CN108345178B - Silicon chip edge protection device - Google Patents
Silicon chip edge protection device Download PDFInfo
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- CN108345178B CN108345178B CN201710060966.8A CN201710060966A CN108345178B CN 108345178 B CN108345178 B CN 108345178B CN 201710060966 A CN201710060966 A CN 201710060966A CN 108345178 B CN108345178 B CN 108345178B
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- silicon wafer
- wafer edge
- protection device
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
Abstract
The invention provides a silicon wafer edge protection device, which comprises a protection ring, a fixing mechanism and a lifting mechanism, wherein the protection ring is arranged on the silicon wafer edge; the protection ring is arranged on the fixing mechanism, and the lifting mechanism is fixed on the exposure platform and drives the fixing mechanism to lift, so that the protection ring is close to or away from the edge of the silicon wafer. According to the silicon wafer edge protection device provided by the invention, the protection ring device is arranged on the exposure platform and moves together with the exposure platform, the connection time is shortened in each silicon wafer exposure process, the production efficiency is improved, the positioning precision is high during the silicon wafer edge protection, and the protection efficiency is improved.
Description
Technical Field
The invention relates to the technical field of silicon wafer protection, in particular to a silicon wafer edge protection device.
Background
Lithographic apparatus is used primarily in the manufacture of integrated circuits, ICs, or other microdevices. By means of a lithographic apparatus, a mask pattern can be imaged onto a wafer, such as a semiconductor or LCD panel, coated with a photoresist. The lithographic apparatus is exposed through a projection objective to transfer the designed mask pattern onto the photoresist. During the exposure process of the negative photoresist process, the silicon wafer edge is easily damaged, thus producing a silicon wafer edge protection device.
The conventional silicon wafer edge protection mechanism has the following process route: before exposure, loading a silicon wafer on an exposure platform, moving the exposure platform to a handover position, and after placing a protection ring on the exposure platform, moving the exposure platform to an exposure position to complete exposure; after exposure is finished, the exposure platform moves to the protection ring connection position to take down the protection ring, and then the silicon wafer after exposure is transported to the next procedure; the silicon wafer edge protection device is arranged on the frame of the whole machine, the position is fixed, the silicon wafer edge protection device does not move along with the exposure table, the process connection time is long, and the efficiency is low.
Disclosure of Invention
The invention provides a silicon wafer edge protection device for making up the defects of the prior art, and aims to solve the problems that in the process of protecting the edge of a silicon wafer, a protection ring does not move along with an exposure table, the process connection time is long, and the efficiency is low in the conventional protection ring device.
In order to achieve the purpose, the technical scheme of the invention is as follows:
a silicon chip edge protection device comprises a protection ring, a fixing mechanism and a lifting mechanism; the protection ring is arranged on the fixing mechanism, and the lifting mechanism is fixed on the exposure platform and drives the fixing mechanism to lift, so that the protection ring is close to or away from the edge of the silicon wafer.
Optionally, the protection ring is an annular structure, the protection ring has a hollow portion in the center and a solid portion at the edge.
Optionally, the fixing mechanism includes an installation seat and a positioning seat, wherein the installation seat is installed on the lifting mechanism, the positioning seat is fixed on the installation seat, and the protection ring is fixed between the positioning seat and the installation seat.
Optionally, the mounting seat is semi-circular.
Optionally, the fixing mechanism further comprises a positioning rest pin, and the positioning rest pin is fixedly installed on the installation seat and attached to the edge of the protection ring.
Optionally, the lifting mechanism employs a scissor lifting mechanism or a side-shifting mechanism.
Optionally, the scissor lifting mechanism comprises a scissor lifting frame and a linear bearing mechanism, the tops of the scissor lifting frame and the linear bearing mechanism are fixed at the bottom of the fixing mechanism, and the bottoms of the scissor lifting frame and the linear bearing mechanism are fixed on the exposure platform.
Optionally, the scissor lift comprises a scissor type link mechanism and a first cylinder driving mechanism, the first cylinder driving mechanism is mounted on the scissor type link mechanism, one end of the scissor type link mechanism is fixed at the bottom of the fixing mechanism, and the other end of the scissor type link mechanism is fixed on the exposure platform.
Optionally, the scissor type link mechanism comprises a base and at least eight connecting rods, wherein every four connecting rods are hinged to each other through a rotating shaft to form a set of parallelogram link structure, the eight connecting rods form two sets of parallelogram link structures, the two sets of parallelogram link structures are connected with each other and symmetrically arranged, and each set is characterized in that one end of each parallelogram link structure is slidably connected with the base and passes through the base which is fixed on an exposure table, the other end of each parallelogram link structure is slidably connected with the mounting seat, and the first cylinder driving mechanism is fixed on the base and connected with the two sets of parallelogram link structures.
Optionally, the side-moving mechanism includes a hinge rod mechanism, a guide mechanism and a second cylinder driving mechanism, one end of the hinge rod mechanism, one end of the guide mechanism and one end of the second cylinder driving mechanism are all mounted on the fixing mechanism, the other end of the hinge rod mechanism is mounted on the exposure table, and the hinge rod mechanism includes a plurality of hinge rods which are symmetrically distributed to form a parallelogram.
Optionally, the hinge rod includes a connecting rod and two hinges, and two ends of the connecting rod are respectively connected to the mounting base and the exposure stage through the two hinges.
Optionally, the guide mechanism includes a circular arc guide rail and a roller, one end of the roller is fixed on the mounting seat, the other end of the roller is arranged in the circular arc guide rail, the circular arc guide rail is fixed on the exposure table, and the lower end of the circular arc guide rail faces the edge of the silicon wafer.
Optionally, the second cylinder driving mechanism includes a cylinder and a hinge, and the cylinder is connected to the exposure stage and the fixing mechanism through the hinge respectively.
Optionally, the silicon wafer edge protection device further comprises a proximity sensor, and the proximity sensor is mounted on the exposure table.
Optionally, the silicon wafer edge protection device further includes a pin positioning component, where the pin positioning component includes a pin installed on the exposure stage and a pin hole disposed on the protection ring and matched with the pin.
Optionally, the pin is a taper pin, and the pin hole is a taper pin hole corresponding to the taper pin.
According to the silicon wafer edge protection device provided by the invention, the fixing mechanism, the lifting mechanism and the positioning detection mechanism are added in the original protection ring device structure, so that the protection ring is not required to leave the exposure table in the silicon wafer exposure process of the same size specification, the protection ring is only required to be lifted or laterally moved to realize the loading and unloading of the silicon wafer, the connection time is shortened in each silicon wafer exposure process, the production efficiency is greatly improved, the positioning precision is high during the silicon wafer edge protection, and the protection efficiency is improved.
Drawings
FIG. 1 is a schematic structural diagram of a silicon wafer edge protection apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a fixing mechanism according to an embodiment of the present invention;
FIG. 3 is a schematic cross-sectional view of a securing mechanism according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a lifting mechanism according to an embodiment of the present invention;
FIG. 5 is a schematic structural view of a scissor lift truck according to an embodiment of the present invention;
FIG. 6 is a schematic structural diagram of a detecting mechanism according to an embodiment of the present invention;
FIG. 7 is a schematic structural diagram of a taper pin according to an embodiment of the present invention;
FIG. 8 is a schematic diagram of a working position of a silicon wafer edge protection apparatus according to an embodiment of the present invention;
FIG. 9 is a top view of an exposure position and a loading/unloading position of a silicon wafer edge protection apparatus according to an embodiment of the present invention;
FIG. 10 is a schematic diagram of the highest ascending position of a protection ring of a silicon wafer edge protection apparatus according to an embodiment of the present invention;
FIG. 11 is a schematic view of a silicon wafer edge protection device of the invention showing a lowered lowest position of a guard ring;
FIG. 12 is a schematic structural view of a second lifting mechanism according to an embodiment of the present invention;
FIG. 13 is a schematic structural view of a second first cylinder/second cylinder driving mechanism according to an embodiment of the present invention;
FIG. 14 is a schematic structural view of a second hinge rod mechanism according to an embodiment of the present invention;
FIG. 15 is a schematic structural view of a second guiding mechanism according to an embodiment of the present invention;
FIG. 16 is a schematic view of the second embodiment of the present invention showing the lowest position of the elevator mechanism;
fig. 17 is a schematic diagram of the second lifting mechanism ascending to the highest position according to the embodiment of the present invention.
Shown in figures 1-17: 1-exposure stage, 2-silicon chip, 3-protection ring, 4-fixing mechanism, 41-mounting seat, 42-positioning seat, 43-screw, 44-adjusting nut, 45-plunger, 46-positioning leaning pin, 5-lifting mechanism, 51-linear bearing mechanism, 52-scissor type connecting rod mechanism, 521-base, 522-connecting rod, 53-first cylinder driving mechanism, 54-hinge rod mechanism, 55-guiding mechanism, 56-second cylinder driving mechanism, 551-circular arc guide rail, 552-roller, 561-cylinder, 562-hinge, 6-proximity sensor and 7-pin positioning component.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. It is to be noted that the drawings are in simplified form and are not to precise scale, which is provided for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
The first embodiment is as follows:
as shown in fig. 1 and 8, the silicon wafer edge protection apparatus of the present invention comprises a protection ring 3, a fixing mechanism 4, and a lifting mechanism 5, wherein the protection ring 3 is mounted on the fixing mechanism 4, the lifting mechanism 5 is fixedly mounted on the exposure stage 1, and the lifting mechanism 5 drives the fixing mechanism 4 to perform a lifting motion, that is, drives the protection ring 3 to perform a lifting motion; the protection ring 3 is hollow in the center, the edge of the protection ring is of a solid annular structure, and the specification of the protection ring 3 is matched with that of the silicon wafer 2; the positioning detection mechanism is used for detecting whether the protection ring 3 moves to a set position or not and ensuring the repeated positioning precision between the silicon wafer 2 and the protection ring 3.
It should be noted that, corresponding guard ring 3 structures are configured according to silicon wafers 2 of different specifications, and guard rings 3 of different specifications can be installed on the exposure stage 1, so that edge protection of silicon wafers 2 of various specifications can be realized.
Further, as shown in fig. 2 to 3, the fixing mechanism includes an installation base 41, a positioning base 42 and a positioning support pin 46, the installation base 41 is installed on the lifting mechanism 5, the positioning base 42 is fixed on the installation base 41, and the protection ring 3 is fixed between the positioning base 42 and the installation base 41, in this embodiment, the installation base 41 is in a semicircular shape, three sets of the positioning bases 42 are provided, and are uniformly distributed on the installation base 41, and two sets of the positioning support pins 46 are provided. Specifically, the three sets of positioning seats 42 are fixed on the mounting seat 41 through screws 43, the plunger 45 penetrates through the positioning seats 42, and the protection ring 3 is fixed between the mounting seat 41 and the positioning seats 42 through adjusting nuts 44 on the adjusting plunger 45; the two sets of positioning pins 46 are fixedly mounted on the mounting block 41 and abut against the edge of the protection ring 3, ensuring the precision of the repeated positioning of the protection ring 3 each time it is fitted, and the coaxiality of the protection ring 3 and the mounting block 41.
As shown in fig. 4-5, the lifting mechanism 5 is a scissors lifting mechanism for driving the fixing mechanism 4 to vertically lift, and the scissors lifting mechanism includes two scissors lifting frames and two linear bearing mechanisms 51, and the two scissors lifting frames and the two linear bearing mechanisms 51 are symmetrically disposed at the bottom of the mounting base 41. The scissor type lifting frame comprises a scissor type connecting rod mechanism 52 and a first air cylinder driving mechanism 53, wherein the first air cylinder driving mechanism 53 is installed on the scissor type connecting rod mechanism 52, one end of the scissor type connecting rod mechanism 52 is fixed at the bottom of the installation base 41, and the other end of the scissor type connecting rod mechanism 52 is fixed on the exposure platform 1. Preferably, the scissor type linkage 52 includes a base 521 and eight links 522, each four links 522 are hinged to each other through a rotation shaft to form a set of parallelogram linkage structure, the eight links 522 form two sets of parallelogram linkage structures, the two sets of parallelogram linkage structures are connected to each other and symmetrically arranged, one end of each set of parallelogram linkage structure is slidably connected to the base 521 and fixed on the exposure table 1 through the base 521, the other end of each set of parallelogram linkage structure is slidably connected to the mounting base 41, and the first cylinder driving mechanism 53 is fixed on the base 521 and connected to the two sets of parallelogram linkage structures. Specifically, when the protection ring needs to be lifted or lowered, the first cylinder driving mechanism 53 is started, and the scissor type link mechanism 52 is driven to vertically lift or lower by taking the linear bearing mechanism 51 as a guide, so as to drive the mounting base 41 to vertically lift or lower upwards, that is, the protection ring 3 is vertically lifted or lowered.
As shown in fig. 6-7, the silicon wafer edge protection apparatus further comprises a positioning detection mechanism, the positioning detection mechanism comprises a proximity sensor 6 and a pin positioning component 7, the proximity sensor 6 is mounted on the exposure stage 1 below the protection ring 3, and detects whether the protection ring 3 moves to a corresponding position; the pin positioning component 7 comprises pins arranged on the exposure platform and pin holes which are arranged on the protection ring 3 and are precisely matched with the pins, in the implementation, the proximity sensors 6 are three and are uniformly distributed on the exposure platform, the pin positioning component 7 is provided with two groups, the pins are preferably conical pins, and the pin holes are correspondingly arranged into conical holes. Specifically, in the descending process of the protection ring, the coaxial deviation in the motion process of the protection ring 3 is compensated through the positioning of the conical surfaces of the two groups of pin positioning components 7, the repeated positioning precision of the protection ring 3 descending to the exposure platform 1 every time is ensured, and the mechanical limiting effect is achieved; at the same time, the proximity sensor 6 detects whether the guard ring 3 is lowered in place.
As shown in fig. 8-11, the working principle of the silicon wafer edge protection device of the present invention is as follows:
the first step, the exposure platform 1 moves to the loading position A1, the guard ring 3 is lifted, the silicon wafer 2 is loaded, and the guard ring 3 is lowered, specifically as follows:
as shown in fig. 8 and 9, the silicon wafer edge protection device moves to a loading position a1 of the silicon wafer 2 along with the exposure stage 1, the first cylinder driving mechanism 53 is started, the scissors-type link mechanism 52 is driven to vertically lift upwards by taking the linear bearing mechanism 51 as a guide, the mounting base 41 is driven to vertically lift upwards, and as shown in fig. 10, the protection ring 3 lifts, so that loading of the silicon wafer 2 is completed; the first cylinder driving mechanism 53 is started again, the scissor type link mechanism 52 is driven to vertically descend by taking the linear bearing mechanism 51 as a guide, the mounting base 41 is driven to vertically descend, and as shown in fig. 11, the protection ring 3 descends to cover the silicon wafer 2. In the descending process of the protection ring 3, the coaxial deviation in the motion process is compensated through the conical surface positioning of the two groups of pin positioning components 7, the repeated positioning precision of the protection ring 3 which descends to the exposure platform 1 every time is ensured, the mechanical limiting effect is achieved, meanwhile, the approach sensor 6 is used for detecting whether the protection ring 3 descends in place in the descending process of the protection ring 3, and the protection reliability is improved.
Secondly, the exposure stage 1 moves to an exposure position A0 to expose the silicon wafer 2, which comprises the following steps:
as shown in FIG. 9, the exposure stage 1 is moved to exposure position A0, the guard ring 3 is moved with the exposure stage 1 to exposure position A0 to begin exposure, and the guard ring 3 protects the edge of the wafer 2 during exposure.
Thirdly, the exposure platform 1 moves to a blanking position A1, the protection ring 3 is lifted, and the silicon wafer 2 is blanked, which comprises the following specific steps:
after exposure is completed, the protection ring 3 moves to a blanking position a1 along with the exposure stage 1, the first cylinder driving mechanism 53 is started, the scissor type link mechanism 52 is driven to vertically lift upwards by taking the linear bearing mechanism 51 as a guide, the mounting seat 41 is driven to vertically lift upwards, as shown in fig. 10, the protection ring 3 is lifted, blanking of the silicon wafer 2 is completed, and then one-time exposure is completed.
Example two:
as shown in fig. 12, the present embodiment is different from the first embodiment in that: the lifting mechanism of the embodiment adopts a side-shifting mechanism, the side-shifting mechanism comprises a hinge rod mechanism 54, a guide mechanism 55 and a second cylinder driving mechanism 56, one end of the hinge rod mechanism 54, one end of the guide mechanism 55 and one end of the second cylinder driving mechanism 56 are all installed at the bottom of the installation base 41, and the other end of the hinge rod mechanism 54, one end of the guide mechanism 55 and one end of the second cylinder driving mechanism 56 are installed on the exposure platform 1.
Further, as shown in fig. 14, the hinge rod mechanism 54 includes a plurality of hinge rods, preferably four hinge rods in this embodiment, symmetrically distributed at the bottom of the mounting seat 41 to form a parallelogram, each hinge rod includes a connecting rod and two hinges, and two ends of the connecting rod are respectively connected to the mounting seat 41 and the exposure stage 1 through the two hinges.
Further, as shown in fig. 13, the second cylinder driving mechanism 56 includes a cylinder 561 and a hinge 562, and the cylinder 561 is connected to the exposure stage 1 and the bottom of the mounting base 41 through the hinge 562, respectively. Specifically, as shown in fig. 16, the cylinder 561 is extended to drive the hinge lever mechanism 54 to move leftward, and the guard ring 3 is lowered; as shown in fig. 17, the cylinder 561 is retracted to drive the hinge rod mechanism 54 to move to the right, and the guard ring 3 is raised to leave a space for loading and unloading the silicon wafer 2.
As shown in fig. 15, the guide mechanism 55 includes a circular arc-shaped guide 551 and a roller 552, the roller 552 has one end fixed to the mounting base 41 and the other end disposed in the circular arc-shaped guide 551, the circular arc-shaped guide 551 is fixed to the exposure stage 1, and the lower end of the circular arc-shaped guide faces the edge of the silicon wafer. Specifically, the roller 552 moves leftward to the lower end of the circular arc guide 551, and the protection ring 3 descends to the lowest position; the roller 552 moves rightwards to the higher end of the circular arc-shaped guide rail 551, the protection ring 3 rises to the highest position, and the guide mechanism 55 plays a role in guiding, limiting and positioning.
That is, in this embodiment, as shown in fig. 17, the second cylinder driving mechanism 56 is started, the cylinder 561 retracts, the hinge rod mechanism 54 is driven to move rightward, the roller 552 moves rightward to the rightmost position of the circular arc-shaped guide rail 551, and the protection ring 3 rises to the highest position, so as to complete the loading and unloading of the silicon wafer 2; as shown in fig. 16, the cylinder 561 is extended to drive the hinge rod mechanism 54 to move to the left, the roller 552 moves to the leftmost position of the circular guide 551, the protection ring 3 descends to the lowest position to cover the silicon wafer 2, and the edge of the silicon wafer 2 is protected during the exposure process.
It will be apparent to those skilled in the art that various changes and modifications may be made in the invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (15)
1. The silicon wafer edge protection device comprises a protection ring and is characterized by also comprising a fixing mechanism and a lifting mechanism; the protection ring is arranged on the fixing mechanism, the lifting mechanism is fixed on the exposure platform and drives the fixing mechanism to lift, so that the protection ring is close to or away from the edge of the silicon wafer, meanwhile, the protection ring is not required to be away from the exposure platform in the process of exposing the silicon wafer with the same size and specification, the silicon wafer loading and unloading can be realized only by lifting or laterally moving the protection ring,
the fixing mechanism comprises a mounting seat and a positioning seat, the mounting seat is semicircular,
the lifting mechanism adopts a parallelogram link mechanism.
2. The silicon wafer edge protection device of claim 1, wherein the guard ring is a ring structure, the guard ring has a hollow portion in the center and a solid portion at the edge.
3. The silicon wafer edge protector as claimed in claim 1, wherein said mounting base is mounted on said lifting mechanism, said positioning base is fixed on said mounting base, and said protection ring is fixed between said positioning base and said mounting base.
4. The silicon wafer edge protection device of claim 3, wherein the fixing mechanism further comprises a positioning pin, and the positioning pin is fixedly mounted on the mounting seat and attached to the edge of the protection ring.
5. The silicon wafer edge protection device of claim 1, wherein the lifting mechanism is a scissor lifting mechanism or a side-shifting mechanism.
6. The silicon wafer edge protection device of claim 5, wherein the scissor lift mechanism comprises a scissor lift frame and a linear bearing mechanism, wherein the top of the scissor lift frame and the top of the linear bearing mechanism are both fixed at the bottom of the fixing mechanism, and the bottom of the scissor lift frame and the bottom of the linear bearing mechanism are both fixed on the exposure stage.
7. The silicon wafer edge protection device of claim 6, wherein the scissor lift comprises a scissor linkage and a first cylinder driving mechanism, the first cylinder driving mechanism is mounted on the scissor linkage, one end of the scissor linkage is fixed at the bottom of the fixing mechanism, and the other end of the scissor linkage is fixed on the exposure stage.
8. The silicon wafer edge protection device of claim 7, wherein the scissor linkage mechanism comprises a base and at least eight links, each four links are hinged to each other through a rotation shaft to form a set of parallelogram linkage structures, the eight links form two sets of parallelogram linkage structures, the two sets of parallelogram linkage structures are connected to each other and symmetrically arranged, one end of each set of parallelogram linkage structures is slidably connected to the base and fixed on the exposure table through the base, the other end of each set of parallelogram linkage structures is slidably connected to the mounting base, and the first cylinder driving mechanism is fixed on the base and connected to the two sets of parallelogram linkage structures.
9. The silicon wafer edge protection device according to claim 5, wherein the side-shifting mechanism comprises a hinge rod mechanism, a guide mechanism and a second cylinder driving mechanism, one end of the hinge rod mechanism, one end of the guide mechanism and one end of the second cylinder driving mechanism are all mounted on the fixing mechanism, the other end of the hinge rod mechanism is mounted on the exposure platform, and the hinge rod mechanism comprises a plurality of hinge rods which are symmetrically distributed to form a parallelogram.
10. The silicon wafer edge protection device of claim 9, wherein the hinge rod comprises a connecting rod and two hinges, and two ends of the connecting rod are respectively connected with the mounting base and the exposure table through the two hinges.
11. The silicon wafer edge protection device of claim 9, wherein the guide mechanism comprises a circular arc-shaped guide rail and a roller, one end of the roller is fixed on the mounting base, the other end of the roller is arranged in the circular arc-shaped guide rail, the circular arc-shaped guide rail is fixed on the exposure table, and the lower end of the circular arc-shaped guide rail faces the silicon wafer edge.
12. The silicon wafer edge protection device of claim 9, wherein the second cylinder driving mechanism comprises a cylinder and a hinge, and the cylinder is connected with the exposure stage and the fixing mechanism through the hinge respectively.
13. The wafer edge protector of claim 1, further comprising a proximity sensor mounted on the exposure stage.
14. The wafer edge protector of claim 1, further comprising a pin positioning assembly, wherein the pin positioning assembly comprises a pin mounted on the exposure stage and a pin hole disposed on the protection ring for engaging with the pin.
15. The silicon wafer edge protection device of claim 14, wherein the pin is a conical pin and the pin hole is a conical pin hole corresponding to the conical pin.
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| CN201710060966.8A CN108345178B (en) | 2017-01-25 | 2017-01-25 | Silicon chip edge protection device |
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| CN201710060966.8A CN108345178B (en) | 2017-01-25 | 2017-01-25 | Silicon chip edge protection device |
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| CN108345178B true CN108345178B (en) | 2020-11-13 |
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| DE10329976A1 (en) * | 2003-06-26 | 2005-02-03 | Sentech Instruments Gmbh | Mechanical fixing device securing substrate to substrate electrode e.g. for plasma treatment of semiconductor wafer, using pneumatic adjustment of clamp relative to substrate support surface |
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| US20160211165A1 (en) * | 2015-01-16 | 2016-07-21 | Lam Research Corporation | Moveable edge coupling ring for edge process control during semiconductor wafer processing |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105390430B (en) * | 2014-09-09 | 2018-08-24 | 北京北方华创微电子装备有限公司 | A kind of pressure ring hold-down mechanism |
| US10658222B2 (en) * | 2015-01-16 | 2020-05-19 | Lam Research Corporation | Moveable edge coupling ring for edge process control during semiconductor wafer processing |
| CN106206399B (en) * | 2015-04-30 | 2018-12-11 | 北京北方华创微电子装备有限公司 | Pressure ring arrangements and reaction chamber |
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| DE10329976A1 (en) * | 2003-06-26 | 2005-02-03 | Sentech Instruments Gmbh | Mechanical fixing device securing substrate to substrate electrode e.g. for plasma treatment of semiconductor wafer, using pneumatic adjustment of clamp relative to substrate support surface |
| GB2527921B (en) * | 2014-05-15 | 2016-10-19 | Infineon Technologies Ag | Wafer releasing |
| CN105206558A (en) * | 2014-05-27 | 2015-12-30 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Protection mechanism of wafer edge, reaction chamber and semiconductor machining device |
| US20160211165A1 (en) * | 2015-01-16 | 2016-07-21 | Lam Research Corporation | Moveable edge coupling ring for edge process control during semiconductor wafer processing |
| CN105988298A (en) * | 2015-02-02 | 2016-10-05 | 上海微电子装备有限公司 | Silicon chip edge protective device and protection method thereof |
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| CN108345178A (en) | 2018-07-31 |
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