance back of the body according to the shortest distance between the scratch and the wafer center of circle
After the group of manipulator, the method for obtaining wafer crystalline substance back of the body scratch source further includes：
Pair production board corresponding with the manipulator for scratching the wafer crystalline substance back of the body repairs.
Optionally, the wafer crystalline substance is carried on the back using particle detection device and carries out particle detections, to judge that the wafer crystalline substance is carried on the back
Whether scratch.
In the acquisition wafer crystalline substance back of the body provided by the invention scratches the method in source, including will produce the manipulator of board according to
The size of cross-sectional width is grouped；Using different groups of other manipulator grasping silicon wafers, in the process of grasping, the machinery hand rest
State the wafer crystalline substance back of the body in residence；The wafer crystalline substance is carried on the back and carries out particle detections, to judge whether the wafer crystalline substance back of the body scratches；When the crystalline substance
When the wafer back of the body scratches, the shortest distance between scratch and the wafer center of circle is obtained；According to the scratch and the wafer
The shortest distance between the center of circle judges to scratch the group of the manipulator of the wafer crystalline substance back of the body.It can be fast using the method for particle detections
Speed and accurately judge wafer crystalline substance the back of the body whether scratch, improve the efficiency of detection, avoid the uncertainty of Manual Visual Inspection, will
Production board manipulator be grouped, when wafer crystalline substance carry on the back scratch when, according between the scratch and the wafer center of circle most
Short distance can quickly determine the group for the manipulator for scratching the wafer crystalline substance back of the body, to timely and effectively find out the production of generation problem
Board avoids the generation of bulk defective products, and reduces manpower expenditure, is effectively improved the yield and quality of product.
Description of the drawings
Fig. 1 is the flow chart for the method that the acquisition wafer crystalline substance back of the body provided in an embodiment of the present invention scratches source；
Fig. 2 is the schematic diagram of manipulator provided in an embodiment of the present invention；
Fig. 3 is the schematic diagram of scratch provided in an embodiment of the present invention；
Fig. 4 is the schematic diagram of manipulator grouping and the classification of production board provided in an embodiment of the present invention；
Wherein, 1- wafers crystalline substance is carried on the back, the 11- wafers center of circle, 12- scratches, 2- manipulators, between X- scratches and the wafer center of circle most
Short distance；The cross-sectional width of Y- manipulators, the extended line of a- diameter wafers.
Specific implementation mode
The specific implementation mode of the present invention is described in more detail below in conjunction with schematic diagram.According to following description and
Claims, advantages and features of the invention will become apparent from.It should be noted that attached drawing is all made of very simplified form and
Using non-accurate ratio, only for the purpose of facilitating and clarifying the purpose of the embodiments of the invention.
Refering to fig. 1, it is the flow chart for the method that the acquisition wafer crystalline substance back of the body provided in this embodiment scratches source, such as Fig. 1 institutes
Show, the method for obtaining wafer crystalline substance back of the body scratch source includes：
S1：The manipulator for producing board is grouped according to the size of cross-sectional width；
S2：Using different groups of other manipulator grasping silicon wafers, in the process of grasping, it is brilliant that the manipulator holds the wafer
The back of the body；
S3：The wafer crystalline substance is carried on the back and carries out particle detections, to judge whether the wafer crystalline substance back of the body scratches；
S4：When the wafer crystalline substance back of the body scratches, the shortest distance between scratch and the wafer center of circle is obtained；
S5：The machinery of the scratch wafer crystalline substance back of the body is judged according to the shortest distance between the scratch and the wafer center of circle
The group of hand.
The present invention can quickly and accurately judge whether the wafer crystalline substance back of the body scratches using the method for particle detections, improve
The efficiency of detection avoids the uncertainty of Manual Visual Inspection, and the manipulator for producing board is grouped, and carries on the back and scratches when wafer crystalline substance
When, the manipulator for scratching the wafer crystalline substance back of the body can be quickly determined according to the shortest distance between the scratch and the wafer center of circle
Group avoids the generation of bulk defective products, and reduce people to timely and effectively find out the production board of generation problem
Power is paid, and the yield and quality of product are effectively improved.
Please continue to refer to Fig. 2-Fig. 4, next, will be scraped to the acquisition wafer crystalline substance provided in this embodiment back of the body in conjunction with Fig. 2-Fig. 4
The method for hindering source is further described.
First, referring to Fig. 2, the manipulator 2 of production board is in grasping silicon wafer or overturning crystal face, using Multi-contact
Mode hold wafer crystalline substance the back of the body 1, so manipulator 2 will not damage crystal face.And manipulator 2 is in grasping silicon wafer, it should
It keeps parallel with the wafer crystalline substance back of the body 1, if board occurs problem and causes manipulator and the wafer crystalline substance back of the body 1 not parallel, is put in manipulator
It is easy to scratch the wafer crystalline substance back of the body 1 when stretching.Further, due to the axisymmetricly structure of manipulator 2, and in grasping silicon wafer
All using the wafer center of circle 11 as calibration point, i.e., in the process of grasping, the symmetry axis alignment brilliant diameter of a circle of the manipulator
Direction (as shown in the straight line a in Fig. 2), therefore the shortest distance between scratch and the wafer center of circle 11 and the section of manipulator 2 are wide
Degree relationship is very close.
Referring to Fig. 3, manipulator 2 in normal work about straight line a axisymmetricly, and in the direction along straight line a
On put in and stretch out, the cross-sectional width of the manipulator 2 is Y, when production board when something goes wrong, manipulator 2 has scratched wafer
The crystalline substance back of the body 1, causes scratch 12, and the minimum range between scratch 12 and the wafer center of circle 11 is X (the wafer center of circle 11 and straight line where scratch
Vertical line length)；And scratch 12 is caused by the friction and Extrusion of two claws in front end in manipulator 2, compared to entire manipulator 2
Cross-sectional width Y, the sectional dimension of two claws in front end can be ignored, therefore, between scratch 12 and the wafer center of circle 11
Minimum range X is approximately the half of cross-sectional width Y, i.e. the cross-sectional width Y and 2X of manipulator 2 can regard equal as.
Referring to Fig. 4, the manipulator 2 for producing board is grouped according to the size of cross-sectional width Y, in the present embodiment,
It is 3 groups that the manipulator 2, which is divided, specifically, the half (Y/ of the cross-sectional width Y when the manipulator 2 of the production board
2) it is A groups when in the first range；When the manipulator 2 of the production board cross-sectional width Y half (Y/2) the
It is B groups when in two ranges；When it is described production board manipulator 2 cross-sectional width Y half (Y/2) in third range
When interior, be C groups, described first ranging from 0 millimeter -50 millimeters, described second ranging from 50 millimeters -100 millimeters, the third model
Enclose is 100 millimeters -300 millimeters.
Then, the manipulator 2 for producing board is classified according to grasp mode, in the present embodiment, by the manipulator 2
It has been divided into 3 classes, has been the first kind specifically, when the grasp mode of the manipulator 2 of the production board is that monolithic captures；Work as institute
It is the second class when the grasp mode for stating the manipulator 2 of production board is multi-disc crawl；When the manipulator 2 for producing board
Grasp mode is when capturing by the gross, is third class, and the wafer number that the manipulator of multi-disc crawl captures every time is 5-10；It is whole
It is 20-30 to criticize the wafer number that the manipulator captured captures every time.Certainly, the manipulator 2 of the production board can be with
It is divided into 4 groups, 5 groups etc., the manipulator 2 of the production board can also be divided into 4 classes, 5 classes etc. according to the difference of grasp mode, to carry
The efficiency and accuracy of high searching problem board, the present embodiment are not being illustrated one by one.
Next, being scanned to the wafer crystalline substance back of the body 1 using particle detection device, the defect situation of the wafer crystalline substance back of the body 1 is obtained, with
Accurately judge whether the wafer crystalline substance back of the body 1 has scratch, when the wafer crystalline substance back of the body 1 does not scratch, production board continues work, works as inspection
The wafer crystalline substance back of the body 1 is measured when scratching, obtains the shortest distance X between scratch 12 and the wafer center of circle 11 by measuring, then
Judge that X is fallen in the group of which manipulator 2, further, detects the case where a collection of wafer scratches, then judge to scratch wafer
The classification of the manipulator 2 of the crystalline substance back of the body, for example, when X=80 millimeters of the shortest distance between scratch 12 and the wafer center of circle 11, and occur
When multi-disc continuously scratches, it can be determined that the source for going out scratch is the manipulator of the second class of B groups.Certainly, when the grouping of manipulator 2 compared with
When more, the classification of manipulator 2 can also be first judged, then judge group, to save the time, improve the effect of searching problem production board
Rate.
Further, if the shortest distance X between the scratch 12 and the wafer center of circle 11 is fallen near the critical value of grouping,
For example, at X=50 millimeters, can the manipulator of A groups and B groups be subjected to shutdown inspection, avoid judging by accident, but in actual production
Cheng Zhong, since the cross-sectional width Y gaps of every group of manipulator are larger, the shortest distance X between scratch 12 and the wafer center of circle 11, which takes, to be faced
The probability that dividing value (50,100) or critical value are nearby worth is smaller.
Finally, it is determined that after the group and classification that scratch the manipulator of the wafer crystalline substance back of the body, by the manufacturing machine in this section
Platform carries out shutdown maintenance, alternatively, the production board of generation problem is further determined that by the direction of scratch, then again to asking
The production board of topic repairs.
To sum up, in the embodiment of the present invention provides the method for obtaining wafer crystalline substance back of the body scratch source, including board will be produced
Manipulator is grouped according to the size of cross-sectional width；Using different groups of other manipulator grasping silicon wafers, in the process of grasping, institute
It states manipulator and holds the wafer crystalline substance back of the body；The wafer crystalline substance is carried on the back and carries out particle detections, to judge whether the wafer crystalline substance back of the body is scraped
Wound；When the wafer crystalline substance back of the body scratches, the shortest distance between scratch and the wafer center of circle is obtained；According to the scratch
The shortest distance between the wafer center of circle judges to scratch the group of the manipulator of the wafer crystalline substance back of the body.Using particle detections
Method can quickly and accurately judge whether the wafer crystalline substance back of the body scratches, and improve the efficiency of detection, avoid Manual Visual Inspection
The manipulator for producing board is grouped by uncertainty, when wafer crystalline substance, which is carried on the back, to be scratched, is justified according to the scratch and the wafer
The shortest distance between the heart can quickly determine the group for the manipulator for scratching the wafer crystalline substance back of the body, to timely and effectively find out generation
The production board of problem avoids the generation of bulk defective products, and reduces manpower expenditure, effectively raises the good of product
Rate and quality.
The preferred embodiment of the present invention is above are only, does not play the role of any restrictions to the present invention.Belonging to any
Those skilled in the art, in the range of not departing from technical scheme of the present invention, to the invention discloses technical solution and
Technology contents make the variations such as any type of equivalent replacement or modification, belong to the content without departing from technical scheme of the present invention, still
Within belonging to the scope of protection of the present invention.
Claims (12)
1. a kind of method for obtaining the wafer crystalline substance back of the body and scratching source, which is characterized in that the side for obtaining the wafer crystalline substance back of the body and scratching source
Method includes：
The manipulator for producing board is grouped according to the size of cross-sectional width；
Using different groups of other manipulator grasping silicon wafers, in the process of grasping, the manipulator holds the wafer crystalline substance back of the body；
The wafer crystalline substance is carried on the back and carries out particle detections, to judge whether the wafer crystalline substance back of the body scratches；
When the wafer crystalline substance back of the body scratches, the shortest distance between scratch and the wafer center of circle is obtained；
The group of the manipulator of the scratch wafer crystalline substance back of the body is judged according to the shortest distance between the scratch and the wafer center of circle
Not.
2. obtaining the method that the wafer crystalline substance back of the body scratches source as described in claim 1, which is characterized in that the machinery of board will be produced
Hand according to the size of cross-sectional width be grouped including：
The manipulator for producing board is grouped according to the size of cross-sectional width；
The manipulator of every group of production board is classified according to grasp mode.
3. obtaining the method that the wafer crystalline substance back of the body scratches source as claimed in claim 2, which is characterized in that the manipulator axis pair
Claim.
4. obtaining the method that the wafer crystalline substance back of the body scratches source as claimed in claim 3, which is characterized in that in the process of grasping, institute
The symmetry axis for stating manipulator is directed at the diametric(al) of the wafer.
5. obtaining the method that the wafer crystalline substance back of the body scratches source as claimed in claim 4, which is characterized in that the machinery of board will be produced
Hand according to the size of cross-sectional width be grouped including：
It is A groups when the half of the cross-sectional width of the manipulator is in the first range；When the section of the manipulator is wide
It is B groups when the half of degree is in the second range；When the manipulator cross-sectional width half within the scope of third
When, it is C groups.
6. as claimed in claim 5 obtain wafer crystalline substance the back of the body scratch source method, which is characterized in that when the scratch with it is described
When the shortest distance between the wafer center of circle is in the first range, the source of scratch is the manipulator of A groups；When the scratch with it is described
When the shortest distance between the wafer center of circle is in the second range, the source of scratch is the manipulator of B groups；When the scratch with it is described
When the shortest distance between the wafer center of circle is within the scope of third, the source of scratch is the manipulator of C groups.
7. obtaining the method that the wafer crystalline substance back of the body scratches source as claimed in claim 5, which is characterized in that described first ranging from 0
- 50 millimeters of millimeter, described second ranging from 50 millimeters -100 millimeters, ranging from 100 millimeters -150 millimeters of the third.
8. the method for obtaining the wafer crystalline substance back of the body and scratching source as described in right wants 4, which is characterized in that by the machine of every group of production board
Tool hand carries out classification according to grasp mode：
It is the first kind when the grasp mode of the manipulator is that monolithic captures；When the grasp mode of the manipulator is multi-disc
It is the second class when crawl；It is third class when the grasp mode of the manipulator is to capture by the gross.
9. the method for obtaining the wafer crystalline substance back of the body and scratching source as described in right wants 8, which is characterized in that carry on the back and occur when single-wafer crystalline substance
When scratch, the source of scratch is the manipulator of the first kind；When the continuous more wafers crystalline substance back of the body scratches, the source of scratch is the
The manipulator of two classes；When the wafer crystalline substance back of the body scratches by the gross, the source of scratch is the manipulator of third class.
10. the method for obtaining the wafer crystalline substance back of the body and scratching source as described in right wants 9, which is characterized in that the manipulator of multi-disc crawl
The wafer number captured every time is 5-10；The wafer number that the manipulator captured by the gross captures every time is 20-30.
11. the method for obtaining the wafer crystalline substance back of the body and scratching source as described in right wants 1, which is characterized in that according to the scratch and institute
After stating the group of manipulator that the shortest distance between the wafer center of circle judges the scratch wafer crystalline substance back of the body, the acquisition wafer is brilliant
Carrying on the back the method for scratching source further includes：
Pair production board corresponding with the manipulator for scratching the wafer crystalline substance back of the body repairs.
12. the method for obtaining the wafer crystalline substance back of the body and scratching source as described in right wants 1, which is characterized in that use particle detection device
The wafer crystalline substance is carried on the back and carries out particle detections, to judge whether the wafer crystalline substance back of the body scratches.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810157691.4A CN108364882B (en) | 2018-02-24 | 2018-02-24 | Method for obtaining wafer back scratch source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810157691.4A CN108364882B (en) | 2018-02-24 | 2018-02-24 | Method for obtaining wafer back scratch source |
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| Publication Number | Publication Date |
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| CN108364882A true CN108364882A (en) | 2018-08-03 |
| CN108364882B CN108364882B (en) | 2020-06-16 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11158040B2 (en) * | 2018-06-29 | 2021-10-26 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for identifying robot arm responsible for wafer scratch |
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|---|---|---|---|---|
| CN102130030A (en) * | 2010-01-18 | 2011-07-20 | 上海华虹Nec电子有限公司 | Method for detecting mechanical scratching condition of silicon wafers |
| CN103681392A (en) * | 2012-09-06 | 2014-03-26 | 中芯国际集成电路制造(上海)有限公司 | Mechanical scratch detection method |
| US20150357216A1 (en) * | 2014-06-06 | 2015-12-10 | Yealy Optic Electronic Co., Ltd. | Computer visual recognition output image-aided led die sorting system and sorting method |
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2018
- 2018-02-24 CN CN201810157691.4A patent/CN108364882B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102130030A (en) * | 2010-01-18 | 2011-07-20 | 上海华虹Nec电子有限公司 | Method for detecting mechanical scratching condition of silicon wafers |
| CN103681392A (en) * | 2012-09-06 | 2014-03-26 | 中芯国际集成电路制造(上海)有限公司 | Mechanical scratch detection method |
| US20150357216A1 (en) * | 2014-06-06 | 2015-12-10 | Yealy Optic Electronic Co., Ltd. | Computer visual recognition output image-aided led die sorting system and sorting method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11158040B2 (en) * | 2018-06-29 | 2021-10-26 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for identifying robot arm responsible for wafer scratch |
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