CN108347836A - The wiring board nickel electricity tin surfaces treatment process of low energy consumption - Google Patents
The wiring board nickel electricity tin surfaces treatment process of low energy consumption Download PDFInfo
- Publication number
- CN108347836A CN108347836A CN201810353904.0A CN201810353904A CN108347836A CN 108347836 A CN108347836 A CN 108347836A CN 201810353904 A CN201810353904 A CN 201810353904A CN 108347836 A CN108347836 A CN 108347836A
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- China
- Prior art keywords
- wiring board
- nickel
- tin
- energy consumption
- low energy
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a kind of wiring board nickel electricity tin surfaces treatment process of low energy consumption, include the following steps：The wiring board of welding resistance is made in cleaning, makes its rough surface, cleaning, without greasy dirt and oxidation；By the wiring board nickel after cleaning, the surface of the wiring board layers of copper is made to plate the nickel layer that a layer thickness is 3~5um；Step 3, the tin layers that a layer thickness is 15~20um are electroplated in the nickel layer surface of the wiring board after change nickel in base sulfonic acid tin liquid；Step 4, the wiring board after electric tin is washed and is dried.The wiring board nickel electricity tin surfaces treatment process of the low energy consumption is a kind of PCB surface treatment process of the environmental protection of novel low energy consumption, all of its both having the advantages that nickel golden watch surface treatment, such as uniform coating thickness, resistance value is low, surface smoothness is high, in processing, printing plate is by high thermal shock etc., but noization it is golden it is of high cost, nickel layer is perishable, not environmentally the shortcomings that.
Description
Technical field
The present invention relates to a kind of process of surface treatment more particularly to a kind of wiring board nickel electricity tin surfaces of low energy consumption to handle
Technique.
Background technology
Chemical nickel plating gold process is a kind of method that solderability processing is carried out to naked copper printing board surface.Silk-screen printing hinders
After solder paste ink, the chemical Ni-plating layer on printed board naked copper surface is used as the diffusion impervious layer of Gold plated Layer, and chemical plating layer gold is as print
The anticorrosion protection and solderability protective layer of making sheet surface mounting pad.Since chemical plating is not necessarily to external power supply device, thickness of coating
Uniformly, the plating especially suitable for discontinuous capacitance figure in Mounting of PCB by Surface Mounting Technology.The advantage of chemical nickel plating gold is：Apply thickness
Degree is uniform, and resistance value is low, and surface smoothness is high, and in processing, printing plate is not by high thermal shock, but cost is higher, in nickel and gold
80~90 DEG C of temperature is needed when displacement, but golden cylinder nickel can will produce black nickel phenomenon by different degrees of corrosion, when serious, lead
Cause that weldment binding force is bad falls off, in addition changing to close object and generate between nickel gold solder Jie Shiyou Sillim metal influences solderability, change nickel gold because
It is that potassium auricyanide contains the huge malicious chemicals of cyanogen in terms of environmental protection it is difficult to which processing, has prodigious destructiveness to environment for gold salt.
Invention content
In order to overcome drawbacks described above, the present invention provides a kind of wiring board nickel electricity tin surfaces treatment process of low energy consumption,
All of its not only having the advantages that nickel golden watch surface treatment, but also overcoming gold are of high cost, and nickel layer is perishable, not environmentally the shortcomings that.
The present invention in order to solve its technical problem used by technical solution be：A kind of wiring board nickel electricity tin of low energy consumption
Process of surface treatment includes the following steps：
Step 1, the wiring board of welding resistance is made in cleaning, makes its rough surface, cleaning, without greasy dirt and oxidation；
Step 2, by the wiring board nickel after cleaning, it is 3~5um so that the surface of the wiring board layers of copper is plated a layer thickness
Nickel layer；
Step 3, by the nickel layer surface for changing the wiring board after nickel be electroplated in base sulfonic acid tin liquid a layer thickness for 15~
The tin layers of 20um；
Step 4, the wiring board after electric tin is washed and is dried.
As a further improvement on the present invention, in the step 2, the wiring board is put into 3~5% diluted acid after change nickel
It is preserved in solution to be carried to subsequent processing.
As a further improvement on the present invention, in the step 2, the thickness of the nickel layer is 4um.
As a further improvement on the present invention, in the step 3, the tin layers of the PCB surface are at 45 DEG C~55 DEG C
Plating is formed in tin methane sulfonate liquid.
The beneficial effects of the invention are as follows：The wiring board nickel electricity tin surfaces treatment process of the low energy consumption is a kind of novel low
The PCB surface treatment process of the environmental protection of energy consumption, its both having the advantages that nickel golden watch surface treatment all, as coating layer thickness is equal
Even, resistance value is low, and surface smoothness is high, and in processing, printing plate is not by high thermal shock etc., and the of high cost, nickel layer of noization gold
It is perishable, not environmentally the shortcomings that
Description of the drawings
Fig. 1 is schematic structural view of the invention.
In conjunction with attached drawing, make the following instructions：
1 --- wiring board；2 --- layers of copper；
3 --- nickel layer；4 --- tin layers.
Specific implementation mode
Below in conjunction with attached drawing, elaborate to the preferred embodiment of the present invention.But protection scope of the present invention is not
Be limited to following embodiments, i.e., in every case with simple equivalence changes made by scope of the present invention patent and description with repair
Decorations, all still belong within patent covering scope of the present invention.
Refering to fig. 1, the wiring board nickel electricity tin surfaces treatment process of a kind of low energy consumption, includes the following steps：
Step 1, the wiring board 1 of welding resistance is made in cleaning, and exposed bond pad surface can be cleaned in sandblasting pre-processing device,
Make its rough surface, cleaning, without greasy dirt and oxidation.
Step 2, by after cleaning wiring board 1 change nickel, make the surface of the wiring board layers of copper 2 plate a layer thickness be 3~
The nickel layer 3 of 5um, optimization thickness be 3.5~4.um, more preferably 4um, and by change nickel after wiring board be put into 3~5% it is dilute
It is preserved in acid solution to be carried to subsequent processing.
The step makes wiring board react the palladium on its copper surface and nickel into line replacement in nickel cylinder using the method for chemistry, from
And one layer of nickel layer is formed on the surface of copper, this layer of nickel can be used as the welding layer of welding, while but also as prevention tin and copper shape
At the protective layer of gun-metal, the failure welding phenomenon therefore formed is avoided.
Step 3,2 surface of nickel layer of the wiring board after change nickel is electroplated one layer in 45 DEG C~55 DEG C of base sulfonic acid tin liquid
Thickness is more than the tin layers 4 of 18um, preferably greater than 20um.
The process relativization gold will be electroplated in 90 degree of liquid medicine, and reaction is without so fierce, while the corrosion of nickel
Will not occur, fundamentally this intractable problem of black nickel caused by the corrosion of solving golden plate nickel, pacifies nickel for one very much
Full reaction eliminates the hidden danger of nickel corrosion.Meanwhile the technique use base sulfonic acid tin liquid, relative to change gold for tin at
Originally more much lower than gold, and potassium auricyanide has very strong toxicity, and environment is seriously polluted, and base sulfonic acid tin liquid then will not
There are these.
Step 4, the wiring board after electric tin is washed and is dried, you can stored for future use or shipment.
A kind of wiring board table of the environmental protection of novel low energy consumption of wiring board nickel electricity tin surfaces treatment process of the low energy consumption
Surface treatment technique, it is that last layer is replaced on copper face by the method for chemistry displacement on exposed pad after welding resistance
The nickel of 4um, the purpose with chemistry displacement are for uniform coating thickness, and surface smoothness is high.Be not by the way of plating because
There are problems that current potential height causes coating layer thickness uneven for plating, surface smoothness is not high.This layer of nickel in displacement
It simultaneously again can be as the phenomenon that preventing tin and copper formation gun-metal from leading to failure welding using the welding layer as welding.Displacement
After upper nickel after washing again by plating by way of power in nickel the tin of plating last layer 15-20um.Why not using chemistry
The mode of displacement is come tin platingBecause it is thick that such tin is not achieved in the mode of displacement, such tin thickness is taken for subsequent welding
Business.Show that tin thickness welding effect only in this way is best by largely testing.Electricity consumption tin substitutionization gold one is because changing gold
Cost of high cost and tin it is low；Second is that changes gold is potassium auricyanide the huge poison chemicals containing cyanogen has prodigious destruction to environment
Property, and methyl yellow acid tin is a kind of environment-friendly materials is not influenced on environment；Third, electrotinning is only needed in the temperature less than 50 degree
Lower reaction, and change Jin Zeyao and reacted at a temperature of nearly 90 degree, change the high energy consumption that gold needs in this way and at a high temperature of sample
Nickel is easy to burn into welding resistance and is also easy lateral erosion.
It can be seen that the wiring board nickel electricity tin surfaces treatment process of the low energy consumption is a kind of environmental protection of novel low energy consumption
PCB surface treatment process, its both having the advantages that nickel golden watch surface treatment all, such as uniform coating thickness, resistance value
Low, surface smoothness is high, and in processing, printing plate is not by high thermal shock etc., and noization gold is of high cost, nickel layer is perishable, no
The disadvantage of environmental protection.
Claims (4)
1. a kind of wiring board nickel electricity tin surfaces treatment process of low energy consumption, which is characterized in that include the following steps：
Step 1, the wiring board of welding resistance is made in cleaning, makes its rough surface, cleaning, without greasy dirt and oxidation；
Step 2, by the wiring board nickel after cleaning, the surface of the wiring board layers of copper is made to plate the nickel that a layer thickness is 3~5um
Layer；
Step 3, it is 15~20um's a layer thickness to be electroplated in the nickel layer surface of the wiring board after change nickel in base sulfonic acid tin liquid
Tin layers；
Step 4, the wiring board after electric tin is washed and is dried.
2. the wiring board nickel electricity tin surfaces treatment process of low energy consumption according to claim 1, it is characterised in that：The step
In rapid 2, the wiring board is put into 3~5% dilute acid soln after change nickel and is preserved to be carried to subsequent processing.
3. the wiring board nickel electricity tin surfaces treatment process of low energy consumption according to claim 1, it is characterised in that：The step
In rapid 2, the thickness of the nickel layer is 4um.
4. the wiring board nickel electricity tin surfaces treatment process of low energy consumption according to claim 1, it is characterised in that：The step
In rapid 3, formation is electroplated in the tin layers of the PCB surface in 45 DEG C~55 DEG C of tin methane sulfonate liquid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810353904.0A CN108347836A (en) | 2018-04-19 | 2018-04-19 | The wiring board nickel electricity tin surfaces treatment process of low energy consumption |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810353904.0A CN108347836A (en) | 2018-04-19 | 2018-04-19 | The wiring board nickel electricity tin surfaces treatment process of low energy consumption |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108347836A true CN108347836A (en) | 2018-07-31 |
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ID=62955101
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810353904.0A Pending CN108347836A (en) | 2018-04-19 | 2018-04-19 | The wiring board nickel electricity tin surfaces treatment process of low energy consumption |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108347836A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201087844Y (en) * | 2007-10-31 | 2008-07-16 | 颜琼章 | Forming device for wafer type electricity sensing component |
| EP2330872A1 (en) * | 2009-12-03 | 2011-06-08 | Yi-Chang Chen | Light emitting diode substrate and method for producing the same |
| CN103029369A (en) * | 2011-07-26 | 2013-04-10 | 罗门哈斯电子材料有限公司 | High temperature resistant silver coated substrates |
| CN103687323A (en) * | 2013-12-24 | 2014-03-26 | 广州杰赛科技股份有限公司 | Anti-oxidation method of PCBs (Printed Circuit Boards) after glue removal with concentrated sulfuric acid |
-
2018
- 2018-04-19 CN CN201810353904.0A patent/CN108347836A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201087844Y (en) * | 2007-10-31 | 2008-07-16 | 颜琼章 | Forming device for wafer type electricity sensing component |
| EP2330872A1 (en) * | 2009-12-03 | 2011-06-08 | Yi-Chang Chen | Light emitting diode substrate and method for producing the same |
| CN103029369A (en) * | 2011-07-26 | 2013-04-10 | 罗门哈斯电子材料有限公司 | High temperature resistant silver coated substrates |
| CN103687323A (en) * | 2013-12-24 | 2014-03-26 | 广州杰赛科技股份有限公司 | Anti-oxidation method of PCBs (Printed Circuit Boards) after glue removal with concentrated sulfuric acid |
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| PB01 | Publication | ||
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Application publication date: 20180731 |