CN108355855B - Tackifier coating device - Google Patents

Tackifier coating device Download PDF

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Publication number
CN108355855B
CN108355855B CN201810243787.2A CN201810243787A CN108355855B CN 108355855 B CN108355855 B CN 108355855B CN 201810243787 A CN201810243787 A CN 201810243787A CN 108355855 B CN108355855 B CN 108355855B
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China
Prior art keywords
tackifier
coating
input
adhesion promotion
sensor
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CN201810243787.2A
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Chinese (zh)
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CN108355855A (en
Inventor
沈雪
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Shenzhen Dr Electronics Co ltd
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Huaian Imaging Device Manufacturer Corp
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Priority to CN201810243787.2A priority Critical patent/CN108355855B/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B9/00—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour
    • B05B9/03—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/24—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means incorporating means for heating the liquid or other fluent material, e.g. electrically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/08—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means
    • B05B12/085—Arrangements for controlling delivery; Arrangements for controlling the spray area responsive to condition of liquid or other fluent material to be discharged, of ambient medium or of target ; responsive to condition of spray devices or of supply means, e.g. pipes, pumps or their drive means responsive to flow or pressure of liquid or other fluent material to be discharged
    • B05B12/087—Flow or presssure regulators, i.e. non-electric unitary devices comprising a sensing element, e.g. a piston or a membrane, and a controlling element, e.g. a valve
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/0221—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/0278—Arrangement or mounting of spray heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
    • B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
    • B05B13/0285—Stands for supporting individual articles to be sprayed, e.g. doors, vehicle body parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
    • B05D3/0218—Pretreatment, e.g. heating the substrate

Abstract

The invention relates to a tackifier coating device, which comprises a coating cavity, wherein the coating cavity comprises: a tackifier input, the tackifier input comprising: the input branch pipe is connected with the input main pipe; the spray head is provided with a plurality of holes which are respectively in one-to-one correspondence with the output ports of the input branch pipes. The tackifier coating device can improve tackifier coating efficiency and improve yield.

Description

Tackifier coating device
Technical Field
The invention relates to the technical field of semiconductors, in particular to a tackifier coating device.
Background
The adhesion promoter hexamethyldisilazane (hereinafter abbreviated as HMDS) is used for chemically reacting with the wafer surface to change the wafer surface from hydrophilic to hydrophobic (i.e. the contact angle of the wafer surface is increased), thereby improving the wafer surface adhesion. After tackifying treatment, the contact angle of the wafer surface is generally required to be more than 65 degrees, the change range of the contact angle numerical values measured at different points on the 300mm wafer surface cannot exceed +/-5 degrees, which is the requirement of tackifying process uniformity. The current machine for gumming and developing uses a tackifier coating cavity (ADH cavity) to complete tackifying coating of HMDS, and passes through N2And (4) carrying out the HMDS from the tackifier container into an ADH cavity, and completing the supply of the HMDS in a single flow guiding mode.
Fig. 1 is a schematic structural diagram of a conventional tackifier application apparatus.
The tackifier coating apparatus includes: tackifier container 10 and ADH chamber 20. The tackifier is fed into the tackifier container 10 through a first inlet port 11, pure N2Is fed into the tackifier container 10 through a second inlet port 20. N is a radical of2After entering the tackifier container 10, the tackifier is swelled in the tackifier container or directly atomized by internal pressure, and then is output from the output end 13, enters the ADH cavity 20 through the flow guide structure 21 with a single flow guide hole, a tackifier film is formed on the surface of the wafer 30 placed on the surface of the heating plate 22, and exhaust gas is discharged through the exhaust end 23.
In the prior art, the whole tackifying time is about 60s, N2The brought HMDS liquid drops enter the ADH cavity 20 through the flow guide holes, and the ADH cavity 20 can be filled with the liquid drops for a period of time, so that the occupied area is increasedDuring a part of the adhering time, the HMDS cannot be guaranteed to uniformly fall on the surface of the wafer 30, and the adhesion uniformity of the surface of the wafer 30 cannot be guaranteed, so that the photoresist is coated and exposed, and the pattern collapses after the photoresist is developed, and the yield and the manufacturing stability of the product cannot be guaranteed.
Therefore, it is also necessary to provide a new tackifier application apparatus to improve the uniformity of tackifier application and improve productivity.
Disclosure of Invention
The invention aims to solve the technical problem of providing a tackifier coating device, which can improve the uniformity of tackifier coating and improve the productivity.
In order to solve the above problems, the present invention provides a tackifier coating apparatus, including a coating chamber, the coating chamber including: a tackifier input, the tackifier input comprising: the input branch pipe is connected with the input main pipe; the spray head is provided with a plurality of holes which are respectively in one-to-one correspondence with the output ports of the input branch pipes.
Optionally, each input branch pipeline is provided with a first airflow sensor and a first flow rate controller.
Optionally, the spray head has a heating component therein.
Optionally, the coating chamber further comprises: and the heating plate is arranged opposite to the tackifier input end and used for placing the wafer and heating the wafer.
Optionally, the tackifier input end is located at the bottom of the coating cavity, and the heating plate is located at the upper part of the coating cavity; the heating plate is provided with a vacuum adsorption component for adsorbing the wafer.
Optionally, the edge structure of the heating plate tilts towards the back of the heating plate; and a clamping rod is arranged below the edge of the heating plate, and the clamping rod is provided with a groove for clamping the wafer.
Optionally, the coating cavity further comprises more than two exhaust ports, and the exhaust ports are located at the bottom of the coating cavity; and the total exhaust port is connected with the more than two exhaust ports and is used for exhausting the gas exhausted from each exhaust port.
Optionally, the device further comprises a tackifier container for containing a tackifier, wherein the tackifier container comprises a tackifier supply end, a carrier gas supply end and a tackifier output end, and the tackifier output end is connected to the input header pipe of the tackifier input end through a pipeline.
Optionally, a second sensor and a second flow controller are installed at the tackifier output end, and the second flow controller is controlled by the second sensor.
Optionally, a third sensor and a third flow rate controller are installed at the carrier gas supply end, and the third flow rate controller is controlled by the third sensor to have a signal connection between the third sensor and the second sensor.
Optionally, an atomization device is arranged between the tackifier output end and the input header pipe.
Optionally, a filter is disposed between the atomization device and the input manifold.
Optionally, the system further comprises a monitoring system, connected to the first sensor, the second sensor, and the third sensor, and configured to monitor sensing data of the first sensor, the second sensor, and the third sensor, and adjust control strategies of the first sensor, the second sensor, and the third sensor on the first flow rate controller, the second controller, and the third first flow rate controller.
Optionally, the coating chamber has a side door as a wafer access passage.
The tackifier coating device disclosed by the invention is supplied through multiple pipes, so that the supply uniformity of the tackifier can be improved, the yield is improved, and the stability of a manufacturing process is ensured; and the chemical reaction rate of the tackifier and the surface of the wafer is accelerated, the tackifying time is reduced, and the productivity is improved.
Drawings
FIG. 1 is a schematic view of a prior art tackifier application apparatus;
FIG. 2 is a schematic structural view of a tackifier application apparatus according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a heating plate of a tackifier coating apparatus according to an embodiment of the present invention.
Detailed Description
The following describes in detail a specific embodiment of the tackifier application apparatus according to the present invention with reference to the accompanying drawings.
Fig. 2 is a schematic structural diagram of a tackifier coating apparatus according to an embodiment of the present invention.
The tackifier coating apparatus includes a coating chamber 200, and the coating chamber 200 includes: a tackifier input 201, the tackifier input 201 comprising: an input manifold 2011 which is led into the cavity from the outside of the cavity, and at least more than two input branch pipes 2012 which are connected with the input manifold 2011; the nozzle 202 has a plurality of holes 2021, which are respectively corresponding to the outlets of the input pipes 2012.
When the wafer is coated with the tackifier, the wafer is placed in the coating cavity 200, and tackifier steam is input into the coating cavity 200 through the tackifier input end 201. Typically, the adhesion promoter is hexamethyldisilazane, and in other embodiments, adhesion promoters for other materials are also possible.
Tackifier enters the coating cavity 200 through the input header 2011 of the tackifier input end 201 and then is distributed to each input branch pipe 2012, so that the uniformity of tackifier supply can be improved. In this specific embodiment, the input branch pipes 2012 are uniformly distributed and arranged in a circular array, and the diameter of the entire circular array is larger than that of the wafer, so as to improve the distribution uniformity of the tackifier on the surface of the wafer. In other embodiments of the present invention, the input branches 2012 may be arranged in a rectangular shape or other shapes.
The inventor finds that as the process time increases, the contact angle of the wafer surface increases, and the uniformity of the tackifier supply is realized through the plurality of input branch pipes 2012, so as to ensure that the contact angle of the whole wafer is basically kept at the same interface, improve the tackifying uniformity, simultaneously accelerate the reaction rate and reduce the tackifying time.
In order to further control the distribution of the tackifier into each region in the coating chamber 200, in this particular manner, a first air flow sensor and a first flow rate controller (not shown) are disposed on each of the input branches 2012. The flow rate of the tackifier vapor in each input branch pipe 2012 can be detected by the first gas flow sensor, and the flow rate of the tackifier can be adjusted by the first flow rate controller, so that the flow rate of the tackifier vapor in each input branch pipe 2012 at each position can be adjusted according to the actual coating requirement, for example, the flow rate of the tackifier vapor in each input branch pipe 2012 is adjusted to be the same; or the flow speed is automatically controlled to increase the supply amount of the HMDS along with the increase of the chemical reaction rate of the tackifier and the surface of the wafer, so that the chemical reaction is more complete, and meanwhile, the first gas flow sensor can also automatically detect whether a pipeline is damaged or not, so that the normal operation of the supply is ensured.
Further, the coating device further comprises a spray head 202, wherein the spray head is provided with a plurality of holes 2021 which correspond to the input branch pipes 2012 respectively, and the tackifier flows out through the input branch pipes 2012 and then enters the inner space of the coating cavity 200 after passing through the spray head. In an embodiment of the invention, the nozzle 202 is circular, and the diameter of the cavity 2021 gradually increases from the center of the circle to the edge along the radial direction of the nozzle, so as to ensure that the tackifier can uniformly fall on the surface of the wafer, eliminate the influence of airflow distribution in the coating chamber 200, and make the tackifier film formed on the surface of the wafer uniform.
The inventor finds that the contact angle of the surface of the wafer is gradually increased along with the increase of the temperature of the heating plate 203 for placing the wafer, and the reaction rate of the tackifier and the surface of the wafer is accelerated by the temperature increase, so that the sprayer with the heating device is installed at the inlet and the outlet of the tackifier supplied by a plurality of pipes, and the uniform heating of the tackifier can be realized to improve the reaction rate.
The showerhead 202 may further include a heating element, such as a heating wire, which is uniformly distributed around the hole 2021, to heat the tackifier flowing through the hole 2021, so that the tackifier has a temperature close to that of the wafer after entering the coating chamber 200, and is heated by the hot plate 203 simultaneously with the wafer. The spray head 202 and the hot plate 203 can be respectively provided with a heat sensor to monitor the heating temperature of the spray head 202 and the hot plate 203, so that the heating temperature and the heating rate of the spray head 202 to the tackifier are consistent with the heating temperature and the heating rate of the hot plate 203 to the wafer, the chemical reaction buffering time is reduced, the chemical reaction rate of the tackifier and the surface of the wafer is accelerated, the tackifying time is reduced, and the productivity is improved.
The coating chamber 200 further includes: and the heating plate 203 is arranged opposite to the tackifier input end 201 and used for placing a wafer and heating the wafer. In this embodiment, the input end of the tackifier 201 is located at the bottom of the coating chamber 200, and the heating plate 203 is located at the upper part of the coating chamber 200; the heating plate 203 has a vacuum suction member, and the wafer is fixed to the heating plate 203 by vacuum suction. Due to the fact that the temperature of the tackifier is increased, gas can flow upwards more easily, and adhesion of the tackifier to the surface of the wafer is facilitated.
In another specific embodiment of the present invention, the input end of the tackifier 201 is located at the top of the coating chamber 200, and the heating plate 203 is located at the bottom of the coating chamber 200 opposite to the input end of the tackifier 201.
The coating cavity 200 further comprises more than two exhaust ports 204 positioned at the bottom of the coating cavity 200; and a total exhaust port 205 connected to the two or more exhaust ports 204 for collectively exhausting the gas exhausted from each exhaust port 204, thereby accelerating the exhaust rate. The exhaust port 204 and the main exhaust port 205 are both exhausted by a vacuum exhaust device.
The tackifier spreading apparatus further includes a tackifier container 100 for containing the tackifier.
With continued reference to fig. 2, the adhesion promotion container 100 includes an adhesion promotion agent supply 101, a carrier gas supply 102, and an adhesion promotion agent output 103, wherein the adhesion promotion agent output 103 is connected to the input manifold 2011 of the adhesion promotion agent input 201 through a pipe.
The carrier gas enters the tackifier container 100 through the carrier gas supply end 102, so that the pressure in the tackifier container 100 is increased, the tackifier liquid is directly gasified into tackifier steam, and the carrier gasThe steam carrying the tackifier is input into the coating cavity 200 through the tackifier output end 103 and an input manifold 2011. The carrier may be N2Or Ar2And the like.
The carrier gas supply end 102 may be installed with a third sensor 1021 for detecting a flow rate of the carrier into the tackifier container 100, and a third flow rate controller 1022 for controlling the carrier gas flow rate according to a detection result of the third sensor 1021.
The viscosity increasing agent output terminal 103 is provided with a second sensor 1031 and a second flow controller 1032, and the second flow controller 1032 is controlled by the second sensor 1031. The second sensor 1031 is configured to detect a flow rate of the tackifier, which is determined by a flow rate of the carrier gas; the second flow rate controller 1032 is used to control the stability of the flow rate of the tackifier.
The third sensor 1021 is in signal connection with the second sensor 1031, when the second sensor 1031 detects that the flow rate of the thickening agent exceeds or falls below a threshold range, the signal is fed back to the third sensor 1021, and the third flow rate controller 1022 is controlled by the third sensor 1021 to adjust the supply rate of the carrier gas.
An atomization device 104 is further arranged between the tackifier output end 103 and the input manifold 2011. When the pressure in the tackifier container 100 is high, the tackifier liquid is also directly pressed into the tackifier output end 103, and tackifier vapor and/or tackifier liquid directly enters the atomization device 104 to be atomized. The atomizing device 104 may be an ultrasonic atomizer or a compression atomizer, etc.
Further, in order to improve the uniformity of the atomized particles entering the coating chamber 200, a filter 105 is disposed between the atomization device 104 and the input manifold 2011 for filtering out the atomized particles exceeding a predetermined size.
The coating chamber 200 has a side door 206 for wafer access.
Referring to fig. 3, a schematic structural view of the heating plate 203 located at the upper part of the coating chamber 200 in this embodiment is shown. The edge structure 2031 of the heating plate 203 tilts towards the back of the heating plate 203; a clamping bar 2032 is arranged below the edge of the heating plate 203, and the clamping bar 2032 is provided with a groove for clamping a wafer. The wafer can be conveyed into the coating cavity 200 through a mechanical arm capable of rotating 180 degrees, the clamping rod 2032 automatically moves a certain angle after detecting the mechanical arm, the wafer is conveyed in, the clamping rod 2032 returns to the position perpendicular to the heating plate 203, the wafer is clamped by the groove of the clamping rod 2032, the mechanical arm moves out, the clamping rod 2032 stretches out and retracts, and the wafer is in front contact with the heating plate 203. The edge structure of the heating plate 203 is tilted, so that after the clamping rod 2032 is contracted, the wafer and the heating plate 203 can be completely heated, and the heating function is completed.
The tackifier coating apparatus may further include: and the monitoring system is connected with the first sensor, the second sensor 1031 and the third sensor 1021, and is used for monitoring sensing data of the first sensor, the second sensor 1031 and the third sensor 1021 and adjusting control strategies of the first sensor, the second sensor 1031 and the third sensor 1021 on the first flow rate controller, the second flow rate controller 1032 and the third flow rate controller 1022, so that the whole supply process achieves a closed-loop control effect.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.

Claims (14)

1. A tackifier coating apparatus comprises a coating cavity, and is characterized in that the coating cavity comprises: a tackifier input, the tackifier input comprising: the input branch pipe is connected with the input main pipe; the spray head is provided with a plurality of holes which are respectively in one-to-one correspondence with the output ports of the input branch pipes; the flow rate of the tackifier in the inlet manifold at each location can be adjusted separately.
2. The adhesion promoter coating apparatus of claim 1, wherein a first airflow sensor and a first flow rate controller are disposed on each input branch line.
3. The adhesion promotion coating device of claim 1 wherein the spray head has a heating element therein.
4. The adhesion promotion coating device of claim 1 wherein the coating chamber further comprises: and the heating plate is arranged opposite to the tackifier input end and used for placing the wafer and heating the wafer.
5. The adhesion promoter coating apparatus of claim 4, wherein the adhesion promoter input is located at the bottom of the coating chamber and the heating plate is located at the upper part of the coating chamber; the heating plate is provided with a vacuum adsorption component for adsorbing the wafer.
6. The adhesion promoter coating device of claim 5, wherein the heating plate edge structure is tilted towards the back of the heating plate; and a clamping rod is arranged below the edge of the heating plate, and the clamping rod is provided with a groove for clamping the wafer.
7. The adhesion promotion coating device of claim 1 wherein the coating chamber further comprises two or more exhaust ports located at the bottom of the coating chamber; and the total exhaust port is connected with the more than two exhaust ports and is used for exhausting the gas exhausted from each exhaust port.
8. The adhesion promotion agent application device of claim 2 further comprising an adhesion promotion agent container for holding adhesion promotion agent, the adhesion promotion agent container comprising an adhesion promotion agent supply, a carrier gas supply, and an adhesion promotion agent output, the adhesion promotion agent output connected to the input manifold of the adhesion promotion agent input via a conduit.
9. The adhesion promotion coating device of claim 8 wherein the adhesion promotion output is mounted with a second sensor and a second flow controller, the second flow controller being controlled by the second sensor.
10. The adhesion promotion coating device of claim 9 wherein the carrier gas supply port is configured with a third sensor and a third flow rate controller, the third flow rate controller being controlled by the third sensor, the third sensor being in signal communication with the second sensor.
11. The adhesion promoter coating apparatus of claim 8, wherein an atomization device is disposed between the adhesion promoter output and the input manifold.
12. The adhesion promotion coating device of claim 11 wherein a filter is disposed between the atomization device and the input manifold.
13. The adhesion promotion coating device of claim 10, further comprising a monitoring system coupled to the first, second, and third air flow sensors for monitoring the sensing data of the first, second, and third air flow sensors, and adjusting the control strategy of the first, second, and third air flow sensors to the first, second, and third flow controllers.
14. The adhesion promotion coating device of claim 1 wherein the coating chamber has a side door as a wafer access passage.
CN201810243787.2A 2018-03-23 2018-03-23 Tackifier coating device Active CN108355855B (en)

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Application Number Priority Date Filing Date Title
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CN108355855B true CN108355855B (en) 2020-05-29

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5641541A (en) * 1995-09-29 1997-06-24 Taiwan Semiconductor Manufacturing Company Process to apply photoresist printer to a wafer
JPH11274024A (en) * 1998-03-18 1999-10-08 Tokyo Electron Ltd Method and device for supplying treatment liquid
US7479464B2 (en) * 2006-10-23 2009-01-20 Applied Materials, Inc. Low temperature aerosol deposition of a plasma resistive layer
DE102008026974A1 (en) * 2008-06-03 2009-12-10 Aixtron Ag Method and apparatus for depositing thin layers of polymeric para-xylylenes or substituted para-xylylenes
JP5083285B2 (en) * 2009-08-24 2012-11-28 東京エレクトロン株式会社 Hydrophobic treatment apparatus, hydrophobic treatment method and storage medium
JP6002888B2 (en) * 2012-06-28 2016-10-05 有限会社 渕田ナノ技研 Deposition method

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Effective date of registration: 20221219

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Address before: 223001 Room 318, Building 6, east of Zhenda Steel Pipe Company, south of Qianjiang Road, Huaiyin District, Huai'an City, Jiangsu Province

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